Thin film capacitor with good heat conduction effect

By introducing a combination structure of heat-conducting plates, heat-conducting sheets, and heat-conducting strips into the film capacitor, the aging and breakdown problems of film capacitors at high temperatures are solved, achieving good thermal conductivity and stable capacitance performance.

CN224190810UActive Publication Date: 2026-05-01JIANGSU SHOUYI PRECISION MANUFACTURING CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU SHOUYI PRECISION MANUFACTURING CO LTD
Filing Date
2025-04-27
Publication Date
2026-05-01

AI Technical Summary

Technical Problem

Existing film capacitors are prone to aging or breakdown at high temperatures, causing sealed film capacitors to swell or burst, affecting capacitance performance.

Method used

The structure adopts a first-side heat-conducting plate, a second-side heat-conducting plate, and heat-conducting sheets. The combination of heat-conducting sheets and heat-conducting plates improves the heat conduction effect of the core package. Heat-conducting strips and groove structures accelerate heat dissipation. Combined with the support base and outer support frame, the overall support and ventilation are provided to prevent the temperature from rising.

Benefits of technology

It effectively prevents film capacitors from bulging or bursting due to temperature rise, improves the heat dissipation efficiency and service life of capacitors, and ensures the stability of capacitor performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a thin-film capacitor with a good heat conduction effect. The thin-film capacitor comprises a thin-film sealing shell; the beneficial effects of the utility model are that through the arrangement of the first side heat conduction plate, the first side heat conduction sheet, the second side heat conduction plate and the second side heat conduction sheet, the heat conduction processing of the first side heat conduction sheet and the second side heat conduction sheet on the core package is realized; heat is conducted out through a first side heat conduction plate, a first side heat conduction strip, a second side heat conduction plate and a second side heat conduction strip, so that the heat conduction effect of the core package is improved, and the condition of swelling or bursting caused by the rise of the internal temperature is avoided; a plurality of first side grooves are formed in one side of the first side heat conduction plate and one side of the first side heat conduction sheet, a plurality of second side grooves are formed in one side of the second side heat conduction plate and one side of the second side heat conduction sheet, and the heat dissipation efficiency is improved.
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Description

A thin-film capacitor with good thermal conductivity Technical Field

[0001] This utility model relates to the field of thin film capacitor technology, specifically a thin film capacitor with good thermal conductivity. Background Technology

[0002] Film capacitors are capacitors made using plastic film as the dielectric through winding or lamination processes. They are characterized by small size, high voltage withstand, good frequency characteristics, and long lifespan. They consist of two layers of metal foil (electrodes) wound together with a plastic film (dielectric) sandwiched in between, or employ a multi-layer lamination structure. Based on the principle of storing charge in the dielectric through an electric field, the storage and release of charge are achieved through the metal foil electrodes. In the use of existing film capacitors, excessively high temperatures acting on the film core can easily lead to aging or breakdown. This increases the internal temperature of the film capacitor, and as the internal temperature rises, the sealed film capacitor may swell or burst, accelerating the aging of the film core and ultimately causing the capacitance performance to fail and the capacitor to be scrapped. Summary of the Invention

[0003] The purpose of this invention is to provide a thin-film capacitor with good thermal conductivity, in order to solve the problem mentioned in the background art that when existing thin-film capacitors are used, excessively high temperatures can easily cause aging or breakdown of the thin-film capacitor core, increase the internal temperature of the thin-film capacitor, and as the internal temperature rises, the sealed thin-film capacitor may swell or burst, accelerate the aging of the thin-film core, and ultimately lead to the capacitor performance failing to meet the requirements and becoming unusable.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a thin-film capacitor with good thermal conductivity, comprising:

[0005] film enclosure;

[0006] Core package, which is placed inside the membrane enclosure;

[0007] A first-side heat-conducting plate is symmetrically arranged inside the film seal. A second-side heat-conducting plate is symmetrically arranged inside the film seal. Multiple first-side heat-conducting sheets are fixedly connected at equal intervals inside the first-side heat-conducting plate. The first-side heat-conducting sheets are fixedly connected to the film seal, and one side of the first-side heat-conducting sheet is connected to the core package.

[0008] The second side heat-conducting sheet is equidistantly arranged inside the second side heat-conducting plate. The second side heat-conducting sheet is fixedly connected to the thin film shell, and one side of the second side heat-conducting sheet is connected to the core package.

[0009] The first side groove is equally spaced on one side of the first side heat-conducting plate and the first side heat-conducting sheet;

[0010] The second side groove is equidistantly formed on one side of the second side heat-conducting plate and the second side heat-conducting sheet.

[0011] As a preferred embodiment of this utility model: a plurality of No. 1 side heat-conducting strips are fixedly connected at equal intervals on one side of the No. 1 side heat-conducting sheet, and the No. 1 side heat-conducting strips are fixedly connected to the No. 1 side heat-conducting plate.

[0012] As a preferred embodiment of this utility model: a plurality of second-side heat-conducting strips are fixedly connected at equal intervals on one side of the second-side heat-conducting sheet, and the second-side heat-conducting strips are fixedly connected to the second-side heat-conducting plate.

[0013] As a preferred embodiment of this utility model: a support base is fixedly connected to the bottom of the film shell, and an outer support frame is fixedly connected to the top of the support base.

[0014] As a preferred embodiment of this utility model, the outer support frame has multiple ventilation holes symmetrically arranged inside.

[0015] As a preferred embodiment of this utility model: pins are symmetrically arranged on the top of the core package, and an isolation top plate is provided on the top of the core package.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting a No. 1 side heat-conducting plate, a No. 1 side heat-conducting sheet, a No. 2 side heat-conducting plate, and a No. 2 side heat-conducting sheet, the No. 1 side heat-conducting sheet and the No. 2 side heat-conducting sheet can conduct heat to the core package, and conduct heat out through the No. 1 side heat-conducting plate, the No. 1 side heat-conducting strip, the No. 2 side heat-conducting plate, and the No. 2 side heat-conducting strip, thereby improving the heat conduction effect of the core package and avoiding the situation of swelling or cracking due to the rise in internal temperature. By setting a No. 1 side groove and a No. 2 side groove, multiple No. 1 side grooves are opened on one side of the No. 1 side heat-conducting plate and the No. 1 side heat-conducting sheet, and multiple No. 2 side grooves are opened on one side of the No. 2 side heat-conducting plate and the No. 2 side heat-conducting sheet, thereby improving the heat dissipation efficiency. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 is a bottom view of this utility model;

[0019] Figure 3 is a schematic diagram of the internal structure of the film sealing shell of this utility model;

[0020] Figure 4 is a schematic diagram of the external support frame structure of this utility model.

[0021] In the diagram: 1. Thin film enclosure; 2. Heat-conducting plate on side 1; 3. Heat-conducting plate on side 2; 4. Insulation top plate; 5. Core package; 6. Heat-conducting sheet on side 1; 7. Recess on side 1; 8. Heat-conducting strip on side 1; 9. Heat-conducting strip on side 2; 10. Pin; 11. Outer support frame; 12. Support base; 13. Ventilation hole; 14. Heat-conducting sheet on side 2; 15. Recess on side 2. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please refer to Figures 1 to 4. This utility model provides a technical solution: a thin-film capacitor with good thermal conductivity, comprising: a thin-film casing 1; a core package 5 disposed inside the thin-film casing 1; a first-side heat-conducting plate 2 symmetrically fixed inside the thin-film casing 1, a second-side heat-conducting plate 3 symmetrically fixed inside the thin-film casing 1, a plurality of first-side heat-conducting sheets 6 equidistantly fixed inside the first-side heat-conducting plate 2, the first-side heat-conducting sheets 6 being fixed to the thin-film casing 1, and one side of the first-side heat-conducting sheet 6 being connected to the core package 5; a second-side heat-conducting sheet 14 equidistantly fixed inside the second-side heat-conducting plate 3, the second-side heat-conducting sheet 14 being fixed to the thin-film casing 1, and one side of the second-side heat-conducting sheet 14 being connected to the core package 5; a first-side groove 7 equidistantly formed on one side of the first-side heat-conducting plate 2 and the first-side heat-conducting sheet 6; and a second-side groove 15 equidistantly formed on one side of the second-side heat-conducting plate 3 and the second-side heat-conducting sheet 14.

[0024] It should be noted that in this embodiment, the heat of the core package 5 is conducted by attaching the first side heat-conducting sheet 6 and the second side heat-conducting sheet 14 to the outside of the core package 5. Heat is conducted by the first side heat-conducting sheet 6 and the first side heat-conducting plate 2. Heat is discharged through each first side groove 7. Heat is discharged through each first side heat-conducting strip 8. Heat is conducted through the second side heat-conducting plate 3 to the second side heat-conducting sheet 14. Heat is dissipated through each second side groove 15 on one side of the second side heat-conducting plate 3 and the second side heat-conducting sheet 14. Heat is conducted through each second side heat-conducting strip 9. The film shell 1 is supported by the support base 12 and the outer support frame 11.

[0025] In one embodiment, as shown in Figures 1 to 4, a plurality of first-side heat-conducting strips 8 are fixedly connected at equal intervals on one side of the first-side heat-conducting sheet 6, and the first-side heat-conducting strips 8 are fixedly connected to the first-side heat-conducting plate 2.

[0026] It should be noted that in this embodiment, the heat dissipation efficiency of the first side heat-conducting plate 2 and the first side heat-conducting sheet 6 is improved by the first side heat-conducting strip 8.

[0027] In one embodiment, as shown in Figures 1 to 4, a plurality of second-side heat-conducting strips 9 are fixedly connected at equal intervals on one side of the second-side heat-conducting sheet 14, and the second-side heat-conducting strips 9 are fixedly connected to the second-side heat-conducting plate 3.

[0028] It should be noted that in this embodiment, the heat dissipation efficiency of the second-side heat-conducting sheet 14 and the second-side heat-conducting plate 3 is improved by using the second-side heat-conducting strip 9.

[0029] In one embodiment, as shown in Figures 1 to 4, a support base 12 is fixedly connected to the bottom of the film cover 1, and an outer support frame 11 is fixedly connected to the top of the support base 12.

[0030] It should be noted that in this embodiment, the film shell 1 is supported as a whole by the outer support frame 11 and the support base 12.

[0031] In one embodiment, as shown in Figures 1 to 4, the outer support frame 11 has a plurality of symmetrical ventilation holes 13 inside.

[0032] It should be noted that in this embodiment, ventilation holes 13 are used to ventilate the interior of the external support frame 11, thereby improving the heat dissipation effect.

[0033] In one embodiment, as shown in Figures 1 to 4, pins 10 are symmetrically arranged on the top of the core package 5, and an isolation top plate 4 is provided on the top of the core package 5.

[0034] It should be noted that in this embodiment, the core package 5 inside the film enclosure 1 is protected by the isolation top plate 4.

[0035] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Furthermore, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of those features.

[0037] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0038] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thin-film capacitor with good thermal conductivity, characterized in that, include: Film Encapsulation(1); Core package (5), the core package (5) is set inside the film shell (1); first side heat conduction plate (2), the first side heat conduction plate (2) is symmetrically set inside the film shell (1), the film shell (1) is symmetrically set with second side heat conduction plate (3), the first side heat conduction plate (2) is equidistantly fixed with multiple first side heat conduction sheets (6) inside the first side heat conduction plate (2), the first side heat conduction sheet (6) is fixed to the film shell (1), one side of the first side heat conduction sheet (6) is connected to the core package (5); second side heat conduction sheet ( 14), the second side heat-conducting sheet (14) is equidistantly arranged inside the second side heat-conducting plate (3), the second side heat-conducting sheet (14) is fixedly connected to the thin film shell (1), and one side of the second side heat-conducting sheet (14) is connected to the core package (5); the first side groove (7) is equidistantly opened on one side of the first side heat-conducting plate (2) and the first side heat-conducting sheet (6); the second side groove (15) is equidistantly opened on one side of the second side heat-conducting plate (3) and the second side heat-conducting sheet (14).

2. The thin-film capacitor with good thermal conductivity according to claim 1, characterized in that: Multiple heat-conducting strips (8) are fixedly connected at equal intervals on one side of the first side heat-conducting sheet (6), and the first side heat-conducting strips (8) are fixedly connected to the first side heat-conducting plate (2).

3. The thin-film capacitor with good thermal conductivity according to claim 1, characterized in that: Multiple second-side heat-conducting strips (9) are fixedly connected at equal intervals on one side of the second-side heat-conducting sheet (14), and the second-side heat-conducting strips (9) are fixedly connected to the second-side heat-conducting plate (3).

4. A thin-film capacitor with good thermal conductivity according to claim 1, characterized in that: The bottom of the film cover (1) is fixedly connected to a support base (12), and the top of the support base (12) is fixedly connected to an outer support frame (11).

5. A thin-film capacitor with good thermal conductivity according to claim 4, characterized in that: The outer support frame (11) has multiple symmetrical ventilation holes (13) inside.

6. A thin-film capacitor with good thermal conductivity according to claim 1, characterized in that: The core package (5) has pins (10) symmetrically arranged on its top, and an isolation top plate (4) is provided on its top.