Mould pressing device for diode production and processing

Abstract

The utility model relates to the technical field of electronic component packaging, in particular to a mould pressing device for diode production and processing. The utility model provides a mould pressing device for diode production and processing, which comprises two racks, a blanking machine, heating pipes, a placing plate, an electric push rod, a mounting plate, a butt-joint frame and the like, the blanking machine is mounted between the two racks, the heating pipes are symmetrically mounted on the front side and the rear side in the blanking machine, the placing plate is mounted between the two racks, and the electric push rod is mounted on the placing plate. Electric push rods are symmetrically mounted on the left side and the right side of the discharging machine, a mounting plate is mounted between the telescopic ends of the two electric push rods, and a butt-joint frame is connected to the bottom face of the mounting plate. The chip and the lead frame can be accurately positioned and aligned before mold pressing by extruding the pushing plate through the extruding block, so that the chip and the lead frame can be accurately placed in the mold groove, the problem of non-uniform filling of a packaging material caused by position deviation is avoided, and the packaging consistency and precision are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic component packaging technology, and in particular to a molding device for diode production and processing. Background Technology

[0002] A diode molding apparatus is a device specifically designed to encapsulate semiconductor chips into a protective casing. This apparatus plays a crucial role in the manufacturing process of electronic components, ensuring that diodes can operate stably and reliably in various working environments.

[0003] Existing diode molding devices typically require precise placement of the chip and lead frame inside the mold cavity during use. However, the chip and lead frame cannot be positioned and aligned before molding, which cannot provide additional protection. If the chip or lead frame is not properly aligned, the packaging material may not be able to completely fill all the areas that need protection, resulting in some parts being too thick or too thin, which in turn affects the quality and appearance of the package. In addition, this may also lead to poor electrical connection and affect the functional performance of the diode.

[0004] To address the existing problems, there is a need for a molding device for diode manufacturing that can align the chip and lead frame. Utility Model Content

[0005] To overcome the drawback of not being able to align the chip and lead frame before molding, this invention provides a molding device for diode manufacturing.

[0006] The technical implementation scheme of this utility model is as follows: A molding device for diode production and processing includes a frame, a feeding machine, heating tubes, a placement plate, electric push rods, a mounting plate, a docking frame, a guide frame, and a mold frame. There are two frames, and a feeding machine is installed between the two frames. Heating tubes are symmetrically installed on the front and rear sides inside the feeding machine. A placement plate is installed between the two frames. Electric push rods are symmetrically installed on the left and right sides of the feeding machine. A mounting plate is installed between the telescopic ends of the two electric push rods. A docking frame is connected to the bottom surface of the mounting plate. The feeding machine passes through the mounting plate and connects to the docking frame. A guide frame is installed on the placement plate. The mounting plate and the guide frame are slidably fitted. A mold frame is installed on the top surface of the placement plate. Multiple mold slots are opened on the mold frame. It also includes guide rods, push plates, springs, and extrusion blocks. Guide rods are symmetrically connected on the left and right sides of the front and rear sides of the placement plate. Push plates are slidably connected between two guide rods on the same side of the front and rear sides. Springs are symmetrically connected between the two push plates and the placement plate. Dock slots are evenly spaced on the inner sides of the two push plates. Multiple extrusion blocks are symmetrically and evenly spaced on the front and rear sides of the mounting plate.

[0007] More preferably, it also includes a motor and an agitator rod. The motors are symmetrically installed on the top of the feeder, and the output shafts of the two motors pass through the feeder and are connected to the agitator rod.

[0008] More preferably, it also includes connecting plates and fans, with connecting plates symmetrically connected to both sides of the two racks, and fans installed between the two connecting plates on the same side at the front and back.

[0009] More preferably, it also includes an observation window, which is embedded in the front side of the unloading machine.

[0010] More preferably, the outer sides of the two push plates are provided with bevels.

[0011] More preferably, the inner side of each extrusion block is beveled.

[0012] The beneficial effects of this utility model are as follows: by extruding the push plate by the extrusion block, the chip and lead frame can be accurately positioned and aligned before molding, ensuring that they are precisely placed in the mold groove. This not only avoids the problem of uneven filling of packaging material due to positional offset, but also greatly improves the consistency and accuracy of packaging. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0014] Figure 2 This is a cross-sectional view of the feeding machine of this utility model.

[0015] Figure 3 This is a three-dimensional structural diagram of the mounting plate, docking frame, and extrusion block of this utility model.

[0016] Figure 4 This is a three-dimensional structural diagram of the guide frame, connecting plate, fan, and other components of this utility model.

[0017] Figure 5 This is a three-dimensional structural diagram of the mold frame, mold groove, and guide rod of this utility model.

[0018] Figure 6 This is a three-dimensional structural diagram of the push plate, spring, and docking groove of this utility model.

[0019] The meanings of the reference numerals in the diagram are as follows: 1-Frame, 2-Feeder, 201-Heating tube, 3-Placement plate, 4-Electric push rod, 5-Mounting plate, 6-Dating frame, 7-Guide frame, 8-Mold frame, 9-Mold groove, 10-Guide rod, 11-Push plate, 12-Spring, 13-Dating groove, 14-Extrusion block, 15-Motor, 16-Agitator rod, 17-Connecting plate, 18-Fan, 19-Observation window. Detailed Implementation

[0020] The technical solution will be further described below with reference to specific embodiments. It should be noted that the terms "up," "down," "left," and "right" used in this document refer only to the position of the structure shown in the corresponding drawings. The serial numbers assigned to components in this document, such as "first," "second," etc., are only used to distinguish the described objects and have no sequential or technical meaning. Unless otherwise specified, terms such as "connection" and "linkage" in this application include both direct and indirect connections (linkages).

[0021] Example: A molding apparatus for diode manufacturing, such as... Figures 1-6 As shown, the assembly includes a frame 1, a feeding machine 2, heating tubes 201, a placement plate 3, an electric push rod 4, a mounting plate 5, a docking frame 6, a guide frame 7, a mold frame 8, a guide rod 10, a push plate 11, a spring 12, an extrusion block 14, a motor 15, a stirring rod 16, a connecting plate 17, a fan 18, and an observation window 19. There are two frames 1, with the feeding machine 2 installed between them. Heating tubes 201 are symmetrically installed on the front and rear sides of the feeding machine 2 to preheat the material inside. A placement plate 3 is installed between the racks 1. Electric push rods 4 are symmetrically installed on the left and right sides of the unloading machine 2. A mounting plate 5 is installed between the telescopic ends of the two electric push rods 4. A docking frame 6 is connected to the bottom surface of the mounting plate 5. The unloading machine 2 passes through the mounting plate 5 and connects to the docking frame 6. A guide frame 7 is installed on the placement plate 3, and the mounting plate 5 and the guide frame 7 are in sliding fit. A mold frame 8 is installed on the top surface of the placement plate 3. Multiple mold slots 9 are provided on the mold frame 8 for placing chips and lead frames. The placement plate 3 is symmetrically connected on the front, back, left, and right sides. There are guide rods 10, and push plates 11 are slidably connected between the two guide rods 10 on the same side at the front and rear. The outer sides of the two push plates 11 are provided with inclined surfaces to facilitate the extrusion blocks 14 to extrude. Springs 12 are symmetrically connected between the two push plates 11 and the placement plate 3. The inner sides of the two push plates 11 are evenly spaced with docking grooves 13 to dock with the lead frame for easy pushing. Multiple extrusion blocks 14 are symmetrically and evenly spaced on the front and rear sides of the mounting plate 5. The inner side of each extrusion block 14 is inclined to facilitate the extrusion of the push plates 11. Motors 15 are symmetrically installed on the top of the feeding machine 2. The output shafts of the two motors 15 pass through the feeding machine 2 and are connected to agitator rods 16 to agitate the material inside the feeding machine 2 to make it flow. Connecting plates 17 are symmetrically connected on the left and right sides of the two frames 1. Fans 18 are installed between the two connecting plates 17 on the same side at the front and rear to dissipate heat from the molded diodes. An observation window 19 is embedded on the front side of the feeding machine 2 for observation.

[0022] When diode molding is required, the operator first pours suitable encapsulation material into the feeding machine 2. After the encapsulation material is poured in, two motors 15 and multiple heating tubes 201 are started. The output shaft of motor 15 drives the stirring rod 16 to stir the material inside the feeding machine 2, and the heating tubes 201 heat the material inside the feeding machine 2 to preheat it. Then, multiple suitable chips and lead frames can be placed inside the mold slot 9. After the chips and lead frames are placed, two electric push rods 4 are started. The telescopic ends of the electric push rods 4 drive the mounting plate 5, the docking frame 6 and the extrusion block 14 to move downward. When the extrusion block 14 moves to a certain position, multiple extrusion blocks 14 will squeeze the push plate 11 inward. The push plate 11 will move inward along the guide rod 10, and the spring 12 will be compressed. During its movement, the pusher plate 11 pushes the chip and lead frame that are not properly placed, keeping the electronic components in the center position. When the docking frame 6 contacts and fits with the mold frame 8, the operator turns off the two electric push rods 4 and then starts the feeding machine 2. The feeding machine 2 transports the material inside to the mold slot 9 and the docking frame 6 through multiple feeding pipes to complete the molding process. After the encapsulation material has been placed for a certain period of time and cooled, the operator starts the two electric push rods 4 again. The telescopic ends of the two electric push rods 4 drive the mounting plate 5, the docking frame 6 and the extrusion block 14 to reset. When the extrusion block 14 resets, it no longer extrudes the pusher plate 11. The spring 12 resets, allowing the pusher plate 11 to return to its initial position. Then, the operator can start the two fans 18 to dissipate heat from the encapsulated diode. After the diode has finished dissipating heat, the two fans 18 can be turned off. Finally, the diode is removed and the heating tube 201 and the motor 15 are turned off.

[0023] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A molding device for diode manufacturing, comprising a frame (1), a feeder (2), heating tubes (201), a placement plate (3), an electric push rod (4), a mounting plate (5), a docking frame (6), a guide frame (7), and a mold frame (8). The frame (1) consists of two units, with the feeder (2) installed between the upper sides of the two frames (1). Heating tubes (201) are symmetrically installed on the front and rear sides inside the feeder (2). The placement plate (3) is installed between the two frames (1). (2) Electric push rods (4) are symmetrically installed on the left and right sides. An installation plate (5) is installed between the telescopic ends of the two electric push rods (4). A docking frame (6) is connected to the bottom surface of the installation plate (5). The unloading machine (2) passes through the installation plate (5) and is fixedly connected to the docking frame (6). A guide frame (7) is installed on the top of the placement plate (3). The installation plate (5) and the guide frame (7) are slidably fitted. A mold frame (8) is installed on the top surface of the placement plate (3). Seven mold slots (9) are opened on the mold frame (8). Its characteristic is that... It also includes guide rods (10), push plates (11), springs (12) and extrusion blocks (14). Guide rods (10) are fixedly connected symmetrically on the front and rear sides of the placement plate (3). Push plates (11) are slidably connected between the two guide rods (10) on the same side. Springs (12) are symmetrically connected between the two push plates (11) and the placement plate (3). Seven docking slots (13) are evenly spaced on the inner side of the two push plates (11). Seven extrusion blocks (14) are symmetrically spaced on the front and rear sides of the mounting plate (5).

2. The molding apparatus for diode manufacturing according to claim 1, characterized in that, It also includes a motor (15) and a stirring rod (16). The top of the feeder (2) is symmetrically equipped with motors (15), and the output shafts of the two motors (15) pass through the feeder (2) and are fixedly connected to the stirring rod (16).

3. A molding apparatus for diode manufacturing according to claim 2, characterized in that, It also includes a connecting plate (17) and a fan (18). The two racks (1) are symmetrically connected to the left and right sides, and a fan (18) is installed between the two connecting plates (17) on the same side at the front and back.

4. A molding apparatus for diode manufacturing according to claim 3, characterized in that, It also includes an observation window (19), which is inlaid on the front side of the feeder (2).

5. A molding apparatus for diode manufacturing according to claim 4, characterized in that, The outer sides of the two push plates (11) are provided with slopes.

6. A molding apparatus for diode manufacturing according to claim 5, characterized in that, The inner side of each extrusion block (14) is a slope.

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