Display device and electronic device

Abstract

A display device and an electronic device are provided. The display device comprises a tempered glass plate; a first display unit on an upper portion of the armorplate glass and having a first display area and a first transmission area arranged in one direction, the first display area including a first pixel circuit layer and a first light emitting element layer; and a second display unit located below the armorplate glass in a direction opposite to the first display unit and having a second display region and a second transmissive region arranged in one direction, the second display region including a second pixel circuit layer and a second light emitting element layer.

Description

Technical Field

[0001] One or more embodiments described herein relate to display devices and electronic devices. Background Technology

[0002] Light-emitting devices (LEDs) offer various advantages, such as wide viewing angles, fast response times, thinness, and low power consumption. Therefore, they are widely used in a variety of electrical and electronic devices, such as televisions, monitors, and mobile phones.

[0003] One type of light-emitting device is the organic light-emitting diode (OLED). An OLED is a self-emitting device in which holes injected from the anode and electrons injected from the cathode recombine in the emitting layer to form excitons. When the excitons are stable, light is emitted.

[0004] To achieve efficient display devices, a display device including a color conversion layer has been proposed. The color conversion layer can convert incident light into different colors. Recently, transparent displays have been developed, in which both the anode and cathode of the organic light-emitting display device are made of transparent electrodes, and the driving thin-film transistors are made of optically transparent materials. Utility Model Content

[0005] One or more embodiments provide a bidirectional display device that displays an image not only in one direction but also in another direction, enabling the use of opposite sides of the display device.

[0006] One or more additional embodiments provide a transparent display device in which light reflected from an object located behind a transmission area is transmitted to the front of the display device, thereby enabling the object behind to be seen from the front of the display device.

[0007] The display device according to an embodiment includes: a tempered glass plate; a first display unit located on the upper part of the tempered glass plate and including a first display area and a first transmissive area arranged in one direction, the first display area including a first pixel circuit layer and a first light-emitting element layer; and a second display unit located below the tempered glass plate in a direction opposite to the first display unit and having a second display area and a second transmissive area arranged in one direction, the second display area including a second pixel circuit layer and a second light-emitting element layer.

[0008] In the display device, each of the first display area of ​​the first display unit and the second display area of ​​the second display unit includes a unit pixel column comprising a red pixel column, a green pixel column, and a blue pixel column. When viewed from the front of the first display unit, the unit pixel columns of the first display area of ​​the first display unit and the unit pixel columns of the second display area of ​​the second display unit may overlap in one direction.

[0009] In the display device, each of the first display area of ​​the first display unit and the second display area of ​​the second display unit includes a unit pixel column containing a red pixel column, a green pixel column and a blue pixel column. When viewed from the front of the first display unit, the unit pixel column in the first display area of ​​the first display unit and the unit pixel column in the second display area of ​​the second display unit may not overlap in one direction.

[0010] In the display device, a first display area of ​​a first display unit and a second display area of ​​a second display unit each have a first transmissive area and a second transmissive area located between adjacent pixel columns that emit light of different colors. When viewed from the front of the first display unit, the pixel columns of the first display area of ​​the first display unit and the pixel columns of the second display area of ​​the second display unit can overlap in one direction.

[0011] In the display device, a first display area of ​​a first display unit and a second display area of ​​a second display unit each have a first transmissive area and a second transmissive area located between adjacent pixel columns that emit light of different colors. When viewed from the front of the first display unit, the pixel columns of the first display area of ​​the first display unit and the pixel columns of the second display area of ​​the second display unit may not overlap in one direction.

[0012] In a display device, each of the first light-emitting element layer and the second light-emitting element layer may include a blue light-emitting layer.

[0013] In a display device, a first display unit may include: a first thin film encapsulation layer on the first light-emitting element layer of the first display unit, a first color conversion layer on the first thin film encapsulation layer, and a first color filter layer on the upper part of the first color conversion layer; and a second display unit may include: a second thin film encapsulation layer below the second light-emitting element layer of the second display unit, a second color conversion layer below the second thin film encapsulation layer, and a second color filter layer below the second color conversion layer.

[0014] In a display device, a first display unit may include a first thin film encapsulation layer on the upper part of the first light-emitting element layer of the first display unit, and a second display unit may include a second thin film encapsulation layer on the lower part of the second light-emitting element layer of the second display unit.

[0015] In a display device, each of the first thin-film encapsulation layer and the second thin-film encapsulation layer may include three layers in which an inorganic layer, an organic layer, and an inorganic layer are sequentially formed.

[0016] In a display device, a first display unit may include a first color conversion layer above a first thin film encapsulation layer of the first display unit, and a second display unit may include a second color conversion layer below a second thin film encapsulation layer of the second display unit.

[0017] In a display device, each of the first color conversion layer and the second color conversion layer may include quantum dots.

[0018] In a display device, a first display unit may include a first color filter layer above a first color conversion layer of the first display unit, and a second display unit may include a second color filter layer below a second color conversion layer of the second display unit.

[0019] In a display device, a first display unit may include a first cover glass substrate above a first color filter layer of the first display unit, and a second display unit may include a second cover glass substrate below a second color filter layer of the second display unit.

[0020] In a display device, a first display unit may include a first anti-reflective film on the upper part of a first cover glass substrate of the first display unit, and a second display unit may include a second anti-reflective film on the lower part of a second cover glass substrate of the second display unit.

[0021] In the display device, the first display unit may further include a first outer coating layer above the first color filter layer of the first display unit, and the second display unit may include a second outer coating layer below the second color filter layer of the second display unit.

[0022] The display device includes a pixel circuit sublayer, which may include oxide thin-film transistors.

[0023] In display devices, the semiconductor layer of oxide thin-film transistors may include indium tin oxide (ITO), polymer ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium tin zinc oxide (ITZO).

[0024] A display device according to one embodiment includes a first display unit and a second display unit located on opposite sides of a tempered glass plate, a printed circuit board, a first integrated circuit film connecting the first display unit and the printed circuit board, a second integrated circuit film connecting the second display unit and the printed circuit board, and a driver chip formed on the first integrated circuit film and the second integrated circuit film, wherein the first integrated circuit film can be connected to a first side of the printed circuit board, and the second integrated circuit film can be connected to a second side of the printed circuit board.

[0025] In a display device, the first side and the second side can be the same side of a printed circuit board.

[0026] In a display device, the second integrated circuit film may include through-holes penetrating the second integrated circuit film and through-hole patterns formed in the through-holes.

[0027] In a display device, the second side can be the opposite side of the printed circuit board located on the first side.

[0028] According to an embodiment, the display device is a transparent display, and light reflected from an object behind it is transmitted to the front in the transmissive region, allowing objects behind the display device to be viewed from the front of the display device. Furthermore, by providing a bidirectional display, bidirectional information can be transmitted, and by sharing a tempered glass plate, the material cost of existing glass substrates can be reduced. Moreover, other features and advantages of this disclosure can be gained a new understanding through embodiments of this disclosure.

[0029] According to an embodiment, an electronic device includes a memory, a processor that executes an application stored in the memory, and a display device. The display device includes a display module that outputs video information provided by the application. The display device includes a tempered glass plate, a first display unit, and a second display unit. The first display unit is located on a first side of the tempered glass plate and has a first display area and a first transmissive area arranged in one direction. The first display area includes a first pixel circuit layer and a first light-emitting element layer. The second display unit is located on a second side of the tempered glass plate in a direction opposite to the first side where the first display unit is located. The second display unit has a second display area and a second transmissive area arranged in one direction. The second display area includes a second pixel circuit layer and a second light-emitting element layer. Attached Figure Description

[0030] Figure 1 This is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0031] Figure 2 According to the embodiments Figure 1 A cross-sectional view of the first display unit of the display device.

[0032] Figure 3 This is a cross-sectional view of a display device according to another embodiment of the present disclosure.

[0033] Figure 4 and Figure 5 This is a floor plan showing an example of a display device.

[0034] Figure 6 and Figure 7 This is a floor plan showing an example of a display device.

[0035] Figure 8 and Figure 9 This is a floor plan showing an example of a display device.

[0036] Figure 10 and Figure 11 This is a floor plan showing an example of a display device.

[0037] Figure 12 This is a perspective view of a display device according to an embodiment.

[0038] Figure 13 This is a perspective view of a display device according to another embodiment.

[0039] Figure 14 yes Figure 12 A cross-sectional view of one embodiment.

[0040] Figure 15 yes Figure 13 A cross-sectional view of another embodiment.

[0041] Figure 16 According to the embodiments Figure 14 A cross-sectional view of the second integrated circuit film.

[0042] Figure 17 According to the embodiments Figure 14 A cross-sectional view of the printed circuit board.

[0043] Figure 18 This is a block diagram of an electronic device according to some embodiments.

[0044] Figure 19 Schematic diagrams of electronic devices according to various embodiments are shown. Detailed Implementation

[0045] In the following, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can readily implement the present disclosure. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein.

[0046] For ease of explanation, the dimensions and thicknesses of each component shown in the accompanying drawings are arbitrarily depicted, and therefore this disclosure is not necessarily limited to what is shown. In the drawings, thicknesses are enlarged to clearly represent the individual layers and regions. Furthermore, in the drawings, the thicknesses of some layers and regions are exaggerated for ease of explanation.

[0047] Furthermore, when a portion of a layer, membrane, region, or plate is referred to as being "above" or "on" another portion, this includes not only the case where it is "directly" "above" the other portion, but also the case where there is another portion in between. Conversely, when an element is referred to as being "directly" "on" another element, there is no intervening element. Additionally, being "above" or "on" a reference portion means being located above or below the reference portion, and does not necessarily mean being located "above" or "on" the reference portion in a direction opposite to gravity.

[0048] Furthermore, throughout the instruction manual, when it is said that a part “includes” a component, it means that it may also include other components, rather than excluding other components, unless otherwise explicitly stated.

[0049] Furthermore, throughout the instruction manual, when "on a plane" is mentioned, it means when the target part is viewed from above, and when "in a cross section" is mentioned, it means when the target part is cut vertically into a cross section and viewed from the side.

[0050] Furthermore, throughout the specification, when the term "connection" is used, it not only means that two or more components are directly connected, but also includes cases where two or more components are indirectly connected, physically connected, or electrically connected through another component, as well as cases where parts that are substantially integrated but are referred to by different names according to their location or function are connected to each other.

[0051] Furthermore, throughout the specification, when a part (such as a conductor, layer, film, region, plate, or component) is referred to as “extending in a first or second direction,” this does not simply mean a straight shape extending in that direction, but rather that it is a structure that extends generally along the first or second direction, and also includes structures that are bent at some parts, have a serrated structure, or extend while including a bent structure.

[0052] Furthermore, electronic devices including the display devices and display panels described in this specification (e.g., mobile phones, televisions, monitors, laptop computers, etc.) or electronic devices including display devices and display panels manufactured by the manufacturing methods described in this specification are not excluded from the scope of this specification.

[0053] In the following text, reference will be made to Figure 1 A display device according to an embodiment is described.

[0054] Figure 1 This is a cross-sectional view of a display device 10 equipped with multiple display units according to an embodiment. In this embodiment, Figure 1 The display device 10 includes a first display unit 501, a second display unit 502, and a tempered glass plate GA. The first display unit 501 and the second display unit 502 can be respectively divided into a display area PA and a transmission area TA, each having a predetermined width. Figure 1In this embodiment, the display area PA and the transmissive area TA appear to have substantially the same width, but in other embodiments, their widths may differ. The display area PA displays an image or information, and the transmissive area TA allows light reflected from an object behind the display device 10 to be transmitted to the front of the display device 10. This makes objects behind the display device 10 visible from the front of the display device 10. The transmissive area TA may include a tempered glass plate GA and a cover glass substrate 110, and may additionally have a transparent insulating layer. The transmissive areas TA are located between adjacent display areas PA to form a transparent display device.

[0055] like Figure 1 As shown, the first display unit 501 and the second display unit 502 may share a tempered glass plate GA. More specifically, the first display unit 501 may be formed on one side of the tempered glass plate GA, and the second display unit 502 may be formed on the other side of the tempered glass plate GA. The first display unit 501 and the second display unit 502 may have one or more similar layers.

[0056] The pixel circuit layer PCL may be located in the display area PA of the first display unit 501 in the z-axis direction (hereinafter referred to as the top) of the tempered glass plate GA. The pixel circuit layer PCL may include one or more thin-film transistors. In one embodiment, the layer containing the thin-film transistors may be referred to as the pixel circuit layer PCL.

[0057] To achieve a transparent display, each thin-film transistor can be implemented as an oxide thin-film transistor. An oxide thin-film transistor may include a gate electrode and a semiconductor layer, and the semiconductor layer may be formed of an oxide semiconductor material. Examples of oxide semiconductor materials include indium tin oxide (ITO), polymeric ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium tin zinc oxide (ITZO).

[0058] The light-emitting element layer (ED) can be located on top of the pixel circuit layer (PCL). The ED includes a first electrode E1, a light-emitting layer (EML), and a second electrode E2. The first electrode E1 can be an anode serving as a hole injection electrode. The light-emitting layer (EML) can be located on top of the first electrode E1. In one embodiment, the EML can be a colored (e.g., blue) light-emitting layer (BLUEOLED) and can employ a 4-in-series structure. A 4-in-series structure is a structure in which four light-emitting layers are stacked, and can improve the brightness and lifespan of the display. Alternatively, structures other than the 4-in-series structure can also be used. The second electrode E2 can be located on the EML. The second electrode E2 can be a cathode serving as an electron injection electrode.

[0059] The thin-film encapsulation layer TFE can be located on the second electrode E2. The TFE protects the light-emitting elements inside the display from exposure to moisture and oxygen, and extends their lifespan. The TFE can comprise multiple layers and can be formed as a composite layer including both inorganic and organic layers. The composite layer can consist of an inorganic layer, an organic layer, and an inorganic layer sequentially.

[0060] The color conversion layer can be located on top of the thin-film encapsulation layer TFE. Quantum dots (QDs) can be used as the color conversion layer. The color conversion layer can consist of a first color conversion layer CCL1, a second color conversion layer CCL2, and a transmission layer TL. The first color conversion layer CCL1 converts the incident light into red light to be emitted. The second color conversion layer CCL2 converts the incident light into green light to be emitted. However, light incident on the transmission layer TL is transmitted without color conversion. The incident light can include blue light emitted from the emissive layer EML. The incident light can be blue light alone, or a mixture of blue and green light. Alternatively, the incident light can include all of blue, green, and red light, for example, white light.

[0061] The color filter layer CF can be located on the color conversion layer. The color filter layer CF may include a first color filter CF1, a second color filter CF2, and a third color filter CF3. The first color filter CF1 may overlap with the transmissive layer TL. The first color filter CF1 can transmit blue light passing through the transmissive layer TL and can absorb light of the remaining wavelengths, thereby improving the purity of the blue light emitted from the display device 10.

[0062] The second color filter CF2 can overlap with the first color conversion layer CCL1. The second color filter CF2 can transmit red light that has passed through the first color conversion layer CCL1 and absorb light of the remaining wavelengths, thereby improving the purity of the red light emitted from the display device 10.

[0063] The third color filter CF3 can overlap with the second color conversion layer CCL2. The third color filter CF3 can transmit green light that passes through the second color conversion layer CCL2 and absorb the remaining wavelengths of light, thereby improving the purity of the green light emitted from the display device 10.

[0064] The cover glass substrate 110 may be located on the color filter layer. The cover glass substrate 110 performs the function of protecting the front of the display device 10 and can also be used as a cover window. The top of the cover glass substrate 110 may be coated with an anti-reflective film AR. The anti-reflective film AR can reduce light incident from the outside and make light from inside the panel clearer.

[0065] In one embodiment, the first display unit 501 and the second display unit 502 may have the same structure and may be formed on the upper and lower sides of the tempered glass plate GA, respectively. The stacking directions of the first display unit 501 and the second display unit 502 may be opposite to each other relative to the z-axis direction. (Refer to...) Figure 2 A more detailed explanation based on Figure 1 The structure of the first display unit 501 in the embodiment.

[0066] Figure 2 It is based on Figure 1 A cross-sectional view of the first display unit 501 according to an embodiment. The first display unit 501 can be divided into a color conversion portion CC and a pixel unit DC. Furthermore, the first display unit 501 can be divided into a display area PA and a transmission area TA in a direction intersecting the z-axis. According to one embodiment, the display area PA includes a red light emitting area RLA, a green light emitting area GLA, and a blue light emitting area BLA. A non-emitting area NLA1 can be located between adjacent emitting areas in the red light emitting area RLA, the green light emitting area GLA, and the blue light emitting area BLA. Each emitting area can correspond to a pixel. For example, the blue light emitting area BLA, the red light emitting area RLA, and the green light emitting area GLA can correspond to a blue pixel, a red pixel, and a green pixel, respectively.

[0067] The cross-sectional structure of the display area PA will now be explained in more detail. According to one embodiment, the pixel unit DC includes multiple driving transistors, a light-emitting element layer ED, and a thin-film encapsulation layer TFE, with one driving transistor per pixel. Each driving transistor includes a semiconductor layer ACT and a gate electrode GE. A tempered glass plate GA provides transparency and excellent durability to prevent physical damage.

[0068] The semiconductor layer ACT is located at the top (hereinafter referred to as the top) of the tempered glass plate GA in the z-axis direction. The semiconductor layer ACT may include an oxide semiconductor. The semiconductor layer ACT includes a channel region C, a source region S, and a drain region D. The source region S and the drain region D are arranged on the respective sides of the channel region C.

[0069] Interlayer insulating layer IL1 is located on the gate electrode GE and gate insulating layer GI of the driving transistor. Openings exposing the source region S and drain region D are located in interlayer insulating layer IL1. Source electrode SE and drain electrode DE are located on interlayer insulating layer IL1. Source electrode SE and drain electrode DE are connected to the source region S and drain region D of semiconductor layer ACT through openings formed in interlayer insulating layer IL1, respectively.

[0070] A protective layer IL2 is located on the interlayer insulating layer IL1, the source electrode SE, and the drain electrode DE. A first electrode E1 is located on the protective layer IL2. The first electrode E1 is connected to the drain electrode DE through an opening in the protective layer IL2.

[0071] One of the multiple driving transistors, including the gate electrode GE, the semiconductor layer ACT, the source electrode SE, and the drain electrode DE, is connected to the first electrode E1 and supplies driving current to the light-emitting element layer ED.

[0072] The pixel defining layer (PDL) is located on top of the protective layer (IL2) and the first electrode (E1). The PDL overlaps with the first electrode (E1) and may have a pixel opening defining the light-emitting area of ​​the pixel. The light-emitting layer (EML) is located on the first electrode (E1) at a position overlapping with the pixel opening. Each EML may include a colored light-emitting layer, such as a blue light-emitting layer (BLUEOLED). Furthermore, the EML may be multilayered, including one or more of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). The EML may be primarily located within the pixel opening, but may also be located on the side or top of the PDL.

[0073] The second electrode E2 is located on the light-emitting layer EML. The second electrode E2 can be positioned across multiple pixels and can receive a common voltage through a common voltage transmitter in the non-display area.

[0074] The first electrode E1, the light-emitting layer EML, and the second electrode E2 can form a light-emitting element layer ED corresponding to one pixel among a plurality of pixels. Here, the first electrode E1 can be an anode (which is a hole injection electrode), and the second electrode E2 can be a cathode (which is an electron injection electrode). However, this embodiment is not necessarily limited to this, and according to the driving method of the organic light-emitting display device, the first electrode E1 can be a cathode and the second electrode E2 can be an anode.

[0075] During operation, holes and electrons are injected into the light-emitting layer EML from the first electrode E1 and the second electrode E2, respectively. When the excitons formed when the injected holes and electrons recombine fall back from the excited state to the ground state, light emission occurs.

[0076] A thin-film encapsulation layer (TFE) is located on the second electrode E2. The TFE seals the display layer by covering not only the top surface of the display layer, including the light-emitting element layer ED, but also its side surfaces. Since light-emitting devices are highly susceptible to moisture and oxygen, the TFE seals the display layer and prevents the inflow of external moisture and oxygen. In one embodiment, the TFE may comprise multiple layers and may be formed as a composite layer including both inorganic and organic layers. In one embodiment, the TFE may be formed as a three-layer structure having a first inorganic layer EIL1, an organic layer EOL, and a second inorganic layer EIL2 formed sequentially.

[0077] The color conversion section CC is located on top of the thin-film encapsulation layer TFE. The color conversion section CC includes a cover glass substrate 110 that overlaps with the tempered glass plate GA. The color conversion section CC may include a dam BK1 located on the thin-film encapsulation layer TFE. The dam BK1 may include a first opening OP1, a second opening OP2, and a third opening OP3 that overlap with the pixel openings. The dimensions of the first opening OP1, the second opening OP2, and the third opening OP3 may be different or the same.

[0078] A first color conversion layer CCL1 may be located within a first opening OP1. The first color conversion layer CCL1 can convert the supplied light into red light. The first color conversion layer CCL1 may include quantum dots. A second color conversion layer CCL2 may be located within a second opening OP2. The second color conversion layer CCL2 can convert the supplied light into green light. The second color conversion layer CCL2 may include quantum dots. In one embodiment, Figure 2 The color conversion layer and transmission layer TL in the middle can be arranged according to... Figure 1 The same order is provided as shown. Now, the quantum dots in the color conversion layer will be described in detail below.

[0079] Quantum dots (hereinafter also referred to as semiconductor nanocrystals) may include group II-VI compounds, group III-V compounds, group IV-VI compounds, group IV elements or compounds, group I-III-VI compounds, group II-III-VI compounds, group I-II-IV-VI compounds, or combinations thereof.

[0080] Group II-VI compounds include binary compounds and mixtures thereof selected from the group consisting of CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, and MgS; and compounds selected from AgInS, CuInS, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, and CdZnTe. Tri-element compounds and mixtures thereof selected from the group consisting of CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, and MgZnS; and tetra-element compounds and mixtures thereof selected from the group consisting of HgZnTeS, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, and HgZnSTe. Group II-VI compounds may also include Group III metals.

[0081] Group III-V compounds include binary compounds and mixtures thereof selected from the group consisting of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, and InSb; ternary compounds and mixtures thereof selected from the group consisting of GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InNAs, InNSb, InPAs, InZnP, and InPSb; and quaternary compounds and mixtures thereof selected from the group consisting of GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, and InAlPSb. Group III-V compounds may also include Group II metals (e.g., InZnP).

[0082] Group IV-VI compounds include binary compounds and mixtures thereof selected from the group consisting of SnS, SnSe, SnTe, PbS, PbSe, and PbTe; ternary compounds and mixtures thereof selected from the group consisting of SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, and SnPbTe; and quaternary compounds and mixtures thereof selected from the group consisting of SnPbSSe, SnPbSeTe, and SnPbSTe.

[0083] Group IV elements or compounds are single-element compounds and combinations thereof selected from the group consisting of Si and Ge, and binary compounds and combinations thereof selected from the group consisting of SiC and SiGe, but are not limited thereto.

[0084] Examples of Group I-III-VI compounds include, but are not limited to, CuInSe2, CuInS2, CuInGaSe, and CuInGaS. Examples of Group I-II-IV-VI compounds include, but are not limited to, CuZnSnSe and CuZnSnS. Group IV elements or compounds are single elements selected from the group consisting of Si and Ge, and mixtures thereof, as well as binary compounds selected from the group consisting of SiC and SiGe, and mixtures thereof.

[0085] Group II-III-VI compounds can be ternary compounds and combinations thereof selected from the group consisting of ZnGaS, ZnAlS, ZnInS, ZnGaSe, ZnAlSe, ZnInSe, ZnGaTe, ZnAlTe, ZnInTe, ZnGaO, ZnAlO, ZnInO, HgGaS, HgAlS, HgInS, HgGaSe, HgAlSe, HgInSe, HgGaTe, HgAlTe, HgInTe, MgGaS, MgAlS, MgInS, MgGaSe, MgAlSe, and MgInSe, but are not limited to these.

[0086] Group I-II-IV-VI compounds may be selected from CuZnSnSe and CuZnSnS, but are not limited thereto.

[0087] In one embodiment, the quantum dots may not include cadmium. The quantum dots may comprise semiconductor nanocrystals based on Group III-V compounds (including indium and phosphorus). The Group III-V compounds may also include zinc. The quantum dots may comprise semiconductor nanocrystals based on Group II-VI compounds (including chalcogen elements (e.g., sulfur, selenium, tellurium, or combinations thereof) and zinc).

[0088] In quantum dots, the aforementioned binary, ternary, and / or quaternary compounds can exist in the particles at a uniform concentration, or they can exist in the same particle with a concentration distribution that is partially divided into different states. Furthermore, a quantum dot can have a core / shell structure surrounding other quantum dots. The interface between the core and shell can have a concentration gradient, where the concentration of the element present in the shell decreases towards the center.

[0089] In some embodiments, the quantum dot may have a core / shell structure comprising a core containing the aforementioned nanocrystals and a shell surrounding the core. The shell of the quantum dot can serve as a protective layer to maintain semiconductor properties by preventing chemical denaturation of the core, and / or as a charging layer to impart electrophoretic properties to the quantum dot. The shell can be monolayer or multilayer. The interface between the core and shell may have a concentration gradient, wherein the concentration of elements present in the shell decreases towards the center. Examples of shells for quantum dots include metal or nonmetal oxides, semiconductor compounds, or combinations thereof.

[0090] For example, the oxides of metals or nonmetals are binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, NiO, or MgAl2O4, CoFe2O4, NiFe2O3, CoMn2O4, etc., but this disclosure is not limited thereto.

[0091] In addition, semiconductor compounds include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, etc. However, this disclosure is not limited thereto.

[0092] The interface between the core and shell can have a concentration gradient, where the concentration of elements present in the shell decreases towards the center. Furthermore, the semiconductor nanocrystal can have a structure comprising a single semiconductor nanocrystal core and a multilayered shell surrounding it. In one embodiment, the multilayered shell can have two or more layers, such as 2, 3, 4, 5, or more layers. Two adjacent layers of the shell can have a single composition or different compositions. In the multilayered shell, each layer can have a composition that varies along its radius.

[0093] The full width at half maximum (FWHM) of the emission wavelength spectrum of quantum dots can be about 45 nm or less, about 40 nm or less in one embodiment, and about 30 nm or less in one or more additional embodiments. Within this range, color purity or color reproducibility can be improved. Furthermore, since light emitted through these quantum dots is emitted in all directions, optical viewing angles can be improved.

[0094] In one embodiment, the quantum dot can have different band gaps between the shell material and the core material. For example, the band gap of the shell material can be larger than that of the core material. In other embodiments, the band gap of the shell material can be smaller than that of the core material. The quantum dot can have multiple shells. In a multi-shell structure, the band gap of the outer layer can be larger than that of the inner layer (e.g., the layer closest to the core). In a multi-shell structure, the band gap of the outer layer can be smaller than that of the inner layer.

[0095] Quantum dots can have their absorption / emission wavelengths controlled by adjusting their composition and size. The maximum emission peak wavelength of quantum dots can range from ultraviolet to infrared wavelengths or even longer.

[0096] Quantum dots can have a predetermined quantum efficiency. For example, quantum dots can have a quantum efficiency of at least about 10%, such as at least about 30%, at least about 50%, at least about 60%, at least about 70%, at least about 90%, or even 100%. Quantum dots can have a relatively narrow spectrum. The full width at half maximum (FWHM) of the emission wavelength spectrum of a quantum dot can be, for example, about 50 nm or less, about 45 nm or less in some embodiments, about 40 nm or less in some embodiments, or about 30 nm or less in other embodiments.

[0097] Quantum dots can have predetermined particle sizes. For example, the particle size of quantum dots can range from about 1 nm or larger to about 100 nm or smaller. The particle size refers to the diameter of the particle or the diameter converted from a two-dimensional image (e.g., obtained by analysis by transmission electron microscopy) assuming a spherical shape. In one embodiment, the size range of quantum dots can be from about 1 nm to about 20 nm, for example, greater than 2 nm, greater than 3 nm, or greater than 4 nm, and less than 50 nm, less than 40 nm, less than 30 nm, less than 20 nm, less than 15 nm, or less than 10 nm. Quantum dots can have various shapes. For example, the shapes of quantum dots can include, but are not limited to, spheres, polyhedra, pyramids, multi-legged shapes, cubes, cuboids, nanotubes, nanorods, nanowires, nanosheets, or combinations thereof.

[0098] Quantum dots are commercially available or can be synthesized appropriately. The particle size of quantum dots can be controlled relatively freely during colloidal synthesis, and the particle size can also be uniformly adjusted.

[0099] Quantum dots may include organic ligands (e.g., having hydrophobic and / or hydrophilic moieties). Organic ligand residues may be bound to the surface of the quantum dots. Organic ligands include RCOOH, RNH2, R2NH, R3N, RSH, R3PO, R3P, ROH, RCOOR, RPO(OH)2, RHPOOH, R2POOH, or combinations thereof, wherein R independently represents a substituted or unsubstituted alkyl group, a C3 to C40 (e.g., C5 or larger and C24 or smaller) substituted or unsubstituted alkenyl group, a C3 to C40 substituted or unsubstituted aliphatic hydrocarbon group, a C6 to C40 (e.g., C6 or larger and C20 or smaller) substituted or unsubstituted aryl group, a substituted or unsubstituted aromatic hydrocarbon group, or combinations thereof.

[0100] Examples of organic ligands include: thiols, such as methanethiol, ethanethiol, propanethiol, butanethiol, pentanethiol, hexanethiol, octanethiol, dodecanethiol, hexadecanethiol, octadecanethiol, and benzylthiol; amines, such as methylamine, ethylamine, propylamine, butylamine, pentylamine, hexylamine, octylamine, nonylamine, decylamine, dodecylamine, hexadecylamine, octadecylamine, dimethylamine, diethylamine, dipropylamine, tributylamine, and trioctylamine; carboxylic acid compounds, such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, hexanoic acid, heptanoic acid, octanoic acid, dodecanoic acid, hexadecanoic acid, oleic acid, and benzoic acid; and phosphine compounds, such as methylphosphine, ethyl ... Phosphorus, propylphosphine, butylphosphine, pentylphosphine, octylphosphine, dioctylphosphine, tributylphosphine, and trioctylphosphine; phosphine compounds or their oxides, such as methylphosphine oxide, ethylphosphine oxide, propylphosphine oxide, butylphosphine oxide, pentylphosphine oxide, tributylphosphine oxide, octylphosphine oxide, dioctylphosphine oxide, trioctylphosphine oxide, diphenylphosphine, and triphenylphosphine compounds, or their oxides; alkylphosphonic acids, such as hexylphosphine, octylphosphine, dodecylphosphine, tetradecylphosphine, hexadecylphosphine, octadecylphosphine, C5 to C20 alkylphosphine, and C5 to C20 alkylphosphine; but not limited to these. Quantum dots may comprise hydrophobic organic ligands, alone or in mixtures of one or more types. The hydrophobic organic ligands may not contain photopolymerizable residues (e.g., acrylate groups, methacrylate groups, etc.).

[0101] Refer again Figure 2 The color-conversion insulating layer IL3 can be positioned on the dam BK1, the first color-conversion layer CCL1, the second color-conversion layer CCL2, and the transmissive layer TL. The color-conversion insulating layer IL3 can have a shape that covers the dam BK1, the first color-conversion layer CCL1, the second color-conversion layer CCL2, and the transmissive layer TL. According to one embodiment, the color-conversion insulating layer IL3 can be omitted.

[0102] The interlayer insulation layer IL1, protective layer IL2, and color-changing insulation layer IL3 can be insulating films made of organic or inorganic materials. Inorganic insulating films may include silicon oxide (SiO2). x SiN x or silicon nitride oxide SiO x N y Organic insulating films may include one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0103] According to one embodiment, the transmissive layer TL may be located in the third opening OP3 of the dam BK1. Furthermore, the transmissive layer TL may be located in the portion of the space separated by the dam BK1 corresponding to the blue light emitting region BLA. The transmissive layer TL can transmit light incident from the light-emitting element layer ED of the corresponding pixel emitting blue light. In the display panel according to this embodiment, the first color conversion layer CCL1 converts the incident light from the corresponding pixel into red light to be emitted. Furthermore, the second color conversion layer CCL2 converts the incident light from the corresponding pixel into green light to be emitted. However, light incident on the transmissive layer TL is transmitted without color conversion. In this case, the incident light may include blue light. The incident light may be blue light alone, or a mixture of blue light and another color of light (e.g., green light). In one embodiment, the incident light may include all of blue, green, and red light, for example, white light. As previously indicated, Figure 2 The order of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmission layer TL is the same as that of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmission layer TL. Figure 1 The order of these layers differs. In one embodiment, Figure 2 The order of the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmission layer TL in the image can be... Figure 1 The order indicated in the text is the same.

[0104] The filler layer FL can be located on the color conversion insulating layer IL3. The filler layer FL can be located on and extend across the dam BK1, the first color conversion layer CCL1, the second color conversion layer CCL2, and the transmissive layer TL. The color conversion section CC includes a first color filter CF1, a second color filter CF2, and a third color filter CF3 located between the cover glass substrate 110 and the pixel unit DC.

[0105] At least two of the third color filter CF3, the second color filter CF2, and the first color filter CF1 can overlap in the non-emitting region NLA1 and serve as a light-blocking layer. The non-emitting region NLA1 can overlap with the pixel-limiting layer PDL of the pixel unit DC and the embankment BK1 of the color conversion part CC.

[0106] The transmissive region TA includes a tempered glass plate GA and a cover glass substrate 110. In one embodiment, the transmissive region TA may optionally include at least one of a plurality of transparent insulating layers (e.g., IL1, IL2, IL3, FL) through which light can be transmitted, and may not include light-blocking layers (e.g., conductive layers (such as gate electrodes, source / drain electrodes, etc.)). In one embodiment, an outer coating OC may be provided (e.g., see...). Figure 3 ( ) to replace the cover glass substrate 110. In the following text, it will be explained by Figure 3 Come and check Figure 1 Modified embodiments of the present invention.

[0107] Figure 3 This is a cross-sectional view of a display device according to another embodiment of the present disclosure. In this embodiment, an outer coating OC is used instead of the cover glass substrate 110. Otherwise, the display device may have the same characteristics as described above. Figure 1 The structure is the same as that of the embodiment. The outer coating OC may cover the color filter layer CF and may be positioned on top of the color filter layer CF. The outer coating OC is designed to protect and flatten the top surface of the display device, may include an organic insulating material, and may be a single layer or multiple layers. The organic insulating material may include one or more materials selected from, for example, polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0108] The transmission region TA includes a tempered glass plate GA and at least one of a plurality of transparent insulating layers (OC, IL1, IL2, IL3, FL in one embodiment) through which light can be transmitted. Light-blocking layers (e.g., conductive layers such as gate electrodes, source / drain electrodes, etc.) may not be located in the transmission region TA.

[0109] In the following text, reference will be made to Figures 4 to 11 Various embodiments of the pixel arrangement structure of the first display unit 501 and the second display unit 502 are discussed.

[0110] Figure 4 and Figure 5 This is a floor plan showing an example of a display device.

[0111] according to Figure 4 In the embodiments, in the first display unit 501 and the second display unit 502, the first column may have a red pixel column R, the second column may have a green pixel column G, and the third column may have a blue pixel column B. These three pixel columns are collectively referred to as unit pixel columns. At this time, the pixel columns are columns of the same color arranged in the y-axis direction. The fourth, fifth, and sixth columns are transmission areas TA where no pixel columns are arranged. Subsequently, starting from the seventh, eighth, and ninth columns, the unit pixel columns are repeated again, and the transmission area TA and the display area PA are arranged alternately. When viewed from the front of the first display unit 501, the unit pixel columns in the display areas PA of the first display unit 501 and the second display unit 502 can overlap. Therefore, in Figure 4 and Figure 5 In one embodiment, the first display unit 501 and the second display unit 502 have identical unit pixel columns arranged in the same way.

[0112] exist Figure 5In this array, the scan lines (SI) extend primarily horizontally and transmit the scan signal to the corresponding unit pixel. The data lines (DI) extend primarily vertically and control the corresponding pixels and transmit information.

[0113] The structure of the display device according to the embodiments of this disclosure described above is merely an example, and various modifications can be made. In one embodiment, the unit pixel column may include a fourth pixel column in addition to red, green, and blue; any pixel column may be omitted, or the order of the colors may be changed. Furthermore, pixels of the same color may be arranged in the same row along the x-axis to form a unit pixel row.

[0114] Figure 6 and Figure 7 This is a plan view illustrating an example of a display device. In this example, the pixel columns in the first display unit 501 are arranged differently from those in the second display unit 502.

[0115] according to Figure 6 In the embodiment, in the first display unit 501, the first column may have a red pixel column R, the second column may have a green pixel column G, and the third column may have a blue pixel column B, and these three columns are collectively referred to as unit pixel columns. The fourth, fifth, and sixth columns are transmission areas TA without pixel columns.

[0116] In the second display unit 502, the first, second, and third columns are transmission areas TA without any pixel columns. The fourth column contains a red pixel column R, the fifth column contains a green pixel column G, and the sixth column contains a blue pixel column B. Therefore, when viewed along the x-axis, the pixel arrangement in the second display unit 502 can be a shifted version of the three pixel columns in the first display unit 501. Thus, when viewed from the front of the first display unit 501, the positions of the unit pixel columns in the display areas PA of the first and second display units 501 can be different and can not overlap.

[0117] The structure of the display device according to the embodiments of this disclosure described above is merely an example and various modifications can be made. For example, a fourth pixel column may be included in addition to red, green, and blue, or any pixel column may be omitted. Furthermore, pixels of the same color may be positioned in the same row to form a row of unit pixels arranged in the x-axis direction. Additionally, if the display area PA of the first display unit 501 does not move according to the size of the unit pixel column in the second display unit 502, one or more pixel columns of the first display unit 501 may partially overlap with one or more pixel columns of the second display unit 502.

[0118] Figure 8 and Figure 9This is a plan view illustrating an example of a display device. In this embodiment, one or more transmissive regions are provided between adjacent pixel columns of a unit pixel, and the arrangement of the pixel columns in the first display unit 501 is the same as the arrangement of the pixel columns in the second display unit 502. Figure 9 In this text, the data lines and scan lines are omitted.

[0119] According to one embodiment, the red pixel column R is positioned in the first column of the first display unit 501 and the second display unit 502, and no pixel columns are arranged in the transmissive regions TA in the second and third columns. The green pixel column G is located in the fourth column, and the fifth and sixth columns are transmissive regions TA without pixel columns. Next, the blue pixel column B is located in the seventh column, and the eighth and ninth columns are transmissive regions TA without pixel columns.

[0120] Therefore, when viewed from the front of the first display unit 501, the pixel columns in the display areas PA of the first display unit 501 and the second display unit 502 can overlap. This disclosure is not limited to this, and the color and arrangement order of the pixel columns can be changed, as can the size of the transmissive area TA between each pixel column. For example, only one transmissive area (no pixel column) can be located between adjacent pixel columns in the red, green, and blue pixel columns, or two or more transmissive areas (no pixel columns) can be located between adjacent pixel columns in the red, green, and blue pixel columns.

[0121] Figure 10 and Figure 11 This is a plan view illustrating an example of a display device. In this embodiment, the pixel columns in the first display unit 501 are in an alternating offset pattern relative to the pixel columns in the second display unit 502. Figure 11 In this text, the data lines and scan lines are omitted.

[0122] According to this embodiment, the red pixel column R is located in the first column of the first display unit 501, and there are no pixel columns in the second and third columns of the transmissive region TA. The green pixel column G is located in the fourth column, and the fifth and sixth columns are transmissive regions TA without any pixel columns. Next, the blue pixel column B is located in the seventh column, and the eighth and ninth columns are transmissive regions TA without any pixel columns.

[0123] In the second display unit 502, the first column is the transmissive region TA where no pixels are present, and the second column contains the red pixel column R. The third and fourth columns are the transmissive regions TA where no pixels are present, and the fifth column is where the green pixel column G is located. The sixth and seventh columns are the transmissive regions TA where no pixels are present, and the blue pixel column B is located in the eighth column. Therefore, compared to the pixel columns in the first display unit 501, the pixel columns in the second display unit 502 are offset by one column along the x-axis.

[0124] This disclosure is not limited thereto, and the color and arrangement order of the pixel columns can be changed, as can the size of the transmissive region TA between each pixel column. The movement size or direction of the pixel columns in the second display unit 502 compared to the first display unit 501 is not limited to a specific embodiment and can be set in various ways. For example, the pixel columns in the second display unit 502 can be shifted two or more columns along the x-axis compared to the pixel columns in the first display unit 501.

[0125] In the following description, from Figures 12 to 17 Various structures were discussed in which a first display unit 501 and a second display unit 502 located on different sides of a tempered glass plate GA are electrically connected to a printed circuit board 300 via integrated circuit films 400, 410, 401 and / or 411.

[0126] Figure 12 This is a perspective view of a display device 20 according to an embodiment. The display device 20 includes a display device 10 connected to a printed circuit board 300. As previously indicated, the display device 10 includes a tempered glass plate GA, a first display unit 501, and a second display unit 502. In addition to the printed circuit board 300, the display device 20 also includes a first integrated circuit film 400 located on (or connected to) the first display unit 501, a second integrated circuit film 410 located on (or connected to) the second display unit 502, and a driver chip IC.

[0127] Integrated circuit films 400 and 410 may include, for example, a base film, a driver chip IC, wires, and via patterns. A first display unit 501 and a second display unit 502, placed on opposite sides of the tempered glass plate GA of the display device 20, can be connected to a printed circuit board 300 using chip-on-film (COF) technology of integrated circuit films 400 and 410.

[0128] In this structure, the first integrated circuit film 400 and the second integrated circuit film 410 are electrically connected to a pad area located on one side (also referred to as the first side) of the printed circuit board 300, and have a structure connected to the same side of the printed circuit board 300. Furthermore, a control driver chip can be formed on the printed circuit board 300. The control driver chip on the printed circuit board 300 can send and control data signals to each driver chip IC on the integrated circuit films 400 and 410. Figure 14 This connection structure is shown in more detail.

[0129] Figure 13 This is a perspective view of a display device 30 according to another embodiment. Apart from the connection method, the display device 30 is similar to the one described above. Figure 12The display device 20 is the same. In this embodiment, the first integrated circuit film 401 is connected to the first side of the printed circuit board 300, and the second integrated circuit film 411 is located on the second side, which is the opposite side of the first side, and can be connected to the corresponding side of the printed circuit board 300. In this structure, the first integrated circuit film 401 and the second integrated circuit film 411 are electrically connected to the pad portion located on the first side of the printed circuit board 300 and the pad portion located on the second side opposite to the first side, thereby forming a structure connected to both sides of the printed circuit board 300.

[0130] Figure 14 yes Figure 12 A cross-sectional view of one embodiment. The display device 20 includes a tempered glass plate GA, a first display unit 501, a second display unit 502, a first integrated circuit film 400 located on the first display unit 501, a second integrated circuit film 410 located on the second display unit 502, at least one driver chip IC, and a printed circuit board 300. The printed circuit board 300 is electrically connected to the first display unit 501 and the second display unit 502 formed on opposite sides of the tempered glass plate GA via corresponding one of the integrated circuit films 400 and 410.

[0131] On a first side of a printed circuit board 300, alternating first a pad portion and first b pad portion are formed. A first integrated circuit film 400 is connected to the first a pad portion of the printed circuit board 300, and a second integrated circuit film 410 can be connected to the first b pad portion of the printed circuit board 300. Simultaneously, a second a pad portion and a second b pad portion are formed on a first side and a second side of a tempered glass plate GA, respectively. The first integrated circuit film 400 is connected to the second a pad portion of the tempered glass plate GA, and the second integrated circuit film 410 can be connected to the second b pad portion of the tempered glass plate GA.

[0132] Each of the first integrated circuit film 400 and the second integrated circuit film 410 has a conductive wire formed thereon, such that the printed circuit board 300, the first display unit 501 and the second display unit 502 are electrically connected to each other. At this time, the conductive wires in the first integrated circuit film 400 and the conductive wires in the second integrated circuit film 410 can be connected, and according to an embodiment, they can have a structure in which they are separated from each other.

[0133] exist Figure 14In this embodiment, at least one driver chip IC includes two driver chip ICs coupled to a corresponding one of the first integrated circuit film 400 and the second integrated circuit film 410. The control driver chip may be located on the printed circuit board 300. In some cases, more driver chips may be present than those described in one embodiment. Two display units can be effectively driven by the driver chip ICs. The driver chip ICs play a role in controlling the pixels of the display units. By using multiple driver chip ICs, high-resolution or large-size displays can be stably driven.

[0134] Figure 15 yes Figure 13 A cross-sectional view of the display device 30.

[0135] The display device 30 includes a tempered glass plate GA, a first display unit 501, a first integrated circuit film 401 connecting the first display unit 501 and a printed circuit board 300, a second display unit 502, and a second integrated circuit film 411 connecting the second display unit 502 and the printed circuit board 300. The printed circuit board 300 is electrically connected to the first display unit 501 and the second display unit 502 formed on opposite sides of the tempered glass plate GA via integrated circuit films 401 and 411.

[0136] A first pad portion is formed on a first side of the printed circuit board 300, and a second pad portion is formed on a second side. A first integrated circuit film 401 is connected to the first pad portion of the printed circuit board 300, and a second integrated circuit film 411 can be connected to the second pad portion of the printed circuit board 300. Simultaneously, a second a pad portion and a second b pad portion are formed on the first and second sides of the tempered glass plate GA, respectively. The first integrated circuit film 401 is connected to the second a pad portion of the tempered glass plate GA, and the second integrated circuit film 411 can be connected to the second b pad portion of the tempered glass plate GA.

[0137] Each of the first integrated circuit film 401 and the second integrated circuit film 411 is formed with a wire, such that the printed circuit board 300, the first display unit 501 and the second display unit 502 are electrically connected to each other.

[0138] The driver chip IC can be located on the first integrated circuit film 401 and the second integrated circuit film 411. The control driver chip can also be located on the printed circuit board 300. In some cases, more driver chips may be present than those described in one embodiment. Referring below... Figure 16 and Figure 17 To discuss in more detail Figure 12 and Figure 14 Electrical connection structure.

[0139] Figure 16 According to one embodiment Figure 12 or Figure 14 A cross-sectional view of the second integrated circuit film 410.

[0140] exist Figure 16 In the second integrated circuit film 410, a first conductive line 511 and a first b-pad portion BP 1b are formed on one side, and a second conductive line 512 and a second b-pad portion BP 2b are formed on the other side. The first conductive line 511 may be an extension of the first b-pad portion BP 1b, and the second conductive line 512 may be an extension of the second b-pad portion BP 2b. A via VH penetrating the second integrated circuit film 410 can be formed in the overlapping area of ​​the first conductive line 511 and the second conductive line 512. A via pattern VP is disposed within the via VH. The via pattern VP can penetrate the second integrated circuit film 410 to electrically connect the first conductive line 511 and the second conductive line 512.

[0141] according to Figure 16 The structure of the second integrated circuit film 410, wherein the first b pad portion BP 1b can be connected to the first a pad portion BP 1a (for example, see...). Figure 17 They are located on the same first side of the printed circuit board 300, just like the others. Thus, as... Figure 12 and Figure 14 In the example, the first a pad portion BP 1a and the first b pad portion BP 1b located on the first side of the printed circuit board 300 can be electrically connected to the first display unit 501 and the second display unit 502, respectively.

[0142] Figure 17 yes Figure 14 A cross-sectional view of the printed circuit board 300.

[0143] The printed circuit board 300 includes a first a-pad portion BP 1a connected to a first integrated circuit film 400 and a first b-pad portion BP 1b connected to a second integrated circuit film 410. The first a-pad portion BP 1a and the first b-pad portion BP 1b may be alternately positioned on one side (also referred to as the first side) of the printed circuit board 300. However, according to an embodiment, the first a-pad portion BP 1a and the first b-pad portion BP 1b may be positioned overlappingly on the first side, or they may be formed on the first side and the second side and thus located on different sides.

[0144] The display device according to the embodiments can be applied to various electronic devices. The electronic device according to the embodiments may include the display device, and may also include modules or devices with additional functions in addition to the display device.

[0145] Figure 18 This is a block diagram of an electronic device 1000 according to an embodiment. (Refer to...) Figure 18The electronic device 1000 according to the embodiment may include a display module 11, a processor 12, a memory 13 and a power module 14.

[0146] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0147] The memory 13 can store the data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application program stored in the memory 13, video data signals and / or input control signals are sent to the display module 11, and the display module 11 is able to process the received signals to output video information through the display screen.

[0148] The power module 14 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power required for the operation of the electronic device 1000.

[0149] At least one of the components of electronic device 1000 may be included in the display device according to the above embodiment. Furthermore, some individual modules functionally included in a single module may be incorporated into the display device, while other modules may be separately disposed from the display device. For example, the display device may include display module 11, while processor 12, memory 13, and power module 14 may be disposed as other devices within electronic device 1000 that are not part of the display device.

[0150] Figure 19 Schematic diagrams of electronic devices according to various embodiments are shown.

[0151] Reference Figure 19 Various electronic devices having a display device according to the embodiments may include not only image display electronic devices, such as smartphones 1000_1a, tablet PCs 1000_1b, laptops 1000_1c, televisions 1000_1d, and desktop monitors 1000_1e, but also wearable electronic devices with display modules, such as smart glasses 1000_2a, head-mounted displays 1000_2b, smartwatches 1000_2c, and automotive electronic devices with display modules 1000_3, such as those placed on car dashboards, center consoles, CID (Central Information Display), interior mirror displays, etc.

[0152] Although embodiments of the present disclosure have been described in detail above, the scope of the disclosure is not limited thereto, and various modifications and improvements are possible by those skilled in the art using the basic concepts of the present disclosure as defined in the appended claims. These embodiments may be combined to form additional embodiments.

Claims

1. A display device, characterized by comprising: include: Tempered glass plate; A first display unit is located on a first side of the tempered glass plate and has a first display area and a first transmission area arranged in one direction. The first display area includes a first pixel circuit layer and a first light-emitting element layer. as well as The second display unit is located on a second side of the tempered glass plate in a direction opposite to the first side where the first display unit is located. The second display unit has a second display area and a second transmission area arranged in the first direction. The second display area includes a second pixel circuit layer and a second light-emitting element layer.

2. The display device according to claim 1, characterized in that, Each of the first display area of ​​the first display unit and the second display area of ​​the second display unit includes a unit pixel column, wherein the unit pixel column includes a red pixel column, a green pixel column, and a blue pixel column. When viewed from the front of the first display unit, the unit pixel column of the first display area of ​​the first display unit and the unit pixel column of the second display area of ​​the second display unit overlap in one direction.

3. The display device according to claim 1, characterized in that, Each of the first display area of ​​the first display unit and the second display area of ​​the second display unit includes a unit pixel column, wherein the unit pixel column includes a red pixel column, a green pixel column, and a blue pixel column. When viewed from the front of the first display unit, the unit pixel column of the first display area of ​​the first display unit and the unit pixel column of the second display area of ​​the second display unit do not overlap in one direction.

4. The display device according to claim 1, characterized in that, The first transmissive region and the second transmissive region are located between adjacent pixel columns displaying different colors of light in the first display area of ​​the first display unit and the second display area of ​​the second display unit, respectively. When viewed from the front of the first display unit, the pixel columns of the first display area of ​​the first display unit and the pixel columns of the second display area of ​​the second display unit overlap in one direction.

5. The display device according to claim 1, characterized in that, The first transmissive region and the second transmissive region are located between adjacent pixel columns displaying different colors of light in the first display area of ​​the first display unit and the second display area of ​​the second display unit, respectively. When viewed from the front of the first display unit, the pixel columns of the first display area of ​​the first display unit and the pixel columns of the second display area of ​​the second display unit do not overlap in one direction.

6. The display device according to claim 1, characterized in that, The first display unit includes: a first thin-film encapsulation layer on the first light-emitting element layer of the first display unit, a first color conversion layer on the first thin-film encapsulation layer, and a first color filter layer on the upper part of the first color conversion layer; and The second display unit includes: a second thin film encapsulation layer below the second light-emitting element layer of the second display unit, a second color conversion layer below the second thin film encapsulation layer, and a second color filter layer below the second color conversion layer.

7. The display device according to claim 6, characterized in that, The first display unit further includes a first cover glass substrate or a first outer coating layer on the first color filter layer of the first display unit, and The second display unit further includes a second cover glass substrate or a second outer coating layer below the second color filter layer of the second display unit.

8. A display device, characterized in that, include: The first display unit and the second display unit are located on opposite sides of the tempered glass plate, respectively. Printed circuit boards; A first integrated circuit film, wherein the first integrated circuit film connects the first display unit and the printed circuit board; A second integrated circuit film, wherein the second integrated circuit film connects the second display unit and the printed circuit board; as well as A driver chip is formed on a corresponding integrated circuit film in the first integrated circuit film and the second integrated circuit film, wherein the first integrated circuit film is connected to a first side of the printed circuit board and the second integrated circuit film is connected to a second side of the printed circuit board.

9. The display device according to claim 8, wherein The first side and the second side are the same side of the printed circuit board.

10. The display device according to claim 8, wherein The first side and the second side are opposite sides of the printed circuit board.

11. An electronic device, characterized in that, include: Memory; A processor that executes an application stored in the memory; as well as The display device includes a display module that outputs video information provided by the application. The display device includes: Tempered glass plate; A first display unit, located on a first side of the tempered glass plate, has a first display area and a first transmissive area arranged in one direction; the first display area includes a first pixel circuit layer and a first light-emitting element layer; and The second display unit is located on a second side of the tempered glass plate in a direction opposite to the first side where the first display unit is located. The second display unit has a second display area and a second transmission area arranged in the first direction. The second display area includes a second pixel circuit layer and a second light-emitting element layer.

Images