In-situ CT analysis device for real-time observation of soldering tin melting process

Abstract

The utility model discloses an in-situ CT (Computed Tomography) analysis device for real-time observation of a soldering tin melting process. The in-situ CT analysis device comprises a heating box, an X-ray receiving device arranged above the heating box and an X-ray emitting device arranged below the heating box, the heating box comprises a mounting box body; a first mounting groove is formed in the top of the mounting box body, and a product clamping mechanism is further mounted in the first mounting groove; and the product clamping mechanism comprises two clamping rods. Based on the X-ray detection principle, the internal structure change in the soldering tin melting process can be observed in real time, the hysteresis and destructive problems of a traditional method are solved, the annular infrared heating pipe is adopted, it can be ensured that a soldering tin sample is evenly heated, temperature change in the real welding environment is simulated, meanwhile, shielding of ray imaging is avoided, and the welding quality is improved. And the resolution and the precision of CT scanning are improved.

Description

An in-situ CT analysis device for real-time observation of solder melting process Technical Field

[0001] This utility model relates to the field of electronic manufacturing technology, and in particular to an in-situ CT analysis device for real-time observation of the solder melting process. Background Technology

[0002] In the field of electronics manufacturing, the melting and solidification process of solder plays a crucial role in soldering quality. Traditional studies of solder melting processes typically rely on destructive testing or offline analysis, making it impossible to observe changes in the internal structure of the solder in real time. In recent years, in-situ CT technology has been increasingly introduced into materials science research; however, existing CT equipment lacks the capability to integrate with temperature control, making it impossible to simulate the reflow soldering process in actual soldering environments. Furthermore, traditional heating methods may obstruct X-ray imaging, affecting the resolution and accuracy of CT scans. Therefore, developing a device capable of simultaneously enabling real-time observation of the solder melting process, simulating reflow soldering temperature changes, and without affecting X-ray imaging is of great significance. Summary of the Invention

[0003] The purpose of this invention is to provide an in-situ CT analysis device for real-time observation of the solder melting process, in order to solve the problems in the prior art that it is impossible to observe changes in the internal structure of the solder in real time, impossible to simulate the actual welding environment, and that the heating device interferes with CT imaging.

[0004] To achieve the above objectives, the following technical solution is adopted:

[0005] An in-situ CT analysis device for real-time observation of solder melting process includes a heating chamber, an X-ray receiving device arranged above the heating chamber, and an X-ray emitting device arranged below the heating chamber. The heating chamber includes a mounting box. A first mounting groove is formed on the top of the mounting box, and a product clamping mechanism is also installed in the first mounting groove. The product clamping mechanism includes two clamping rods. A first slide rail is installed at each end of the first mounting groove. The two clamping rods are arranged parallel and spaced between the two first slide rails, and the two ends of each clamping rod are slidably connected to a first slide rail. A locking component for limiting and fixing the clamping rods is also installed on the first slide rail. A clamping groove is formed on each side of the two clamping rods along their length. A sealing cover is rotatably connected to the top side of the first mounting groove, and an infrared heating tube with an annular structure is installed on the bottom surface of the sealing cover.

[0006] Furthermore, three first fixing blocks are installed on the bottom surface of the sealing cover, with two of the first fixing blocks located at one end of the bottom surface of the sealing cover and the other first fixing block located at the upper part of the bottom surface of the sealing cover; the infrared heating tube is arranged on the three first fixing blocks, and each first fixing block is also equipped with a limiting clip for clamping and limiting the infrared heating tube.

[0007] Furthermore, the top of the first slide rail is provided with a first slide groove along its length; the locking assembly includes a locking seat; the locking seat is arranged on the first slide rail, and the bottom of the locking seat is also provided with a guide plate, which is movably inserted into the first slide groove; one end of the locking seat extends towards the clamping rod and is connected to the top end of the clamping rod; the locking seat is also equipped with a first locking screw for locking the locking seat onto the first slide rail, and the upper part of the first locking screw is also equipped with a first locking knob.

[0008] Furthermore, a clamping block is slidably connected to each clamping rod; one end of the clamping block on each clamping rod extends toward the other clamping rod; each clamping block is also equipped with a second locking screw for locking the clamping block to the clamping rod, and a second locking knob is also installed on the upper part of the second locking screw.

[0009] Furthermore, a U-shaped groove is provided at the bottom of the clamping block, through which the clamping block is installed on the clamping rod.

[0010] Furthermore, a second fixing block is also installed on the top of the clamping rod, and a temperature sensor is also installed on the second fixing block.

[0011] Furthermore, the clamping groove has a V-shaped structure.

[0012] Furthermore, a handle is installed on each side of the heating box.

[0013] Furthermore, the X-ray receiving device includes a first X-axis translation mechanism, a first Y-axis translation mechanism connected to the first X-axis translation mechanism, and a flat panel detector mounted on the first Y-axis translation mechanism.

[0014] Furthermore, the X-ray emitting device includes a second Y-axis translation mechanism, a second X-axis translation mechanism connected to the second Y-axis translation mechanism, and a light tube mounted on the second X-axis translation mechanism.

[0015] By adopting the above solution, the beneficial effects of this utility model are:

[0016] This invention is based on the principle of X-ray detection and can observe the internal structural changes of solder during the melting process in real time. It solves the problems of lag and destructiveness of traditional methods. Furthermore, the use of a ring-shaped infrared heating tube can ensure that the solder sample is heated evenly, simulating the temperature changes in the real welding environment. At the same time, it avoids obstruction of X-ray imaging and improves the resolution and accuracy of CT scans. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the structure of this utility model;

[0018] Figure 2 is a schematic diagram of the structure of the heating box of this utility model;

[0019] Figure 3 is a magnified view of part A in Figure 2;

[0020] Figure 4 is a schematic diagram of the present invention in actual use;

[0021] The following are explanations of the labels in the attached diagram:

[0022] 1. X-ray receiving device; 2. X-ray emitting device; 3. Mounting housing; 4. Product clamping mechanism; 5. Second fixing block; 31. First slide rail; 32. Locking assembly; 33. Sealing cover; 34. Infrared heating tube; 35. First fixing block; 36. Limiting clamp; 37. Handle; 41. Clamping rod; 42. Clamping block; 43. Second locking knob; 51. Temperature sensor; 311. First slide groove; 321. Locking seat; 322. Guide plate; 323. First locking knob; 411. Clamping groove. Detailed Implementation

[0023] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] Referring to Figures 1 to 4, this utility model provides an in-situ CT analysis device for real-time observation of the solder melting process. In one embodiment, it includes a heating box, an X-ray receiving device 1 arranged above the heating box, and an X-ray emitting device 2 arranged below the heating box. The heating box includes a mounting box 3. A first mounting groove is provided on the top of the mounting box 3, and a product clamping mechanism 4 is also installed in the first mounting groove. The product clamping mechanism 4 includes two clamping rods 41. Each end of the first mounting groove is also equipped with a clamping rod. A first slide rail 31 is installed, and two clamping rods 41 are arranged in parallel and spaced between the two first slide rails 31, with each end of the clamping rod 41 slidably connected to a first slide rail 31; a locking assembly 32 for limiting and fixing the clamping rods 41 is also installed on the first slide rail 31; a clamping groove 411 is opened on each side of the two clamping rods 41 along their length direction; a sealing cover 33 is rotatably connected to the top side of the first mounting groove, and an infrared heating tube 34 with an annular structure is installed on the bottom surface of the sealing cover 33.

[0025] Referring again to Figures 1 to 4, in this embodiment, the X-ray receiving device 1 includes a first X-axis translation mechanism, a first Y-axis translation mechanism connected to the first X-axis translation mechanism, and a flat panel detector mounted on the first Y-axis translation mechanism; the X-ray emitting device 2 includes a second Y-axis translation mechanism, a second X-axis translation mechanism connected to the second Y-axis translation mechanism, and a light tube mounted on the second X-axis translation mechanism; the first X-axis translation mechanism, the second X-axis translation mechanism, the first Y-axis translation mechanism, and the second Y-axis translation mechanism can all be linear modules, and this utility model does not limit this. Through the cooperation of the above translation mechanisms, the flat panel detector and the light tube can be driven to perform translational movements in order to detect the solder melting process.

[0026] In this embodiment, the infrared heating tube 34 has a ring-shaped structure, which can ensure that the solder sample is heated evenly, simulate the temperature changes in the real welding environment, and avoid obstruction of X-ray imaging, thereby improving the resolution and accuracy of CT scans. Meanwhile, the inner wall of the mounting box 3 is made of a 0.5mm thick aluminum plate, and the sealing cover 33 and the bottom surface of the mounting box 3 are made of a 1mm thick low-density carbon fiber plate. X-rays can easily penetrate the box and ensure that the welding process image is not interfered with by the box.

[0027] During operation, the distance between the two clamping rods 41 is first adjusted, and then the PCB board containing the chip is placed between the two clamping slots 411. Subsequently, the sealing cover 33 is closed, and the infrared heating tube 34 is turned on to heat the chip by setting the temperature. At the same time, the light tube and the flat panel detector move synchronously on their respective X and Y axis motion components to perform real-time diagonal circumferential scanning and imaging of the soldering process and cooling solidification process between the chip and the PCB board. After the imaging and scanning, the background performs three-dimensional reconstruction of the CT scan data to intuitively display the formation process of defects such as internal pores and cracks.

[0028] In one embodiment, three first fixing blocks 35 are also installed on the bottom surface of the sealing cover 33, with two of the first fixing blocks 35 located at one end of the bottom surface of the sealing cover 33 and the other first fixing block 35 located at the upper part of the bottom surface of the sealing cover 33. The infrared heating tube 34 is arranged on the three first fixing blocks 35, and each first fixing block 35 is also equipped with a limiting clip 36 for clamping and limiting the infrared heating tube 34. The infrared heating tube 34 can be clamped and fixed on the first fixing block 35 by the three limiting clips 36, ensuring its stable installation.

[0029] In one embodiment, the top of the first slide rail 31 is provided with a first groove 311 along its length; the locking assembly 32 includes a locking seat 321; the locking seat 321 is arranged on the first slide rail 31, and the bottom of the locking seat 321 is also provided with a guide plate 322, which is movably inserted into the first groove 311; one end of the locking seat 321 extends toward the clamping rod 41 and is connected to the top end of the clamping rod 41; the locking seat 321 is also provided with a first locking screw for locking the locking seat 321 onto the first slide rail 31, and the upper part of the first locking screw is also provided with a first locking knob 323. The locking seat 321 can be manually pushed to adjust the distance between the two clamping rods 41 to adapt to the clamping requirements of PCB boards of different specifications and sizes, making it highly versatile. After adjusting the clamping rods 41 to the appropriate position, the first locking knob 323 can be manually tightened to lock and fix them, making it convenient to use. At the same time, the bottom of the locking seat 321 is also provided with a guide plate 322, which is movably inserted into the first slide groove 311 and can guide the locking seat 321 when it is moved.

[0030] In one embodiment, a clamping block 42 is slidably connected to each clamping rod 41; one end of the clamping block 42 on each clamping rod 41 extends toward the other clamping rod 41; each clamping block 42 is also equipped with a second locking screw for locking the clamping block 42 onto the clamping rod 41, and a second locking knob 43 is also installed on the upper part of the second locking screw (the bottom of the clamping block 42 is also provided with a U-shaped slot, and the clamping block 42 is installed on the clamping rod 41 through the U-shaped slot). After inserting the PCB board into a clamping slot 411 on each side, the clamping block 42 can be manually pushed to clamp the PCB board, and then locked by the second locking knob 43. This avoids the problem of the PCB board shaking affecting the detection effect. In addition, to further improve the clamping effect of the PCB board, the clamping slot 411 has a V-shaped structure.

[0031] In one embodiment, a second fixing block 5 is also installed on the top of the clamping rod 41, and a temperature sensor 51 is also installed on the second fixing block 5. In this embodiment, an air outlet is also provided at one end of the mounting box 3, and a heat dissipation shell is connected to the other end of the mounting box 3, and a cooling fan is installed inside the heat dissipation shell; an air inlet is provided at the other end of the mounting box 3 corresponding to the cooling fan, and the two temperature sensors 51 can feed back the temperature inside the mounting box 3 to the backend in real time. The backend controls the fan at the air inlet to turn on or off according to the feedback information, thereby effectively controlling the heating temperature inside the mounting box 3.

[0032] In one embodiment, a handle 37 is installed on each side of the heating box to facilitate the handling and installation of the box body 3. At the same time, a latch is installed on one end of the sealing cover 33, and a locking handle is installed on one end of the heating box corresponding to the latch to facilitate opening or closing the sealing cover 33.

[0033] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An in-situ CT analysis device for real-time observation of the solder melting process, characterized in that, The device includes a heating chamber, an X-ray receiving device arranged above the heating chamber, and an X-ray emitting device arranged below the heating chamber. The heating chamber includes a mounting box. The top of the mounting box has a first mounting groove, and a product clamping mechanism is also installed in the first mounting groove. The product clamping mechanism includes two clamping rods. A first slide rail is installed at each end of the first mounting groove. The two clamping rods are arranged parallel and spaced between the two first slide rails, and the two ends of each clamping rod are slidably connected to a first slide rail. A locking component for limiting and fixing the clamping rods is also installed on the first slide rail. A clamping groove is opened on each side of the two clamping rods along their length. A sealing cover is rotatably connected to the top side of the first mounting groove, and an infrared heating tube with a ring structure is installed on the bottom surface of the sealing cover.

2. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, characterized by, The bottom surface of the sealing cover is also equipped with three first fixing blocks, two of which are located at one end of the bottom surface of the sealing cover, and the other first fixing block is located at the top of the bottom surface of the sealing cover; the infrared heating tube is arranged on the three first fixing blocks, and each first fixing block is also equipped with a limiting clip for clamping and limiting the infrared heating tube.

3. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, characterized by, The first slide rail has a first groove along its length at its top; the locking assembly includes a locking seat; the locking seat is arranged on the first slide rail, and the bottom of the locking seat is also provided with a guide plate, which is movably inserted into the first groove; one end of the locking seat extends toward the clamping rod and is connected to the top end of the clamping rod; the locking seat is also equipped with a first locking screw for locking the locking seat onto the first slide rail, and a first locking knob is also installed on the upper part of the first locking screw.

4. The in-situ CT analysis device for real-time observation of the solder melting process according to claim 1, characterized in that, Each clamping rod is also slidably connected to a clamping block; one end of the clamping block on each clamping rod extends toward the other clamping rod; each clamping block is also equipped with a second locking screw for locking the clamping block to the clamping rod, and a second locking knob is also installed on the upper part of the second locking screw.

5. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 4, characterized by, The bottom of the clamping block is also provided with a U-shaped groove, through which the clamping block is installed on the clamping rod.

6. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, characterized by, A second fixing block is also installed on the top of the clamping rod, and a temperature sensor is also installed on the second fixing block.

7. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, characterized by, The clamping groove has a V-shaped structure.

8. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, characterized by, A handle is also installed on each side of the heating box.

9. The in-situ CT analysis apparatus for real-time observation of a solder melting process according to claim 1, wherein, The X-ray receiving device includes a first X-axis translation mechanism, a first Y-axis translation mechanism connected to the first X-axis translation mechanism, and a flat panel detector mounted on the first Y-axis translation mechanism.

10. The in-situ CT analysis device for real-time observation of the solder melting process according to claim 1, characterized in that, The X-ray emitting device includes a second Y-axis translation mechanism, a second X-axis translation mechanism connected to the second Y-axis translation mechanism, and a light tube mounted on the second X-axis translation mechanism.

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