Reaction equipment

By using plasma bombardment and stirring mechanisms in the reaction equipment, the problem of uneven dispersion of conductive fillers was solved, achieving uniform dispersion of conductive fillers in the polymer matrix, improving the electrical and mechanical properties of the material, and reducing costs.

CN224194692UActive Publication Date: 2026-05-05YANTAI WANHUA ELECTRICAL NEW MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YANTAI WANHUA ELECTRICAL NEW MATERIALS CO LTD
Filing Date
2025-02-20
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

The uneven dispersion of conductive fillers in the polymer matrix leads to unstable performance and poor reliability of polymer-based conductive composite materials.

Method used

A reaction apparatus comprising a plasma generator and a mixing reactor is employed to generate oxygen plasma to bombard conductive filler, and combined with a vacuum environment and a stirring mechanism, to ensure that the conductive filler is uniformly dispersed in the polymer matrix.

Benefits of technology

It improves the dispersibility of conductive fillers in resin, enhances the electrical and mechanical properties of the material, reduces costs, and improves the reliability of the material.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to reaction equipment which comprises a plasma generator provided with a reaction channel used for generating plasma; the uniform mixing reactor comprises a reactor body and a material driving mechanism, a reaction cavity is formed in the reactor body, the reaction cavity is communicated with the reaction channel, and the material driving mechanism is configured to drive materials in the reaction cavity to move. According to the reaction equipment disclosed by the invention, the conductive filler can be effectively modified, so that the conductive filler has good dispersity.
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Description

Technical Field

[0001] This application relates to the field of reaction equipment technology, and in particular to a reaction device. Background Technology

[0002] In modern industrial and technological development, conductive materials have become increasingly important due to their wide application in electronics, electrical engineering, communications, aerospace, and other fields. Polymer-based conductive composite materials have become a research hotspot due to their combination of high conductivity, lightweight, low cost, and good processing performance. Polymer-based conductive composite materials achieve conductivity by adding conductive fillers, such as carbon black, carbon nanotubes, and graphene, to the polymer matrix.

[0003] However, the dispersion of conductive fillers in the polymer matrix is ​​a key factor affecting the performance of polymer-based conductive composites. The dispersion of conductive fillers directly affects the electrical conductivity, mechanical properties, and processability of polymer-based conductive composites. Uneven dispersion of conductive fillers will lead to discontinuous and unstable performance in polymer-based conductive composites, which affects the reliability of these composites in practical applications.

[0004] This can also be understood as follows: in polymer-based conductive composites, good dispersion of the conductive filler ensures its uniform distribution within the polymer matrix, thus forming an effective conductive path. If the conductive filler is not uniformly dispersed, it can lead to significant differences in local conductivity. For example, in carbon black-filled polymers, if the carbon black agglomerates, the conductivity in the agglomerated areas may be excessively high, while other areas, lacking carbon black, may be almost non-conductive, severely impacting the overall electrical properties of the material. Simultaneously, uniform dispersion also significantly affects the mechanical properties of the material. Agglomerated fillers become stress concentration points; when the material is subjected to external forces, these locations are prone to cracks or defects, reducing the material's strength and toughness.

[0005] Therefore, addressing the problem of uneven dispersion of conductive fillers is particularly important. Utility Model Content

[0006] Therefore, it is necessary to provide a reaction device to address the problem of uneven dispersion of conductive fillers.

[0007] A reaction apparatus includes:

[0008] A plasma generator, which is equipped with a reaction channel for generating plasma;

[0009] A mixing reactor includes a reactor body and a material driving mechanism. The reactor body is provided with a reaction chamber, which is connected to a reaction channel. The material driving mechanism is configured to drive the movement of materials within the reaction chamber.

[0010] In one embodiment, the peripheral walls of the reaction chamber are made of an insulating material; and / or,

[0011] The reaction equipment also includes a vacuum generator, the vacuum generator's extraction port of which is connected to the reaction chamber.

[0012] In one embodiment, the material driving mechanism is a stirring mechanism, which includes a stirring element and a drive motor. At least a portion of the stirring element is located inside the reaction chamber, and the drive motor is used to drive the stirring element to rotate.

[0013] The agitator is made of insulating material.

[0014] In one embodiment, the reactor body is provided with an assembly through-hole for allowing the stirring element to extend into the reaction chamber.

[0015] The reaction equipment also includes a seal, which is used to seal the gap between the agitator and the assembly through hole.

[0016] In one embodiment, the plasma generator includes an excitation source and a conductive tube, the conductive tube passing through the excitation source and defining a reaction channel within the conductive tube;

[0017] The reaction equipment also includes: a first valve body and a second valve body, the connecting pipe is connected to the reactor body as a whole, and the reactor body is provided with a loading port and a discharge port. The first valve body is used to open and close the loading port, and the second valve body is used to open and close the discharge port.

[0018] Alternatively, the connecting pipe is selectively connected to the reactor body, so that the discharge port of the connecting pipe is selectively engaged with the connecting port located in the reactor body, so that the connecting port is used for filling and removing materials.

[0019] In one embodiment, the conduit is provided with an input port away from the discharge port along the extension direction of the conduit.

[0020] The reaction apparatus also includes a third valve body, which is installed in the conductive pipe and is used to open and close the input port.

[0021] In one embodiment, the reaction apparatus further includes a connecting fastener, through which a conductive pipe is fixedly connected to the reactor body, thereby connecting the discharge port to the communication port.

[0022] In one embodiment, the reactor body is provided with a negative pressure port, and the reaction chamber is adapted to be connected to the exhaust port of a vacuum generator through the negative pressure port.

[0023] The reaction equipment also includes a filter element, which is installed between the negative pressure port and the exhaust port. The filter element is used to prevent materials in the reaction chamber from entering the exhaust port.

[0024] In one embodiment, the reaction apparatus further includes a fourth valve body disposed between the negative pressure port and the exhaust port, the fourth valve body being configured to control the connection state between the negative pressure port and the exhaust port.

[0025] In one embodiment, the reaction apparatus further includes a pressure monitoring element configured to monitor the pressure value within the reaction chamber.

[0026] The above-mentioned reaction equipment can effectively modify the conductive filler, giving it good dispersibility. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a reaction apparatus according to an embodiment of this application.

[0028] Figure 2 This is a schematic diagram of a reaction apparatus according to another embodiment of this application.

[0029] Figure label:

[0030] 100. Reaction equipment; 1. Plasma generator; 11. Excitation source; 12. Conducting pipe; 120. Reaction channel; 12a. Input port; 12b. Discharge port; 2. Mixing reactor; 21. Reactor body; 210. Reaction chamber; 211. Assembly through hole; 212. Feed port; 213. Discharge port; 214. Connecting port; 215. Negative pressure port; 216. Pressure measuring pipe; 22. Material driving mechanism; 220. Stirring mechanism; 221. Stirring component; 221a. Transmission rod; 221b. Blade; 222. Drive motor; 3. Vacuum generator; 30. Evacuation port; 4. Sealing component; 51. First valve body; 52. Second valve body; 53. Third valve body; 54. Fourth valve body; 55. Fifth valve body; 6. Connecting fastener; 7. Filter; 8. Pressure monitoring component. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0037] See Figure 1 and Figure 2 As shown, a reaction apparatus 100 according to some embodiments of this application includes a plasma generator 1 and a mixing reactor 2. The plasma generator 1 is provided with a reaction channel 120 for generating plasma, so that when the plasma generator 1 is in operation, a reaction gas (e.g., oxygen) is introduced into the reaction channel 120 to ionize the reaction gas into oxygen-containing plasma (O2). 2+ The mixing reactor 2 includes a reactor body 21 and a material driving mechanism 22. A reaction chamber 210 disposed within the reactor body 21 is connected to a reaction channel 120, thereby generating oxygen-containing plasma (O2) within the reaction channel 120. 2+ The gas can be introduced into the reaction chamber 210. In addition, the reaction chamber 210 is also used to fill conductive fillers (such as carbon black, carbon nanotubes, graphene, etc.).

[0038] Since the material driving mechanism 22 is used to drive the movement of the conductive packing material filled in the reaction chamber 210, the conductive packing material moves continuously within the reaction chamber 210. During this movement, each surface of the conductive packing material is exposed to oxygen plasma (O2). 2+ Thorough bombardment ensures that the conductive filler is effectively modified.

[0039] It is important to understand that the conductive filler is subjected to oxygen plasma (O2). 2+ After bombardment, the number of oxygen-containing functional groups on the surface of the conductive filler increases, as does the zeta potential and the oxygen / carbon ratio. This reduces the surface energy of the conductive filler, thereby achieving thermodynamic compatibility between the conductive filler and the resin, and ultimately enabling the conductive filler to achieve good dispersion.

[0040] Furthermore, after modifying the conductive filler using the reaction apparatus 100 according to this application, the impurity elements in the modified conductive filler are reduced, thus improving the dispersion of the conductive filler in the resin. For resin composite materials, the amount of conductive filler can be reduced while ensuring the conductivity of the resin composite material. This not only reduces costs but also improves the surface smoothness of the resin composite material when used as a semi-conductive shielding material, thereby improving the performance and voltage rating of the shielding material.

[0041] In summary, the reaction apparatus 100 according to this application can effectively modify the conductive filler, giving it good dispersibility.

[0042] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reaction apparatus 100 further includes a vacuum generator 3. The vacuum generator 3's extraction port 30 is connected to the reaction chamber 210 to adjust the vacuum level inside the reaction chamber 210, creating a low-vacuum environment within the reaction chamber 210. This ensures that the oxygen plasma (O2) inside the reaction chamber 210 is properly maintained. 2+ The stability of oxygen plasma (O) makes it possible to achieve this. 2+ It can effectively bombard the conductive packing in the reaction chamber 210, thereby promoting the effective modification of the conductive packing.

[0043] It is also worth noting that, because the vacuum generator 3 creates a low-vacuum environment inside the reaction chamber 210, a pressure difference exists between the reaction chamber 210 and the reaction channel 120, thereby promoting the production of oxygen plasma (O2O3). 2+ The oxygen plasma (O) enters the reaction chamber 210 through the reaction channel 120 to ensure the oxygen plasma (O) 2+ It enters the reaction chamber 210.

[0044] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the plasma generator 1 includes an excitation source 11 and a conductive tube 12. The conductive tube 12 passes through the excitation source 11 and defines a reaction channel 120 within the conductive tube 12. The excitation source 11 is adapted to be electrically connected to a power source. When energized, the excitation source 11 can be used to excite the reaction gas introduced into the reaction channel 120, thereby initially ionizing the reaction gas into oxygen plasma (O2). 2+ ), making oxygen plasma (O 2+ It can be introduced into the reaction chamber 210 to bombard the conductive filler and modify it.

[0045] See Figure 1 and Figure 2 As shown, along the extension direction (i.e., the length direction) of the conductive pipe 12, the two ends of the conductive pipe 12 are respectively provided with an input port 12a and an outlet port 12b. The input port 12a and the outlet port 12b can also be understood as the two ports of the reaction channel 120. The reaction gas is introduced into the reaction channel 120 through the input port 12a. The reaction gas is initially ionized into oxygen plasma (O2) in the reaction channel 120. 2+ Then it enters the reaction chamber 210 through the discharge port 12b.

[0046] It is important to understand that in the conductive tube 12, the reacting gas is initially ionized to generate oxygen plasma (O2). 2+ After that, oxygen plasma (O 2+ Under the influence of the electric field, the particles migrate towards the negative electrode and accelerate to collide with the negative electrode plate, generating high-energy particles (such as secondary electrons) on the electrode plate surface. These secondary electrons then move towards the positive electrode plate under the influence of the electric field, colliding with oxygen molecules in the reaction chamber and re-ionizing the oxygen to produce oxygen plasma (O₂). 2+ Oxygen plasma (O) 2+ The electrons then strike the negative electrode plate again, generating secondary electrons. Repeating this process continuously produces oxygen plasma (O2). 2+ ).

[0047] In one embodiment, see Figure 1 As shown, the conductive pipe 12 is integrally connected to the reactor body 21. This can also be understood as the conductive pipe 12 and the reactor body 21 being permanently fixedly connected. The reactor body 21 is also provided with a loading port 212 and a discharge port 213, both of which are connected to the reaction chamber 210. This allows the loading port 212 to be used to load conductive packing material into the reaction chamber 210, and the conductive packing material in the reaction chamber 210 to be removed from the discharge port 213, allowing the modified conductive packing material to be removed from the reactor body 21. Furthermore, the reaction equipment 100 may also include a first valve body 51 and a second valve body 52. ​​The first valve body 51 is used to open and close the loading port 212, and the second valve body 52 is used to open and close the discharge port 213.

[0048] Or, see Figure 2 As shown, in another embodiment, the conductive pipe 12 is selectively connected to the reactor body 21. This can be understood as the conductive pipe 12 being able to engage and disengage from the reactor body 21. The discharge port 12b of the conductive pipe 12 is selectively engaged with the communication port 214 of the reactor body 21. That is, when the conductive pipe 12 and reactor body 21 are engaged, they are connected as a single unit, and the discharge port 12b of the conductive pipe 12 is connected to the communication port 214 of the reactor body 21, thus connecting the reaction channel 120 to the reaction chamber 210. When the conductive pipe 12 and reactor body 21 are disengaged, they separate. When the conductive pipe 12 and reactor body 21 are disengaged, conductive packing material can be inserted into the reaction chamber 210 through the communication port 214, and conductive packing material located in the reaction chamber 210 can also be removed from the communication port 214.

[0049] See Figure 2As shown, the reaction apparatus 100 may further include a connecting fastener 6, such as a clamp, pipe clamp, or flange, to fix the conductive pipe 12 to the reactor body 21 via the connecting fastener 6, while simultaneously connecting the discharge port 12b to the connecting port 214. It is worth noting that the connecting fastener 6 not only has the ability to fix the conductive pipe 12 to the reactor body 21, but also ensures the airtightness between the discharge port 12b and the connecting port 214, thus preventing air leakage at the connection point.

[0050] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reaction apparatus 100 may further include a third valve body 53, which is disposed on the conductive pipe 12 and is used to open and close the input port 12a. The third valve body 53 may also be used to control the flow rate at the input port 12a. In one embodiment, the input port 12a is adapted to be connected to a memory (not shown) for storing reaction gases, so that the reaction gases stored in the memory are introduced into the reaction channel 120 through the input port 12a, i.e., the reaction gases stored in the memory are introduced into the plasma generator 1 to generate oxygen plasma (O2). 2+ By providing a third valve body 53 in the conductive pipe 12, when the third valve body 53 is in the open state, the reaction gas stored in the memory can enter the reaction channel 120; when the third valve body 53 is in the closed state, the reaction gas stored in the memory cannot enter the reaction channel 120, thus achieving selective control of the reaction gas entering the reaction channel 120 for reaction. It is also worth noting that the third valve body 53 can be used to control the flow rate of the reaction gas into the reaction channel 120.

[0051] It is worth noting that the third valve body 53 is a one-way check valve, which can prevent the backflow of reaction gas.

[0052] See Figure 1 and Figure 2As shown, in some embodiments of this application, the reactor body 21 is provided with a negative pressure port 215, and the reaction chamber 210 is connected to the exhaust port 30 through the negative pressure port 215, so that the vacuum generator 3 can be used to adjust the vacuum degree in the reaction chamber 210, making the reaction chamber 210 a low vacuum environment. The reaction device 100 may also include a filter element 7, which is disposed between the negative pressure port 215 and the exhaust port 30. During the operation of the vacuum generator 3, under the action of negative pressure, the gas in the reaction chamber 210 flows from the negative pressure port 215 to the exhaust port 30. By providing the filter element 7 between the negative pressure port 215 and the exhaust port 30, the filter element 7 can be used to filter the flowing gas, preventing the conductive packing mixed in the gas from passing through the exhaust port 30 with the gas. This not only avoids the loss of conductive packing, but also avoids the problem of damage caused by the vacuum generator 3 sucking in conductive packing, ensuring the reliability of the reaction device 100.

[0053] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reaction apparatus 100 may further include a fourth valve body 54, which is disposed between the negative pressure port 215 and the extraction port 30. The fourth valve body 54 is configured to control the connection state between the negative pressure port 215 and the extraction port 30. It is worth noting that the fourth valve body 54 is a one-way check valve, which allows gas to flow from the negative pressure port 215 to the extraction port 30, while preventing gas from flowing from the extraction port 30 to the negative pressure port 215. This prevents ambient gas from flowing into the reaction chamber 210 through the extraction port 30 of the vacuum generator 3, thus ensuring the vacuum level within the reaction chamber 210.

[0054] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reaction apparatus 100 may further include a pressure monitoring element 8, which is configured to monitor the pressure value inside the reaction chamber 210. The vacuum generator 3 is controlled based on the pressure value inside the reaction chamber 210, thereby ensuring that the vacuum level inside the reaction chamber 210 reaches a preset vacuum level.

[0055] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reactor body 21 is provided with a pressure measuring pipe 216, which is connected to the reaction chamber 210, and the detection part of the pressure monitoring element 8 is located inside the pressure measuring pipe 216. Since the pressure measuring pipe 216 is connected to the reaction chamber 210, the pressure value inside the pressure measuring pipe 216 is the pressure value inside the reaction chamber 210. Therefore, by placing the detection part of the pressure monitoring element 8 inside the pressure measuring pipe 216, the pressure value inside the reaction chamber 210 can be obtained.

[0056] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the reaction apparatus 100 may further include a fifth valve body 55, which may be mounted on the pressure measuring pipe 216. The fifth valve body 55 is configured to control the communication state between the reaction chamber 210 and the pressure measuring pipe 216. It is worth noting that the fifth valve body 55 is a one-way check valve, which ensures that gas can only flow from the reaction chamber 210 to the pressure measuring pipe 216, thus preventing gas from flowing from the pressure measuring pipe 216 to the reaction chamber 210. This prevents ambient gas from flowing into the reaction chamber 210 through the pressure measuring pipe 216, thereby ensuring the vacuum level within the reaction chamber 210.

[0057] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the peripheral wall of the reaction chamber 210 is made of insulating material. In one embodiment, the reactor body 21 is a single piece, which can also be understood as a one-piece molded part, that is, the entire reactor body 21 is made of insulating material, thus ensuring that the reaction chamber 210 meets the insulation requirements. Alternatively, in another embodiment, the reactor body 21 is an assembly, for example, the reactor body 21 includes an inner liner and an outer shell, wherein the inner liner defines the reaction chamber 210. Based on this, only the inner liner can be made of insulating material, which can also ensure that the reaction chamber 210 meets the insulation requirements.

[0058] It is worth noting that by making the peripheral wall of the reaction chamber 210 with an insulating material, the insulation conditions within the reaction chamber 210 are met. This prevents the conductive filler from adhering to the peripheral wall of the reaction chamber 210 due to static electricity, ensuring that the conductive filler within the reaction chamber 210 can move fully under the action of the material driving mechanism 22, thereby ensuring that the conductive filler is effectively modified.

[0059] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the material driving mechanism 22 is a stirring mechanism 220. The stirring mechanism 220 includes a stirring element 221 and a drive motor 222. At least a portion of the stirring element 221 is located inside the reaction chamber 210. The drive motor 222 is used to drive the stirring element 221 to rotate. During the rotation of the stirring element 221, the stirring element 221 agitates the conductive packing material inside the reaction chamber 210, thereby enabling the conductive packing material to move sufficiently, and thus enabling each surface of the conductive packing material to be exposed to oxygen plasma (O2). 2+ (To bombard thoroughly.)

[0060] See Figure 1 and Figure 2As shown, in some embodiments of this application, the reactor body 21 is provided with an assembly through hole 211, which allows the stirring element 221 to extend into the reaction chamber 210. Within the stirring element 221, the blades 221b of the transmission rod 221a mounted on the stirring element 221 are located inside the reaction chamber 210, with a portion of the transmission rod 221a located outside the reaction chamber 210 for transmission connection with the drive motor 222. Under the driving action of the drive motor 222, the transmission rod 221a rotates around its axis, thereby causing the blades 221b mounted on the transmission rod 221a to move, thereby driving the conductive packing material to move via the blades 221b.

[0061] The reaction apparatus 100 also includes a sealing element 4, which is disposed within the assembly through hole 211 and can be sleeved on the transmission rod 221a. The sealing element 4 seals the gap between the transmission rod 221a and the assembly through hole 211, thereby ensuring the airtightness of the reactor body 21 and the vacuum level within the reaction chamber 210. For example, the sealing element 4 can be a rubber sealing ring, a mechanical seal, or other similar sealing methods.

[0062] See Figure 1 and Figure 2 As shown, in some embodiments of this application, the stirring element 221 is made of insulating material, which can prevent the conductive filler from adhering to the stirring element 221 due to static electricity, ensuring that the conductive filler in the reaction chamber 210 can move fully, thereby ensuring that the conductive filler is effectively modified.

[0063] It should be further noted that in some of the above embodiments, the reactor body 21 is in a stationary state, and a material driving mechanism 22 (e.g., a stirring mechanism 220) is used to drive the movement of the conductive packing material in the reaction chamber 210. However, this application is not limited to this. In other embodiments, the material driving mechanism can be used to drive the reactor body to move (e.g., rotate the reactor body). During the rotation of the reactor body, the conductive packing material filled in the reaction chamber moves, so that each surface of the conductive packing material can be exposed to oxygen plasma (O2). 2+ (To bombard thoroughly.)

[0064] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0065] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A reaction apparatus, characterized in that, include: A plasma generator, wherein the plasma generator is provided with a reaction channel for generating plasma; A mixing reactor, comprising a reactor body and a material driving mechanism, wherein a reaction chamber is provided in the reactor body and the reaction chamber is connected to the reaction channel, and the material driving mechanism is configured to drive the movement of material within the reaction chamber.

2. The reaction apparatus according to claim 1, characterized in that, The peripheral walls of the reaction chamber are made of an insulating material; and / or, It also includes a vacuum generator, the vacuum generator's extraction port being connected to the reaction chamber.

3. The reaction apparatus according to claim 1, characterized in that, The material driving mechanism is a stirring mechanism, which includes a stirring element and a drive motor. At least a portion of the stirring element is located inside the reaction chamber, and the drive motor is used to drive the stirring element to rotate. The stirring element is made of insulating material.

4. The reaction apparatus according to claim 3, characterized in that, The reactor body is provided with an assembly through hole, which is used to allow the stirring element to extend into the reaction chamber; It also includes: a seal, which is used to seal the gap between the agitator and the assembly through hole.

5. The reaction apparatus according to claim 1, characterized in that, The plasma generator includes an excitation source and a conductive tube, the conductive tube passing through the excitation source and defining the reaction channel within the conductive tube; It also includes: a first valve body and a second valve body, the conductive pipe is connected to the reactor body as a whole, and the reactor body is provided with a loading port and a discharge port, the first valve body is used to open and close the loading port, and the second valve body is used to open and close the discharge port; Alternatively, the connecting pipe is selectively connected to the reactor body, such that the discharge port of the connecting pipe is selectively engaged with the communication port provided in the reactor body, so that the communication port is used for loading and unloading materials.

6. The reaction apparatus according to claim 5, characterized in that, Along the extending direction of the conductive pipe, the conductive pipe is provided with an input port away from the discharge port; It also includes a third valve body, which is disposed on the conductive pipe and is used to open and close the input port.

7. The reaction apparatus according to claim 5, characterized in that, Also includes: A connecting fastener is used to fix the conductive pipe to the reactor body, thereby connecting the discharge port to the communication port.

8. The reaction apparatus according to claim 1, characterized in that, The reactor body is provided with a negative pressure port, and the reaction chamber is connected to the air extraction port of the vacuum generator through the negative pressure port. It also includes a filter element disposed between the negative pressure port and the exhaust port, the filter element being used to prevent material in the reaction chamber from entering the exhaust port.

9. The reaction apparatus according to claim 8, characterized in that, Also includes: A fourth valve body is disposed between the negative pressure port and the air extraction port, and the fourth valve body is configured to control the connection state between the negative pressure port and the air extraction port.

10. The reaction apparatus according to any one of claims 1 to 9, characterized in that, Also includes: A pressure monitoring device configured to monitor the pressure value within the reaction chamber.