Server with multiple heat dissipation modes

Abstract

The utility model belongs to the technical field of servers, and discloses a server with multiple heat dissipation modes, which comprises a server box body, an integrated circuit board, a graphic processing assembly and a storage module, the front end of the server box body is connected with a box door through a hinge, the right side end of the box door is connected with a lock catch, the integrated circuit board is fixed on the inner wall of the server box body, and the graphic processing assembly is connected with the integrated circuit board. A graphic processing assembly is installed at the front end of the integrated circuit board, a storage module is connected to the right side of the integrated circuit board, a cooling fan is arranged on the left side of the server box body, and a flow guide fan is arranged on the right side of the server box body. The server is provided with multiple heat dissipation modes; in order to meet the requirement for stable operation of equipment under high-load operation, a multi-heat-dissipation mode combining air cooling and water cooling is adopted in the design innovation, independent temperature control over the mainboard and the image processing assembly can be achieved, stable operation during high-load operation is kept, the multi-heat-dissipation structure operates relatively independently, practicability and reliability are achieved, heat dissipation can be conducted in a targeted mode, and the service life of the equipment is prolonged. And the heat dissipation effect is more ideal.

Description

Technical Field

[0001] This utility model relates to the field of server technology, specifically to a server with multiple heat dissipation modes. Background Technology

[0002] A server is a type of computer that runs faster, handles higher loads, and is more expensive than a regular computer. In a network, a server provides computing or application services to other client machines (such as PCs, smartphones, ATMs, and even large equipment like train systems). Servers possess high-speed CPU processing power, long-term reliable operation, powerful I / O external data throughput capabilities, and better scalability. Depending on the services provided, servers generally have the ability to respond to service requests, provide services, and ensure service availability.

[0003] An existing overheat-resistant server enclosure and server, as described in Chinese patent application number CN202120975843.9, includes a server enclosure with ventilation openings and a mounting base on one side. A display screen is fixedly mounted in the center of the mounting base, and an alarm is fixedly mounted on one side of the front of the display screen. A high-definition dust cover is fixedly mounted on one side of the mounting base, with dustproof holes corresponding to the alarm on the dust cover. An integrated motherboard is fixedly mounted on one side inside the server enclosure. Temperature sensors and heat dissipation devices are mounted on both sides of the integrated motherboard. A CPU and multiple memory modules are mounted on the surface of the integrated motherboard. The temperature sensors are electrically connected in series with the display screen via connecting wires. Although the existing server has a certain heat dissipation capacity, with the development of AI, cloud computing and other fields, servers need to rely on core computing. The existing equipment does not have an independent heat dissipation structure, resulting in unsatisfactory reliability and overall temperature control.

[0004] Therefore, we propose a server with multiple cooling modes to address the issues mentioned above. Utility Model Content

[0005] The purpose of this invention is to provide a server with multiple heat dissipation modes to solve the problem mentioned in the background art that existing servers do not have independent heat dissipation structures for core computing components, making it difficult to effectively cool them down when performing high-power operations such as AI and cloud computing resets.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a server with multiple heat dissipation modes, comprising a server chassis, an integrated circuit board, a graphics processing component, and a storage module:

[0007] The server chassis is hinged to a door at the front end, and a latch is connected to the right side of the door. An integrated circuit board is fixed to the inner wall of the server chassis, and a graphics processing component is installed at the front end of the integrated circuit board. A storage module is connected to the right side of the integrated circuit board.

[0008] A cooling fan is installed on the left side of the server chassis, and a guide fan is installed on the right side of the server chassis. A positioning tube is fixed at the bottom of the server chassis, and a threaded rod is connected to the lower end of the positioning tube. The lower end of the threaded rod is connected to a support base.

[0009] A heat exchange plate is provided on the rear side of the integrated circuit board, and fins are connected to the rear side of the heat exchange plate.

[0010] Preferably, the first dust filter is snapped onto the left side of the server chassis, and the left side of the first dust filter is fixed to the cooling fan, which is arrayed on the left side of the graphics processing unit.

[0011] Using the above technical solution, targeted heat dissipation can be achieved by the cooling fan corresponding to the left side of the graphics processing component. External air is delivered to the inside of the server chassis and flows through the graphics processing component. The air flow carries heat to achieve rapid heat dissipation, while the design of the first dust filter can prevent dust from entering the inside of the server chassis.

[0012] Preferably, the airflow fan is snapped into place inside the server chassis, and a mounting frame is snapped into place on the right side of the server chassis, with a second dust filter connected inside the mounting frame.

[0013] By adopting the above technical solution, and through the design of multiple sets of airflow guiding fans in conjunction with the cooling fans, rapid air circulation inside the server chassis is achieved, further improving the air cooling effect.

[0014] Preferably, the lower end of the positioning tube is threadedly connected to the threaded rod, and the lower end of the threaded rod is hexagonal in design. The lower end of the threaded rod is rotatably connected to the support seat, and the support seat is made of rubber.

[0015] By adopting the above technical solution, the height of the support can be adjusted through the cooperation of the positioning tube and the threaded rod, which can maintain the stability of the server during use, and the rubber support can improve the anti-slip effect.

[0016] Preferably, the heat exchange plate is bolted to the integrated circuit board, and the rear side of the integrated circuit board is in contact with the heat exchange plate. Both the fins and the heat exchange plate are made of aluminum alloy, and the fins are distributed in an equidistant array.

[0017] By adopting the above technical solution, the heat absorption of the integrated circuit board can be achieved through the design of heat exchange plate and fins. The fins can increase the contact area with air and improve the heat dissipation effect.

[0018] Preferably, a liquid storage tank is provided at the lower end of the heat exchange plate, and the liquid storage tank is fixed to the inner wall of the server chassis. A micro water pump is installed at the upper end of the liquid storage tank, and the inlet end of the micro water pump is connected to the liquid storage tank. The outlet end of the micro water pump is connected to an outlet pipe, and the upper end of the outlet pipe is connected to the lower end of the circulation tank. A return pipe is connected to the upper end of the circulation tank, and the lower end of the return pipe is connected to the liquid storage tank.

[0019] Using the above technical solution, a micro water pump can drive the coolant to flow from the outlet pipe into the circulation tank. When the coolant flows inside the circulation tank, it can absorb heat from the heat exchange plate and flow back into the storage tank. The continuously circulating coolant can achieve rapid cooling of the integrated circuit board.

[0020] Compared with the prior art, the beneficial effects of this utility model are: This multi-heat dissipation server; in order to meet the stable operation requirements of the equipment under high load, this design innovatively adopts a multi-heat dissipation mode that combines air cooling and water cooling, which can realize independent temperature control of the motherboard and image processing components, maintain stable operation under high load, and the multi-heat dissipation structure operates relatively independently, which is practical and reliable, and can perform targeted heat dissipation, resulting in a more ideal heat dissipation effect; Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of this utility model;

[0023] Figure 3 This is a schematic diagram of the mounting frame and the second dust filter structure of this utility model;

[0024] Figure 4 This is a schematic diagram of the positioning tube and threaded rod structure of this utility model;

[0025] Figure 5 This is a schematic diagram of the heat exchange plate and fin structure of this utility model;

[0026] Figure 6 This is a schematic diagram of the heat exchange plate and circulation tank structure of this utility model.

[0027] In the diagram: 1. Server chassis; 2. Chassis door; 3. Integrated circuit board; 4. Graphics processing component; 5. Storage module; 6. First dust filter; 7. Cooling fan; 8. Airflow fan; 9. Mounting frame; 10. Second dust filter; 11. Positioning tube; 12. Threaded rod; 13. Support base; 14. Heat exchange plate; 15. Fins; 16. Circulation tank; 17. Liquid storage tank; 18. Miniature water pump; 19. Liquid outlet pipe; 20. Return pipe. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figure 1-6 This utility model provides a technical solution: a server with multiple heat dissipation modes, including a server chassis 1, an integrated circuit board 3, a graphics processing component 4, and a storage module 5. The server chassis 1 is hinged to a door 2 at its front end, and a latch is connected to the right side of the door 2. The integrated circuit board 3 is fixed to the inner wall of the server chassis 1, and the graphics processing component 4 is mounted on the front end of the integrated circuit board 3. The storage module 5 is connected to the right side of the integrated circuit board 3. In use, the integrated circuit board 3, graphics processing component 4, and storage module 5 are installed inside the server chassis 1 for protection. The door 2 is designed for easy disassembly and maintenance. The integrated circuit board 3 houses components such as a central processing unit, and connects the storage module 5 and graphics processing component 4 to the integrated circuit board 3. The integrated circuit board 3 is fixed to the inner wall of the chassis, serving as a hardware connection hub and providing power transmission and data communication buses. The graphics processing component 4 is mounted on the front end of the motherboard and connected to the motherboard via a PCIe slot, responsible for graphics rendering and high-performance computing, such as AI training and video processing. The storage module 5 is connected to the right side of the motherboard, transmitting data via a SATA interface, and is used to store the operating system, applications, and user data.

[0030] A cooling fan 7 is installed on the left side of the server chassis 1, and a guide fan 8 is installed on the right side of the server chassis 1. A first dust filter 6 is snapped into the left side of the server chassis 1, and the left side of the first dust filter 6 is fixed to the cooling fan 7. The cooling fan 7 is arrayed on the left side of the graphics processing component 4. The guide fan 8 is snapped into the inside of the server chassis 1, and a mounting frame 9 is snapped into the right side of the server chassis 1. A second dust filter 10 is connected inside the mounting frame 9. When the server is running, the cooling fan 7 starts. The cooling fan 7 is installed in a position corresponding to the graphics processing unit 4, and can directly deliver external air into the server chassis 1. The air flows through the gaps in the graphics processing unit 4, carrying away the heat generated by the graphics processing unit 4, ensuring stable and reliable operation and avoiding overheating during high-load operation. At the same time, the air guide fan 8 is set on the right side of the server chassis 1. The multiple air guide fans 8 work together with the cooling fan 7 to realize rapid air circulation inside the server chassis 1, further improving the air cooling effect. When the air flows inside the server chassis 1, the first dust filter 6 and the second dust filter 10 work together to block dust, preventing dust from entering the server chassis 1 and causing short circuits or other malfunctions.

[0031] The bottom of the server chassis 1 is fixed with a positioning tube 11, and the lower end of the positioning tube 11 is connected to a threaded rod 12, and the lower end of the threaded rod 12 is connected to a support base 13. The lower end of the positioning tube 11 is threadedly connected to the threaded rod 12, and the lower end of the threaded rod 12 is hexagonal. The lower end of the threaded rod 12 is rotatably connected to the support base 13, and the support base 13 is made of rubber. Through the cooperation of the positioning tube 11, the threaded rod 12 and the support base 13, the server chassis 1 can be supported. The height of the support base 13 can be adjusted by rotating the threaded rod 12 to keep the server chassis 1 stable. The rubber support base 13 can further improve the stability of the placement.

[0032] A heat exchange plate 14 is provided on the rear side of the integrated circuit board 3, and fins 15 are connected to the rear side of the heat exchange plate 14. The heat exchange plate 14 is bolted to the integrated circuit board 3, and the rear side of the integrated circuit board 3 is in close contact with the heat exchange plate 14. Both the fins 15 and the heat exchange plate 14 are made of aluminum alloy, and the fins 15 are distributed in an equidistant array. A liquid storage tank 17 is provided at the lower end of the heat exchange plate 14. The liquid storage tank 17 is fixed to the inner wall of the server housing 1. A micro water pump 18 is installed at the upper end of the liquid storage tank 17, and the liquid inlet of the micro water pump 18 is connected to the liquid storage tank 17. The liquid outlet of the micro water pump 18 is connected to the liquid outlet pipe 19, and the upper end of the liquid outlet pipe 19 is connected to the lower end of the circulation tank 16. The upper end of the circulation tank 16 is connected to the return pipe 20, and the lower end of the return pipe 20 is connected to the liquid storage tank 17. The heat exchange plate 14 absorbs the heat generated by the integrated circuit board 3. Multiple fins 15 increase the contact area with air, improving heat dissipation efficiency. Combined with a liquid-cooled circulation structure, the heat dissipation effect is further enhanced. A micro water pump 18 draws coolant from the storage tank 17 and delivers it to the circulation tank 16 via the outlet pipe 19. The coolant carries most of the heat as it flows through the circulation tank 16 and returns to the storage tank 17 via the return pipe 20, mixing with the liquid inside. Because the storage tank 17 contains a large amount of coolant, the temperature rises slowly. A fan structure is also included to maintain efficient heat dissipation.

[0033] This completes a series of tasks. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A server with multiple heat dissipation modes, comprising a server chassis (1), an integrated circuit board (3), a graphics processing component (4), and a storage module (5), characterized in that: The server chassis (1) is hinged to a door (2) at the front end, and a latch is connected to the right side of the door (2). An integrated circuit board (3) is fixed to the inner wall of the server chassis (1), and a graphics processing component (4) is installed at the front end of the integrated circuit board (3). A storage module (5) is connected to the right side of the integrated circuit board (3). A cooling fan (7) is provided on the left side of the server chassis (1), and a guide fan (8) is provided on the right side of the server chassis (1). A positioning tube (11) is fixed at the bottom of the server chassis (1), and a threaded rod (12) is connected to the lower end of the positioning tube (11), and a support base (13) is connected to the lower end of the threaded rod (12). A heat exchange plate (14) is provided on the rear side of the integrated circuit board (3), and fins (15) are connected to the rear side of the heat exchange plate (14).

2. The server of multiple heat dissipation modes according to claim 1, wherein: The server chassis (1) is connected to the first dust filter (6) on the left side, and the first dust filter (6) is fixed to the cooling fan (7) on the left side. The cooling fan (7) is arranged in an array on the left side of the graphics processing component (4).

3. The server of multiple heat dissipation modes according to claim 1, wherein: The airflow fan (8) is snapped into the inside of the server chassis (1), and the right side of the server chassis (1) is snapped into the mounting frame (9), and the inside of the mounting frame (9) is connected to the second dust filter (10).

4. A server with multiple heat dissipation modes according to claim 1, characterized in that: The lower end of the positioning tube (11) is threadedly connected to the threaded rod (12), and the lower end of the threaded rod (12) is hexagonal. The lower end of the threaded rod (12) is rotatably connected to the support seat (13), and the support seat (13) is made of rubber.

5. A server with multiple heat dissipation modes according to claim 1, characterized in that: The heat exchange plate (14) is bolted to the integrated circuit board (3), and the rear side of the integrated circuit board (3) is attached to the heat exchange plate (14). The fins (15) and the heat exchange plate (14) are both made of aluminum alloy, and the fins (15) are distributed in an equidistant array.

6. A server with multiple heat dissipation modes according to claim 1, characterized in that: A liquid storage tank (17) is provided at the lower end of the heat exchange plate (14). The liquid storage tank (17) is fixed to the inner wall of the server housing (1). A micro water pump (18) is installed at the upper end of the liquid storage tank (17). The inlet end of the micro water pump (18) is connected to the liquid storage tank (17). The outlet end of the micro water pump (18) is connected to an outlet pipe (19). The upper end of the outlet pipe (19) is connected to the lower end of the circulation tank (16). The upper end of the circulation tank (16) is connected to a return pipe (20). The lower end of the return pipe (20) is connected to the liquid storage tank (17).

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