Automatic wafer feeding mechanism and wafer measuring and sorting system

Abstract

The utility model discloses an automatic feeding mechanism for wafers and a wafer measuring and sorting system, and the automatic feeding mechanism comprises a lifting module which provides a driving force for lifting motion; the placing table is arranged at the output end of the lifting module and performs lifting motion under the action of the lifting module; the material box detection module is arranged on the placing table and is used for detecting whether an external wafer material box is placed on the placing table or not; and the conveying module is positioned on one side of the placement table and is used for conveying the wafers in the wafer boxes positioned on the placement table out. The utility model provides a brand new feeding mechanism which replaces a mechanical arm wafer fork hand mode, and the whole structure is simple in design, integrated, convenient to manufacture and low in manufacturing cost.

Description

An automated wafer feeding mechanism and a wafer measurement and sorting system Technical Field

[0001] This utility model relates to the field of wafer measurement technology, and in particular to an automatic wafer feeding mechanism and a wafer measurement and sorting system. Background Technology

[0002] In the material handling stage of semiconductor wafer measurement and sorting systems, the traditional loading solution combining robotic arms and wafer forks is facing significant technical and economic challenges. While this solution can achieve precise wafer positioning and transport, its complex internal structure makes it inconvenient to manufacture and has high production costs. Therefore, a novel automated wafer loading mechanism has been developed. Summary of the Invention

[0003] According to an embodiment of the present invention, an automatic wafer feeding mechanism is provided, comprising:

[0004] The lifting module provides the driving force for the lifting motion;

[0005] The placement platform is located at the output end of the lifting module and moves up and down under the action of the lifting module.

[0006] The wafer cassette detection module is installed on the placement stage and is used to detect whether the external wafer cassette is placed on the placement stage.

[0007] The conveying module, located on one side of the placement stage, is used to convey wafers from the wafer cassettes on the placement stage.

[0008] Furthermore, it also includes: a limiting block, which is set on the placement stage and used to limit the wafer cassette on the placement stage.

[0009] Furthermore, the wafer cassette detection module includes a detection sensor, which is set on the placement stage to detect whether an external wafer cassette is placed on the placement stage.

[0010] Furthermore, the conveying module includes:

[0011] The first support frame, the top of the first support frame penetrates the placement platform;

[0012] Support wheels are rotatably mounted on the first support frame;

[0013] The second support frame is located on one side of the placement platform;

[0014] The sensing sensor is located at the head end of the second support frame and is used to sense the wafers in the wafer cassette.

[0015] A conveying assembly, mounted on a second support frame, is used to convey wafers within the wafer cassette.

[0016] Furthermore, the delivery component includes:

[0017] Two pivots, which pass through the top head end and the bottom end of the second support frame respectively;

[0018] Four drive wheels are respectively fitted onto the two ends of two rotating shafts, and two transmission belts are provided between the two drive wheels located on the same side of the second support frame;

[0019] A drive assembly, which connects one of the rotating shafts and the second support frame, is used to drive one of the rotating shafts to rotate.

[0020] Furthermore, the driving component includes:

[0021] The motor is mounted on the second support frame.

[0022] The belt drive assembly has its input end connected to the output end of the motor, and its output end connected to one of the rotating shafts.

[0023] Furthermore, the drive assembly also includes a clearance groove, which is formed on one side of the second support frame.

[0024] Furthermore, the conveyor belt is made of PU material.

[0025] According to another embodiment of the present invention, a wafer measurement and sorting system is provided, which includes an automatic wafer feeding mechanism of the previous embodiment.

[0026] According to an embodiment of the present invention, an automatic wafer feeding mechanism is provided, which replaces the method of using a robotic arm to fork wafers. The overall structure is simple, integrated, easy to manufacture, and has low manufacturing cost.

[0027] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0028] Figure 1 is a three-dimensional structural schematic diagram of an automatic wafer feeding mechanism according to an embodiment of the present invention.

[0029] Figure 2 is a three-dimensional structural diagram of an automatic wafer feeding mechanism according to an embodiment of the present invention when it has a wafer hopper. Detailed Implementation

[0030] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0031] First, an automatic wafer feeding mechanism according to an embodiment of the present invention will be described with reference to Figures 1-2. It is used to take out wafers from the wafer cassette 600 and transport them out. It has a wide range of applications.

[0032] As shown in Figures 1-2, an automatic wafer feeding mechanism according to an embodiment of the present invention includes a lifting module 100, a placement platform 200, a material box detection module, and a conveying module.

[0033] Specifically, as shown in Figures 1-2, the lifting module 100 provides the driving force for the lifting motion.

[0034] Specifically, as shown in Figures 1-2, the placement stage 200 is located at the output end of the lifting module 100 and moves up and down under the action of the lifting module 100. The placement stage 200 is used to place the wafer cassette 600.

[0035] Specifically, as shown in Figures 1-2, the wafer cassette detection module is mounted on the placement stage 200. The wafer cassette detection module includes a detection sensor 300, which is mounted on the placement stage 200 and is used to detect whether an external wafer cassette 600 has been placed onto the placement stage 200.

[0036] Specifically, as shown in Figures 1 and 2, the conveying module is located on one side of the placement stage 200 and is used to convey the wafers in the wafer cassette 600 on the placement stage 200. The conveying module includes: a first support frame 401, support wheels 402, a second support frame 403, a sensing sensor 404, and a conveying assembly. The top of the first support frame 401 extends through the placement stage 200; the support wheels 402 are rotatably mounted on the first support frame 401; the second support frame 403 is located on one side of the placement stage 200; the sensing sensor 404 is located at the head end of the second support frame 403 and is used to sense the wafers in the wafer cassette 600. When a wafer in the wafer cassette 600 is detected by the sensing sensor 404, it indicates that the wafer in the wafer cassette 600 has reached the position to be conveyed; the conveying assembly is located on the second support frame 403 and is used to convey the wafers in the wafer cassette 600.

[0037] Further, as shown in Figures 1 and 2, the conveying assembly includes: two rotating shafts 405, four drive wheels 406, and a drive assembly. The two rotating shafts 405 pass through the top head and tail ends of the second support frame 403, respectively; the four drive wheels 406 are respectively sleeved on both ends of the two rotating shafts 405, and two conveyor belts 410 are provided between the two drive wheels 406 on the same side of the second support frame 403; the drive assembly connects one of the rotating shafts 405 and the second support frame 403, and is used to drive the rotation of one of the rotating shafts 405. By driving the rotation of one of the rotating shafts 405, the drive wheels 406 on that shaft can rotate, causing the conveyor belts 410 to rotate, thereby conveying the wafers within the wafer cassette 600.

[0038] Further, as shown in Figures 1 and 2, the drive assembly includes a motor 407 and a belt drive assembly 408. The motor 407 is mounted on the second support frame 403; the input end of the belt drive assembly 408 is connected to the output end of the motor 407, and the output end of the belt drive assembly 408 is connected to one of the rotating shafts 405. The motor 407 operates, and the belt drive assembly 408 transmits the power of the motor 407, causing one of the rotating shafts 405 to rotate.

[0039] Furthermore, as shown in Figures 1-2, the drive assembly also includes a clearance groove 409, which is formed on one side of the second support frame 403 to provide a position for the installation of the belt drive assembly 408, thereby facilitating the installation of the belt drive assembly 408.

[0040] Furthermore, in this embodiment, the conveyor belt is made of PU material, thereby preventing wear and tear on the wafer during the wafer transport process.

[0041] Furthermore, as shown in Figures 1-2, an automatic wafer feeding mechanism according to an embodiment of the present invention further includes: a limiting block 500, which is disposed on the placement stage 200 and is used to limit the wafer cassette 600 on the placement stage 200.

[0042] Working principle:

[0043] The wafer cassette 600 containing the wafers is placed onto the placement stage 200, and the detection sensor 300 detects whether the wafer cassette 600 has been placed.

[0044] If a wafer cassette 600 is detected being placed in, the lifting module 100 controls the placement platform 200 and the wafer cassette 600 to descend synchronously. When the first wafer in the wafer cassette 600 is detected by the sensing sensor 404, the lifting module 100 stops descending, and the first wafer falls onto the support wheel 402 and the conveyor belt 410.

[0045] The drive component drives one of the rotating shafts 405 to rotate, which in turn causes the transmission wheel 406 on the rotating shaft 405 to rotate, causing the conveyor belt 410 to rotate, thereby transporting the wafers in the wafer cassette 600 and sending the wafers out.

[0046] When the sensor 404 no longer detects a wafer, it means that the first wafer has been transported away. The lifting module 100 is then lowered again, and the above steps are repeated to transport all the wafers in the wafer cassette 600.

[0047] As described above, an automatic wafer feeding mechanism according to an embodiment of the present invention provides a novel feeding mechanism that replaces the robotic arm wafer fork. The overall structure is simple, integrated, easy to manufacture, and has low manufacturing cost.

[0048] The above description, in conjunction with Figures 1 and 2, describes an automatic wafer feeding mechanism according to an embodiment of the present invention. Furthermore, the present invention can also be applied to a wafer measurement and sorting system.

[0049] According to another embodiment of the present invention, a wafer measurement and sorting system is provided, which includes an automatic wafer feeding mechanism of the previous embodiment.

[0050] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0051] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. An automatic wafer feeding mechanism, characterized in that, It includes: a lifting module that provides the driving force for lifting movement; and a placement platform disposed at the output end of the lifting module, which performs lifting movement under the action of the lifting module. A wafer cassette detection module is disposed on the placement platform and is used to detect whether an external wafer cassette is placed on the placement platform. A conveying module, located on one side of the placement stage, is used to convey wafers from the wafer cassette on the placement stage.

2. The automatic wafer feeding mechanism as described in claim 1, characterized in that, It also includes: a limiting block, which is disposed on the placement stage and is used to limit the wafer cassette on the placement stage.

3. The automatic wafer feeding mechanism as described in claim 1, characterized in that, The wafer cassette detection module includes a detection sensor, which is disposed on the placement stage and is used to detect whether an external wafer cassette is placed on the placement stage.

4. The automatic wafer feeding mechanism as described in claim 1, characterized in that, The conveying module includes: a first support frame, the top of which extends through the placement stage; a support wheel rotatably mounted on the first support frame; a second support frame disposed on one side of the placement stage; a sensing sensor disposed at the head end of the second support frame for sensing wafers in the wafer cassette; and a conveying assembly disposed on the second support frame for conveying wafers in the wafer cassette.

5. The automatic wafer feeding mechanism as described in claim 4, characterized in that, The conveying assembly includes: two rotating shafts that pass through the top head end and tail end of the second support frame respectively; four drive wheels that are respectively sleeved on both ends of the two rotating shafts, and two transmission belts are provided between the two drive wheels located on the same side of the second support frame; and a drive assembly that connects one of the rotating shafts and the second support frame to drive one of the rotating shafts to rotate.

6. The automatic wafer feeding mechanism as described in claim 5, characterized in that, The drive assembly includes: a motor mounted on the second support frame; and a belt drive assembly, the input end of which is connected to the output end of the motor, and the output end of which is connected to one of the rotating shafts.

7. The automatic wafer feeding mechanism as described in claim 6, characterized in that, The drive assembly further includes a clearance groove, which is formed on one side of the second support frame.

8. The automatic wafer feeding mechanism as described in claim 5, characterized in that, The conveyor belt is made of PU material.

9. A wafer measurement and sorting system, characterized in that, An automatic wafer feeding mechanism comprising any one of claims 1 to 8.

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