Double-channel reflow soldering cooling mechanism

Abstract

The utility model discloses a double-channel reflow soldering cooling mechanism, which belongs to the technical field of reflow soldering technology and comprises a support frame, a cold row structure, a heat absorption circulation structure, a fan structure and a module connecting structure. A cold discharge structure is arranged in the bearing frame, and the two heat absorption circulation structures are oppositely arranged on the two side faces of the bearing frame. The two fan structures are arranged above the cold row structure side by side, a module connecting structure is arranged on the side face of each heat absorption circulation structure, each module connecting structure is provided with a guide connecting pin, a pre-positioning hole and a locking block, and the multiple guide connecting pins are evenly arranged on the side face of one heat absorption circulation structure at intervals. A plurality of pre-positioning holes are uniformly arranged on the side surface of the other heat absorption circulation structure, and one guide connecting pin is correspondingly matched with one pre-positioning hole; the two locking blocks are oppositely arranged at the two ends of the diagonal lines of the two heat absorption circulation structures correspondingly. According to the utility model, the technical problem of how to improve the layout convenience of the cooling structure is solved.

Description

Technical Field

[0001] This utility model relates to the technical field of reflow soldering process, and in particular to a dual-channel reflow soldering cooling mechanism. Background Technology

[0002] Reflow soldering is a surface mount soldering technology widely used in the electronics manufacturing industry. Its core lies in melting and reflowing pre-coated solder paste through precise temperature control, thereby achieving mechanical and electrical connections between electronic components and printed circuit board pads.

[0003] Dual-channel reflow soldering, also known as dual-track reflow soldering, is a soldering process based on traditional reflow soldering technology. Its core lies in the use of a dual-track structure design, which allows two printed circuit boards to be processed in parallel at the same time, thereby significantly improving production efficiency.

[0004] Based on this, Chinese patent document CN112291946B discloses a dual-channel chip mount production line, which includes two parallel printers and a dual-track reflow soldering machine. Each printer has a chip mounter located on one side of its output, between the printer and the reflow soldering machine. A first connector for transferring circuit boards is provided between adjacent printers and chip mounters. The reflow soldering machine is close to one of the chip mounters, and a second connector is provided between the chip mounter and the reflow soldering machine, docking at the first track of the reflow soldering machine. A third connector is provided on the output side of the other chip mounter, and a transfer device is provided between the third connector and the reflow soldering machine to transfer the circuit board to the second track of the reflow soldering machine. In this technical solution, the transfer device eliminates the need for a reflow soldering machine on the other production line, thereby reducing operating costs when both production lines are operating simultaneously and minimizing space occupation.

[0005] However, existing dual-channel surface mount production lines still face the technical challenge of difficult cooling zone layout. Specifically, in existing dual-channel surface mount production lines, the reflow soldering cooling mechanism is a module used to rapidly cool the solder joints. It is located in the final stage of the reflow soldering process, specifically in the cooling zone. Its core function is to control the cooling rate to ensure the molten solder paste forms a uniform and dense microstructure during solidification, thereby guaranteeing the mechanical strength and electrical reliability of the solder joints. This mechanism typically consists of a radiator, cooling fan, water-cooled circulation system, or nitrogen-assisted cooling device. Depending on the equipment type, the cooling method can be divided into two modes: air cooling (forced convection) and water cooling (liquid circulation). During the cooling stage of reflow soldering, the solder paste rapidly solidifies from a liquid state to a solid state. The cooling rate directly affects the fineness of the solder joint crystallization and the distribution of intermetallic compounds. A faster cooling rate, typically controlled at 2°C to 5°C per minute, can refine the solder joint microstructure, improve mechanical properties, and enhance fatigue resistance. In current dual-channel reflow soldering production lines, the cooling mechanism needs to be customized for the length of the production line, and each reflow oven needs to be customized separately, resulting in high operating costs and difficult installation. Utility Model Content

[0006] Therefore, it is necessary to provide a dual-channel reflow soldering cooling mechanism to address the technical issue of how to improve the ease of layout of the cooling structure.

[0007] A dual-channel reflow soldering cooling mechanism includes: a support frame, a heat exchanger structure, a heat absorption circulation structure, a fan structure, and a module connection structure. The heat exchanger structure is disposed within the support frame, and two heat absorption circulation structures are disposed opposite each other on two sides of the support frame. Two fan structures are arranged side-by-side above the heat exchanger structure. Each heat absorption circulation structure has a module connection structure on its side, and each module connection structure has a guide pin, a pre-positioning hole, and a locking block. A plurality of guide pins are evenly spaced on the side of one heat absorption circulation structure, and a plurality of pre-positioning holes are evenly spaced on the side of another heat absorption circulation structure. Each guide pin is paired with a pre-positioning hole. Two locking blocks are respectively disposed on the sides of the two heat absorption circulation structures, and are respectively disposed opposite each other at the two ends of the diagonal of the two heat absorption circulation structures.

[0008] Furthermore, the cooling radiator structure has a support body, a handle structure, and several fins.

[0009] Furthermore, each end of the support body is provided with a handle structure, and a plurality of fins are evenly arranged at intervals in the support body; the support frame is connected to the support body.

[0010] Furthermore, each of the described heat-absorbing circulation structures has a working fluid flow cavity, a protective connecting frame, a connecting pad, and a connecting port.

[0011] Furthermore, the working fluid flow cavity is disposed on the side of the support body, and the working fluid flow cavity is disposed within the protective connecting frame.

[0012] Furthermore, the upper part of the protective connecting frame is provided with the connecting pad, the connecting pad connecting the support frame and the protective connecting frame respectively, and the module connecting structure is provided on the side of the protective connecting frame.

[0013] Furthermore, each end of the working fluid flow cavity is provided with a connection port, and each connection port is located on the end side of the protective connecting frame.

[0014] Furthermore, each of the aforementioned fan structures has a perforated protective cover, connecting pins, a drive motor, and blades.

[0015] Furthermore, the perforated protective cover is connected to the support frame, and a number of connecting pins are evenly distributed around the periphery of the perforated protective cover; each connecting pin is connected to the perforated protective cover and the support frame respectively.

[0016] Furthermore, the drive motor is connected to the hollow protective cover, the blade is movably disposed within the hollow protective cover, the blade is disposed above the fin, and the drive motor is driven and connected to the blade.

[0017] In summary, the dual-channel reflow soldering cooling mechanism of this utility model includes a support frame, a cold air radiator structure, a heat absorption circulation structure, a fan structure, and a module connection structure. The cold air radiator structure is disposed within the support frame, and two heat absorption circulation structures are disposed opposite each other on the two sides of the support frame. Two fan structures are disposed side by side above the cold air radiator structure. Each side of each heat absorption circulation structure is provided with a module connection structure. Each module connection structure is provided with a guide connecting pin, a pre-positioning hole, and a locking block. A plurality of guide connecting pins are evenly arranged at intervals on the side of one heat absorption circulation structure, and a plurality of pre-positioning holes are evenly arranged on the side of another heat absorption circulation structure. Each guide connecting pin is paired with a pre-positioning hole. Two locking blocks are respectively disposed on the sides of the two heat absorption circulation structures, and the two locking blocks are respectively disposed opposite each other at the two ends of the diagonal of the two heat absorption circulation structures. This utility model's dual-channel reflow soldering cooling mechanism allows for convenient and rapid interconnection between adjacent support frames through a modular design. This enables extended, rapid, and uniform heat dissipation from the circuit board during the reflow soldering process. Furthermore, to facilitate the application of the dual-channel structure, this utility model proposes a cooling radiator structure using parallel dual fans, with additional heat absorption circulation structures on both sides of the radiator, achieving even better heat dissipation. Therefore, this utility model's dual-channel reflow soldering cooling mechanism solves the technical problem of improving the ease of installation of cooling structures. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the dual-channel reflow soldering cooling mechanism of this utility model;

[0019] Figure 2 This is a schematic diagram of the dual-channel reflow soldering cooling mechanism of this utility model from another direction;

[0020] Figure 3 This is a cross-sectional view of the dual-channel reflow soldering cooling mechanism of this utility model from another direction.

[0021] Figure 4 This is a structural schematic diagram of one usage state of the dual-channel reflow soldering cooling mechanism of this utility model. Detailed Implementation

[0022] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0023] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0028] Please refer to the following: Figures 1 to 4 The present invention relates to a dual-channel reflow soldering cooling mechanism, comprising: a support frame 1, a heat exchanger structure 2, a heat absorption circulation structure 3, a fan structure 4, and a module connection structure 5; the heat exchanger structure 2 is disposed within the support frame 1, and two heat absorption circulation structures 3 are disposed opposite each other on the two sides of the support frame 1; two fan structures 4 are disposed side by side above the heat exchanger structure 2; each heat absorption circulation structure 3 has a module connection structure 5 disposed on its side, and each module connection structure 5 is provided with a guide connecting pin 501, a pre-positioning hole 502, and a locking block 503; a plurality of guide connecting pins 501 are evenly arranged at intervals on the side of one heat absorption circulation structure 3, and a plurality of pre-positioning holes 502 are evenly arranged on the side of another heat absorption circulation structure 3, with one guide connecting pin 501 corresponding to one pre-positioning hole 502; two locking blocks 503 are respectively disposed on the side of the two heat absorption circulation structures 3, and the two locking blocks 503 are respectively disposed opposite each other at the two ends of the diagonal of the two heat absorption circulation structures 3.

[0029] Specifically, this utility model proposes a modular design cooling mechanism for dual-channel reflow soldering equipment. The support frame 1 can be placed on top of the external reflow soldering equipment so that the cooling radiator structure 2 faces the circuit board's transport channel, absorbing the heat emitted by the circuit board. Subsequently, the fan structure 4, under external control, starts and draws airflow through the cooling radiator structure 2 for heat diffusion and transfer via air cooling. Simultaneously, the heat-absorbing circulation legs 3 on both sides of the cooling radiator structure 2 also absorb heat, accelerating heat diffusion. Specifically, the inner cavity of the heat-absorbing circulation structure 3 can be filled with a heat-absorbing working fluid, such as cold water or coolant, to absorb and remove heat. In addition, to ensure uniform heat dissipation throughout the channel, when one cooling radiator structure 2 is insufficient to cover the entire channel, another cooling mechanism can be connected in series on the side of the support frame 1. In this case, the guide connecting pin 501 can be used to pre-align and position the two adjacent support frames 1. At this time, one guide connecting pin 501 can be matched and connected to the pre-positioning hole 502 provided on the side of the other support frame 1. After the two adjacent support frames 1 are paired and positioned, they can be securely connected by the locking block 503. Therefore, the dual-channel reflow soldering cooling mechanism of this invention allows for convenient and rapid interconnection between two adjacent support frames 1 through its modular design. This enables rapid and uniform heat dissipation from the circuit board during the reflow soldering process. Furthermore, to facilitate the application of the dual-channel structure, this invention also proposes a technical solution using a parallel dual-fan structure 4 and a heat-absorbing circulation structure 3 on both sides of the heat-absorbing structure 2, thereby achieving even better heat dissipation. Thus, this invention solves the technical problem of improving the ease of installation of the cooling structure.

[0030] Furthermore, the cold radiator structure 2 includes a support body 201, a handle structure 202, and several fins 203. Each end of the support body 201 has a handle structure 202, and the several fins 203 are evenly arranged and spaced apart within the support body 201. The support frame 1 is connected to the support body 201. Specifically, the handle structure 202 facilitates the installation, disassembly, and maintenance of the dual-channel reflow soldering cooling mechanism by operators. The handle structure 202 can be connected to the support body 201 using fasteners such as screws and bolts, or by welding.

[0031] Furthermore, each of the heat absorption circulation structures 3 includes a working fluid flow cavity 301, a protective connecting frame 302, a connecting pad 303, and a connecting port 304. The working fluid flow cavity 301 is disposed on the side of the support body 201 and within the protective connecting frame 302. The connecting pad 303 is disposed on the upper part of the protective connecting frame 302, and the connecting pad 303 connects the support frame 1 and the protective connecting frame 302 respectively. The module connecting structure 5 is disposed on the side of the protective connecting frame 302. Each end of the working fluid flow cavity 301 has a connecting port 304, and each connecting port 304 is disposed on the end side of the protective connecting frame 302. Specifically, external working fluid can enter the working fluid flow cavity 301 through one connecting port 304 and then flow back to the external working fluid storage tank or chamber through the other connecting port 304. The working fluid flowing in the working fluid cavity 301 can quickly carry away the heat absorbed by the fins 203 from both sides of the support body 201. The protective connecting frame 302 serves two purposes: first, it protects the working fluid cavity 301 from impacts that could cause leakage; second, it provides connection space so that external structural components can be connected to the side of the protective connecting frame 302 via threads or other means. Similarly, the connecting pad 303 is located on the upper part of the protective connecting frame 302, thereby facilitating the connection of the support frame 1 to the protective connecting frame 302 via screws or other fasteners, while preventing screws or other fasteners from damaging the structure of the working fluid cavity 301.

[0032] Furthermore, each of the aforementioned fan structures 4 includes a perforated protective cover 401, connecting pins 402, a drive motor 403, and a rotor blade 404. The perforated protective cover 401 is connected to the support frame 1, and several connecting pins 402 are evenly distributed around the periphery of the perforated protective cover 401. Each connecting pin 401 connects the perforated protective cover 401 to the support frame 1. The drive motor 403 is connected within the perforated protective cover 401, and the rotor blade 404 is movably disposed within the perforated protective cover 401, positioned above the fins 203. The drive motor 403 is drively connected to the rotor blade 404. Specifically, when the drive motor 403 is powered on and started, it can drive the rotor blade 404 to rotate above the fins 203, thereby guiding air through the gaps between the fins 203 to carry away the heat absorbed by the fins 203. When the blade rotates within the perforated protective cover 401, the perforated protective cover 401 allows air to pass through, preventing users' fingers or other objects from passing through and causing workplace injuries or other accidents. The several connecting pins 402 provided at the bottom of the perforated protective cover 401 can be fastened to the support frame 1 using screws or other fasteners.

[0033] In summary, the dual-channel reflow soldering cooling mechanism of this utility model is provided with a support frame 1, a cold air radiator structure 2, a heat absorption circulation structure 3, a fan structure 4, and a module connection structure 5. The cold air radiator structure 2 is disposed within the support frame 1, and the two heat absorption circulation structures 3 are disposed opposite each other on the two sides of the support frame 1. The two fan structures 4 are disposed side by side above the cold air radiator structure 2. Each side of the heat absorption circulation structure 3 is provided with a module connection structure 5, and each module connection structure 5 is provided with a guide connecting pin 50. 1. A pre-positioning hole 502 and a locking block 503, a plurality of guide connecting pins 501 are evenly arranged at intervals on the side of one heat absorption circulation structure 3, a plurality of pre-positioning holes 502 are evenly arranged on the side of another heat absorption circulation structure 3, and a guide connecting pin 501 is paired with a pre-positioning hole 502; two locking blocks 503 are respectively disposed on the side of the two heat absorption circulation structures 3, and the two locking blocks 503 are respectively disposed opposite to each other at the two ends of the diagonal of the two heat absorption circulation structures 3. This utility model's dual-channel reflow soldering cooling mechanism allows for convenient and rapid interconnection between two adjacent support frames 1 through a modular design. This enables extended, rapid, and uniform heat dissipation from the circuit board during the reflow soldering process. Furthermore, to facilitate the application of the dual-channel structure, this utility model also proposes a cooling radiator structure 2 using a parallel dual-fan structure 4, with additional heat absorption circulation structures 3 on both sides of the cooling radiator structure 2, thereby achieving even better heat dissipation. Therefore, this utility model's dual-channel reflow soldering cooling mechanism solves the technical problem of improving the ease of installation of the cooling structure.

[0034] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A dual-channel reflow soldering cooling mechanism, characterized in that, It includes: The support frame (1), the radiator structure (2), the heat absorption circulation structure (3), the fan structure (4), and the module connection structure (5) are provided; the radiator structure (2) is provided in the support frame (1), and the two heat absorption circulation structures (3) are arranged opposite to each other on the two sides of the support frame (1); the two fan structures (4) are arranged side by side above the radiator structure (2), and each heat absorption circulation structure (3) has a module connection structure (5) on its side, and each module connection structure (5) has a guide connecting pin (501) and a pre-positioning hole (502). 2) and locking blocks (503), a plurality of guide connecting pins (501) are evenly arranged at intervals on the side of one heat absorption circulation structure (3), a plurality of pre-positioning holes (502) are evenly arranged on the side of another heat absorption circulation structure (3), and one guide connecting pin (501) is paired with one pre-positioning hole (502); two locking blocks (503) are respectively arranged on the side of the two heat absorption circulation structures (3), and the two locking blocks (503) are respectively arranged opposite to each other at the two ends of the diagonal of the two heat absorption circulation structures (3).

2. The dual-channel reflow soldering cooling mechanism according to claim 1, characterized in that: The cooling radiator structure (2) has a support body (201), a handle structure (202), and several fins (203).

3. The dual-channel reflow soldering cooling mechanism according to claim 2, characterized in that: The support body (201) has a handle structure (202) at each end, and a plurality of fins (203) are evenly arranged and spaced apart in the support body (201); the support frame (1) is connected to the support body (201).

4. The dual-channel reflow soldering cooling mechanism according to claim 3, characterized in that: Each of the heat absorption circulation structures (3) has a working fluid flow cavity (301), a protective connecting frame (302), a connecting pad (303), and a connecting port (304).

5. The dual-channel reflow soldering cooling mechanism according to claim 4, characterized in that: The working fluid flow cavity (301) is disposed on the side of the support body (201) and the working fluid flow cavity (301) is disposed in the protective connecting frame (302).

6. The dual-channel reflow soldering cooling mechanism according to claim 5, characterized in that: The upper part of the protective connecting frame (302) is provided with the connecting pad (303), the connecting pad (303) connects the support frame (1) and the protective connecting frame (302) respectively, and the module connecting structure (5) is provided on the side of the protective connecting frame (302).

7. The dual-channel reflow soldering cooling mechanism according to claim 6, characterized in that: The working fluid flow cavity (301) has a connection port (304) at each end, and each connection port (304) is located on the end side of the protective connecting frame (302).

8. The dual-channel reflow soldering cooling mechanism according to claim 7, characterized in that: Each of the fan structures (4) has a perforated protective cover (401), connecting pins (402), a drive motor (403), and blades (404).

9. The dual-channel reflow soldering cooling mechanism according to claim 8, characterized in that: The perforated protective cover (401) is connected to the support frame (1), and a plurality of the connecting pins (402) are evenly distributed around the periphery of the perforated protective cover (401); each of the connecting pins (401) is connected to the perforated protective cover (401) and the support frame (1).

10. The dual-channel reflow soldering cooling mechanism according to claim 9, characterized in that: The drive motor (403) is connected to the hollow protective cover (401), the blade (404) is movably disposed in the hollow protective cover (401), the blade (404) is disposed above the fin (203), and the drive motor (403) is drivenly connected to the blade (404).

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