High-voltage box with novel temperature acquisition structure

Abstract

The utility model discloses a high-voltage box with a novel temperature acquisition structure, which belongs to the technical field of high-voltage power distribution and comprises a first shell, a circuit board, an electric control device, a first conducting bar, a temperature detector and a second conducting bar. The first shell is provided with a first cavity; the circuit board is connected with the first shell and is arranged on the first shell; the electric control device is connected with the first shell and is arranged in the first cavity; the first conducting bar is connected with the first shell and arranged in the first cavity, and the first conducting bar is connected with the electric control device; the temperature detector is connected with the first conducting bar; and the second conducting bar is arranged between the first conducting bar and the circuit board and is connected with the temperature detector. The temperature detector and the circuit board are connected through the conducting bar, and wireless harness connection is achieved; and the phenomena of displacement, occupation, interference and tangling caused by the soft characteristic of the wire harness are avoided, so that the reasonability of the layout of the wire harness in the high-voltage box, the fixity of the position of the wire harness and the working safety of a high-voltage box product are improved.

Description

A high-voltage box with a novel temperature acquisition structure Technical Field

[0001] This application belongs to the field of high-voltage power distribution technology, specifically relating to a high-voltage box with a novel temperature acquisition structure. Background Technology

[0002] In a vehicle's battery module, high-voltage power distribution equipment such as BDU (Battery Disconnect Unit), PDU (Power Distribution Unit), and BMU (Battery Management Unit) are typically required to manage the power distribution of the battery.

[0003] In the aforementioned high-voltage power distribution equipment, electrical control devices such as fuses, contactors, pre-charge resistors, and shunts are typically installed and connected via busbars to form a power distribution circuit for high-voltage power distribution. At the same time, in order to ensure the normal operation of the equipment and to detect problems such as short circuits and overloads in a timely manner, it is necessary to monitor the temperature at multiple locations inside the high-voltage box in real time. Due to the large number of detection points, many independently installed detection harnesses are required, which can easily lead to displacement, occupation, interference, and entanglement, affecting the assembly efficiency of the high-voltage box and the normal operation of the finished product. Summary of the Invention

[0004] Purpose of the utility model: This application develops a high-voltage box with a novel temperature acquisition structure, aiming to solve the technical problems in the prior art where wire harness displacement, occupation, interference, and entanglement affect the assembly efficiency of the high-voltage box and its normal operation after completion.

[0005] Technical solution: This application provides a high-voltage box with a novel temperature acquisition structure, comprising:

[0006] A first housing, the first housing having a first chamber;

[0007] A circuit board, comprising a board body connected to the first housing and disposed in the first chamber; the board body having a first direction, a second direction and a third direction intersecting and disposed, the board body extending along a plane formed by the first direction and the second direction;

[0008] An electrical control device, which is connected to the first housing and disposed in the first chamber;

[0009] A first conductive busbar is connected to the first housing and disposed in the first chamber. The first conductive busbar extends along a plane formed by the first direction and the second direction. The first conductive busbar is connected to the electrical control device.

[0010] A temperature detector, wherein the temperature detector is connected to the first conductive bus;

[0011] The second conductive busbar is arranged along the third direction, with the first conductive busbar, the second conductive busbar and the circuit board spaced apart. One end of the second conductive busbar is connected to the temperature detector, and the other end of the second conductive busbar is connected to the circuit board.

[0012] In some embodiments, along the third direction, a limiting hole is provided on the side of the first conductive bus closest to the circuit board;

[0013] The high-voltage box also includes a limiting member, which is connected to the temperature detector and is at least partially inserted through the limiting hole.

[0014] In some embodiments, the high-voltage box further includes an insulating element that covers the second conductive busbar.

[0015] In some embodiments, the second conductive bus includes:

[0016] A first conductive portion is provided, which extends along the third direction;

[0017] The second conductive part is connected to the first conductive part, and along the third direction, the second conductive part is disposed on the side of the first conductive part away from the first conductive busbar;

[0018] The insulating component includes:

[0019] A first insulating portion, wherein the first insulating portion covers the first conductive portion;

[0020] The second insulating part covers the second conductive part, and a positioning hole is provided on the side of the second insulating part near the first conductive bar along the third direction;

[0021] The first housing includes a positioning block disposed in the first chamber, and at least a portion of the positioning block passes through the positioning hole.

[0022] In some embodiments, the high-voltage box further includes a second housing, which is connected to the first conductive bus and disposed along the third direction on the side of the first conductive bus close to the circuit board;

[0023] The second housing has a second chamber, and the temperature detector is connected to the second housing and disposed in the second chamber;

[0024] The limiting member is connected to the second housing.

[0025] In some embodiments, the second housing further has a first opening, which communicates with the second chamber and extends along the first direction;

[0026] The temperature detector includes a detection element that faces the first opening.

[0027] In some embodiments, the second housing further has a second opening that communicates with the second chamber and extends along the third direction, and is disposed on the side of the second housing away from the first conductive bar;

[0028] The second conductive busbar passes through the second opening.

[0029] In some embodiments, the first housing further includes a support member disposed in the first cavity;

[0030] Along the third direction, the support member is disposed on the side of the second insulating portion near the first conductive busbar and abuts against the second insulating portion.

[0031] In some embodiments, the positioning block is connected to the support member, and along the third direction, the positioning block is disposed on the side of the support member near the second insulating portion.

[0032] Beneficial Effects: Compared with the prior art, the embodiments of this application provide a high-voltage box with a novel temperature acquisition structure, including a first housing, a circuit board, an electrical control device, a first conductive bus, a temperature detector, and a second conductive bus. The first housing has a first chamber for housing the components required for the high-voltage box. The circuit board is connected to and disposed within the first housing. The electrical control device is connected to and disposed within the first chamber. The first conductive bus is connected to and disposed within the first chamber and is connected to the electrical control device to cooperate in constructing a high-voltage power distribution circuit. The temperature detector is connected to the first conductive bus for detecting the temperature at a designated location on the first conductive bus. The second conductive bus is disposed between the first conductive bus and the circuit board and connected to the temperature detector, transmitting the temperature data detected by the temperature detector to the circuit board. This application uses a conductive busbar to connect the temperature detector and the circuit board. While ensuring data transmission performance, the conductive busbar replaces the traditional wire harness to achieve a wireless connection. This avoids the displacement, occupation, interference, and entanglement caused by the soft characteristics of the wire harness, which affect the assembly efficiency of the high-voltage box and the normal operation of the finished product. This improves the rationality of the wire harness layout inside the high-voltage box, the fixation of the wire harness position, and the safety of the high-voltage box product during operation. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 is a three-dimensional cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application;

[0035] Figure 2 is a perspective view of the first conductive busbar in the high-voltage box with a novel temperature acquisition structure provided in the embodiment of this application;

[0036] Figure 3 is a three-dimensional structural view of the temperature detector, second housing, limiting member, insulating member and second conductive bus in the high-voltage box with a novel temperature acquisition structure provided in the embodiment of this application.

[0037] Figure 4 is a perspective view of the limiting component and the second shell in the high-voltage box with a novel temperature acquisition structure provided in the embodiment of this application;

[0038] Figure 5 is a three-dimensional cross-sectional view of the temperature detector, second housing, limiting member, insulating member and second conductive bus in a high-voltage box with a novel temperature acquisition structure provided in the embodiment of this application.

[0039] Figure 6 is a partial perspective view of the first housing in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application;

[0040] Reference numerals: 10, first housing; 11, first chamber; 12, positioning block; 13, support member; 20, circuit board; 21, board body; 30, electrical control device; 40, first conductive bar; 41, limiting hole; 50, temperature detector; 51, detection element; 60, second conductive bar; 61, first conductive part; 62, second conductive part; 70, limiting member; 80, insulating member; 81, first insulating part; 82, second insulating part; 821, positioning hole; 90, second housing; 91, second chamber; 92, first opening; 93, second opening; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0041] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0042] In a vehicle's battery module, high-voltage power distribution equipment such as BDU (Battery Disconnect Unit), PDU (Power Distribution Unit), and BMU (Battery Management Unit) are typically required to manage the power distribution of the battery.

[0043] In the aforementioned high-voltage power distribution equipment, electrical control devices such as fuses, contactors, pre-charge resistors, and shunts are typically installed and connected via busbars to form a power distribution circuit for high-voltage power distribution. At the same time, in order to ensure the normal operation of the equipment and to detect problems such as short circuits and overloads in a timely manner, it is necessary to monitor the temperature at multiple locations inside the high-voltage box in real time. Due to the large number of detection points, many independently installed detection harnesses are required, which can easily lead to displacement, occupation, interference, and entanglement, affecting the assembly efficiency of the high-voltage box and the normal operation of the finished product.

[0044] In view of this, embodiments of this application provide a high-voltage box with a novel temperature acquisition structure, including a first housing 10, a circuit board 20, an electrical control device 30, a first conductive bus 40, a temperature detector 50, and a second conductive bus 60; wherein, the first housing 10 has a first chamber 11 for accommodating the components required for the high-voltage box; the circuit board 20 is connected to and disposed in the first housing 10; the electrical control device 30 is connected to and disposed in the first chamber 11; the first conductive bus 40 is connected to and disposed in the first chamber 11, and is connected to the electrical control device 30 to cooperate with the electrical control device 30 in constructing a high-voltage power distribution circuit; the temperature detector 50 is connected to the first conductive bus 40 for detecting the temperature at a specified location on the first conductive bus 40; the second conductive bus 60 is disposed between the first conductive bus 40 and the circuit board 20, and is connected to the temperature detector 50 to transmit the temperature data detected by the temperature detector 50 to the circuit board 20. This application uses a conductive busbar to connect the temperature detector 50 and the circuit board 20. While ensuring data transmission performance, the conductive busbar replaces the traditional wire harness to achieve a wireless connection. This avoids the displacement, occupation, interference, and entanglement caused by the soft characteristics of the wire harness, which would affect the assembly efficiency of the high-voltage box and the normal operation of the finished product. This improves the rationality of the wire harness layout inside the high-voltage box, the fixation of the wire harness position, and the safety of the high-voltage box product during operation.

[0045] In some embodiments, please refer to Figures 1 and 6. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 6 is a partial three-dimensional view of the first housing 10 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The first housing 10 is an injection-molded plastic housing and is used as a base for connecting other devices. The first housing 10 forms a first chamber 11 during the molding process to provide a cavity for accommodating other components.

[0046] In some embodiments, please refer to FIG1, which is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in this application embodiment. The circuit board 20 includes a plate body 21, which is connected to the first housing 10 and disposed in the first chamber 11. To facilitate understanding of the relative positional relationship between components, this application introduces intersecting first direction X, second direction Y, and third direction Z in the plate body 21. The plate body 21 extends along the plane formed by the first direction X and the second direction Y to form a plate surface. Specifically, the plate body 21 is a rectangular plate body, with the length direction of the rectangular plate body being the first direction X, the width direction of the rectangular plate body being the second direction Y, and the thickness direction of the rectangular plate body being the third direction Z. It can be understood that the first direction X, the second direction Y, and the third direction Z are orthogonally arranged. Specifically, the circuit board 20 is a PCB board (Printed Circuit Board).

[0047] In some embodiments, please refer to FIG1, which is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The electrical control device 30 is connected to the first housing 10 and disposed in the first chamber 11. The electrical control device 30 in this application is a high-voltage power distribution device in BDU (Battery Disconnect Unit), PDU (Power Distribution Unit), or BMU (Battery Management Unit), such as a fuse, contactor, pre-charge resistor, or shunt.

[0048] In some embodiments, please refer to Figures 1 and 2. Figure 1 is a three-dimensional cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 2 is a three-dimensional view of the first conductive busbar 40 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The first conductive busbar 40 is connected to the first housing 10 and disposed in the first chamber 11. The first conductive busbar 40 extends along the plane formed by the first direction X and the second direction Y. The first conductive busbar 40 is connected to the electrical control device 30 to realize the electrical connection between the electrical control devices 30, so as to build a high-voltage power distribution circuit. Specifically, the first conductive busbar 40 can be a copper busbar or an aluminum busbar. It can be understood that the body of the first conductive busbar 40 is arranged parallel to the board body 21 of the circuit board 20.

[0049] In some embodiments, please refer to Figures 1, 3, 5, and 6. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 3 is a three-dimensional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 5 is a three-dimensional cross-sectional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 6 is a partial three-dimensional view of the first housing 10 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Along the third direction Z, the first conductive bus 40 is provided with a limiting hole 41 on the side near the circuit board 20. The high-voltage box provided in this embodiment of this application also includes a limiting member 70, which is connected to the temperature detector 50 and at least partially passes through the limiting hole 41. Specifically, the temperature detector 50 is connected to the first conductive bus 40 by bolts, and the connecting surface is parallel to the plane formed by the first direction X and the second direction Y. Understandably, the limiting member 70 passes through the limiting hole 41 to restrict the movement of the limiting member 70 in the plane formed by the first direction X and the second direction Y, that is, the limiting hole 41 restricts the movement of the temperature detector 50 in the plane formed by the first direction X and the second direction Y. Further, the limiting hole 41 is a through hole extending through the first conductive bus 40 along the third direction Z.

[0050] In some embodiments, please refer to FIG1, which is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in the embodiments of this application. The temperature detector 50 is connected to the first conductive bus 40 to detect the temperature at the corresponding position of the first conductive bus 40. Specifically, along the third direction Z, the first conductive bus 40, the temperature detector 50 and the circuit board 20 are arranged at intervals in sequence.

[0051] In some embodiments, please refer to Figures 1, 3, and 5. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 3 is a three-dimensional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 5 is a three-dimensional cross-sectional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The second conductive bus 60 extends along the third direction Z, and the first conductive bus 40, the second conductive bus 60, and the circuit board 20 are arranged sequentially at intervals. In the third direction Z, one end of the second conductive bus 60 is connected to the temperature detector 50, and the other end of the second conductive bus 60 is connected to the circuit board 20 to realize the electrical connection between the temperature detector 50 and the circuit board 20. Specifically, the second conductive bus 60 is a copper bus or an aluminum bus. This application uses a copper bus or an aluminum bus to replace the wire harness to realize the connection between the temperature detector 50 and the circuit board 20. While ensuring data transmission performance, the conductive bus replaces the traditional wire harness to realize the wireless connection. This avoids the displacement, occupation, interference, and entanglement phenomena caused by the soft characteristics of the wire harness, which affect the assembly efficiency of the high-voltage box and the normal operation of the finished product. This improves the rationality of the wire harness layout in the high-voltage box, the fixation of the wire harness position, and the safety of the high-voltage box product.

[0052] In some embodiments, please refer to Figures 1, 3, and 5. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 3 is a three-dimensional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 5 is a three-dimensional cross-sectional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The high-voltage box in this application also includes an insulating member 80, which covers the second conductive bus 60 to provide insulation protection for the second conductive bus 60. Specifically, the insulating member 80 is an integrally molded injection molded part, and the insulating member 80 is integrally molded with the second conductive bus 60 during manufacturing.

[0053] In some embodiments, please refer to Figures 1, 3, and 5. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 3 is a three-dimensional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 5 is a three-dimensional cross-sectional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. When the distance between the first conductive bus 40 and the circuit board 20 is too large, in order to fix the second conductive bus 60 and prevent the second conductive bus 60 from shaking, the second conductive bus 60 in this application includes a first conductive part 61 and a second conductive part 62. The first conductive part 61 extends along the third direction Z. The second conductive part 62 is connected to the first conductive part 61 and is disposed on the side of the first conductive part 61 away from the first conductive bus 40. The insulating member 80 includes a first insulating portion 81 and a second insulating portion 82. The first insulating portion 81 covers the first conductive portion 61, and the second insulating portion 82 covers the second conductive portion 62. A positioning hole 821 is provided on the side of the second insulating portion 82 closest to the first conductive busbar 40. The housing in this application includes a positioning block 12, which is disposed in the first chamber 11. At least a portion of the positioning block 12 is disposed through the positioning hole 821. Specifically, the first conductive portion 61 extends along the third direction Z, and the second conductive portion 62 extends in the plane formed by the first direction X and the second direction Y, i.e., the first conductive portion 61 and the second conductive portion 62 are perpendicularly disposed. The positioning hole 821 is a through hole penetrating the second insulating portion 82 along the third direction Z. The positioning block 12 is a cylindrical rod extending along the third direction Z. Understandably, when the length of the second conductive busbar 60 in the third direction Z is too long, in order to avoid the second conductive busbar 60 from shaking, a second conductive part 62 is provided in the second conductive busbar 60, and a second insulating part 82 is injection molded over the second conductive part 62. A positioning hole 821 is provided on the second insulating part 82 along the third direction Z, and a positioning rod is inserted into the positioning hole 821 so as to limit the movement of the second insulating part 82, the second conductive part 62 and the first conductive part 61 by the positioning block 12, thereby achieving the technical effect of preventing the second conductive busbar 60 from shaking.

[0054] In some embodiments, please refer to Figures 1 and 6. Figure 1 is a three-dimensional structural cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 6 is a partial three-dimensional view of the first housing 10 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The first housing 10 in this application also includes a support member 13. The support member 13 is disposed in the first chamber 11 and along the third direction Z. The support member 13 is disposed on the side of the second insulating part 82 near the first conductive bus 40 and abuts against the second insulating part 82 to support the second insulating part 82. Specifically, the positioning block 12 is connected to the support member 13 and is disposed on the side of the support member 13 near the second insulating part 82 along the third direction Z.

[0055] In some embodiments, please refer to Figures 1, 3, 4, and 5. Figure 1 is a three-dimensional cross-sectional view of a high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 3 is a three-dimensional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 4 is a three-dimensional view of the limiting member 70 and second housing 90 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. Figure 5 is a three-dimensional cross-sectional structural view of the temperature detector 50, second housing 90, limiting member 70, insulating member 80, and second conductive bus 60 in the high-voltage box with a novel temperature acquisition structure provided in an embodiment of this application. The high-voltage box in this application also includes a second housing 90, which is connected to the first conductive bus 40 and disposed along the third direction Z on the side of the first conductive bus 40 near the circuit board 20. The second housing 90 has a second chamber 91, and the temperature detector 50 is connected to the second housing 90 and disposed in the second chamber 91. The limiting member 70 is connected to the second housing 90. Specifically, the second housing 90 is connected to the first conductive bus 40 by bolts, and the limiting member 70 is connected to the second housing 90 to restrict the movement of the second housing 90 in the plane formed by the first direction X and the second direction Y.

[0056] In some embodiments, please refer to Figures 3 and 4. Figure 3 is a perspective view of the structure of a temperature detector 50, a second housing 90, a limiting member 70, an insulating member 80, and a second conductive bus 60 in a high-voltage box with a novel temperature acquisition structure provided in this application embodiment. Figure 4 is a perspective view of the limiting member 70 and the second housing 90 in a high-voltage box with a novel temperature acquisition structure provided in this application embodiment. The second housing 90 in this application has a first opening 92, which communicates with a second chamber 91 and extends along a first direction X. The temperature detector 50 includes a detection element 51 facing the first opening 92 to detect the temperature at the connection between the first conductive bus 40 and the second housing 90 through the first opening 92, so as to monitor the operating status of the high-voltage power distribution circuit through the intuitive temperature change of the first conductive bus 40.

[0057] In some embodiments, please refer to Figures 3 and 4. Figure 3 is a perspective view of the structure of a temperature detector 50, a second housing 90, a limiting member 70, an insulating member 80, and a second conductive bus 60 in a high-voltage box with a novel temperature acquisition structure provided in this application embodiment. Figure 4 is a perspective view of the limiting member 70 and the second housing 90 in a high-voltage box with a novel temperature acquisition structure provided in this application embodiment. The second housing 90 of this application also has a second opening 93, which communicates with the second chamber 91 and extends along a third direction Z. The second opening 93 is disposed facing the circuit board 20. The second conductive bus 60 passes through the second opening 93 and connects to the temperature detector 50 after passing through the second opening 93, so as to transmit the data acquired by the temperature detector 50 to the circuit board 20 through the second conductive bus 60.

[0058] Understandably, embodiments of this application provide a high-voltage box with a novel temperature acquisition structure, including a first housing 10, a circuit board 20, an electrical control device 30, a first conductive bus 40, a temperature detector 50, and a second conductive bus 60; wherein, the first housing 10 has a first chamber 11 for accommodating the components required for the high-voltage box; the circuit board 20 is connected to and disposed in the first housing 10; the electrical control device 30 is connected to and disposed in the first chamber 11; the first conductive bus 40 is connected to and disposed in the first chamber 11, and is connected to the electrical control device 30 to cooperate with the electrical control device 30 in constructing a high-voltage power distribution circuit; the temperature detector 50 is connected to the first conductive bus 40 for detecting the temperature at a designated location on the first conductive bus 40; the second conductive bus 60 is disposed between the first conductive bus 40 and the circuit board 20, and is connected to the temperature detector 50 to transmit the temperature data detected by the temperature detector 50 to the circuit board 20. This application uses a conductive busbar to connect the temperature detector 50 and the circuit board 20. While ensuring data transmission performance, the conductive busbar replaces the traditional wire harness to achieve a wireless connection. This avoids the displacement, occupation, interference, and entanglement caused by the soft characteristics of the wire harness, which would affect the assembly efficiency of the high-voltage box and the normal operation of the finished product. This improves the rationality of the wire harness layout inside the high-voltage box, the fixation of the wire harness position, and the safety of the high-voltage box product during operation.

[0059] This application has provided a detailed description of a high-voltage box with a novel temperature acquisition structure according to the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A high-voltage box with a novel temperature acquisition structure, characterized in that, include: A first housing (10) having a first chamber (11); A circuit board (20), comprising a board body (21) connected to the first housing (10) and disposed in the first chamber (11); the board body (21) having intersecting first direction (X), second direction (Y) and third direction (Z), the board body (21) extending along the plane formed by the first direction (X) and the second direction (Y); an electrical control device (30), connected to the first housing (10) and disposed in the first chamber (11); and a first conductive bus (40), connected to the first housing (10) and disposed in the first chamber (11). The first chamber (11) has a first conductive bus (40) extending along a plane formed by the first direction (X) and the second direction (Y); the first conductive bus (40) is connected to the electrical control device (30); a temperature detector (50) is connected to the first conductive bus (40); and a second conductive bus (60) is arranged along the third direction (Z), with the first conductive bus (40), the second conductive bus (60) and the circuit board (20) spaced apart, one end of the second conductive bus (60) being connected to the temperature detector (50) and the other end of the second conductive bus (60) being connected to the circuit board (20).

2. The high-voltage box with a novel temperature acquisition structure according to claim 1, characterized in that, Along the third direction (Z), the first conductive bus (40) is provided with a limiting hole (41) on the side near the circuit board (20); the high voltage box also includes a limiting member (70), which is connected to the temperature detector (50) and at least partially passes through the limiting hole (41).

3. The high-voltage box with a novel temperature acquisition structure according to claim 1, characterized in that, The high-voltage box also includes an insulating component (80) that covers the second conductive busbar (60).

4. The high-voltage box with a novel temperature acquisition structure according to claim 3, characterized in that, The second conductive bus (60) includes: a first conductive part (61) extending along the third direction (Z); a second conductive part (62) connected to the first conductive part (61), and along the third direction (Z), the second conductive part (62) is disposed on the side of the first conductive part (61) away from the first conductive bus (40); the insulating member (80) includes: a first insulating part (81) covering the first conductive part (61); a second insulating part (82) covering the second conductive part (62), and along the third direction (Z), the second insulating part (82) has a positioning hole (821) on the side near the first conductive bus (40); the first housing (10) includes a positioning block (12) disposed in the first chamber (11), and at least a portion of the positioning block (12) passes through the positioning hole (821).

5. The high-voltage box with a novel temperature acquisition structure according to claim 2, characterized in that, The high-voltage box further includes a second housing (90), which is connected to the first conductive bus (40) and disposed along the third direction (Z) on the side of the first conductive bus (40) near the circuit board (20); the second housing (90) has a second chamber (91), the temperature detector (50) is connected to the second housing (90) and disposed in the second chamber (91); the limiting member (70) is connected to the second housing (90).

6. The high-voltage box with a novel temperature acquisition structure according to claim 5, characterized in that, The second housing (90) also has a first opening (92) communicating with the second chamber (91) and extending along the first direction (X); the temperature detector (50) includes a detection element (51) facing the first opening (92).

7. The high-voltage box with a novel temperature acquisition structure according to claim 5, characterized in that, The second housing (90) also has a second opening (93), which communicates with the second chamber (91) and extends along the third direction (Z), and is located on the side of the second housing (90) away from the first conductive bus (40); the second conductive bus (60) passes through the second opening (93).

8. The high-voltage box with a novel temperature acquisition structure according to claim 4, characterized in that, The first housing (10) further includes a support member (13), which is disposed in the first chamber (11); along the third direction (Z), the support member (13) is disposed on the side of the second insulating part (82) near the first conductive bus (40) and abuts against the second insulating part (82).

9. The high-voltage box with a novel temperature acquisition structure according to claim 8, characterized in that, The positioning block (12) is connected to the support member (13) along the third direction (Z), and the positioning block (12) is disposed on the side of the support member (13) near the second insulating part (82).

Images