Efficient heat dissipation structure for computer GPU (Graphics Processing Unit)
By combining heat-conducting blocks with air cooling and semiconductor heat dissipation components, the heat dissipation problem of GPUs under high load is solved, achieving efficient heat dissipation and stable operation, and preventing condensation from damaging electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHENGZHOU UNIVERSITY OF LIGHT INDUSTRY
- Filing Date
- 2025-02-17
- Publication Date
- 2026-05-01
AI Technical Summary
Existing air-cooling methods are insufficient to meet the heat dissipation requirements when the GPU is under high load, resulting in excessively high temperatures that affect performance and lifespan.
It adopts a combination of heat-conducting blocks, air-cooled heat dissipation components, and semiconductor heat dissipation components. The heat-conducting blocks absorb the heat of the GPU chip, and the air-cooling and semiconductor cooling chips are used for dual cooling. Combined with the sealing cover and pipe design, it prevents condensation from dripping.
It achieves efficient GPU heat dissipation, ensures stable operation, prevents condensation from damaging electronic components, and improves heat dissipation efficiency.
Smart Images
Figure CN224190468U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of computer technology, specifically to a high-efficiency heat dissipation structure for computer GPUs. Background Technology
[0002] GPUs generate a significant amount of heat during high-speed computation. If this heat is not dissipated effectively and promptly, it can lead to overheating. Excessive heat not only drastically reduces GPU performance, causing stuttering and frame drops, thus impacting user experience, but can also cause permanent damage to internal electronic components, shortening the GPU's lifespan. Current commercially available graphics cards primarily use air cooling, typically employing a fan and heatsink configuration. However, air cooling has limited efficiency and struggles to meet the cooling demands of prolonged high-load GPU operation. Utility Model Content
[0003] The purpose of this invention is to provide a high-efficiency heat dissipation structure for computer GPUs in order to solve the above-mentioned problems, as detailed below.
[0004] To achieve the above objectives, the present invention provides the following technical solution:
[0005] This utility model provides a high-efficiency heat dissipation structure for a computer GPU, including an air-cooled heat dissipation component and a graphics card. A heat-conducting block is mounted on the graphics card via a connecting bracket, and the heat-conducting block is attached to the GPU chip of the graphics card with thermal grease. The air-cooled heat dissipation component is mounted on the heat-conducting block for heat dissipation.
[0006] The surface of the heat-conducting block is provided with a semiconductor heat dissipation component, which includes a semiconductor cooling chip for reducing the surface temperature of the heat-conducting block.
[0007] The aforementioned efficient heat dissipation structure for computer GPUs absorbs heat from the GPU chip through a heat-conducting block. By combining air-cooled heat dissipation components with semiconductor heat dissipation components, the heat-conducting block can be cooled in two ways, achieving efficient heat dissipation for the GPU chip.
[0008] Preferably, the air-cooled heat dissipation component includes a plurality of heat pipes, which are disposed through the heat-conducting block and are fixedly connected to a heat sink. A fan is fixedly connected to the heat-conducting block, and the fan corresponds to the heat sink.
[0009] Preferably, a heat-conducting plate is provided inside the heat-conducting pipe, and a fan is connected to the same end of several heat-conducting pipes through a connecting cover.
[0010] Preferably, the end of the heat pipe away from the second fan is connected to an extension pipe, and the length of the extension pipe is parallel to the length direction of the first heat sink.
[0011] Preferably, the semiconductor heat dissipation component includes a sealing cover, which is fixedly connected to the heat-conducting block. A semiconductor cooling chip is disposed inside the sealing cover, and the heating surface of the semiconductor cooling chip passes through the sealing cover. A heat-conducting component is disposed on the heating surface of the semiconductor cooling chip, and the heat-conducting component corresponds to the fan.
[0012] Preferably, the heat-conducting component includes a second heat-conducting sheet, which is fixedly connected to the heating surface of the semiconductor cooling chip, and several second heat sinks are horizontally fixedly connected to the second heat-conducting sheet.
[0013] Preferably, a number of heat-conducting rods are fixedly connected to the cooling surface of the semiconductor refrigeration chip, and a number of insertion holes are opened on the heat-conducting block, with the heat-conducting rods being inserted into the insertion holes.
[0014] Preferably, the bottom of the sealing cover is connected to a pipe for conveying condensate, the sealing cover is made of heat-insulating material, and the surface of the sealing cover is provided with a water-absorbing sponge layer.
[0015] The beneficial effects are:
[0016] 1. By absorbing the heat of the GPU chip through the heat-conducting block, and through the cooperation of the air-cooling heat dissipation component and the semiconductor heat dissipation component, the heat-conducting block can be cooled in two ways, so as to achieve efficient heat dissipation of the GPU chip and enable the GPU to run stably under continuous high load.
[0017] 2. The use of a sealed cover and piping can prevent condensation from dripping into the chassis and damaging electronic components;
[0018] 3. By using fan two to make airflow flow inside the heat pipe, the heat dissipation effect of the air-cooled heat dissipation component can be further improved. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a front view structural diagram of the present invention;
[0021] Figure 2 This is a top view of the structure of this utility model;
[0022] Figure 3 This is a schematic diagram of the exploded structure of this utility model;
[0023] Figure 4This is a three-dimensional structural diagram of the heat-conducting component of this utility model;
[0024] Figure 5 This is a three-dimensional structural diagram of the semiconductor cooling chip of this utility model;
[0025] Figure 6 This is a front view structural diagram of the heat-conducting block of this utility model.
[0026] The annotations in the attached figures are explained as follows:
[0027] 1. Air-cooled heat dissipation assembly; 2. Graphics card; 3. Heatsink; 4. GPU chip; 5. Connector; 6. Semiconductor heat dissipation assembly; 7. Heat pipe; 8. Heatsink 1; 9. Heatsink 1; 10. Fan 1; 11. Fan 2; 12. Connecting cover; 13. Extension tube; 14. Heatsink assembly; 15. Heatsink 2; 16. Heatsink 2; 17. Sealing cover; 18. Semiconductor cooling chip; 19. Pipe; 20. Heatsink rod; 21. Socket; 22. Absorbent sponge layer. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0029] See Figures 1-6 As shown, this utility model provides a high-efficiency heat dissipation structure for a computer GPU, including a wind-cooled heat dissipation component 1 and a graphics card 2. A heat-conducting block 3 is mounted on the graphics card 2 via a connecting bracket 5, and the heat-conducting block 3 is attached to the GPU chip 4 of the graphics card 2 with thermal grease. The wind-cooled heat dissipation component 1 is mounted on the heat-conducting block 3 for heat dissipation of the heat-conducting block 3.
[0030] A semiconductor heat dissipation component 6 is provided on the surface of the heat conduction block 3. The semiconductor heat dissipation component 6 includes a semiconductor cooling chip 18 for reducing the surface temperature of the heat conduction block 3.
[0031] As an optional implementation, the air-cooled heat dissipation assembly 1 includes a plurality of heat pipes 7, which are disposed through the heat-conducting block 3, and a heat sink 8 is fixedly connected to the heat pipe 7. A fan 10 is fixedly connected to the heat-conducting block 3, and the fan 10 corresponds to the heat sink 8. The heat pipes 7 transfer the heat of the heat-conducting block 3 to the heat sink 8, and the fan 10 transfers the heat of the heat sink 8 to the environment.
[0032] A heat-conducting plate 9 is provided inside the heat pipe 7, and a fan 11 is connected to the same end of several heat pipes 7 through a connecting cover 12. The heat-conducting plate 9 can increase the heat conduction area of the heat pipe 7. The airflow is made to flow inside the heat pipe 7 by the fan 11, which can further improve the heat dissipation effect of the air-cooled heat dissipation component 1.
[0033] The end of the heat pipe 7 away from the fan 11 is connected to an extension pipe 13, and the length of the extension pipe 13 is parallel to the length direction of the heat sink 8. The extension pipe 13 is set so that the airflow direction in the heat pipe 7 is consistent with the airflow direction pushed by the fan 10. This can avoid turbulence and facilitate the distribution of air channels inside the chassis.
[0034] The semiconductor heat dissipation assembly 6 includes a sealing cover 17, which is fixedly connected to the heat-conducting block 3. A semiconductor cooling chip 18 is disposed inside the sealing cover 17, and the heating surface of the semiconductor cooling chip 18 passes through the sealing cover 17. The semiconductor cooling chip 18 and the sealing cover 17 are sealed together. A heat-conducting component 14 is disposed on the heating surface of the semiconductor cooling chip 18, and the heat-conducting component 14 corresponds to the fan 10.
[0035] The heat-conducting component 14 includes a second heat-conducting sheet 15, which is fixedly connected to the heating surface of the semiconductor cooling chip 18. Several heat sinks 16 are horizontally fixedly connected to the second heat-conducting sheet 15. The fan 10, in cooperation with the heat-conducting component 14, can dissipate heat from the heating surface of the semiconductor cooling chip 18.
[0036] A number of heat-conducting rods 20 are fixedly connected to the cooling surface of the semiconductor refrigeration chip 18, and a number of insertion holes 21 are provided on the heat-conducting block 3. The heat-conducting rods 20 are inserted into the insertion holes 21. The heat exchange area between the semiconductor refrigeration chip 18 and the heat-conducting block 3 can be increased by the cooperation of the heat-conducting rods 20 and the insertion holes 21.
[0037] The bottom of the sealing cover 17 is connected to a pipe 19 for conveying condensate. The outlet of the pipe 19 should be located outside the chassis to prevent the condensate from contacting the electronic components inside the chassis. The sealing cover 17 is made of heat-insulating material, and the surface of the sealing cover 17 is provided with a water-absorbing sponge layer 22. The water-absorbing sponge layer 22 can prevent condensate droplets from forming on the surface of the sealing cover 17.
[0038] With the above structure, the heat of the GPU chip 4 is absorbed by the heat-conducting block 3, and the heat is cooled by the air-cooled heat dissipation component 1 and the semiconductor heat dissipation component 6, so that the heat-conducting block 3 can be cooled in two ways, thus achieving efficient heat dissipation of the GPU chip 4.
[0039] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.
Claims
1. A high-efficiency heat dissipation structure for a computer GPU, characterized in that: The device includes a heat dissipation assembly (1) and a graphics card (2). A heat-conducting block (3) is mounted on the graphics card (2) via a connecting bracket (5). The heat-conducting block (3) is attached to the GPU chip (4) of the graphics card (2) via thermal grease. The heat dissipation assembly (1) is mounted on the heat-conducting block (3) for dissipating heat from the heat-conducting block (3). The surface of the heat-conducting block (3) is provided with a semiconductor heat dissipation component (6), which includes a semiconductor cooling chip (18) for reducing the surface temperature of the heat-conducting block (3).
2. The high-efficiency heat dissipation structure for a computer GPU according to claim 1, characterized in that: The air-cooled heat dissipation component (1) includes several heat pipes (7), which are installed through the heat-conducting block (3) and a heat sink (8) is fixedly connected to the heat pipe (7). A fan (10) is fixedly connected to the heat-conducting block (3), and the fan (10) corresponds to the heat sink (8).
3. The high-efficiency heat dissipation structure for a computer GPU according to claim 2, characterized in that: The heat pipe (7) is provided with a heat-conducting plate (9), and the same end of several heat pipes (7) is connected to a fan (11) through a connecting cover (12).
4. The high-efficiency heat dissipation structure for a computer GPU according to claim 3, characterized in that: The end of the heat pipe (7) away from the fan (11) is connected to an extension pipe (13), and the length of the extension pipe (13) is parallel to the length direction of the heat sink (8).
5. The high-efficiency heat dissipation structure for a computer GPU according to claim 2, characterized in that: The semiconductor heat dissipation assembly (6) includes a sealing cover (17), which is fixedly connected to the heat-conducting block (3). A semiconductor cooling chip (18) is disposed inside the sealing cover (17), and the heating surface of the semiconductor cooling chip (18) passes through the sealing cover (17). A heat-conducting component (14) is disposed on the heating surface of the semiconductor cooling chip (18), and the heat-conducting component (14) corresponds to the fan (10).
6. The high-efficiency heat dissipation structure for a computer GPU according to claim 5, characterized in that: The heat-conducting component (14) includes a second heat-conducting sheet (15), which is fixedly connected to the heating surface of the semiconductor cooling chip (18), and several second heat sinks (16) are horizontally fixedly connected to the second heat-conducting sheet (15).
7. The high-efficiency heat dissipation structure for a computer GPU according to claim 5, characterized in that: A number of heat-conducting rods (20) are fixedly connected to the cooling surface of the semiconductor cooling chip (18), and a number of insertion holes (21) are opened on the heat-conducting block (3), and the heat-conducting rods (20) are inserted into the insertion holes (21).
8. The high-efficiency heat dissipation structure for a computer GPU according to claim 5, characterized in that: The bottom of the sealing cover (17) is connected to a pipe (19) for conveying condensate. The sealing cover (17) is made of heat-insulating material and the surface of the sealing cover (17) is provided with a water-absorbing sponge layer (22).