Heat dissipation structure of capacitor parallel compensation device

Abstract

The utility model relates to the technical field of heat dissipation structures, in particular to a heat dissipation structure of a capacitor parallel compensation device, which comprises an exhaust part comprising an exhaust fan mounted on a first side plate and used for exhausting air and dissipating heat outwards and a first protective net mounted on the outer side of the exhaust fan; the air inlet part comprises a cold accumulation assembly mounted on the inner side of the second side plate and a mounting screen plate mounted on the outer side of the second side plate, and a semiconductor chilling plate used for providing a cold source for the cold accumulation assembly is detachably mounted on the mounting screen plate; flowing airflow can be formed through the air exhaust part and the air inlet part to take away heat in the device; meanwhile, the arranged cold storage assembly and the semiconductor chilling plate can provide a cold source on the path of flowing airflow, reduce the temperature of the airflow, facilitate the improvement of the heat dissipation efficiency and quality, facilitate the guarantee of the performance reliability and the service life of the capacitor parallel compensation device, and can better meet the use requirements of equipment.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation structure technology, specifically to a heat dissipation structure for a capacitor parallel compensation device. Background Technology

[0002] In the construction and stable operation of power systems, inductive devices such as current transformers, voltage transformers, transformers, and reactors play a crucial role. These devices must undergo rigorous performance verification tests before being put into use and during operation. Due to the inductive nature of these devices, the power factor of the test circuit may be low during the test. To reduce the excessive requirements on the power supply output current and capacity of the test, it is now necessary to add a parallel capacitor in the test circuit for compensation.

[0003] However, existing parallel capacitor compensation devices have many shortcomings in terms of heat dissipation. On the one hand, most common test equipment directly installs parallel compensation capacitors inside the main body of the equipment. This layout makes it easy for the heat generated by the capacitors to accumulate inside the equipment during operation. Poor air circulation makes it difficult for the heat to be effectively dissipated, which in turn leads to a continuous rise in the internal temperature of the equipment. Overheating will seriously affect the performance and reliability of the parallel capacitor compensation device, resulting in a decrease in compensation accuracy and failing to meet the requirements for accurate power factor compensation during the test.

[0004] In summary, the existing heat dissipation structure of the capacitor parallel compensation device has shortcomings. To improve the performance, reliability and service life of the capacitor parallel compensation device and better meet the needs of power system equipment testing, we propose a heat dissipation structure for the capacitor parallel compensation device. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings mentioned in the background art and provide a heat dissipation structure for a capacitor parallel compensation device.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A heat dissipation structure for a capacitor parallel compensation device is mounted on a first side plate and a second side plate symmetrically arranged on the body of the capacitor parallel compensation device, comprising:

[0008] The exhaust section includes an exhaust fan installed on the first side plate for exhausting air and dissipating heat, and a first protective net installed on the outside of the exhaust fan;

[0009] The air inlet includes a cold storage component installed inside the second side plate and a mounting mesh plate installed outside the second side plate. A semiconductor refrigeration chip for providing a cold source to the cold storage component is detachably installed on the mounting mesh plate.

[0010] Preferably, the mounting mesh panel includes a frame panel with a mounting window, and a second protective mesh that is installed on the frame panel;

[0011] The inner wall of the mounting window is provided with a side support plate for detachably mounting the semiconductor cooling chip.

[0012] Preferably, the cold storage assembly includes an air guide hood that is positioned corresponding to and connected to the second protective net, and an intermediate chamber that is connected to and installed on the air guide hood, wherein cold storage fins are installed in the intermediate chamber.

[0013] The intermediate compartment corresponds to the position of the mounting window.

[0014] Preferably, the air guide cover has air holes, and a threaded copper tube is installed inside the air guide cover.

[0015] Preferably, a heat-conducting unit is detachably installed on the frame plate and located outside the semiconductor cooling chip.

[0016] Preferably, the heat-conducting unit includes an outer shield with openings at both ends, and the inner side of the outer shield has a heat-conducting opening corresponding to the position of the semiconductor cooling chip;

[0017] The outer baffle is equipped with heat-conducting fins;

[0018] The outer baffle is provided with a flow guide groove that is consistent with the flow guide path of the air guide shroud.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] The heat dissipation structure of this parallel capacitor compensation device can form a flowing airflow through the exhaust and intake sections to remove internal heat. At the same time, the included cold storage components and semiconductor cooling chips can provide a cold source along the path of the flowing airflow, reducing the airflow temperature. This is beneficial for improving heat dissipation efficiency and quality, ensuring the reliability and service life of the parallel capacitor compensation device, and better meeting the needs of equipment use. Attached Figure Description

[0021] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0022] Figure 1 This is one of the schematic diagrams of the overall structure of this utility model;

[0023] Figure 2 This is the second schematic diagram of the overall structure of this utility model;

[0024] Figure 3 This is a schematic diagram of the installation of the exhaust section of this utility model;

[0025] Figure 4 This is one of the installation diagrams of the air inlet section of this utility model;

[0026] Figure 5 This is the second schematic diagram of the air inlet installation of this utility model;

[0027] Figure 6 This is a schematic diagram of the installation of the mesh plate of this utility model;

[0028] Figure 7 This is one of the exploded views of the air inlet installation relationship of this utility model;

[0029] Figure 8 This is the second exploded view of the installation relationship of the air inlet section of this utility model;

[0030] Figure 9 This is a schematic diagram of the cold storage component of this utility model.

[0031] The meanings of the labels in the diagram are as follows:

[0032] 1. Capacitor parallel compensation device body; 11. First side plate; 12. Second side plate; 2. First protective net; 3. Exhaust fan; 4. Mounting mesh plate; 41. Frame plate; 4101. Mounting window; 42. Second protective net; 43. Side support plate; 5. Heat conduction unit; 51. Outer baffle; 511. Air guide groove; 52. Heat conduction fins; 501. Heat conduction opening; 6. Cold storage component; 61. Air guide cover; 611. Air hole; 62. Intermediate chamber; 63. Cold storage fins; 64. Threaded copper pipe; 7. Semiconductor refrigeration chip. Detailed Implementation

[0033] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0034] Please see Figure 1-9 The present invention will describe the above technical solution in detail through the following embodiments:

[0035] The heat dissipation structure of the capacitor parallel compensation device in this embodiment is as follows: Figure 1 and Figure 2As shown in the installation diagram, a first side plate 11 and a second side plate 12 are symmetrically arranged on the main body 1 of the capacitor parallel compensation device. In order to remove internal heat, an exhaust section and an air inlet section are respectively installed on the first side plate 11 and the second side plate 12 to form a unidirectional airflow and carry away the heat.

[0036] Specifically, such as Figure 3 As shown, in order to obtain the power of airflow, an exhaust fan 3 is installed on the first side plate 11 in this embodiment, and a first protective net 2 is installed on the outside of the exhaust fan 3. The exhaust fan 3 exhausts air outward to dissipate heat.

[0037] like Figures 4-8 As shown in the structure, in this embodiment, the air inlet includes a cold storage component 6 installed inside the second side plate 12, and a mounting mesh plate 4 is installed on the outside of the second side plate 12. In this embodiment, the mounting mesh plate 4 is as follows: Figure 6 As shown, a mounting window 4101 is provided in the middle of the frame plate 41. A semiconductor cooling chip 7 is detachably installed on the inner side of the mounting window 4101 through a side support plate 43. A ventilation hole is provided on the frame plate 41 and connected to the upper and lower sides of the mounting window 4101. A second protective net 42 is installed in the ventilation hole. A passage structure is provided on the second side plate 12 that is connected to the ventilation hole and the mounting window 4101.

[0038] It should be explained that the thermoelectric cooler 7 cools on one side and dissipates heat on the other side. Therefore, in this embodiment, the cooling side of the thermoelectric cooler 7 is close to the cold storage component 6, and a heat conduction unit 5 is installed on the heat dissipation side of the thermoelectric cooler 7.

[0039] In this embodiment, to improve the durability of the cooling atmosphere, a cold storage function is considered, allowing the cooled airflow to enter the body 1 of the capacitor parallel compensation device and carry away the heat; therefore, as Figure 8 , Figure 9 The cold storage component 6 shown includes two air guide shrouds 61 corresponding to the ventilation holes. The air guide shrouds 61 are provided with air holes 611. An intermediate chamber 62 is installed between the two air guide shrouds 61, corresponding to the position of the installation window 4101. Cold storage fins 63 are installed in the intermediate chamber 62. During the cooling process of the semiconductor cooling chip 7, the cold storage fins 63 absorb the cold source and maintain a low temperature, but the cold storage fins 63 are not located in the flow path. Therefore, in this embodiment, a threaded copper pipe 64 is installed in the air guide shroud 61. The threaded copper pipe 64 can conduct cold and cool down, so that the airflow is cooled down after flowing through the threaded copper pipe 64.

[0040] In this embodiment, the heat-conducting unit 57 is as follows: Figure 7 and Figure 8As shown, it is mounted on the frame plate 41 and corresponds to the position of the semiconductor cooling chip 7. In order to align, a heat-conducting opening 501 is provided on the inner side of the outer baffle 51 so that the heat dissipation side of the semiconductor cooling chip 7 can be conducted to the heat-conducting fins 52 inside the outer baffle 51. In order to avoid affecting the intake air, a flow-guiding groove 511 is provided on the outer baffle 51 that is consistent with the flow-guiding path.

[0041] The working principle of the heat dissipation structure of the capacitor parallel compensation device in this embodiment is as follows: the exhaust fan 3 exhausts air outward, and the airflow enters through the ventilation hole at the second side plate 12. The semiconductor cooling chip 7 is cooled inside, and the cold storage fins 63 and the threaded copper tube 64 can complete the cold storage, so that the airflow is cooled down based on the principle of heat transfer. The airflow flows through the body 1 of the capacitor parallel compensation device and quickly carries away the heat, realizing the rapid cooling of the equipment. The semiconductor cooling chip 7 can operate intermittently without continuous operation, maintaining a long-term cold storage and cooling effect.

[0042] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0043] Furthermore, if the embodiments of this utility model involve descriptions such as "first," "second," etc., such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. It will be apparent to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model.

Claims

1. A heat dissipation structure for a capacitor parallel compensation device, mounted on a first side plate (11) and a second side plate (12) symmetrically arranged on the body (1) of the capacitor parallel compensation device, characterized in that: include: The exhaust section includes an exhaust fan (3) installed on the first side plate (11) for exhausting air and dissipating heat, and a first protective net (2) installed on the outside of the exhaust fan (3); The air inlet includes a cold storage assembly (6) installed inside the second side plate (12) and a mounting mesh plate (4) installed outside the second side plate (12). A semiconductor cooling chip (7) for providing a cold source to the cold storage assembly (6) is detachably installed on the mounting mesh plate (4).

2. The heat dissipation structure of the capacitor parallel compensation device as described in claim 1, characterized in that: The mounting mesh plate (4) includes a frame plate (41) with a mounting window (4101) and a second protective mesh (42) installed on the frame plate (41); The inner wall of the mounting window (4101) is provided with a side support plate (43) for detachably mounting the semiconductor cooling chip (7).

3. The heat dissipation structure of the capacitor parallel compensation device as described in claim 2, characterized in that: The cold storage assembly (6) includes a wind guide hood (61) that is positioned and connected to the second protective net (42), and an intermediate chamber (62) that is connected to the wind guide hood (61). The intermediate chamber (62) is equipped with cold storage fins (63). The intermediate compartment (62) corresponds to the position of the mounting window (4101).

4. The heat dissipation structure of the capacitor parallel compensation device as described in claim 3, characterized in that: The air guide cover (61) has air holes (611) on its cover, and a threaded copper tube (64) is installed inside the air guide cover (61).

5. The heat dissipation structure of the capacitor parallel compensation device as described in claim 4, characterized in that: A heat-conducting unit (5) is detachably installed on the frame plate (41) and located outside the semiconductor cooling chip (7).

6. The heat dissipation structure of the capacitor parallel compensation device as described in claim 5, characterized in that: The heat-conducting unit (5) includes an outer cover (51) with openings at both ends, and the inner side of the outer cover (51) is provided with a heat-conducting opening (501) corresponding to the position of the semiconductor cooling chip (7); The outer baffle (51) is equipped with heat-conducting fins (52); The outer baffle (51) is provided with a flow guide groove (511) that is consistent with the flow guide path of the air guide shroud (61).

Images