Aging test clamp for plastic package surface-mounted discrete semiconductor device

Abstract

The utility model discloses an aging test fixture for a plastic package surface-mounted discrete semiconductor device, which comprises a bottom plate, a middle plate and a top plate, the bottom plate, the middle plate and the top plate are sequentially stacked, the bottom plate and the middle plate are jointly provided with a step mounting hole, a probe is mounted in the step mounting hole, and two ends of the probe respectively penetrate out of two ends of the step mounting hole; a positioning groove is formed in the top plate, a probe hole is formed in the bottom of the positioning groove, the upper end of the probe points to the probe hole, and a limiting mechanism is arranged on the bottom plate and used for fixing a device in the positioning groove; and flexible fixing and rapid fixing of the structure are improved, the working efficiency is improved, and convenience is provided for development of automatic aging feeding in the future.

Description

A molded surface mount semiconductor discrete device aging test fixture Technical Field

[0001] This utility model relates to the field of semiconductor device testing, and in particular to an aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices. Background Technology

[0002] An aging fixture is a device used for aging tests of electronic devices. Its function is to continuously perform repeated charge and discharge tests on electronic devices to verify the quality and performance of the devices. The aging fixtures on the market for plastic-encapsulated surface-mount semiconductor discrete devices are flip-top type. After opening the test cover, the plastic-encapsulated surface-mount semiconductor discrete device is manually placed into the fixture, and then the test cover is closed to fix it.

[0003] In the prior art, Chinese patent document CN 212392226U discloses an aging fixture for surface-mount devices, belonging to the field of surface-mount device clamping technology. This fixture includes a heat sink A, a heat sink B, and multiple clamping components. A heat dissipation component is provided on one side of the heat sink A, the heat sink B is mounted on the heat sink A, and the multiple clamping components are mounted on the heat sink B. The heat sink B is equipped with multiple clamping components, each used to clamp surface-mount devices of different models and specifications. Compared with batch aging of surface-mount devices, this method helps improve the efficiency of aging tests and the practicality of the fixture.

[0004] In most existing technologies, manual clamping of the cover and clamping of the device is required. This design is highly dependent on manual labor, slow to operate, and poses a great challenge to the future development of automated aging feeding. Summary of the Invention

[0005] To solve the above-mentioned technical problems, this utility model provides an aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices.

[0006] This utility model is achieved through the following technical solution.

[0007] This utility model provides an aging test fixture for surface-mount semiconductor discrete devices, including a base plate, a middle plate, and a top plate, which are stacked sequentially. The base plate and the middle plate are provided with stepped mounting holes, in which probes are installed, with the two ends of the probes extending out of the two ends of the stepped mounting holes respectively. The top plate is provided with a positioning groove, with a probe hole at the bottom of the positioning groove, and the upper end of the probe pointing to the probe hole. The base plate is provided with a limiting mechanism for fixing the device in the positioning groove.

[0008] Preferably, the limiting mechanism includes two metal bases arranged opposite each other, the metal bases are mounted on a base plate, a rotating shaft is rotatably connected to the metal bases, a metal claw is fixedly connected to the rotating shaft, the claw arm end of the metal claw is located in a positioning groove, and a pressing component is provided on the metal bases, the pressing component is used to make the metal claw rotate counterclockwise.

[0009] Preferably, the pressing assembly includes a pressing spring, a metal pressing block, and a connecting block. Both ends of the metal pressing block are provided with pressing springs. The end of the pressing spring away from the metal pressing block is fixedly connected to the upper surface of the metal base. One end of the connecting block is fixedly connected to the middle position of the metal pressing block, and the other end is rotatably connected to the end of the metal claw away from the claw arm end.

[0010] Preferably, guide grooves are provided at both ends of the upper surface of the metal base. The end of the pressing spring away from the metal pressure block is fixedly installed in the guide groove. A guide rod is passed through the pressing spring. One end of the guide rod is fixedly connected to the metal pressure block, and the other end extends into the guide groove.

[0011] Preferably, a telescopic spring is fixedly installed at each of the four corners of the middle plate, and the other end of the telescopic spring is fixedly installed on the lower end face of the top plate.

[0012] Preferably, the top plate has screws threaded through its four corners, and the middle plate has mounting grooves at its four corners. The end of the telescopic spring near the middle plate is fixedly installed at the bottom of the mounting groove, and the screws pass through the top plate and the telescopic spring in sequence and extend into the mounting groove.

[0013] Preferably, a positioning pin is connected to the middle plate, and a positioning hole is provided on the top plate, with the positioning pin engaging and fitting with the positioning hole.

[0014] Preferably, a positioning plate is installed in the middle of the middle plate, the positioning plate is aligned with the positioning groove in the vertical direction, and the upper end of the probe passes through the positioning plate and points to the probe hole.

[0015] The beneficial effects of this utility model are as follows:

[0016] 1. By placing the device in the positioning slot, the two metal claws press down on the device to fix it in place, while also ensuring good contact between the device and the probe. This prevents the device from shifting or loosening during the test, and ensures a reliable electrical connection between the probe and the device, thereby guaranteeing the accuracy of the measurement results.

[0017] 2. The device is fixed and unlocked by pressing the metal claw with a metal pressure block, eliminating the need for manual fixing. This improves the flexibility and speed of fixing the structure, increases work efficiency, and facilitates the future development of automated aging feeding. Attached Figure Description

[0018] Figure 1 is a structural schematic diagram of this utility model;

[0019] Figure 2 is a structural schematic diagram of the present invention, which is mainly used to display the base plate, middle plate, positioning plate and step mounting holes.

[0020] Figure 3 is a schematic diagram of the structure of this utility model, which is mainly used to display the top plate, positioning groove and probe hole;

[0021] Figure 4 is a structural schematic diagram of this utility model, which is mainly used to demonstrate some of the structures in the limiting mechanism.

[0022] Figure 5 is a structural schematic diagram of the present invention, mainly used to show the base plate, middle plate, top plate, telescopic spring and screw.

[0023] Figure 6 is a structural schematic diagram of some parts of the base plate and middle plate of this utility model;

[0024] Figure 7 is a schematic diagram of the structure of this utility model, which is mainly used to display the base plate and probe.

[0025] In the diagram: 1-Base plate; 2-Middle plate; 3-Top plate; 4-Step mounting hole; 5-Probe; 6-Positioning groove; 7-Metal base; 8-Rotating shaft; 9-Metal claw; 10-Pressing spring; 11-Metal pressure block; 12-Connecting block; 13-Guide groove; 14-Guide rod; 15-Telescopic spring; 16-Screw; 17-Mounting groove; 18-Positioning pin; 19-Positioning plate; 20-Pin shaft; 21-Probe hole; 22-Aging board mounting hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0028] In this embodiment, referring to Figures 1, 2, 3, and 6, the device includes a base plate 1, a middle plate 2, and a top plate 3, which are stacked sequentially. The base plate 1 and the middle plate 2 are provided with stepped mounting holes 4, and probes 5 are installed in the stepped mounting holes 4 to facilitate fixing the middle part of the probes 5 at the middle position of the stepped mounting holes 4. The two ends of the probes 5 protrude from the two ends of the stepped mounting holes 4, respectively. The top plate 3 is provided with a positioning groove 6, and the bottom of the positioning groove 6 is provided with probe holes 21. A positioning plate 19 is installed at the middle position of the middle plate 2. The positioning plate 19 is aligned with the positioning groove 6 in the vertical direction. The upper end of the probes 5 protrudes from the positioning plate 19 and points to the probe holes 21, so that when the device is placed into the positioning groove 6, the device can make precise contact with the probes 5.

[0029] In this embodiment, referring to Figures 1, 3, 4, and 7, a limiting mechanism is provided on the base plate 1. The limiting mechanism is used to fix the device in the positioning groove 6. The limiting mechanism includes two metal bases 7 arranged opposite each other. The base plate 1 is provided with mounting holes. The metal bases 7 are fixedly installed on the base plate 1 by bolts. The middle position of the metal base 7 is provided with a movable notch. A rotating shaft 8 is provided in the movable notch. The two ends of the rotating shaft 8 are respectively rotatably connected to the two side walls of the movable notch. A metal claw 9 is fixedly connected to the rotating shaft 8. The claw arm end of the metal claw 9 is located in the positioning groove 6. When the device is placed into the positioning groove 6, the metal claw 9 abuts against the device under natural gravity, fixing the device in the positioning groove 6.

[0030] In this embodiment, referring to FIG4, a pressing component is provided on the metal base 7. The pressing component is used to rotate the metal claw 9 counterclockwise to unlock the device, thereby facilitating the picking and putting away of the device.

[0031] The pressing assembly includes a pressing spring 10, a metal pressure block 11, and a connecting block 12. One end of the connecting block 12 is fixedly connected to the middle position of the metal pressure block 11. A pin 20 is installed on the end of the metal claw 9 away from the claw arm end. The other end of the connecting block 12 is rotatably connected to the pin 20. Pressing springs 10 are provided at both ends of the metal pressure block 11, and one end of the pressing spring 10 is fixedly connected to the metal pressure block 11. Guide grooves 13 are provided at both ends of the upper surface of the metal base 7. The end of the pressing spring 10 away from the metal pressure block 11 is fixedly installed in the guide groove 13. A guide rod 14 passes through the pressing spring 10. One end of the guide rod 14 is fixedly connected to the metal pressure block 11, and the other end extends into the guide groove 13. There is a space between the end of the guide rod 14 extending into the guide groove 13 and the bottom of the guide groove 13. The guide rod 14 limits and guides the pressing spring 10, preventing excessive deformation of the pressing spring 10 during extension and retraction, and providing protection for the pressing spring 10.

[0032] The same metal pressure block 11 is supported by two pressing springs 10. Pressing the metal pressure block 11 compresses the pressing springs 10, which in turn pushes the end of the metal claw 9 away from the claw arm downward through the connecting block 12. The metal claw 9 rotates counterclockwise as a whole, so that the claw arm of the metal claw 9 moves out of the positioning groove 6, making it convenient to pick up and put down the device.

[0033] In this embodiment, referring to Figures 5 and 6, telescopic springs 15 are fixedly installed at the four corners of the middle plate 2. The other end of the telescopic springs 15 is fixedly installed on the lower end face of the top plate 3. Screws 16 are threaded through the four corners of the top plate 3. Mounting grooves 17 are opened at the four corners of the middle plate 2. The end of the telescopic spring 15 near the middle plate 2 is fixedly installed at the bottom of the mounting groove 17. The screws 16 pass through the top plate 3 and the telescopic spring 15 in sequence and extend into the mounting groove 17. There is a space between the end of the screw 16 extending into the mounting groove 17 and the bottom of the mounting groove 17, so that the screw 16 has a protective and guiding function for the telescopic spring 15, thereby realizing the connection between the top plate 3 and the middle plate 2. The telescopic spring 15 is in a compressed state. At this time, the device is in contact with the upper end of the probe 5, realizing effective contact between the device and the probe 5. Under the elastic action of the telescopic spring 15, excessive contact between the probe 5 and the device is avoided, which may cause damage to the device. It has a protective function for the device and the probe 5 and avoids poor contact during the test as much as possible.

[0034] In this embodiment, referring to FIG6, a positioning pin 18 is connected to the middle plate 2, and a positioning hole is provided on the top plate 3. The positioning pin 18 is engaged with the positioning hole to facilitate the precise positioning and installation of the top plate 3 on the middle plate 2.

[0035] In this embodiment, referring to FIG7, an aging board mounting hole 22 is provided on the base plate 1. The base plate 1 is mounted on the aging board by means of bolts passing through the aging board mounting hole 22 and threadedly connecting to the aging board.

[0036] The working principle of this embodiment is as follows: By applying pressure to press down the metal pressure block 11, the spring 10 is compressed elastically, causing the metal pressure block 11 to drive the connecting block 12 to move downward. The connecting block 12 pushes the end of the metal claw 9 away from the claw arm end downward, causing the metal claw 9 to move counterclockwise as a whole. This causes the claw arm end of the metal claw 9 to move away from the positioning groove 6, and the two metal claws 9 are in an open state. After the device is placed into the positioning groove 6, no more pressure is applied to the metal pressure block 11, and the end of the metal claw 9 away from the claw arm end is no longer under pressure. The claw arm end of the metal claw 9 enters the positioning groove 6 under natural gravity and presses the device, so that the device and the probe 5 make contact and achieve good circuit contact. Finally, the overall structure is welded onto the aging board, and the aging board is placed in the aging table to perform aging test on the device, so that the probe 5 and the device make reliable electrical connection to ensure the accuracy of the measurement results.

[0037] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. An aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices, characterized in that: The device includes a base plate (1), a middle plate (2), and a top plate (3). The base plate (1), the middle plate (2), and the top plate (3) are stacked in sequence. The base plate (1) and the middle plate (2) are provided with stepped mounting holes (4). A probe (5) is installed in the stepped mounting holes (4). The two ends of the probe (5) protrude from the two ends of the stepped mounting holes (4). The top plate (3) is provided with a positioning groove (6). A probe hole (21) is opened at the bottom of the positioning groove (6). The upper end of the probe (5) points to the probe hole (21). The base plate (1) is provided with a limiting mechanism. The limiting mechanism is used to fix the device in the positioning groove (6).

2. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 1, characterized in that: The limiting mechanism includes two metal bases (7) arranged opposite to each other. The metal bases (7) are mounted on the base plate (1). A rotating shaft (8) is rotatably connected to the metal bases (7). A metal claw (9) is fixedly connected to the rotating shaft (8). The claw arm end of the metal claw (9) is located in the positioning groove (6). A pressing component is provided on the metal bases (7). The pressing component is used to make the metal claw (9) rotate counterclockwise.

3. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 2, characterized in that: The pressing assembly includes a pressing spring (10), a metal pressing block (11), and a connecting block (12). Both ends of the metal pressing block (11) are provided with pressing springs (10). The end of the pressing spring (10) away from the metal pressing block (11) is fixedly connected to the upper surface of the metal base (7). One end of the connecting block (12) is fixedly connected to the middle position of the metal pressing block (11), and the other end is rotatably connected to the end of the metal claw (9) away from the claw arm end.

4. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 3, characterized in that: The metal base (7) has guide grooves (13) on both ends of its upper surface. The end of the pressing spring (10) away from the metal pressure block (11) is fixedly installed in the guide groove (13). A guide rod (14) passes through the pressing spring (10). One end of the guide rod (14) is fixedly connected to the metal pressure block (11), and the other end extends into the guide groove (13).

5. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 1, characterized in that: Telescopic springs (15) are fixedly installed at the four corners of the middle plate (2), and the other end of the telescopic springs (15) is fixedly installed on the lower end face of the top plate (3).

6. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 5, characterized in that: The top plate (3) has screws (16) threaded through its four corners, and the middle plate (2) has mounting grooves (17) at its four corners. The end of the telescopic spring (15) near the middle plate (2) is fixedly installed at the bottom of the mounting groove (17). The screws (16) pass through the top plate (3) and the telescopic spring (15) in sequence and extend into the mounting groove (17).

7. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 1, characterized in that: The middle plate (2) is connected to a positioning pin (18), and the top plate (3) is provided with a positioning hole. The positioning pin (18) is engaged with the positioning hole.

8. The aging test fixture for plastic-encapsulated surface-mount semiconductor discrete devices as described in claim 1, characterized in that: A positioning plate (19) is installed in the middle of the middle plate (2). The positioning plate (19) is aligned with the positioning groove (6) in the vertical direction. The upper end of the probe (5) passes through the positioning plate (19) and points to the probe hole (21).

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