Micro heat source structure, atomizing core and electronic device
By setting first and second impedance bodies in series on the substrate and utilizing a conductive connection structure, the problem of low thermal radiation efficiency of traditional micro resistors is solved, achieving a more efficient heating effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GLASSMICRO (CHONGQING) SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-03-31
- Publication Date
- 2026-05-05
AI Technical Summary
Traditional micro-resistors have low thermal radiation efficiency and limitations in heat transfer efficiency.
The first and second impedance bodies are set on the substrate and connected in series through a through hole in the substrate to increase the contact area and improve the heating effect.
It significantly improves the heating effect of the micro heat source structure, increases the contact area, and improves the thermal radiation efficiency.
Smart Images
Figure CN224192925U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of electronic component technology, and in particular relates to a micro heat source structure, atomizing core and electronic device. Background Technology
[0002] A resistor, or simply resistor, is a conductor that impedes the flow of electric current. Traditional miniature resistors can generate heat by passing an electric current through them. However, traditional miniature resistors use the entire resistor body for heating and transferring heat, which limits their heat transfer efficiency and results in low thermal radiation efficiency. Utility Model Content
[0003] This application provides a micro heat source structure, which aims to solve the problem of low thermal radiation efficiency in existing resistors.
[0004] The embodiments of this application provide a micro heat source structure, including:
[0005] A substrate having a first surface and a second surface facing away from each other;
[0006] A first impedance body disposed on a first surface; and
[0007] The second impedance body is disposed on the second surface;
[0008] The substrate is provided with a plurality of first through holes penetrating the first surface and the second surface. A first conductive connection structure is provided in the first through hole. The first end of the first conductive connection structure is electrically connected to the first impedance body, and the second end of the first conductive connection structure is electrically connected to the second impedance body.
[0009] Furthermore, the projection of the first impedance body on the first surface at least partially overlaps with the projection of the second impedance body on the first surface.
[0010] Furthermore, it also includes a first pad and a second pad disposed on the first surface. The first pad is electrically connected to the first impedance body. The substrate is provided with a second through hole penetrating the first surface and the second surface. A second conductive connection structure is disposed in the second through hole. The first end of the second conductive connection structure is electrically connected to the second impedance body, and the second end of the second conductive connection structure is electrically connected to the second pad.
[0011] Furthermore, the first conductive connection structure is a hollow conductive structure attached to the inner wall of the first through hole, and / or the second conductive connection structure is a hollow conductive structure attached to the inner wall of the second through hole.
[0012] Furthermore, the first impedance body covers at least a portion of the first end of the first conductive connection structure, and the second impedance body covers at least a portion of the second end of the first conductive connection structure.
[0013] Furthermore, the substrate is provided with several heat dissipation through holes, which penetrate the first surface and the second surface.
[0014] Furthermore, it also includes a protective layer disposed on the first surface, the protective layer having openings to expose the first pad and the second pad.
[0015] Furthermore, the substrate is a glass substrate.
[0016] Secondly, this application also provides an atomizing core, characterized in that it includes the micro heat source structure as described above.
[0017] Thirdly, this application also provides an electronic device including the micro heat source structure as described above.
[0018] The beneficial effects of this application are as follows: The micro heat source structure provided by this application includes a substrate having a first surface and a second surface facing away from each other; a first impedance body disposed on the first surface; and a second impedance body disposed on the second surface. The substrate is provided with a plurality of first through holes penetrating the first and second surfaces. A first conductive connection structure is disposed within each of the first through holes. A first end of the first conductive connection structure is electrically connected to the first impedance body, and a second end of the first conductive connection structure is electrically connected to the second impedance body. By connecting the first impedance body and the second impedance body through the first conductive connection structure, the first impedance body and the second impedance body form a series structure. The first impedance body, the second impedance body, and the first conductive connection structure can all conduct electricity and generate heat, increasing the contact area of the micro heat source structure and thus significantly improving the heating effect of the micro heat source structure. Attached Figure Description
[0019] Figure 1 This is a cross-sectional view of one embodiment of the micro heat source structure provided in this application;
[0020] Figure 2 This is a cross-sectional view of an embodiment of the micro heat source structure provided in this application, with a protective layer provided.
[0021] Figure 3 This is a cross-sectional view of the through-holes on the substrate of one embodiment of the micro heat source structure provided in this application, showing a smaller inner hole and a larger outer hole.
[0022] Figure 4 This is a schematic diagram of a micro heat source structure provided in this application, showing that pads are provided on both sides of the substrate.
[0023] Figure 5 This is a schematic diagram of the structure of one embodiment of the micro heat source structure provided in this application, facing the first surface.
[0024] Explanation of reference numerals in the attached figures:
[0025] 100 - Substrate, 110 - First surface, 120 - Second surface, 130 - First through-hole, 140 - First conductive connection structure, 150 - First pad, 160 - Second pad, 170 - Second through-hole, 180 - Second conductive connection structure, 190 - Heat dissipation hole, 200 - First impedance body, 300 - Second impedance body, 400 - Protective layer, 410 - Window. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. Furthermore, it should be understood that the specific embodiments described herein are merely for explaining this application and are not intended to limit this application.
[0027] In the description of this application, it should be understood that the terms "length", "width", "upper", "lower", "left", "right", "horizontal", "top", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0031] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference values and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.
[0032] The micro heat source structure provided in this application includes a substrate having a first surface and a second surface facing away from each other; a first impedance body disposed on the first surface; and a second impedance body disposed on the second surface. The substrate has a plurality of first through holes penetrating the first and second surfaces. A first conductive connection structure is disposed within each of the first through holes. A first end of the first conductive connection structure is electrically connected to the first impedance body, and a second end of the first conductive connection structure is electrically connected to the second impedance body. The first conductive connection structure connects the first impedance body and the second impedance body, forming a series structure. All three components—the first impedance body, the second impedance body, and the first conductive connection structure—can conduct electricity and generate heat, increasing the contact area of the micro heat source structure and thus significantly improving its heating effect.
[0033] like Figures 1 to 5 As shown, one embodiment of this application provides a micro heat source structure, including:
[0034] Substrate 100, substrate 100 having a first surface 110 and a second surface 120 opposite to each other;
[0035] A first impedance body 200 disposed on the first surface 110; and
[0036] The second impedance body 300 is disposed on the second surface 120;
[0037] The substrate 100 is provided with a plurality of first through holes 130 penetrating the first surface 110 and the second surface 120. A first conductive connection structure 140 is provided in the first through hole 130. The first end of the first conductive connection structure 140 is electrically connected to the first impedance body 200, and the second end of the first conductive connection structure 140 is electrically connected to the second impedance body 300.
[0038] The micro heat source structure is used to impede the current, so that the micro heat source structure will generate heat when energized, and thus can be used as a heat source.
[0039] Optionally, the substrate 100 is used to support the first impedance body 200 and the second impedance body 300, such as Figure 1 As shown. The substrate 100 can be made of an insulating material, such as glass, plastic or other insulating materials. The substrate 100 is preferably made of glass substrate 100, but there is no limitation.
[0040] The first impedance body 200 and the second impedance body 300 are the core of the micro heat source structure, which play the role of converting electrical energy into heat energy.
[0041] Optionally, the first impedance body 200 and / or the second impedance body 300 can be in the form of a strip or a block structure. For the strip-shaped impedance body, it can be designed as a straight, curved, spiral or wavy strip.
[0042] It should be noted that the shape of the impedance body described above is an example of the embodiments of this application and not a specific limitation of this application. In some other embodiments, the impedance body may also adopt other shapes, for example, all or part of the impedance body may be designed as a snake shape, without limitation.
[0043] Alternatively, the impedance body can be fabricated on the substrate 100 by electroplating, PVD (Physical Vapor Deposition), CVD (Chemical Vapor Deposition), PCVD (plasma chemical vapor deposition), or other methods, without limitation.
[0044] A first through-hole 130 is provided in the substrate 100, which penetrates the first surface 110 and the second surface 120. A first conductive connection structure 140 is provided within the first through-hole 130, connecting and transmitting a first impedance body 200 and a second impedance body 300. That is, the first impedance body 200 and the second impedance body 300 are connected in series. In use, the first impedance body 200 and / or the second impedance body 300 can be selectively connected to the circuit according to usage requirements. For example, when both access points of the external circuit are on the first impedance body 200, it can be considered that only the first impedance body 200 is electrically connected to the external circuit. Similarly, when both access points of the external circuit are on the second impedance body 300, it can be considered that only the second impedance body 300 is electrically connected to the external circuit. Optionally, when one access point of the external circuit is on the first impedance body 200 and the other access point is on the second impedance body 300, it can be regarded as the first impedance body 200 and the second impedance body 300 being connected in series and electrically connected to the external circuit.
[0045] In some possible embodiments, the projection of the first impedance body 200 on the first surface 110 at least partially overlaps with the projection of the second impedance body 300 on the first surface 110. That is, the sum of the areas of the first impedance body 200 and the second impedance body 300 is greater than the area of the first surface 110, thereby increasing the overall area of the impedance structure, which in turn increases the heat source area of the micro heat source structure to ensure the heating effect of the micro heat source structure.
[0046] As one possible implementation, the first conductive connection structure 140 is a solid metal pillar disposed within the first through hole 130.
[0047] As another possible implementation, the first conductive connection structure 140 is a hollow conductive structure attached to the inner wall of the first through hole 130. By adopting a hollow structure for the first conductive connection structure 140, the material used in the first conductive connection structure 140 can be reduced, thus lowering the cost. Moreover, the hollow structure of the first conductive connection structure 140 can also serve as a flow channel for gas and / or liquid, allowing the gas and / or liquid to better contact the heat source and improve the heat conduction efficiency.
[0048] Optionally, such as Figure 3 As shown, the diameter of the first through hole 130 gradually increases from the middle to both ends. Similarly, the diameter of the first conductive connection structure 140 can also be designed to gradually increase from the middle to both ends.
[0049] Optionally, the first impedance body 200 covers at least a portion of the first end of the first conductive connection structure 140, and the second impedance body 300 covers at least a portion of the second end of the first conductive connection structure 140, which can effectively improve the connection reliability between the first conductive connection structure 140 and the first impedance body 200 and the second impedance body 300.
[0050] The micro heat source structure provided in this application includes a substrate 100, which has a first surface 110 and a second surface 120 facing away from each other; a first impedance body 200 disposed on the first surface 110; and a second impedance body 300 disposed on the second surface 120. The substrate 100 is provided with a plurality of first through holes 130 penetrating the first surface 110 and the second surface 120. A first conductive connection structure 140 is disposed within each of the first through holes 130. A first end of the first conductive connection structure 140 is electrically connected to the first impedance body 200, and a second end of the first conductive connection structure 140 is electrically connected to the second impedance body 300. The first impedance body 200 and the second impedance body 300 are connected through the first conductive connection structure 140, so that the first impedance body 200 and the second impedance body 300 form a series structure. The first impedance body 200, the second impedance body 300, and the first conductive connection structure 140 can all conduct electricity and generate heat, increasing the contact area of the micro heat source structure and thus significantly improving the heating effect of the micro heat source structure.
[0051] In some embodiments, the micro heat source structure provided in this application further includes a first pad 150 and a second pad 160, wherein both the first pad 150 and the second pad 160 are disposed on the first surface 110. The first pad 150 is electrically connected to the first impedance body 200. The substrate 100 is provided with a second through hole 170 penetrating the first surface 110 and the second surface 120. A second conductive connection structure 180 is disposed within the second through hole 170. The first end of the second conductive connection structure 180 is electrically connected to the second impedance body 300, and the second end of the second conductive connection structure 180 is electrically connected to the second pad 160. The first pad 150 and the second pad 160 are disposed on the same surface, such as... Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, this allows for easy connection of the micro heat source structure to an external circuit.
[0052] In other embodiments, a pad may be provided on each side of the first impedance body 200 and the second impedance body 300, such as... Figure 4 As shown, these two pads are used for connecting to external circuitry.
[0053] In implementation, the second through hole 170 and the second conductive connection structure 180 can refer to the first through hole 130 and the first conductive connection structure 140 described above, respectively. For example, the second conductive connection structure 180 can be a solid metal column or a hollow metal tube. That is, the second conductive connection structure 180 is a hollow conductive structure attached to the inner wall of the second through hole 170, which will not be elaborated further.
[0054] Optionally, the substrate 100 is provided with a plurality of heat dissipation through holes, which penetrate the first surface 110 and the second surface 120. By providing heat dissipation holes 190, the surface area of the micro heat source structure can be effectively increased to conduct away the heat generated by the first impedance body 200 and / or the second impedance body 300, thereby improving the heat conduction efficiency.
[0055] Alternatively, the heat dissipation through-hole can refer to the first through-hole 130 mentioned above, without further explanation.
[0056] Optionally, such as Figure 2 As shown, the micro heat source structure provided in this application also includes a protective layer 400 disposed on the first surface 110, and the protective layer 400 is provided with a window 410 to expose the first pad 150 and the second pad 160.
[0057] The protective layer 400 covers the first surface 110. That is, the protective layer 400 can cover the first impedance body 200, the first pad 150 and the second pad 160, and can play a protective role against oxidation and corrosion for the first impedance body 200, the first pad 150 and the second pad 160.
[0058] Optionally, the protective layer 400 is provided with a window 410 that extends to the first pad 150 and the second pad 160 to expose the first pad 150 and the second pad 160, so as to facilitate the electrical connection between the micro heat source structure and the external circuit.
[0059] Furthermore, the protective layer 400 can also be made of a material with high thermal conductivity. The thermally conductive layer not only protects the first impedance body 200, the first pad 150 and the second pad 160 from oxidation, but also conducts heat and improves the heat transfer efficiency.
[0060] This application also provides an atomizing core, including the micro heat source structure as described above.
[0061] The atomizer core is the core component of atomizers, e-cigarettes, or other atomizing electronic products. It is mainly responsible for heating and vaporizing liquid drugs, e-liquids, or other liquids that need to be atomized to produce mist particles and achieve the atomization effect.
[0062] Those skilled in the art will understand that, for the sake of convenience and brevity, the structure and implementation principle of the atomizing core described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0063] This application also provides an electronic device including the micro heat source structure described above.
[0064] In practice, electronic devices include, but are not limited to, atomizers, humidifiers, temperature controllers, drug delivery systems, smart wearable devices, micro-analytical instruments, beauty devices, de-icers for automobiles or aerospace, exhaust gas treatment equipment for vehicles or equipment, and other related components, without specific limitations.
[0065] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the structure and implementation principle of the electronic device described above can be referred to the corresponding structure and implementation principle in the foregoing embodiments, and will not be repeated here.
[0066] The micro heat source structure provided in this application includes a substrate 100, which has a first surface 110 and a second surface 120 facing away from each other; a first impedance body 200 disposed on the first surface 110; and a second impedance body 300 disposed on the second surface 120. The substrate 100 is provided with a plurality of first through holes 130 penetrating the first surface 110 and the second surface 120. A first conductive connection structure 140 is disposed within each of the first through holes 130. A first end of the first conductive connection structure 140 is electrically connected to the first impedance body 200, and a second end of the first conductive connection structure 140 is electrically connected to the second impedance body 300. The first impedance body 200 and the second impedance body 300 are connected through the first conductive connection structure 140, so that the first impedance body 200 and the second impedance body 300 form a series structure. The first impedance body 200, the second impedance body 300, and the first conductive connection structure 140 can all conduct electricity and generate heat, increasing the contact area of the micro heat source structure and thus significantly improving the heating effect of the micro heat source structure.
[0067] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A micro heat source structure, characterized in that, include: A substrate having a first surface and a second surface facing away from each other; A first impedance body disposed on the first surface; as well as A second impedance body disposed on the second surface; The substrate is provided with a plurality of first through holes penetrating the first surface and the second surface. A first conductive connection structure is provided in the first through hole. The first end of the first conductive connection structure is electrically connected to the first impedance body, and the second end of the first conductive connection structure is electrically connected to the second impedance body.
2. The micro heat source structure as described in claim 1, characterized in that, The projection of the first impedance body onto the first surface at least partially overlaps with the projection of the second impedance body onto the first surface.
3. The micro heat source structure as described in claim 1, characterized in that, It also includes a first pad and a second pad disposed on the first surface. The first pad is electrically connected to the first impedance body. The substrate is provided with a second through hole that penetrates the first surface and the second surface. A second conductive connection structure is disposed in the second through hole. The first end of the second conductive connection structure is electrically connected to the second impedance body, and the second end of the second conductive connection structure is electrically connected to the second pad.
4. The micro heat source structure as described in claim 3, characterized in that, The first conductive connection structure is a hollow conductive structure attached to the inner wall of the first through hole, and / or the second conductive connection structure is a hollow conductive structure attached to the inner wall of the second through hole.
5. The micro heat source structure as described in claim 4, characterized in that, The first impedance body covers at least a portion of the first end of the first conductive connection structure, and the second impedance body covers at least a portion of the second end of the first conductive connection structure.
6. The micro heat source structure as described in claim 3, characterized in that, The substrate is provided with a plurality of heat dissipation through holes, which penetrate the first surface and the second surface.
7. The micro heat source structure as described in claim 3, characterized in that, It also includes a protective layer disposed on the first surface, the protective layer having openings to expose the first pad and the second pad.
8. The micro heat source structure according to any one of claims 1 to 7, characterized in that, The substrate is a glass substrate.
9. An atomizing core, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 8.
10. An electronic device, characterized in that, Includes the micro heat source structure as described in any one of claims 1 to 8.