Semiconductor processing equipment cabinet suitable for crown block system

Abstract

The utility model discloses a semiconductor processing equipment cabinet suitable for a crown block system. The semiconductor processing equipment cabinet comprises a bottom layer part, a middle layer part and a case part, the bottom layer portion has a top portion. The middle layer part is arranged on the bottom layer part along a vertical direction, and the middle layer part does not cover or partially covers the top part, so that the uncovered part of the top part becomes a setting platform. The case part is arranged on the middle layer part along the vertical direction; and in the vertical direction, the projection of the case part on the top is only partially overlapped on the setting platform, so that the upper part of the rest part of the setting platform is open and is not shielded. According to the invention, the upper part of the platform can be cleared so as to facilitate the transfer of the wafer in the vertical direction. Therefore, the crown block system can be applied to the transfer of the wafer arranged on the platform, and the transfer efficiency of the wafer is improved. In addition, the crown block vertically moves the wafer to a higher position and then horizontally transfers the wafer, so that the horizontal moving line around the cabinet is not interfered, and the arrangement of the moving line in an operation place is facilitated.

Description

Technical Field

[0001] This application relates to a cabinet for semiconductor processing equipment, and more particularly to a cabinet for semiconductor processing equipment suitable for overhead crane systems. Background Technology

[0002] In semiconductor manufacturing, wafers need to go through multiple stations to complete the entire process.

[0003] like Figure 1 As shown, the existing workstation is integrated into rack 1. The rack design typically consists of three parts: a bottom section 1a, a middle section 1b, and a chassis section 1c. The bottom section 1a serves as the base, and its top provides a platform 1d for placing wafers. The middle section 1b is positioned above the bottom section 1a and provides a front opening. This front opening allows the platform 1d to be accessed for placing or removing wafers to be processed. The chassis section 1c is positioned above the middle section 1b and houses the computer host, fan filters, control circuit boards, etc. The bottom section 1a can also house process-supporting devices, such as photoresist or chemical solution supply systems.

[0004] Figure 2 Another type of cabinet 2 is provided, in which the middle layer 2b partially covers the top of the bottom layer 2a, leaving the top partially open to serve as a platform 2d. The chassis 2c is attached to the front side of the middle layer 2b, and the chassis 2c may have a multi-layer structure.

[0005] like Figure 1 and Figure 2 As shown, the upper parts of platforms 1d and 2d are obstructed by chassis sections 1c and 2c, therefore the wafers or wafer carriers (crystal boats) can only be moved from the front of the middle sections 1b and 2b. Consequently, the transfer of wafers or wafer carriers (crystal boats) can only be carried out horizontally via tracks and trolleys, and cannot be moved from above using an overhead crane system, thus affecting the horizontal movement within the workplace. Utility Model Content

[0006] In view of the above-mentioned technical problems, this application proposes a semiconductor processing equipment cabinet suitable for overhead crane systems, which provides a vertical flow path for moving materials in the vertical direction.

[0007] This application provides a semiconductor processing equipment cabinet suitable for overhead crane systems, comprising a bottom section, a middle section, and a chassis section. The bottom section has a top. The middle section is disposed on the bottom section along a vertical direction, and the middle section does not cover or partially covers the top, so that the uncovered portion of the top forms a mounting platform. The chassis section is disposed on the middle section along the vertical direction. In this vertical direction, the projection of the chassis section onto the top only partially overlaps the mounting platform, so that the upper part of the remaining portion of the mounting platform is open and unobstructed.

[0008] In at least one embodiment, the middle layer is open at least on the front side.

[0009] In at least one embodiment, the middle layer has three closed sides that extend upwards from the edge of the top, thereby opening the front side of the middle layer.

[0010] In at least one embodiment, the chassis section is mounted on the top edge of the three enclosed sides.

[0011] In at least one embodiment, the chassis is a box, which can be formed by combining multiple beams into a frame and adding multiple cover plates.

[0012] In at least one embodiment, the bottom layer is a box, which can be formed by combining multiple beams into a frame and then adding multiple cover plates to form the box.

[0013] In at least one embodiment, the chassis portion extends into the middle layer.

[0014] In at least one embodiment, the chassis includes a first layer structure and a second layer structure, the first layer structure being attached to the middle layer and partially protruding above the mounting platform, and the second layer structure being connected to the lower part of the first layer structure and located on the front side of the middle layer.

[0015] In at least one embodiment, the chassis section is composed of multiple beams.

[0016] Based on the semiconductor processing equipment cabinet applicable to the overhead crane system of this application, the area above the mounting platform can be cleared to facilitate vertical wafer transfer. Therefore, the overhead crane system can be applied to wafer transfer on the mounting platform, improving wafer transfer efficiency. Furthermore, the overhead crane moves the wafer vertically to a higher position before horizontal transfer, which does not interfere with the horizontal traffic flow around the cabinet, facilitating traffic flow arrangement in the operating area. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a 3D view of the server rack from previous technologies.

[0019] Figure 2 This is a 3D view of another type of cabinet from the previous technology.

[0020] Figure 3 This is a perspective view of a semiconductor processing equipment cabinet applicable to a crane system, as described in the first embodiment of this application.

[0021] Figure 4 This is a top view of a semiconductor processing equipment cabinet applicable to a crane system, as described in the first embodiment of this application.

[0022] Figure 5 This is a perspective view of the modified cabinet in the first embodiment of this application.

[0023] Figure 6 This is another perspective view of the modified cabinet in the first embodiment of this application.

[0024] Figure 7 This is a perspective view of a semiconductor processing equipment cabinet applicable to a crane system, as described in the second embodiment of this application.

[0025] Figure 8 This is a perspective view of the modified cabinet in the second embodiment of this application.

[0026] Symbol Explanation: 1: Cabinet; 1a: Bottom layer; 1b: Middle layer; 1c: Chassis; 1d: Platform; 2: Another type of cabinet; 2a: Bottom layer; 2b: Middle layer; 2c: Chassis; 2d: Platform; 100: Semiconductor processing equipment cabinet suitable for overhead crane systems; 110: Bottom layer; 112: Top; 120: Middle layer; 122: Enclosed side; 130: Chassis; 132: First layer structure; 134: Second layer structure; Y: Vertical direction; P: Platform. Detailed Implementation

[0027] Various exemplary embodiments will be more fully described below with reference to the accompanying drawings, some of which illustrate exemplary embodiments. However, the concepts of this application may be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these exemplary embodiments are provided so that this application will be exhaustive and complete, and will fully convey the scope of the concepts of this application to those skilled in the art. Similar numerals always indicate similar elements. The fast port switching method and switcher will be described below with reference to various embodiments and accompanying drawings; however, the following embodiments are not intended to limit this application.

[0028] Please see Figure 3As shown, a semiconductor processing equipment cabinet 100 suitable for a crane system, as proposed in the first embodiment of this application, includes a bottom layer 110, a middle layer 120, and a chassis 130. A crane system can be configured on top of this semiconductor processing equipment cabinet 100 to directly transfer wafers processed in the semiconductor processing equipment cabinet 100 using the crane system.

[0029] like Figure 3 As shown, the bottom section 110 is a box with a top 112. The bottom section 110 can be formed by combining multiple beams into a frame and then adding a cover plate to form the box.

[0030] like Figure 3 As shown, the middle layer 120 is disposed above the bottom layer 110 along a vertical direction Y, and the middle layer 120 does not cover or partially covers the top 112, so that the uncovered part of the top 112 forms a mounting platform P. The mounting platform P is used to mount epitaxial or photoresist coating equipment therein for wafer processing. Specifically, the middle layer 120 is open at least on its front side to facilitate the operator to adjust the equipment on the mounting platform P.

[0031] like Figure 3 As shown, in the first embodiment, the middle layer 120 has only three closed sides 122, which extend upward to the edge of the top 112, thus opening the front side of the middle layer 120, and there is no additional structure covering the top 112.

[0032] like Figure 3 As shown, the chassis section 130 is disposed above the middle section 120 along the vertical direction Y. For example, in the first embodiment, the chassis section 130 is mounted on the top edge of the three enclosed side panels 122. Like the bottom section 110, the chassis section 130 can also be a box, which can be formed by combining multiple beams into a frame and then adding a cover plate to form a box. However, the cover plate can also be omitted, leaving only the frame, as long as it can fix the computer host, fan filter assembly, control circuit board, and other devices.

[0033] It should be noted that although the semiconductor processing equipment cabinet 100 is divided into a bottom section 110, a middle section 120, and a chassis section 130, this does not mean that the bottom section 110, the middle section 120, and the chassis section 130 are three separate components. The beams and covers constituting the bottom section 110, the middle section 120, and the chassis section 130 can be shared among them. For example, the cover located on the side of the bottom section 110 actually extends upwards and also serves as a closed side of the middle section 120. Similarly, the beam extending upwards from the rear of the bottom section 110 can simultaneously serve as a vertical beam for the bottom section 110, the middle section 120, and the chassis section 130.

[0034] like Figure 4As shown, in the vertical Y direction, the projection of the chassis portion 130 onto the top 112 only partially overlaps with the mounting platform P, particularly only with the rear half of the mounting platform P, leaving the rest of the mounting platform P, especially the upper part of the front half of the mounting platform P, open and unobstructed. Therefore, wafers or wafer carriers can be moved from above by vertical handling equipment such as overhead crane systems without affecting the horizontal flow of movement in the workplace.

[0035] like Figure 5 and Figure 6 As shown, the semiconductor processing equipment cabinet 100 for overhead crane systems in the first embodiment can utilize, as... Figure 1 The modification was based on cabinet 1.

[0036] like Figure 5 As shown, the specific modification method is to remove the cover plate of the chassis section 1c, as well as the computer host, fan filter group, control circuit board and other devices.

[0037] like Figure 6 As shown, the beams of the original chassis section 1c frame are then cut and assembled to form the new chassis section 130 frame, making the remaining parts of the platform P, especially the upper part of the front half, open. Finally, as... Figure 3 As shown, simply reinstall the computer host, fan filter assembly, control circuit board, and cover back into the new chassis section 130.

[0038] See Figure 7 As shown, a semiconductor processing equipment cabinet 100 suitable for a crane system is proposed in the second embodiment of this application, which includes a bottom layer 110, a middle layer 120 and a chassis 130.

[0039] like Figure 7 As shown, the bottom section 110 is a box with a top 112. The bottom section 110 can be formed by combining multiple beams into a frame and then adding a cover plate to form the box.

[0040] like Figure 7 As shown, the middle layer 120 is disposed above the bottom layer 110 along a vertical direction Y. In the second embodiment, the middle layer 120 is also a housing that can be used to install other necessary devices. However, in the second embodiment, the housing 130 only partially covers the top 112, so that part of the top 112 is exposed to provide the mounting platform P.

[0041] like Figure 7As shown, the chassis section 130 is disposed above the middle section 120 along the vertical direction Y, and partially extends to the front side of the middle section 120. Specifically, in the second embodiment, multiple beams can be combined to form a frame, omitting the cover plate to form a shelf structure. Meanwhile, the chassis section 130 includes a two-layer structure: a first layer structure 132 is attached to the middle section 120 and partially protrudes above the mounting platform P; a second layer structure 134 is connected below the first layer structure 132 and is located on the front side of the middle section 120. Specifically, as... Figure 4 The projection of the chassis section 130 onto the mounting platform P only partially overlaps with the mounting platform P, so that the rest of the mounting platform P, especially the upper part of the front half of the mounting platform P, is open and not obstructed.

[0042] like Figure 8 As shown, the semiconductor processing equipment cabinet 100 for overhead crane systems in the first embodiment can be used as follows: Figure 2 Another type of cabinet 2 is used as the basis for modification. Specifically, the modification involves removing the computer host, fan filter assembly, control circuit board, and other devices from chassis section 2c. Then, all the beams that form the frame of chassis section 2c are removed, and then... Figure 7 As shown, the new frame can be connected to serve as the new chassis section 130.

[0043] Based on the semiconductor processing equipment cabinet 100 applicable to the overhead crane system of this application, the area above the platform P can be cleared to facilitate vertical wafer transfer. Therefore, the overhead crane system can be applied to wafer transfer on the platform P, improving wafer transfer efficiency. Furthermore, the overhead crane system moves the wafer vertically to a higher position before horizontal transfer, which does not interfere with the horizontal movement around the semiconductor processing equipment cabinet 100, thus facilitating workflow arrangement in the operating area.

[0044] The above description is merely a preferred embodiment or example of the technical means employed in this application to solve the problem, and is not intended to limit the scope of this patent application. Any changes or modifications that conform to the wording of this patent application or are made in accordance with the scope of this patent application are covered by the scope of this patent application.

Claims

1. A semiconductor processing equipment cabinet suitable for overhead crane systems, characterized in that, include: The bottom layer has a top; The middle layer is disposed vertically above the bottom layer, and the middle layer does not cover or partially covers the top, so that the uncovered part of the top becomes the mounting platform; as well as The chassis section is disposed above the middle layer section along the vertical direction; In the vertical direction, the projection of the chassis portion onto the top only partially overlaps the mounting platform, so that the upper part of the remaining portion of the mounting platform is open and unobstructed.

2. The semiconductor processing equipment cabinet for overhead crane systems according to claim 1, characterized in that, The middle layer is open at least on the front side.

3. The semiconductor processing equipment cabinet for overhead crane systems according to claim 2, characterized in that, The middle layer has three closed sides that extend upwards to the edge of the top, thus opening the front side of the middle layer.

4. The semiconductor processing equipment cabinet for overhead crane systems according to claim 3, characterized in that, The chassis section is mounted on the top edge of the three enclosed sides.

5. The semiconductor processing equipment cabinet for overhead crane systems according to claim 1, characterized in that, The chassis section is a box body, which can be formed by combining multiple beams into a frame and adding multiple cover plates to form the box body.

6. The semiconductor processing equipment cabinet for overhead crane systems according to claim 1, characterized in that, The bottom part is a box-shaped structure, which can be formed by combining multiple beams into a frame and then adding multiple cover plates to form the box-shaped structure.

7. The semiconductor processing equipment cabinet for overhead crane systems according to claim 1, characterized in that, The chassis section extends into the middle layer section.

8. The semiconductor processing equipment cabinet for overhead crane systems according to claim 7, characterized in that, The chassis includes a first layer structure and a second layer structure. The first layer structure is attached to the middle layer and partially protrudes above the mounting platform. The second layer structure is connected to the lower part of the first layer structure and is located on the front side of the middle layer.

9. The semiconductor processing equipment cabinet for overhead crane systems according to claim 7, characterized in that, The chassis section is composed of multiple beams.

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