Linear interaction wafer conveying device

Abstract

The utility model discloses a linear interaction wafer conveying device which comprises a transfer cavity, a first wafer receiving mechanism, a second wafer receiving mechanism and a jacking mechanism, one of the first wafer receiving mechanism and the second wafer receiving mechanism is arranged on the upper portion, and the other one is arranged on the lower portion, so that the occupied area of the device is reduced, and the space utilization rate is increased; during working, the first wafer receiving mechanism can receive a to-be-processed wafer from the outside and transport the wafer to the working position of the jacking mechanism, the jacking mechanism can jack up the wafer, so that the wafer is separated from the first wafer receiving mechanism, and after the second wafer receiving mechanism moves to the working position, the jacking mechanism can carry the wafer to descend, so that the wafer falls onto the second wafer receiving mechanism; therefore, the second wafer receiving mechanism delivers the wafer to the process chamber. According to the linear interaction wafer conveying device provided by the invention, through the linear motion of the two groups of wafer connecting mechanisms and the lifting motion of the jacking mechanism, the wafers can be quickly handed over and delivered, the transmission path of the wafers is shortened, and the transmission efficiency is improved.

Description

Linear Interactive Wafer Transfer Device Technical Field

[0001] This application relates to the field of wafer manufacturing equipment technology, and in particular to a linear interactive wafer transfer device. Background Technology

[0002] In semiconductor manufacturing, wafer transfer efficiency and equipment layout directly impact production line performance. Traditional single-arm rotary transfer systems rely on an external vacuum control unit (VCE), which presents the following core problems:

[0003] 1. Low transmission efficiency. The rotary robotic arm uses an arc-shaped path, which increases the actual transmission distance by 30%-50% compared to straight-line transmission.

[0004] Second, the equipment occupies a large area. The rotating mechanism requires reserved space for swinging, which increases the equipment's footprint and makes it difficult to adapt to the high-density layout requirements of compact factory buildings.

[0005] Third, the system is complex and costly. External VCE requires multiple sets of cables, and electromagnetic interference can cause signal delays and easily lead to malfunctions. Furthermore, annual maintenance costs and equipment upgrade / retrofit costs are high.

[0006] Fourth, manual intervention can easily disrupt vacuum stability. Traditional equipment requires manual adjustment of the wafer, which leads to frequent vacuum breaks in the cavity. After each vacuum break, the vacuum needs to be re-evacuated, which takes an extra 3-5 minutes, affecting work efficiency and increasing energy consumption.

[0007] Traditional wafer transfer equipment is inefficient, bulky, and unreliable, and there is an urgent need to improve it to overcome the transfer bottleneck in high-precision processes. Summary of the Invention

[0008] The purpose of this application is to overcome the shortcomings of the prior art and provide a linear interactive wafer transfer device.

[0009] This application provides a linear interactive wafer transfer device, comprising: a transfer cavity for connecting to a process chamber; a first wafer receiving mechanism disposed within the transfer cavity for receiving and transferring wafers externally; a second wafer receiving mechanism disposed within the transfer cavity for receiving and transferring wafers to the process chamber; and a lifting mechanism disposed within the transfer cavity and located between the first and second wafer receiving mechanisms, capable of lifting the wafer away from the first wafer receiving mechanism by rising and lowering the wafer into the second wafer receiving mechanism; wherein, one of the first and second wafer receiving mechanisms is positioned above the other... One is positioned below the other, and their movement paths do not interfere with each other. During operation, the first wafer receiving mechanism can pick up the wafer to be processed from the outside and transport the wafer to the working position of the lifting mechanism. The lifting mechanism can lift the wafer, causing it to detach from the first wafer receiving mechanism, so that the first wafer receiving mechanism can move away from the working position. After the second wafer receiving mechanism moves to the working position, the lifting mechanism can lower the wafer, causing the wafer to fall onto the second wafer receiving mechanism. The lifting mechanism continues to lower, avoiding the second wafer receiving mechanism, so that the second wafer receiving mechanism can deliver the wafer to the process chamber.

[0010] Furthermore, the transfer chamber is equipped with: an inlet / outlet, through which a first wafer receiving mechanism can receive or deliver wafers; a connecting port, connecting to the process chamber, through which a second wafer receiving mechanism can deliver wafers into or receive wafers from the process chamber; a first valve for sealing the inlet / outlet; and a second valve for sealing the connecting port. Both the first and second valves have open and closed states. When the first valve is open, the wafer can be transferred through the inlet / outlet. When both the first and second valves are closed, the transfer chamber is closed. When the second valve is open, the wafer can be transferred through the connecting port.

[0011] Furthermore, the cavity wall of the transfer chamber is provided with a sandwich channel, and the first valve and the second valve are slidably disposed in the sandwich channel; the linear interactive wafer transfer device also includes: a first driving member for driving the first valve to approach or move away from the wafer inlet / outlet; and a second driving member for driving the second valve to approach or move away from the connection port.

[0012] Furthermore, the linear interactive wafer transfer device also includes a feed detection device, which is used to confirm whether the wafer has passed through the inlet / outlet port; after confirming that the wafer has completely entered the transfer chamber, the first gate valve enters the closed state.

[0013] Furthermore, the linear interactive wafer transfer device also includes a vacuum pumping mechanism, which is used to regulate the vacuum level in the transfer cavity so that the pressure inside the transfer cavity matches the pressure inside the process chamber.

[0014] Furthermore, the vacuum pumping mechanism includes: a dry vacuum pump connected to the transfer chamber; a pressure sensor for monitoring the vacuum level in the transfer chamber; after the first wafer receiving mechanism receives the wafer to be processed into the transfer chamber, the first gate valve enters the closed state, the dry vacuum pump starts, and the transfer chamber is evacuated; when the vacuum level in the transfer chamber is no greater than 10 mTorr, the second gate valve enters the open state to facilitate the second wafer receiving mechanism to deliver the wafer to the process chamber; if the pressure sensor detects that the vacuum level in the transfer chamber has not reached the preset value, the dry vacuum pump starts the re-evacuation process until the vacuum level meets the process requirements.

[0015] Furthermore, the first wafer receiving mechanism and / or the second wafer receiving mechanism include: a receiving finger disposed in the transfer cavity for receiving wafers; and a transfer drive assembly for driving the receiving finger to translate so that the receiving finger can move to the desired workstation within the transfer cavity.

[0016] Furthermore, the front end of the receiving finger branches to form two support strips; the front end of the receiving finger of the first receiving mechanism faces the wafer inlet / outlet; the front end of the receiving finger of the second receiving mechanism faces the connection port; the receiving finger can extend out of the transfer cavity through the wafer inlet / outlet, or the receiving finger can extend into the process chamber through the connection port; the surface of the receiving finger used to receive the wafer is provided with a groove, which is used to receive and define the position of the wafer.

[0017] Furthermore, the conveying drive assembly includes: a conveying driver, disposed outside the transfer cavity; a first magnetic chuck, disposed at the output end of the conveying driver; and a second magnetic chuck, disposed on the receiving finger; the first magnetic chuck and the second magnetic chuck attract each other, and the receiving finger is non-contactly connected to the conveying driver through the first magnetic chuck and the second magnetic chuck; during operation, the conveying driver drives the first magnetic chuck to translate, and the second magnetic chuck, located in the transfer cavity, moves along with the first magnetic chuck due to the magnetic coupling effect, further driving the receiving finger to move.

[0018] Furthermore, the lifting mechanism includes: a lifting drive component located outside the transfer cavity; at least two ejector pins located inside the transfer cavity, wherein the drive shaft of the lifting drive component passes through the transfer cavity and is connected to the ejector pins; and a bellows connecting the transfer cavity and the lifting drive component, wherein the drive shaft of the lifting drive component passes through the bellows, and the bellows is used to seal the connection position between the transfer cavity and the lifting drive component.

[0019] This application provides a linear inter-wafer transfer device, including a transfer cavity, a first wafer receiving mechanism, a second wafer receiving mechanism, and a lifting mechanism. One of the first and second wafer receiving mechanisms is positioned above the other. During operation, the first wafer receiving mechanism can pick up a wafer to be processed from the outside and transport the wafer to the working position of the lifting mechanism. The lifting mechanism can lift the wafer, causing it to detach from the first wafer receiving mechanism. After the second wafer receiving mechanism moves to its working position, the lifting mechanism can lower the wafer, causing it to fall onto the second wafer receiving mechanism, facilitating the second wafer receiving mechanism's delivery of the wafer to the process chamber. The linear inter-wafer transfer device provided in this application... In this process, the linear motion of the first and second wafer receiving mechanisms, combined with the lifting motion of the lifting mechanism, enables rapid wafer transfer and delivery, shortening the wafer transport path and improving transport efficiency. Simultaneously, the vertically arranged wafer receiving mechanism and the compact lifting mechanism design reduce the footprint of the device, improving space utilization. Since the first wafer receiving mechanism picks up wafers from the outside, the lifting mechanism facilitates wafer transfer, and the second wafer receiving mechanism delivers wafers to the process chamber, all within the transfer chamber, no manual intervention is required. This effectively maintains the chamber environment, reducing equipment energy consumption, minimizing particulate contamination, and contributing to improved wafer production yield. Attached Figure Description

[0020] Figure 1 is a schematic diagram of the structure of a linear interactive wafer transfer device provided in this application;

[0021] Figure 2 is a structural cross-sectional view of the linear interactive wafer transfer device shown in Figure 1;

[0022] Figure 3 is a cross-sectional view of the linear interactive wafer transfer device shown in Figure 1 from another direction. Detailed Implementation

[0023] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0024] This application provides a linear interactive wafer transfer device, comprising: a transfer cavity 1 for connecting to a process chamber; a first wafer receiving mechanism 100 disposed within the transfer cavity 1 for receiving and transferring wafers externally; a second wafer receiving mechanism 200 disposed within the transfer cavity 1 for receiving and transferring wafers to the process chamber; and a lifting mechanism 300 disposed within the transfer cavity 1 and located between the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200, capable of lifting the wafer away from the first wafer receiving mechanism 100 by rising and lowering the wafer into the second wafer receiving mechanism 200; wherein, one of the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200 is positioned above the other. The two are positioned so that their movement paths do not interfere with each other. During operation, the first wafer receiving mechanism 100 can pick up the wafer to be processed from the outside and transport the wafer to the working position of the lifting mechanism 300. The lifting mechanism 300 can lift the wafer so that the wafer is detached from the first wafer receiving mechanism 100, so that the first wafer receiving mechanism 100 can move away from the working position. After the second wafer receiving mechanism 200 moves to the working position, the lifting mechanism 300 can carry the wafer down so that the wafer falls onto the second wafer receiving mechanism 200. The lifting mechanism 300 continues to descend, avoiding the second wafer receiving mechanism 200, so that the second wafer receiving mechanism 200 can deliver the wafer to the process chamber.

[0025] Referring specifically to Figures 1 and 2, in the illustrated embodiment, the left side of the transfer cavity 1 has an inlet / outlet port that connects to the outside; the right side of the transfer cavity 1 has a connecting port for connecting to the process chamber. The process chamber can be a coating chamber, or any functional chamber for wafer surface treatment, such as an etching chamber or a resist removal chamber.

[0026] Referring again to Figure 2, the first wafer receiving mechanism 100 is positioned above, and the second wafer receiving mechanism 200 is positioned below. Both the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200 include a receiving section and a driving section. The receiving section is used to receive wafers, and the driving section is used to drive the receiving section to move horizontally. The receiving section can adopt any structure that is convenient for holding wafers, such as a tray, platform, suction cup, or gripper. The driving section can adopt any linear drive structure, such as an electric cylinder or module.

[0027] Referring again to Figure 2, the lifting mechanism 300 is located in the middle of the transfer cavity 1, on the movement path of the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200. The lifting mechanism 300 includes a lifting fixture and a lifting drive. The lifting fixture can be any structure capable of lifting and supporting the wafer, such as a lifting pin or a lifting rod. The lifting drive can be any structure capable of driving the lifting fixture to move up and down, such as a cylinder or an electric cylinder.

[0028] During operation, the wafer inlet / outlet opens, and the first wafer receiving mechanism 100 is activated. Its drive unit propels the receiving section towards the wafer inlet / outlet, allowing external workers or conveying equipment (such as a robotic arm) to place the wafer to be processed onto the receiving section. After the first wafer receiving mechanism 100 picks up the wafer, its drive unit propels the receiving section back, carrying the wafer to a position directly above the lifting mechanism 300. The lifting mechanism 300 is activated, and its lifting drive unit propels the top fixture upward, lifting the wafer and detaching it from the first wafer receiving mechanism 100. The first wafer receiving mechanism 100 is activated again to move its receiving section away from the lifting mechanism 300 and the wafer. The second wafer receiving mechanism 200 is activated, and its drive unit propels the receiving section to a position directly below the lifting mechanism 300. The lifting mechanism 300 is activated again, and its lifting drive unit propels the top fixture downward, causing the wafer to fall. The wafer falls onto the second wafer receiving mechanism 200, and the ejector continues to descend, detach from the wafer, and avoid the movement path of the second wafer receiving mechanism 200. The second wafer receiving mechanism 200 is restarted, and its drive unit can drive the receiving unit to move the wafer toward the connection port to deliver the wafer into the process chamber.

[0029] In other embodiments, the second receiving mechanism 200 can be positioned on top and the first receiving mechanism 100 on the bottom, thereby controlling the rising and falling ranges of the lifting mechanism 300.

[0030] The first wafer receiving mechanism 100 and the second wafer receiving mechanism 200 are arranged one above the other. On the one hand, their movement paths do not interfere with each other. When needed, during the process of the second wafer receiving mechanism 200 delivering wafers to the process chamber, the first wafer receiving mechanism 100 can move in the opposite direction to pick up the next wafer to be processed, thereby speeding up the wafer transfer cycle and improving the transfer efficiency. On the other hand, the vertical arrangement can save space and optimize the spatial layout of the equipment.

[0031] Depending on the requirements of wafer surface treatment, the process chamber often possesses specific environmental conditions such as air pressure and temperature. In this application, the transfer chamber 1 can also serve as a preparatory chamber. After receiving the wafer and before delivering it, by pre-adjusting the air pressure (e.g., introducing a specific gas, or controlling the vacuum level) and temperature (e.g., heating or cooling), the environment inside the transfer chamber 1 can be made close to the environment inside the process chamber. Based on this, opening the connection port and delivering the wafer helps protect the internal environment of the process chamber, avoiding damage to the internal environment and the need for time-consuming repairs.

[0032] In the linear interoperable wafer transfer device provided in this application, the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200, through linear motion in conjunction with the lifting mechanism 300, can quickly transfer and deliver wafers, shortening the wafer transfer path and improving transfer efficiency. Simultaneously, the vertically arranged wafer receiving mechanism and the compact lifting mechanism 300 design reduce the device's footprint and improve space utilization. Since the first wafer receiving mechanism 100's external wafer pickup, the lifting mechanism 300's wafer transfer, and the second wafer receiving mechanism 200's wafer delivery to the process chamber are all completed within the transfer chamber 1, no manual intervention is required within the chamber. This effectively maintains the chamber environment, thereby reducing equipment energy consumption, minimizing particulate contamination, and contributing to improved wafer production yield.

[0033] Furthermore, traditional equipment relies on external VCEs to achieve coordinated control of the transmission mechanism's motion and vacuum level, resulting in high system complexity, high maintenance costs, and poor compatibility. This application reduces reliance on external VCEs by integrating the control logic within the device. The motion coordination between mechanisms and vacuum level control are automated through internal electrical logic and sensors, reducing system complexity, improving equipment reliability, and simultaneously reducing maintenance costs and the difficulty of upgrades.

[0034] Furthermore, the transfer chamber 1 is provided with: a wafer inlet / outlet, through which the first wafer receiving mechanism 100 can receive or deliver wafers; a connecting port, connecting to the process chamber, through which the second wafer receiving mechanism 200 can deliver wafers into or receive wafers from the process chamber; a first valve 2, used to seal the wafer inlet / outlet; and a second valve 3, used to seal the connecting port. Both the first valve 2 and the second valve 3 have open and closed states. When the first valve 2 is in the open state, the wafer can be transferred through the wafer inlet / outlet. When both the first valve 2 and the second valve 3 are in the closed state, the transfer chamber 1 is closed. When the second valve 3 is in the open state, the wafer can be transferred through the connecting port.

[0035] The transfer chamber 1 plays a crucial connecting and transitional role in the linear interactive wafer transfer device provided in this application. The transfer chamber 1 has an inlet / outlet and a connecting port on opposite sides. The inlet / outlet is the channel for the first wafer receiving mechanism 100 to exchange wafers with the outside world. The first wafer receiving mechanism 100 can receive wafers to be processed from the outside through the inlet / outlet, and can also send the wafers out through it after processing. The connecting port is the channel for the second wafer receiving mechanism 200 to exchange wafers with the process chamber. The second wafer receiving mechanism 200 can deliver wafers into the process chamber or receive processed wafers from the process chamber through the inlet / outlet.

[0036] The first valve 2 is used to open and close the inlet and outlet, and the second valve 3 is used to open and close the outlet and inlet. The first valve 2 and the second valve 3 can be opened and closed in any convenient manner, such as by translation or flipping. This application does not limit the specific configuration of the first valve 2 and the second valve 3.

[0037] The linear interactive wafer transfer device provided in this application achieves standardized operation of wafer receiving and transfer and cavity environment control through the automatic opening and closing control of the first gate valve 2 and the second gate valve 3. During the transfer process, the corresponding gate valve will only open when wafer exchange is required, and the gate valve will close quickly after the exchange is completed, reducing the possibility of external environmental influence on transfer cavity 1 and facilitating the control and maintenance of the cavity environment.

[0038] In one specific embodiment, the cavity wall of the transfer cavity 1 is provided with a sandwich channel, and the first valve 2 and the second valve 3 are slidably disposed in the sandwich channel; the linear interactive wafer transfer device further includes: a first driving member 4, used to drive the first valve 2 to approach or move away from the wafer inlet / outlet; and a second driving member 5, used to drive the second valve 3 to approach or move away from the connection port.

[0039] The first driving component 4 and the second driving component 5 can be any driving structure capable of driving the valve to move up and down, such as a cylinder or an electric cylinder.

[0040] Referring specifically to Figure 3, in the illustrated embodiment, along the length of the transfer chamber 1, one end has an inlet / outlet port and the other end has a connecting port. The end with the inlet / outlet port and the connecting port uses a thickened panel, and the thickened panel has a sandwich channel. The sandwich channel can not only install a valve, but also limit the movement direction of the valve, so that the valve can only move vertically up and down, and also constrain the position of the valve, ensuring that the valve fits tightly against the inlet / outlet port or the connecting port, thus achieving a sealing function.

[0041] Optionally, the first drive unit 4 and the second drive unit 5 are disposed outside the transfer chamber 1. The drive shaft of the first drive unit 4 passes through the interlayer channel and is connected to the first valve 2, and the drive shaft of the second drive unit 5 passes through the interlayer channel and is connected to the second valve 3.

[0042] In the embodiments shown in Figures 1 to 3, the first drive member 4 and the second drive member 5 are installed outside the transfer chamber 1 for ease of installation, maintenance, and operation. The drive shaft of the first drive member 4 passes through the interlayer channel from bottom to top and is connected to the first valve 2; similarly, the drive shaft of the second drive member 5 passes through the interlayer channel from bottom to top and is connected to the second valve 3. This connection method allows the external drive member to transmit power to the valves, facilitating valve movement.

[0043] During actual operation, when the wafer inlet / outlet port needs to be opened, the first drive unit 4 is activated, and its drive shaft moves, causing the connected first valve 2 to slide away from the wafer inlet / outlet port in the interlayer channel, thus opening the wafer inlet / outlet port. At this time, the first wafer receiving mechanism 100 can receive or deliver wafers through the wafer inlet / outlet port. After the wafer is received, the first drive unit 4 reverses its direction, causing the first valve 2 to slide closer to the wafer inlet / outlet port in the interlayer channel, thus closing the wafer inlet / outlet port. Similarly, the second drive unit 5 controls the movement of the second valve 3 to open and close the communication port, thus meeting the wafer transfer requirements between the second wafer receiving mechanism 200 and the process chamber.

[0044] By placing the first drive component 4 and the second drive component 5 outside the transfer chamber 1, the required internal space is reduced, and maintenance and repair of the equipment are facilitated. When a drive component malfunctions, it can be replaced or repaired directly from the outside without opening the transfer chamber 1, thus avoiding damage to the internal structure. The sandwich channel design ensures a good seal and makes the valve movement more stable, reducing malfunctions caused by valve malfunctions and improving the overall reliability of the equipment. The clever design of the sandwich channel integrates the valve's movement space into the wall of the transfer chamber 1, avoiding additional space occupation. This compact structural design makes the entire linear interactive wafer transfer device more compact, adaptable to different installation space requirements, and helps improve the overall space utilization of the equipment.

[0045] Optionally, the drive shaft and the cavity wall of the transfer chamber 1 are sealed by a magnetohydrodynamic seal.

[0046] Specifically, permanent magnets and pole shoes are arranged at the connection between the drive shaft and the wall of the transfer chamber 1, forming a non-uniform magnetic field. Magnetorheological fluid is injected into this magnetic field, and under the influence of the magnetic force, it adheres tightly to the gap between the drive shaft and the chamber wall, forming a continuous sealing ring. When the drive shaft moves, the magnetorheological fluid flows with the shaft's movement, maintaining good sealing performance and preventing gas exchange between the inside and outside of the chamber, thus ensuring a vacuum environment within the transfer chamber 1.

[0047] Optionally, a bellows is provided between the first driving member 4 and / or the second driving member 5 and the transfer cavity 1, and the drive shaft of the first driving member 4 or the second driving member 5 passes through the bellows.

[0048] Bellows can also act as a seal at the connection point while adapting to the movement of the drive shaft.

[0049] Optionally, the linear interactive wafer transfer device provided in this application further includes a feed detection device, which is used to confirm whether the wafer has passed through the inlet / outlet port; after confirming that the wafer has completely entered the transfer chamber 1, the first gate valve 2 enters the closed state.

[0050] The feed detection device can accurately monitor the wafer transfer status, prevent the valve from opening or closing accidentally, and help ensure the accuracy and stability of the entire transfer process.

[0051] In one embodiment, the feed detection device is a through-beam photoelectric sensor, including a transmitter and a receiver, which are respectively installed on the upper and lower sides of the wafer inlet / outlet. The transmitter can emit an infrared beam, and the receiver can receive the infrared beam. When the wafer passes through the wafer inlet / outlet, it is positioned between the transmitter and the receiver, and the receiver cannot receive the beam emitted by the transmitter. After the wafer has completely entered the transfer cavity 1, the beam is no longer blocked, and the receiver can receive the light signal.

[0052] Setting up a feed detection device to confirm whether the wafer has passed through the inlet / outlet port can prevent the first valve 2 from prematurely closing and accidentally touching the wafer, and can also close the first valve 2 in time to allow the transfer chamber 1 to quickly enter the next process (such as initiating a vacuum operation), thereby improving the transmission efficiency of the transfer device. In large-scale semiconductor production lines, every improvement in transmission efficiency helps to increase output.

[0053] The feed inspection unit works in conjunction with the control system of the entire conveying device to achieve automated control from wafer entry to valve closure, reducing the need for manual intervention, lowering the risk of human error, conforming to the development trend of highly automated semiconductor manufacturing equipment, and further improving the stability and reliability of production.

[0054] In other embodiments, the feed detection device may also employ a capacitive sensor (which utilizes the property that changes in dielectric material cause changes in capacitance to determine whether the wafer has passed through the inlet / outlet port by detecting changes in capacitance), an inductive sensor (which utilizes the principle of electromagnetic induction to determine whether the wafer has passed through the inlet / outlet port by confirming changes in inductance), or an ultrasonic sensor (which calculates the distance to the wafer based on the time difference between the emitted and reflected waves to determine whether the wafer has entered), etc. This application does not limit the specific configuration of the feed detection device.

[0055] Furthermore, the linear interactive wafer transfer device provided in this application also includes a vacuum pumping mechanism, which is used to regulate the vacuum level in the transfer cavity 1 so that the pressure inside the transfer cavity 1 is adapted to the pressure inside the process chamber.

[0056] In semiconductor manufacturing, a specific vacuum environment is often required inside the process chamber to ensure the accuracy and stability of the process. Processes such as etching and coating have strict requirements for vacuum levels.

[0057] If the pressure inside transfer chamber 1 does not match that of the process chamber, when the wafer enters the process chamber with a different pressure from transfer chamber 1, the sudden pressure change will cause airflow impact, thereby interfering with the environment inside the process chamber and affecting the process performance. In addition, if a suitable vacuum level cannot be maintained in transfer chamber 1, external air and impurities can easily enter it. These impurities may adhere to the wafer surface, forming defects in subsequent processes and reducing product yield.

[0058] The vacuum pumping mechanism enables rapid and precise control of the vacuum level in the transfer chamber 1, allowing the equipment to better adapt to the pressure requirements of different process chambers, thereby improving the adaptability and stability of the equipment in various semiconductor manufacturing processes.

[0059] By matching the pressure within the transfer chamber 1 with that of the process chamber, the interference of the loading and unloading process on the process chamber environment can be reduced, and the risk of wafer contamination during transport can be decreased, which helps improve the quality and yield of semiconductor products. Simultaneously, the built-in vacuum mechanism reduces potential malfunctions associated with external VCEs, lowers the equipment failure rate, and avoids the maintenance and replacement of complex seals at the VCE-chamber interface, thus helping to reduce maintenance costs.

[0060] In one specific embodiment, the vacuum pumping mechanism includes: a dry vacuum pump connected to the transfer chamber 1; a pressure sensor for monitoring the vacuum level in the transfer chamber 1; after the first wafer receiving mechanism 100 receives the wafer to be processed into the transfer chamber 1, the first gate valve 2 enters the closed state, the dry vacuum pump starts, and the transfer chamber 1 is evacuated; when the vacuum level in the transfer chamber 1 is not greater than 10 mTorr, the second gate valve 3 enters the open state, so that the second wafer receiving mechanism 200 can deliver the wafer to the process chamber; if the pressure sensor detects that the vacuum level in the transfer chamber 1 has not reached the preset value, the dry vacuum pump starts the re-evacuation process until the vacuum level meets the process requirements.

[0061] The dry vacuum pump is connected to the transfer chamber 1 via a gas pipe. Its function is to extract the gas from the transfer chamber 1, thereby achieving the vacuuming operation of the transfer chamber 1. A pressure sensor is installed inside the transfer chamber 1 to monitor the vacuum level in the transfer chamber 1 in real time. It can convert the detected pressure signal into an electrical signal and transmit it to the control system.

[0062] During wafer transfer, after the first wafer receiving mechanism 100 receives the wafer to be processed into the transfer chamber 1, the first valve 2 closes, and in conjunction with the second valve 3 which is in a closed state, the transfer chamber 1 is sealed. The control system issues a command to start the dry vacuum pump, which begins to evacuate the transfer chamber 1. The pressure sensor continuously monitors the vacuum level in the transfer chamber 1 and feeds the data back to the control system. When the pressure sensor detects that the vacuum level in the transfer chamber 1 is no greater than 10 mTorr, the control system controls the second valve 3 to open, and the second wafer receiving mechanism 200 then delivers the wafer into the process chamber.

[0063] In actual operation, the vacuuming process is often set with specific nodes and durations, such as the dry vacuum pump operating at a specific power for 60 seconds after the transfer chamber 1 is sealed. The presence of a pressure sensor also confirms whether the vacuum level in the transfer chamber 1 has reached the preset value after the dry vacuum pump completes the preset process. If the vacuum level in the transfer chamber 1 does not reach the preset value, the control system can restart the dry vacuum pump and perform the vacuuming operation again until the vacuum level meets the process requirements.

[0064] Precise and reliable vacuum control allows the wafer to be in a stable vacuum environment during transport, reducing the impact of external factors on the wafer and helping to improve the quality of subsequent processes.

[0065] In one embodiment, the first wafer receiving mechanism 100 and / or the second wafer receiving mechanism 200 include: a receiving finger 110 (i.e., the receiving part mentioned above), disposed in the transfer cavity 1, for receiving wafers; and a transfer drive assembly (i.e., the drive part mentioned above), for driving the receiving finger 110 to translate so that the receiving finger 110 can move to the desired work station in the transfer cavity 1.

[0066] The first wafer receiving mechanism 100 and the second wafer receiving mechanism 200 in the linear interactive wafer transfer apparatus provided in this application undertake the tasks of receiving and transferring wafers. They can take the same form or be different. In the embodiment shown in Figure 3, both the first wafer receiving mechanism 100 and the second wafer receiving mechanism 200 adopt a combination of receiving fingers 110 and transfer drive components.

[0067] The receiving finger 110 is the component that directly contacts the wafer. Its shape and size are usually designed according to the wafer specifications to stably support the wafer. The transfer drive assembly can be any drive structure capable of translating the receiving finger 110, such as an electric cylinder or a linear module. The transfer drive assembly can be located inside or outside the transfer cavity 1.

[0068] In one specific embodiment, the front end of the receiving finger 110 branches to form two support strips; when the receiving finger 110 moves to the working position of the lifting mechanism 300, the lifting mechanism 300 can pass through the support strips and perform lifting and lowering movements; the front end of the receiving finger 110 of the first receiving mechanism 100 faces the inlet and outlet of the sheet; the front end of the receiving finger 110 of the second receiving mechanism 200 faces the connecting port; the receiving finger 110 can extend out of the transfer cavity 1 through the inlet and outlet of the sheet, or the receiving finger 110 can extend into the process chamber through the connecting port.

[0069] Referring specifically to Figure 3, in the illustrated embodiment, the front end of the receiving finger 110 branches into two support strips, and the surface area of ​​the receiving finger 110 decreases as it approaches the front end. This reduces the contact area between the receiving finger 110 and the wafer, preventing the receiving finger 110 from damaging the structure on the back of the wafer. Simultaneously, the gaps between the support strips provide space for the lifting mechanism 300 to move up and down.

[0070] Referring to Figure 3, the front end of the receiving finger 110 of the first wafer receiving mechanism 100 faces the wafer inlet / outlet. The receiving finger 110 has a certain length. When the first gate valve 2 is in the open state, the receiving finger 110 can pass through the wafer inlet / outlet and extend out of the transfer chamber 1, so as to receive wafers from the outside or deliver wafers to the outside.

[0071] Referring to Figure 3, the receiving finger 110 of the second wafer receiving mechanism 200 faces the connection port. The receiving finger 110 has a certain length. When the second gate valve 3 is in the open state, the receiving finger 110 can pass through the connection port and extend into the process chamber, so as to deliver the wafer into the process chamber or pick up the wafer from the process chamber.

[0072] The forked design at the front end of the receiving finger 110 provides space for the movement of the lifting mechanism 300 without increasing space occupancy, thus improving the space utilization efficiency of the device. Simultaneously, the receiving finger 110 can enter and exit the transfer cavity 1 and the process chamber through the wafer inlet / outlet and the connecting port, enhancing the wafer handling capability without extending the drive path. Especially for the first wafer receiving mechanism 100, its receiving finger 110 can extend out of the transfer cavity 1, preventing workers or external equipment from entering the transfer cavity 1.

[0073] Optionally, the receiving finger 110 has a groove on its surface for receiving the wafer, the groove being used to receive and define the position of the wafer.

[0074] Referring specifically to Figure 3, in the illustrated embodiment, the receiving finger 110 is provided with a recessed groove on the upper surface of the wafer. The groove wall can fit the circumference of the wafer, thereby limiting the position of the wafer and preventing the wafer from sliding or shifting during the transfer process.

[0075] The reasonable coordination between the receiving finger 110 and the lifting mechanism 300, as well as the limiting effect of the groove on the wafer, makes the conveying device more stable and reliable during operation, reduces production interruptions caused by accidents, and improves production efficiency.

[0076] Optionally, the first receiving mechanism 100 and / or the second receiving mechanism 200 further include a guide member, which can be any guiding structure such as a guide rail or guide rod. The guide member is fixedly disposed within the transfer cavity 1, and the receiving finger 110 is slidably disposed on the guide member. The guide member can limit the movement direction of the receiving finger 110, ensuring the stability and accuracy of the movement of the receiving finger 110.

[0077] In one specific embodiment, the conveying drive assembly includes: a conveying driver 121, disposed outside the transfer cavity 1; a first magnetic chuck 122, disposed at the output end of the conveying driver 121; and a second magnetic chuck 123, disposed on the receiving finger 110. The first magnetic chuck 122 and the second magnetic chuck 123 attract each other, and the receiving finger 110 is non-contactly connected to the conveying driver 121 through the first magnetic chuck 122 and the second magnetic chuck 123. During operation, the conveying driver 121 drives the first magnetic chuck 122 to translate, and the second magnetic chuck 123, located in the transfer cavity 1, moves along with the first magnetic chuck 122 due to the magnetic coupling effect, further driving the receiving finger 110 to move.

[0078] Referring specifically to Figures 1 and 2, in the illustrated embodiment, the transfer driver 121 can employ a cylinder, module, or other drive structure. The transfer driver 121 serves as a power source, providing driving force for the movement of the receiving finger 110. The transfer driver 121 is installed outside the transfer cavity 1 and fixed to its top or bottom. In traditional mechanical transmission methods, transmission components are prone to wear and failure. If these components are installed inside the transfer cavity 1, maintenance and replacement are extremely difficult. This application installs the transfer driver 121 outside the transfer cavity 1, making installation, maintenance, and repair easier, reducing equipment maintenance costs and downtime.

[0079] Referring again to Figure 2, the first magnetic attractor 122 and the second magnetic attractor 123 can be structures with magnetic attraction, such as magnets. The first magnetic attractor 122 is located at the output end of the transfer driver 121, outside the transfer cavity 1. When the transfer driver 121 is started, it will drive the first magnetic attractor 122 to perform a translational movement. The second magnetic attractor 123 is installed on the receiving finger 110, located inside the transfer cavity 1. The second magnetic attractor 123 and the first magnetic attractor 122 attract each other, and the two achieve a non-contact connection through magnetic coupling.

[0080] Referring again to Figure 2, the receiving finger 110 is disposed within the transfer cavity 1 and is indirectly connected to the transfer driver 121 through the magnetic coupling of the first magnetic chuck 122 and the second magnetic chuck 123. When the transfer driver 121 drives the first magnetic chuck 122 to translate, the second magnetic chuck 123, located within the transfer cavity 1, will follow the movement of the first magnetic chuck 122 due to the magnetic coupling effect, thereby causing the receiving finger 110 to move within the transfer cavity 1.

[0081] It should be explained that magnetic coupling refers to the transmission of force and motion between two or more magnets through the interaction of their magnetic fields. In the linear inter-wafer transfer device provided in this application, the magnetic fields generated by the first magnetic chuck 122 and the second magnetic chuck 123 attract each other. When the transfer driver 121 moves the first magnetic chuck 122, its magnetic field moves accordingly. Since the second magnetic chuck 123 is within the magnetic field range of the first magnetic chuck 122, it is subjected to the magnetic force and therefore moves along with the first magnetic chuck 122. This non-contact connection method avoids the limitations of traditional mechanical connection methods that require physical contact to transmit power.

[0082] It is easy to understand that traditional mechanical transmission methods require the drive shaft to penetrate into the transfer chamber 1 to connect the receiving finger 110. This would compromise the sealing of the transfer chamber 1, allowing outside air to enter and affecting the vacuum level inside the transfer chamber 1. To solve this problem, traditional equipment also requires auxiliary sealing structures such as magnetohydrodynamics and bellows.

[0083] The linear interactive wafer transfer device provided in this application employs a magnetically coupled non-contact connection method. Although the transfer driver 121 is located outside the transfer cavity 1, the drive shaft does not need to pass through the cavity wall, avoiding leakage problems and helping to ensure environmental stability within the transfer cavity 1. Furthermore, in the semiconductor manufacturing process, even minute particulate contamination can lead to chip failure. Traditional mechanical transmission methods may generate friction and wear during movement, resulting in particulate contaminants. The magnetically coupled non-contact connection method avoids direct contact between mechanical components, reducing the generation of particulate contaminants and helping to lower the risk of wafer contamination.

[0084] In one specific embodiment, the lifting mechanism 300 includes: a lifting drive member 310 (i.e., the lifting drive part mentioned above), disposed outside the transfer cavity 1; at least two ejector pins 320 (i.e., the ejector pins mentioned above), disposed inside the transfer cavity 1, with the drive shaft of the lifting drive member 310 passing through the transfer cavity 1 and connected to the ejector pins 320; and a bellows 330, connecting the transfer cavity 1 and the lifting drive member 310, with the drive shaft of the lifting drive member 310 passing through the bellows 330, and the bellows 330 used to seal the connection position between the transfer cavity 1 and the lifting drive member 310.

[0085] Referring specifically to Figures 2 and 3, in the illustrated embodiment, the lifting mechanism 300 includes four ejector pins 320, which are distributed along the four corners of a rectangle. Along the width direction of the transfer cavity 1, the spacing between the ejector pins 320 is greater than the width of the receiving fingers 110. The four ejector pins 320 can rise or fall from both sides of the receiving fingers 110, thereby smoothly lifting or lowering the wafer.

[0086] Referring again to Figures 2 and 3, the lifting drive 310 can be any drive structure capable of driving the ejector pin 320 to move vertically, such as a cylinder or electric cylinder. The lifting drive 310 is located outside the transfer chamber 1, and its drive shaft passes through the transfer chamber 1 from bottom to top and is connected to the ejector pin 320. When the lifting drive 310 is activated, it transmits power to the ejector pin 320 through the drive shaft, causing the ejector pin 320 to move up and down. The ejector pin 320 can contact the wafer, enabling the wafer to move at different heights, such as lifting the wafer from the receiving finger 110 or lowering the wafer onto the receiving finger 110.

[0087] Referring again to Figures 2 and 3, a bellows 330 is provided between the transfer cavity 1 and the lifting drive 310. One end of the bellows 330 is connected to the bottom surface of the transfer cavity 1, and the other end is connected to the cylinder of the lifting drive 310. The drive shaft of the lifting drive 310 passes through the bellows 330. The bellows 330 is telescopic, and can extend and retract with the movement of the drive shaft during the lifting and lowering of the ejector pin 320, while also sealing the connection between the transfer cavity 1 and the lifting drive 310.

[0088] When a wafer lifting operation is required, the lifting drive 310 is activated, generating an upward driving force. This driving force is transmitted to the ejector pin 320 via the drive shaft, causing the ejector pin 320 to move upward. During the ascent of the ejector pin 320, the bellows 330 stretches along with the rising drive shaft. Due to the sealing effect of the bellows 330, the vacuum environment within the transfer chamber 1 is not disrupted. When it is necessary to lower the wafer, the lifting drive 310 reverses its direction, the ejector pin 320 descends, and the bellows 330 contracts, again maintaining the seal of the transfer chamber 1.

[0089] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A linear interactive wafer transfer device, characterized in that, include: A transfer chamber (1) is used to connect to the process chamber; a first wafer receiving mechanism (100) is located in the transfer chamber (1) and is used to receive and deliver wafers to the outside. The second wafer receiving mechanism (200) is located in the transfer cavity (1) and is used to receive and transfer wafers to the process chamber. The lifting mechanism (300) is located in the transfer cavity (1) and between the first wafer receiving mechanism (100) and the second wafer receiving mechanism (200). It can lift the wafer away from the first wafer receiving mechanism (100) by rising and can lower the wafer into the second wafer receiving mechanism (200) by falling. The first wafer receiving mechanism (100) and the second wafer receiving mechanism (200) are respectively located on top and on the bottom, and their movement paths do not interfere with each other. During operation, the first wafer receiving mechanism (100) can receive wafers from the outside. The wafer is processed and transported to the working position of the lifting mechanism (300). The lifting mechanism (300) can lift the wafer so that the wafer is detached from the first bonding mechanism (100) so that the first bonding mechanism (100) can move away from the working position. After the second bonding mechanism (200) moves to the working position, the lifting mechanism (300) can lower the wafer so that the wafer falls onto the second bonding mechanism (200). The lifting mechanism (300) continues to lower, avoiding the second bonding mechanism (200) so that the second bonding mechanism (200) can deliver the wafer to the process chamber.

2. The linear inter-wafer transfer device according to claim 1, characterized in that, The transfer chamber (1) is provided with: a wafer inlet / outlet, through which the first wafer receiving mechanism (100) can receive or deliver wafers; a connecting port, which connects to the process chamber, through which the second wafer receiving mechanism (200) can deliver wafers into the process chamber or receive wafers from the process chamber; a first valve (2), used to seal the wafer inlet / outlet; and a second valve (3), used to seal the connecting port. Both the first valve (2) and the second valve (3) have open and closed states. When the first valve (2) is in the open state, the wafer can be transferred through the wafer inlet / outlet. When both the first valve (2) and the second valve (3) are in the closed state, the transfer chamber (1) is closed. When the second valve (3) is in the open state, the wafer can be transferred through the connecting port.

3. The linear inter-wafer transfer device according to claim 2, characterized in that, The transfer chamber (1) has a double-layer channel in its cavity wall, and the first valve (2) and the second valve (3) are slidably disposed in the double-layer channel; The linear interactive wafer transfer device further includes: a first driving element (4) for driving the first gate valve (2) to move closer to or away from the wafer inlet / outlet. The second drive element (5) is used to drive the second gate valve (3) closer to or away from the communication port.

4. The linear inter-wafer transfer device according to claim 2, characterized in that, It also includes a feed detection device, which is used to confirm whether the wafer has passed through the wafer inlet / outlet; after confirming that the wafer has completely entered the transfer chamber (1), the first gate valve (2) enters the closed state.

5. The linear inter-wafer transfer device according to claim 2, characterized in that, It also includes a vacuum pumping mechanism, which is used to regulate the vacuum level in the transfer chamber (1) so that the pressure inside the transfer chamber (1) is adapted to the pressure inside the process chamber.

6. The linear inter-wafer transfer device according to claim 5, characterized in that, The vacuum pumping mechanism includes: a dry vacuum pump connected to the transfer chamber (1); a pressure sensor for monitoring the vacuum level in the transfer chamber (1); after the first wafer receiving mechanism (100) receives the wafer to be processed into the transfer chamber (1), the first gate valve (2) enters the closed state, the dry vacuum pump starts, and the transfer chamber (1) is evacuated; when the vacuum level in the transfer chamber (1) is not greater than 10 mTorr, the second gate valve (3) enters the open state so that the second wafer receiving mechanism (200) can deliver the wafer to the process chamber; if the pressure sensor detects that the vacuum level in the transfer chamber (1) has not reached the preset value, the dry vacuum pump starts the re-evacuation process until the vacuum level meets the process requirements.

7. The linear inter-wafer transfer device according to claim 1, characterized in that, The first wafer receiving mechanism (100) and / or the second wafer receiving mechanism (200) include: a receiving finger (110) disposed in the transfer cavity (1) for receiving wafers; and a transfer drive assembly for driving the receiving finger (110) to translate so that the receiving finger (110) can move to the desired work station in the transfer cavity (1).

8. The linear inter-wafer transfer device according to claim 7, characterized in that, The front end of the receiving finger (110) is forked to form two support strips; the front end of the receiving finger (110) of the first wafer receiving mechanism (100) faces the wafer inlet / outlet; the front end of the receiving finger (110) of the second wafer receiving mechanism (200) faces the connecting port; the receiving finger (110) can extend out of the transfer cavity (1) through the wafer inlet / outlet, or the receiving finger (110) can extend into the process chamber through the connecting port; the surface of the receiving finger (110) for receiving the wafer is provided with a groove, the groove is used to receive and define the position of the wafer.

9. The linear inter-wafer transfer device according to claim 7, characterized in that, The transmission drive assembly includes: a transmission driver (121) located outside the transfer cavity (1); a first magnetic chuck (122) located at the output end of the transmission driver (121); and a second magnetic chuck (123) located on the receiving finger (110). The first magnetic chuck (122) and the second magnetic chuck (123) attract each other, and the receiving finger (110) is non-contactly connected to the transmission driver (121) through the first magnetic chuck (122) and the second magnetic chuck (123). During operation, the transmission driver (121) drives the first magnetic chuck (122) to translate, and the second magnetic chuck (123) located in the transfer cavity (1) moves with the first magnetic chuck (122) due to the magnetic coupling effect, further driving the receiving finger (110) to move.

10. The linear inter-wafer transfer device according to claim 1, characterized in that, The lifting mechanism (300) includes: a lifting drive (310) located outside the transfer cavity (1); at least two ejector pins (320) located inside the transfer cavity (1), wherein the drive shaft of the lifting drive (310) passes through the transfer cavity (1) and is connected to the ejector pins (320); and a bellows (330) connecting the transfer cavity (1) and the lifting drive (310), wherein the drive shaft of the lifting drive (310) passes through the bellows (330), and the bellows (330) is used to seal the connection position between the transfer cavity (1) and the lifting drive (310).

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