Multi-channel chip semi-automatic test fixture

Abstract

The utility model discloses a multichannel chip semi-automatic test fixture, which comprises a fixture lower mounting table, a plurality of sliding rod and sliding sleeve assemblies fixed on the fixture lower mounting table, and an upper fixture table, a chip device supporting table and a lower fixture table which are sequentially sleeved on the sliding rod and sliding sleeve assemblies from top to bottom, the test controller is arranged on the clamp lower mounting table and electrically connected with the upper clamp table and the lower clamp table, the chip device objective table is arranged in the chip device supporting table and carries a chip device to be tested, the lower portions of the first longitudinal movement actuators are fixed to the clamp lower mounting table, and the tops of the first longitudinal movement actuators are connected with the side edge of the upper clamp table. The lower parts of the second longitudinal movement actuators are fixed on the clamp lower mounting table, and the tops of the second longitudinal movement actuators are connected with the side edge of the lower clamp table; the first longitudinal movement actuator pulls the upper clamp table, and the second longitudinal movement actuator drives the lower clamp table to get close to the chip device supporting table and is electrically connected with a to-be-tested chip device of the chip device objective table.

Description

Technical Field

[0001] This utility model relates to the field of chip device testing technology, and in particular to a multi-channel chip semi-automatic test fixture. Background Technology

[0002] This technology is mainly used for testing multi-channel chips. Currently, the traditional method of chip device testing involves first mounting the chip device under test on a PCB board or fixture and then making electrical connections. This process of mounting and dismounting the chip device is relatively complex and has low testing efficiency.

[0003] Therefore, there is an urgent need to propose a multi-channel chip semi-automatic test fixture that is simple in structure, easy to install, and reliable. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this utility model is to provide a semi-automatic testing fixture for multi-channel chips. The technical solution adopted by this utility model is as follows:

[0005] A multi-channel semi-automatic chip test fixture for clamping a chip device under test includes a lower mounting platform, several sliding rod and sleeve assemblies fixed on the lower mounting platform, an upper clamping platform, a chip device support platform, and a lower clamping platform sequentially mounted on the sliding rod and sleeve assemblies from top to bottom, a test controller disposed on the lower mounting platform and electrically connected to the upper and lower clamping platforms, a chip device carrying platform disposed within the chip device support platform and for mounting the chip device under test, a pair of first longitudinal motion actuators fixed at the lower mounting platform and connected at the top to the side of the upper clamping platform, and a pair of second longitudinal motion actuators fixed at the lower mounting platform and connected at the top to the side of the lower clamping platform; the chip device support platform is fixedly connected to the sliding rod and sleeve assemblies; the first longitudinal motion actuators pull the upper clamping platform, and the second longitudinal motion actuators drive the lower clamping platform closer to the chip device support platform and electrically connect it to the chip device under test on the chip device carrying platform.

[0006] Furthermore, the lower fixture platform is provided with a first connector, a first control signal interface, and a first radio frequency signal interface; the first control signal interface is electrically connected to the first connector and the test controller; the first radio frequency signal interface is electrically connected to the first connector and the test controller; and the first connector is electrically connected to the lower part of the chip device under test.

[0007] Furthermore, the upper fixture platform is provided with a second connector, a second control signal interface, and a second radio frequency signal interface; the second control signal interface is electrically connected to the second connector and the test controller; the second radio frequency signal interface is electrically connected to the second connector and the test controller; and the second connector is electrically connected to the upper part of the chip device under test.

[0008] Furthermore, the chip device stage includes a download stage sleeved on the chip device support stage, a mounting groove formed on the download stage, and a stage cover plate covering the download stage; the chip device to be tested is placed in the mounting groove and covered by the stage cover plate; the stage cover plate is U-shaped.

[0009] Furthermore, the slide rod and slide sleeve assembly includes a slide rod fixed on the lower mounting platform of the fixture, and a first slide sleeve and a second slide sleeve slidably sleeved on the slide rod; the first slide sleeve is placed inside the upper fixture platform, and the second slide sleeve is placed inside the lower fixture platform.

[0010] Furthermore, the lower part of the fixture mounting platform is provided with several lower shock-absorbing rubber seats.

[0011] Furthermore, a handle is provided on the side of the lower mounting platform of the fixture.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) This utility model ensures the reliability of the installation of the chip device under test by setting up a chip device support platform and a chip device carrier platform.

[0014] (2) This utility model sets up a lower fixture stage, an upper fixture stage, a first longitudinal movement actuator and a second longitudinal movement actuator. The first longitudinal movement actuator pulls the upper fixture stage and the second longitudinal movement actuator drives the lower fixture stage to move closer to the chip device support stage and electrically connects with the chip device under test on the chip device carrier stage, so as to achieve rapid electrical connection and improve the efficiency of testing.

[0015] (3) By setting up a sliding sleeve assembly, two first longitudinal movement actuators and two second longitudinal movement actuators, this utility model ensures the reliability of movement of the lower fixture table and the upper fixture table.

[0016] In summary, this utility model has the advantages of simple structure and convenient and reliable installation, and has high practical and promotional value in the field of chip device testing technology. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a structural schematic diagram of the present invention from a first angle.

[0019] Figure 2 This is a structural schematic diagram of the present invention from a second angle.

[0020] Figure 3 This is a structural schematic diagram of the present invention from a third angle.

[0021] Figure 4 This is a schematic diagram of the structure of the present invention, which removes the upper clamping table.

[0022] Figure 5 This is a schematic diagram of the structure of this utility model without the upper clamping table and the lower clamping table.

[0023] Figure 6 This is a schematic diagram of the chip device support platform and chip device stage from the first angle in this utility model.

[0024] Figure 7 This is a schematic diagram of the chip device support platform and chip device stage from a second angle in this utility model.

[0025] Figure 8 This is a schematic diagram of the chip device stage in this utility model.

[0026] In the above figures, the component names corresponding to the reference numerals are as follows:

[0027] 100. Chip under test; 1. Lower mounting stage of the fixture; 2. Test controller; 3. Lower fixture stage; 4. Chip device support stage; 5. Upper fixture stage; 6. First longitudinal movement actuator; 7. Second longitudinal movement actuator; 8. Chip device stage; 9. Slide rod and sleeve assembly; 31. First connector; 32. First control signal interface; 33. First radio frequency signal interface; 51. Second connector; 52. Second control signal interface; 53. Second radio frequency signal interface; 81. Lower stage; 82. Mounting slot; 83. Stage cover plate; 91. Slide rod; 92. First sleeve; 93. Second sleeve; 101. Lower shock-absorbing rubber seat; 102. Handle. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0029] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0030] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0031] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0032] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0033] like Figures 1 to 8 As shown, this embodiment provides a multi-channel semi-automatic chip test fixture for clamping a chip device 100 under test. The multi-channel semi-automatic chip test fixture includes a lower mounting platform 1, several sliding rod and sleeve assemblies 9 fixed on the lower mounting platform 1, an upper clamping platform 5, a chip device support platform 4, and a lower clamping platform 3 sequentially mounted on the sliding rod and sleeve assemblies 9 from top to bottom, a test controller 2 mounted on the lower mounting platform 1 and electrically connected to the upper clamping platform 5 and the lower clamping platform 3, a chip device carrying platform 8 mounted inside the chip device support platform 4 and supporting the chip device 100 under test, a pair of first longitudinal movement actuators 6 fixed at the lower mounting platform 1 and connected to the side of the upper clamping platform 5 at the top, and a pair of second longitudinal movement actuators 7 fixed at the lower mounting platform 1 and connected to the side of the lower clamping platform 3 at the top. The chip device support platform 4 is fixedly connected to the sliding rod and sleeve assemblies 9. Here, the first longitudinal motion actuator 6 pulls the upper clamping platform 5, and the second longitudinal motion actuator 7 drives the lower clamping platform 3 to move closer to the chip device support platform 4, and electrically connects it with the chip device under test 100 on the chip device carrier platform 8. When the chip device under test 100 is being loaded, it is manually installed in the chip device carrier platform 8 and inserted into the chip device support platform 4 for testing. In addition, in this embodiment, several lower shock-absorbing rubber seats 101 and handles 102 are provided at the lower part of the clamping lower mounting platform 1.

[0034] In this embodiment, to ensure the reliable movement of the upper clamping platform 5 and the lower clamping platform 3, four sliding rod and sleeve assemblies 9 are used for sliding guidance. Each sliding rod and sleeve assembly 9 includes a sliding rod 91 fixed to the lower mounting platform 1 of the clamp, and a first sleeve 92 and a second sleeve 93 slidably sleeved on the sliding rod 91. The first sleeve 92 is located within the upper clamping platform 5, and the second sleeve 93 is located within the lower clamping platform 3.

[0035] In this embodiment, a first connector 31, a first control signal interface 32, and a first radio frequency (RF) signal interface 33 are provided on the lower fixture stage 3. The first control signal interface 32 is electrically connected to the first connector 31 and the test controller 2, and the first RF signal interface 33 is also electrically connected to both the first connector 31 and the test controller 2. The first connector 31 is electrically connected to the lower part of the chip device under test (DUT) 100. Additionally, a second connector 51, a second control signal interface 52, and a second RF signal interface 53 are provided on the upper fixture stage 5. The second control signal interface 52 is electrically connected to both the second connector 51 and the test controller 2, and the second RF signal interface 53 is also electrically connected to both the second connector 51 and the test controller 2. The second connector 51 is electrically connected to the upper part of the DUT 100. In this embodiment, the first RF signal interface 33 and the second RF signal interface 53 are used to receive RF signals, and the first control signal interface 32 and the second control signal interface 52 are used to receive external control signals.

[0036] In this embodiment, the chip device under test 100 is manually mounted on the chip device stage 8. The chip device stage 8 includes a loading stage 81 fitted onto the chip device support stage 4, a mounting slot 82 formed on the loading stage 81, and a stage cover 83 covering the loading stage 81. The chip device under test 100 is placed within the mounting slot 82 and covered by the stage cover 83. Here, the stage cover 83 is U-shaped.

[0037] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. A multi-channel semi-automatic chip test fixture for clamping a chip device (100) under test, characterized in that, The device includes a lower mounting platform (1), several sliding rod sleeve assemblies (9) fixed on the lower mounting platform (1), an upper clamping platform (5), a chip device support platform (4) and a lower clamping platform (3) sequentially mounted on the sliding rod sleeve assemblies (9) from top to bottom, a test controller (2) set on the lower mounting platform (1) and electrically connected to the upper clamping platform (5) and the lower clamping platform (3), a chip device carrier platform (8) set inside the chip device support platform (4) and for mounting the chip device (100) under test, and a lower part fixed on the lower mounting platform (1) and a top part fixed to the lower mounting platform (1). A pair of first longitudinal movement actuators (6) are connected to the side of the upper fixture stage (5), and a pair of second longitudinal movement actuators (7) are fixed at the bottom on the lower fixture mounting stage (1) and connected at the top to the side of the lower fixture stage (3); the chip device support stage (4) is fixedly connected to the slide rod sleeve assembly (9); the first longitudinal movement actuators (6) pull the upper fixture stage (5), and the second longitudinal movement actuators (7) drive the lower fixture stage (3) to move closer to the chip device support stage (4) and electrically connect to the chip device (100) under test on the chip device carrier stage (8).

2. The multi-channel chip semi-automatic test fixture according to claim 1, characterized in that, The lower fixture stage (3) is provided with a first connector (31), a first control signal interface (32) and a first radio frequency signal interface (33); the first control signal interface (32) is electrically connected to the first connector (31) and the test controller (2); the first radio frequency signal interface (33) is electrically connected to the first connector (31) and the test controller (2); the first connector (31) is electrically connected to the lower part of the chip device under test (100).

3. The multi-channel chip semi-automatic test fixture according to claim 1, characterized in that, The upper fixture stage (5) is provided with a second connector (51), a second control signal interface (52), and a second radio frequency signal interface (53); the second control signal interface (52) is electrically connected to the second connector (51) and the test controller (2); the second radio frequency signal interface (53) is electrically connected to the second connector (51) and the test controller (2); the second connector (51) is electrically connected to the upper part of the chip device under test (100).

4. A semi-automatic multi-channel chip test fixture according to claim 1, 2, or 3, characterized in that, The chip device stage (8) includes a download stage (81) sleeved on the chip device support stage (4), a mounting groove (82) opened on the download stage (81), and a stage cover plate (83) covering the download stage (81); the chip device to be tested (100) is placed in the mounting groove (82) and covered by the stage cover plate (83); the stage cover plate (83) is U-shaped.

5. A semi-automatic multi-channel chip test fixture according to claim 1, 2, or 3, characterized in that, The slide rod and sleeve assembly (9) includes a slide rod (91) fixed on the lower mounting platform (1) of the fixture, a first sleeve (92) and a second sleeve (93) slidably sleeved on the slide rod (91); the first sleeve (92) is placed in the upper fixture platform (5), and the second sleeve (93) is placed in the lower fixture platform (3).

6. A semi-automatic multi-channel chip test fixture according to claim 1, 2, or 3, characterized in that, The lower part of the fixture mounting platform (1) is provided with several lower shock-absorbing rubber seats (101).

7. A multi-channel chip semi-automatic test fixture according to claim 1, 2, or 3, characterized in that, The lower mounting platform (1) of the fixture is provided with a handle (102) on its side.

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