Solder ball collecting mechanism and semiconductor ball mounting equipment

Abstract

The utility model discloses a solder ball collecting mechanism and a semiconductor ball mounting device, which are used for solving the technical problem that the existing solder ball collecting mechanism is inconvenient to use because the existing solder ball collecting mechanism needs to be disassembled in a complicated way after collecting waste solder balls. The device comprises a collecting cavity, the top of the collecting cavity is communicated with a collecting opening, an opening is formed in the outer side face of the collecting cavity, a collecting drawer is detachably installed in the collecting cavity, and the collecting drawer can be driven to enter or leave the collecting cavity from the opening.

Description

Technical Field

[0001] This utility model relates to the field of waste collection mechanism design technology, and in particular to a solder ball collection mechanism and a semiconductor ball planting device. Background Technology

[0002] The main function of the solder ball collection mechanism is to collect the waste solder balls ejected from the ejection valve of the semiconductor ball packing equipment. It is a commonly used structure in the field of semiconductor ball packing equipment.

[0003] Most existing solder ball collection systems use fixed waste ball collection boxes, which are typically secured with screws. Once the box is full of waste solder balls, operators need to disassemble it, a process that involves unscrewing multiple screws, making it cumbersome. After processing the waste balls, the box must be reinstalled. This undoubtedly causes inconvenience for operators.

[0004] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Utility Model Content

[0005] This utility model discloses a solder ball collecting mechanism to solve the technical problem that existing solder ball collecting mechanisms require complicated disassembly after collecting waste solder balls, resulting in inconvenience in use.

[0006] The present invention provides a solder ball collecting mechanism, including a collecting cavity, a collecting port connected to the top of the collecting cavity, an opening provided on the outer side of the collecting cavity, and a collecting drawer detachably installed inside the collecting cavity, the collecting drawer being driven to enter or leave the collecting cavity through the opening.

[0007] Optionally, the collecting cavity is provided with a first magnetic attraction part, and the collecting drawer is provided with a second magnetic attraction part that cooperates with the first magnetic attraction part;

[0008] When the collection drawer is driven into the collection cavity, the first magnetic part and the second magnetic part attract each other to fix the collection drawer in the collection cavity.

[0009] Optionally, a first magnetic attraction part is provided in the collection cavity, and the collection drawer is a collection drawer made of metal.

[0010] When the collection drawer is driven into the collection cavity, the first magnetic part attracts the collection drawer to fix the collection drawer in the collection cavity.

[0011] Optionally, the outer side of the collection drawer is provided with a pull-out handle.

[0012] Optionally, the outer peripheral edge of the pull handle is provided with an anti-slip part.

[0013] Optionally, the top of the collection cavity is provided with a mounting base, the mounting base is a hollow structure and a flexible block is provided on its top, the flexible block is provided with a collection port, and the collection port is connected to the collection cavity.

[0014] Optionally, a support platform is connected to the bottom of the collection cavity.

[0015] Optionally, a movable guide rail is provided inside the collection cavity;

[0016] The outer side of the collection drawer is provided with a slider that works in conjunction with the moving guide rail;

[0017] The slider is detachably and slidably connected to the movable guide rail.

[0018] Optionally, the collection cavity is provided with multiple guide rollers, which are arranged in a straight line along the in-and-out direction of the collection drawer.

[0019] This utility model discloses a semiconductor ball-planting device, characterized in that it includes the aforementioned solder ball collection mechanism.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] In this embodiment of the solder ball collection mechanism, waste solder balls fall from the collection port onto the collection drawer inside the collection chamber. When the collection drawer is full of waste solder balls, the operator can directly pull the collection drawer out of the collection chamber and push it back into the collection chamber after processing the waste solder balls. This design effectively solves the technical problems of complex disassembly and inconvenient operation in existing solder ball collection mechanisms, greatly improving the operator's ease of use. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 A schematic diagram of the structure of a solder ball collecting mechanism provided by this utility model when the collecting drawer is located in the collecting cavity;

[0024] Figure 2A schematic diagram of the structure of a solder ball collecting mechanism provided by this utility model when the collecting drawer leaves the collecting cavity;

[0025] Figure 3 for Figure 1 Exploded view of the structure;

[0026] Illustration: 1. Collection cavity; 2. Collection drawer; 3. Pull-out handle; 4. Support platform; 5. Mounting base; 6. Flexible block; 7. Collection port; 8. First magnetic suction part. Detailed Implementation

[0027] This utility model discloses a solder ball collection mechanism and a semiconductor ball planting device, which solves the technical problem that existing solder ball collection mechanisms require complicated disassembly after collecting waste solder balls, resulting in inconvenience in use.

[0028] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1 to 3 The present invention provides a solder ball collecting mechanism, including a collecting cavity 1, a collecting port 7 connected to the top of the collecting cavity 1, an opening provided on the outer side of the collecting cavity 1, and a collecting drawer 2 detachably installed inside the collecting cavity 1, the collecting drawer 2 being driven to enter or leave the collecting cavity 1 through the opening.

[0030] In this embodiment of the solder ball collection mechanism, waste solder balls fall from the collection port 7 onto the collection drawer 2 inside the collection chamber 1. When the collection drawer 2 is full of waste solder balls, the operator can directly pull the collection drawer 2 out of the collection chamber 1 and push it back into the collection chamber 1 after processing the waste solder balls. This design effectively solves the technical problems of complex disassembly and inconvenient operation in existing solder ball collection mechanisms, greatly improving the operator's ease of use.

[0031] Furthermore, in this embodiment, the collection cavity 1 is provided with a first magnetic suction part 8, and the collection drawer 2 is provided with a second magnetic suction part that works in conjunction with the first magnetic suction part 8.

[0032] When the collection drawer 2 is driven into the collection cavity 1, the first magnetic part 8 and the second magnetic part attract each other to fix the collection drawer 2 inside the collection cavity 1.

[0033] It should be noted that, through the above design, the collection drawer 2 can be stably fixed inside the collection cavity 1, and the magnetic fixing method makes it easy for operators to install or remove the collection drawer 2.

[0034] In another specific embodiment, the above-mentioned collection cavity 1 is provided with a first magnetic suction part 8, and the collection drawer 2 is a collection drawer 2 made of metal.

[0035] When the collection drawer 2 is driven into the collection cavity 1, the first magnetic part 8 attracts the collection drawer 2 to fix the collection drawer 2 inside the collection cavity 1.

[0036] It should be noted that in the above specific embodiment, the principle of magnetic fixation is also used to stably fix the collection drawer 2 in the collection cavity 1, which is also convenient for operators to install or remove the collection drawer 2.

[0037] Furthermore, in this embodiment, the outer side of the collection drawer 2 is provided with a pull-out handle 3.

[0038] It should be noted that, with the above design, operators can pull out or push in the collection drawer 2 using the pull handle 3.

[0039] Furthermore, the outer periphery of the pull handle 3 in this embodiment is provided with an anti-slip part.

[0040] It should be noted that the above-mentioned anti-slip design can prevent operators from slipping their hands during operation.

[0041] Furthermore, in this embodiment, the top of the collection cavity 1 is provided with a mounting base 5, the mounting base 5 is a hollow structure and a flexible block 6 is provided on its top, the flexible block 6 is provided with a collection port 7, and the collection port 7 is connected to the collection cavity 1.

[0042] It should be noted that, through the above design, the waste solder balls pass through the collection port 7 and the mounting base 5 in sequence before entering the collection cavity 1 and being collected by the collection drawer 2.

[0043] In addition, the aforementioned flexible block 6 is made of plastics with a certain degree of elasticity, such as PU polyurethane. Through the above design, the solder ball collection mechanism can avoid hard contact with the components of the semiconductor ball packing equipment during the collection of waste solder balls, thus preventing damage.

[0044] Furthermore, in this embodiment, the bottom of the collection cavity 1 is connected to a support platform 4.

[0045] It should be noted that the above design can effectively support the collection chamber 1.

[0046] Furthermore, a movable guide rail is provided inside the collection cavity 1 in this embodiment;

[0047] The outer side of the collection drawer 2 is provided with a slider that works in conjunction with the moving guide rail;

[0048] The slider is detachably and slidably connected to the movable guide rail.

[0049] It should be noted that the above design makes the collection drawer 2 move more smoothly and steadily during the pulling process.

[0050] In another specific embodiment, the collection cavity 1 is provided with a plurality of guide rollers, which are arranged in a straight line along the in-and-out direction of the collection drawer 2.

[0051] It should be noted that the above design also makes the collection drawer 2 move more smoothly and steadily during the pulling process.

[0052] Please see Figures 1 to 3 The present invention provides a semiconductor ball-mounting device, including the aforementioned solder ball collection mechanism.

[0053] It should be noted that in the solder ball collection mechanism of the semiconductor ball-mounting equipment of this embodiment, waste solder balls fall from the collection port 7 onto the collection drawer 2 inside the collection cavity 1. When the collection drawer 2 is full of waste solder balls, the operator can directly pull the collection drawer 2 out of the collection cavity 1 and push it back into the collection cavity 1 after processing the waste solder balls. Through the above design, the technical problems of complicated disassembly and inconvenient operation of existing solder ball collection mechanisms can be effectively solved, greatly improving the operator's ease of operation.

[0054] The above provides a detailed description of the solder ball collecting mechanism and semiconductor ball planting equipment provided by this utility model. For those skilled in the art, based on the ideas of the embodiments of this utility model, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A solder ball collecting mechanism, characterized in that, Includes a collection cavity (1), the top of which is connected to a collection port (7), and an opening is provided on the outer side of the collection cavity (1). A collection drawer (2) is detachably installed inside the collection cavity (1), and the collection drawer (2) can be driven to enter or leave the collection cavity (1) through the opening.

2. The solder ball collecting mechanism according to claim 1, characterized in that, The collection cavity (1) is provided with a first magnetic suction part (8), and the collection drawer (2) is provided with a second magnetic suction part that works in conjunction with the first magnetic suction part (8); When the collection drawer (2) is driven into the collection cavity (1), the first magnetic part (8) and the second magnetic part attract each other to fix the collection drawer (2) inside the collection cavity (1).

3. The solder ball collecting mechanism according to claim 1, characterized in that, The collection cavity (1) is provided with a first magnetic suction part (8), and the collection drawer (2) is a collection drawer (2) made of metal. When the collection drawer (2) is driven into the collection cavity (1), the first magnetic part (8) and the collection drawer (2) attract each other to fix the collection drawer (2) inside the collection cavity (1).

4. The solder ball collecting mechanism according to claim 1, characterized in that, The outer side of the collection drawer (2) is provided with a pull handle (3).

5. The solder ball collecting mechanism according to claim 4, characterized in that, The outer periphery of the pull handle (3) is provided with an anti-slip part.

6. The solder ball collecting mechanism according to claim 1, characterized in that, The top of the collection cavity (1) is provided with a mounting base (5), which is a hollow structure and has a flexible block (6) on its top. The flexible block (6) is provided with a collection port (7), which is connected to the collection cavity (1).

7. The solder ball collecting mechanism according to claim 1, characterized in that, The bottom of the collection chamber (1) is connected to a support platform (4).

8. The solder ball collecting mechanism according to claim 1, characterized in that, The collection cavity (1) is equipped with a movable guide rail; The outer side of the collection drawer (2) is provided with a slider that works in conjunction with the moving guide rail; The slider is detachably and slidably connected to the movable guide rail.

9. The solder ball collecting mechanism according to claim 1, characterized in that, The collection cavity (1) is provided with multiple guide rollers, which are arranged in a straight line along the inlet and outlet direction of the collection drawer (2).

10. A semiconductor ball-planting device, characterized in that, Includes the tin ball collecting mechanism as described in any one of claims 1 to 9.

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