Crimping mechanism and testing device

By configuring a counterweight module and a guide rod guide hole structure on the indenter module, the problem of poor contact caused by the offset of the center of gravity of the indenter module is solved, thereby realizing the reliability and pressure control of the crimping test and improving the test accuracy.

CN224203268UActive Publication Date: 2026-05-05SUZHOU HUAXING YUANCHUANG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUZHOU HUAXING YUANCHUANG TECH CO LTD
Filing Date
2025-05-26
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

In the existing technology, during the crimping test of the display module, the crimping head module is prone to poor contact due to the center of gravity shift, and the test pressure is not easy to control, which affects the test results.

Method used

By configuring a detachable counterweight module on the indenter module, the center of gravity position is adjusted, and the cooperation between the guide rod and the guide hole ensures good contact between the indenter module and the product under test and control of the test pressure.

Benefits of technology

This improves the reliability and accuracy of electrical crimping test results for display modules, meeting various testing requirements.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a crimping mechanism and a testing device, the crimping mechanism comprises a rack, a pressure head module and at least one counterweight module, the rack is provided with a carrier, and the carrier is provided with a bearing position for bearing a to-be-tested product; the pressure head module is movably arranged on the rack and directly faces the bearing position, and the pressure head module can move in the direction close to or away from the bearing position; the counterweight module is detachably arranged on the pressure head module, and the counterweight module is located on the side, away from the carrier, of the pressure head module. According to the crimping mechanism provided by the invention, different numbers of counterweight modules are configured on the pressure head module, so that the gravity center position of the pressure head module is adjusted, good contact between the pressure head module and the to-be-tested product is ensured, and the reliability of an electrical crimping test result of the to-be-tested product is improved; the test pressure applied to the surface of the to-be-tested product by the pressure head module can be controlled so as to meet different test requirements of the to-be-tested product.
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Description

Technical Field

[0001] This application relates to the field of electronic component testing technology, and in particular to a crimping mechanism and testing device. Background Technology

[0002] In the fields of electronic components and digital products, products need to be tested before packaging to check whether their functions are normal. For example, when testing a display module, a pressure head module is used to press the display module onto the testing machine to electrically connect the display module to the testing machine, and then power-on and signal tests are performed on the display module.

[0003] Currently, in the crimping test of display modules, the display module is placed on a test platform, and a pressure head module presses down and applies crimping force to the surface of the display module to perform the crimping test. Because the pressure head module is usually eccentrically mounted on the frame, when the pressure head module presses down and comes into contact with the display module, the center of gravity shifts, leading to poor contact between the pressure head module and the test section of the display module. This severely affects the crimping test results, and the test pressure applied by the pressure head module to the display module is difficult to control. Utility Model Content

[0004] Therefore, it is necessary to provide a crimping mechanism and testing device to address the problems of poor contact between the existing pressure head module and the testing section of the display module, and the difficulty in controlling the testing pressure applied to the display module.

[0005] A crimping mechanism, the crimping mechanism comprising:

[0006] A frame, wherein the frame is equipped with a carrier, and the carrier has a bearing position for carrying the product to be tested;

[0007] A pressure head module is movably mounted on the frame and faces the bearing position. The pressure head module can move towards or away from the bearing position.

[0008] At least one counterweight module is detachably disposed on the pressure head module and located on the side of the pressure head module opposite to the vehicle.

[0009] In one embodiment, there are multiple counterweight modules, which are spaced apart along the circumferential direction of the pressure head module.

[0010] In one embodiment, the counterweight module includes a counterweight frame and a plurality of counterweights, the counterweight frame being detachably mounted on the pressure head module, and the plurality of counterweights being detachably mounted on the counterweight frame.

[0011] In one embodiment, the pressing mechanism further includes a guide plate disposed on the frame and having guide holes;

[0012] The pressure head module includes a pressure head and a guide rod disposed on the pressure head, the guide rod being movably inserted into the guide hole.

[0013] In one embodiment, the guide hole is a tapered hole;

[0014] The guide rod includes a connecting part and a mating part. One end of the connecting part is connected to the pressure head, and the mating part is located at the end of the connecting part away from the pressure head. The mating part has a tapered surface that mates with the guide hole. During the movement of the guide rod, the mating part can enter or exit the guide hole.

[0015] In one embodiment, the pressure head module is provided with a plurality of positioning pins, the plurality of positioning pins being spaced apart along the circumferential direction of the pressure head module, and the carrier having a plurality of positioning holes, the plurality of positioning holes corresponding to the plurality of positioning pins, and being spaced apart along the circumferential direction of the carrier;

[0016] When the pressure head module moves toward the bearing position, the positioning pin can be inserted into the positioning hole.

[0017] In one embodiment, the crimping mechanism further includes a signal transmission element. The crimping head module is provided with a conductive copper foil, which is electrically connected to the signal transmission element. When the crimping head module moves toward the bearing position, the conductive copper foil can electrically abut against the product under test.

[0018] In one embodiment, the conductive copper foil is any one of a circle, a square, or a cross shape.

[0019] In one embodiment, the pressure head module is provided with an adsorption plate, which has a plurality of adsorption holes, and the adsorption plate can adsorb the product to be tested when the pressure head module moves toward the bearing position.

[0020] A testing apparatus, the testing apparatus comprising:

[0021] The crimping mechanism as described in any of the above technical solutions.

[0022] The aforementioned crimping mechanism and testing device allow the crimping head module to move towards the bearing position and crimp onto the product under test for electrical crimping testing. After the crimping test is completed, the crimping head module moves away from the bearing position, separating from the product under test for easy replacement. The crimping mechanism provided in this application, by configuring different numbers of counterweight modules on the crimping head module, adjusts the center of gravity of the crimping head module, ensuring good contact between the crimping head module and the product under test, thus improving the reliability of the electrical crimping test results. Furthermore, by increasing or decreasing the number of counterweight modules on the crimping head module, the test pressure applied to the surface of the product under test by the crimping head module can be controlled to meet different testing requirements. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the crimping mechanism provided in some embodiments.

[0024] Figure 2 This is a top view of the crimping mechanism provided in some embodiments in the separated state.

[0025] Figure 3 for Figure 2 Sectional view along the AA direction.

[0026] Figure 4 for Figure 3 A magnified view of a portion of region B in the middle.

[0027] Figure 5 This is a schematic diagram of the crimping mechanism provided in some embodiments in the pressed state.

[0028] Figure 6 for Figure 5 Sectional view along the CC direction.

[0029] Figure 7 for Figure 6 A magnified view of a portion of region D.

[0030] Figure 8 This is an exploded view of the pressure head module, guide plate, and signal transmission component modules provided in some embodiments.

[0031] Figure 9 This is a bottom view of the pressure head module provided in some embodiments.

[0032] Figure 10 This is a schematic diagram of the pressure head module provided in some embodiments.

[0033] Figure label:

[0034] 100. Crimping mechanism;

[0035] 110. Frame; 111. Carrier; 1111. Bearing position; 1112. Positioning hole; 120. Pressure head module; 121. Pressure head; 122. Guide rod; 1221. Connecting part; 1222. Mating part; 123. Positioning pin; 124. Conductive copper foil; 1241. Guide strip; 125. Adsorption plate; 1251. Adsorption hole; 130. Counterweight module; 131. Counterweight frame; 132. Counterweight; 140. Guide plate; 141. Guide hole; 150. Signal transmission component; 160. Drive module;

[0036] 200. Product to be tested. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] The technical solutions provided by the embodiments of this application are described below with reference to the accompanying drawings.

[0044] See Figure 1 As shown, this application provides a crimping mechanism 100, which includes a frame 110, a crimping head module 120, and at least one counterweight module 130. The crimping mechanism 100 is used to perform electrical crimping tests on a product under test 200 to test the electrical performance of the product under test 200. In this embodiment, the product under test 200 can be an electronic component such as a display module or a chip. This application does not limit the specific component type of the product under test 200.

[0045] The frame 110 is provided with a carrier 111, which is installed on the frame 110 by means of screwing, snap-fit, or other methods. The carrier 111 has a bearing position 1111 for bearing the product to be tested 200. Preferably, the bearing position 1111 is integrally formed on the carrier 111 by means of injection molding, extrusion, or other methods to simplify the forming method of the bearing position 1111 on the carrier 111. For example, the bearing position 1111 is a contoured cavity to accommodate the bearing and placement of the product to be tested 200 and to ensure the stability of the product to be tested 200 placed on the bearing position 1111.

[0046] The pressure head module 120 is movably mounted on the frame 110, and the pressure head module 120 is directly opposite the bearing position 1111. If the pressure head module 120 is located... Figure 1 Above the bearing position 1111 shown. The pressure head module 120 can move toward or away from the bearing position 1111. For example, the pressure head module 120 moves toward the bearing position 1111 and can press against the product under test 200 to perform an electrical pressing test on the product under test 200. After the pressing test of the product under test 200 is completed, the pressure head module 120 moves away from the bearing position 1111 and separates from the product under test 200, which facilitates the replacement operation of the product under test 200.

[0047] The counterweight module 130 is detachably mounted on the indenter module 120, and the counterweight module 130 is located on the side of the indenter module 120 away from the carrier 111. Since the indenter module 120 is usually eccentrically connected to the frame 110, the center of gravity of the indenter module 120 will deviate. Based on this, by configuring different numbers of counterweight modules 130 on the indenter module 120 and adaptively adjusting the position of the counterweight modules 130, the center of gravity of the indenter module 120 can be adjusted to ensure good contact between the indenter module 120 and the product under test 200, thereby improving the reliability of the electrical crimping test results of the product under test 200. Furthermore, by increasing or decreasing the counterweight modules 130 configured on the indenter module 120, the test pressure applied by the indenter module 120 to the surface of the product under test 200 can be controlled to meet the different test requirements of the product under test 200.

[0048] In one embodiment, see Figure 1As shown, there are multiple counterweight modules 130, which are spaced apart along the circumferential direction of the pressure head module 120. Through the proper arrangement of these counterweight modules 130, the center of gravity of the pressure head module 120 can be balanced to its central position, ensuring good contact between the pressure head module 120 and the product under test 200, and improving the reliability of the electrical crimping test results of the product under test 200. For example, there may be four counterweight modules 130, each positioned at one of the four opposite corners of the pressure head module 120; or two counterweight modules 130 may be positioned on opposite sides of the pressure head module 120. Of course, in other feasible embodiments, the number of counterweight modules 130 can also be different, and specific settings can be made according to the above embodiments, which will not be elaborated further here.

[0049] Further, see Figure 1 As shown, the counterweight module 130 includes a counterweight frame 131 and multiple counterweights 132. The counterweight frame 131 is detachably mounted on the pressure head module 120. For example, the counterweight frame 131 is mounted on the pressure head module 120 by means of screws, snap-fits, etc. By attaching and detaching the counterweight frame 131 from the pressure head module 120, the center of gravity position of the pressure head module 120 can be adjusted. The multiple counterweights 132 are detachably mounted on the counterweight frame 131. For example, the counterweights 132 are mounted on the counterweight frame 131 by means of sleeves, snap-fits, etc. By increasing or decreasing the counterweight module 130 configured in the pressure head module 120, the test pressure applied by the pressure head module 120 to the surface of the product under test 200 can be controlled to meet the different test requirements of the product under test 200.

[0050] Continue reading Figures 2-8 As shown, in one embodiment, the pressing mechanism 100 further includes a guide plate 140, which is disposed on the frame 110 and has a guide hole 141. Preferably, the guide hole 141 is integrally formed on the guide plate 140 by injection molding, extrusion, or other methods to simplify the forming method of opening the guide hole 141 on the guide plate 140. The pressing head module 120 includes a pressing head 121 and a guide rod 122, which is movably inserted into the guide hole 141. Exemplarily, the guide rod 122 is movably inserted into the guide hole 141 along its extension direction. When the guide rod 122 moves within the guide hole 141 along its extension direction, it can limit the movement path of the pressing head 121. Thus, through the cooperation structure of the guide rod 122 and the guide hole 141, the movement path of the pressing head 121 is limited to ensure the path accuracy of the pressing head module 120 during the pressing process and improve the testing accuracy of the pressing head module 120 on the pressed product 200.

[0051] Further, see Figure 1 , Figure 3 , Figure 4 , Figure 6 , Figure 7 and Figure 8 As shown, the guide hole 141 is a tapered hole. The guide rod 122 includes a connecting part 1221 and a mating part 1222. One end of the connecting part 1221 is connected to the pressure head 121, and the mating part 1222 is located at the end of the connecting part 1221 away from the pressure head 121. Preferably, the connecting part 1221 and the mating part 1222 are integrally formed by injection molding, extrusion, or other methods to simplify the molding process of the guide rod 122 and improve the structural strength of the guide rod 122. The two opposite ends of the connecting part 1221 are respectively provided with the pressure head 121 and the mating part 1222. The mating part 1222 has a tapered surface that mates with the guide hole 141. During the movement of the guide rod 122, the mating part 1222 can enter or exit the guide hole 141. Since the guide hole 141 is a tapered hole and the mating part 1222 has a tapered surface that mates with the guide hole 141, on the one hand, referring to Figures 2-4 As shown, when the mating part 1222 enters the guide hole 141, the mating part 1222 and the guide hole 141 are tightly fitted. The guide hole 141 limits the mating part 1222 to prevent the guide rod 122 from having an adverse effect of misalignment due to shaking during the pressing process; on the other hand, refer to Figures 5-7 As shown, when the mating part 1222 exits the guide hole 141, the mating part 1222 and the guide hole 141 are in clearance fit, and the guide rod 122 can move in the guide hole 141 so that the pressure head 121 is floatingly set on the guide plate 140. During the pressing process, the pressure head 121 can adaptively adjust the pressing position with the product under test 200, thereby improving the pressing head 121's pressing test accuracy for the product under test 200.

[0052] Furthermore, see Figure 1 , Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the guide plate 140 faces the bearing position 1111, and the guide plate 140 is spaced apart on the side of the pressure head 121 away from the carrier 111. For example, see [reference needed]. Figure 1 As shown, the guide plate 140 is located Figure 1 Above the bearing position 1111 shown. The guide hole 141 gradually widens in the direction away from the pressure head 121, that is to say, see... Figure 4 and Figure 7 As shown, the guide hole 141 has a hole structure that is smaller at the bottom and larger at the top. The guide hole 141 has a guide slope. The guide hole 141 can guide the mating part 1222 to move towards the product to be tested 200. That is, the guide hole 141 can guide the pressure head 121 to move towards the bearing position 1111. The guide hole 141 will not hinder the movement of the mating part 1222 into the guide hole 141, so as to ensure the smoothness of the guide rod 122 during the movement.

[0053] The aforementioned crimping mechanism 100, see reference. Figures 2-4 As shown, when the pressure head module 120 moves towards the bearing position 1111, the guide hole 141 guides the mating part 1222 to move and slide into the guide hole 141. The outer contour of the mating part 1222 fits against the guide hole 141, and the guide hole 141 limits the guide rod 122 to ensure the alignment accuracy between the guide rod 122 and the product 200 to be tested. Furthermore, see... Figures 5-7 As shown, when the pressure head 121 presses against the surface of the product under test 200, if there is a deviation in the pressing position between the pressure head 121 and the product under test 200, the pressure head 121 pushes up the guide rod 122 in the opposite direction, and the mating part 1222 moves in the direction of exiting the guide hole 141. The guide rod 122 and the guide hole 141 are in clearance fit, and the guide rod 122 can move in the guide hole 141. The pressure head 121 floats relative to the guide plate 140 to adaptively adjust the pressing position with the product under test 200, thereby improving the pressing test accuracy of the pressure head 121 for the product under test 200.

[0054] In one embodiment, see Figure 1 , Figure 4 , Figure 7 and Figure 8 As shown, there are multiple guide holes 141, which are spaced apart along the circumferential direction of the guide plate 140. There are also multiple guide rods 122, each corresponding to a different guide hole 141, and these guide rods are spaced apart along the circumferential direction of the pressure head 121. For example, there are four guide holes 141, located at the four opposite corners of the guide plate 140. Similarly, there are four guide rods 122, each located at one of the four opposite corners of the pressure head 121, and each inserted into one of the four guide holes 141. Thus, the movement of the pressure head 121 can be guided by the movement of the multiple guide rods 122 within the multiple guide holes 141, and the synchronous movement of the multiple guide rods 122 within the multiple guide holes 141 improves the stability of the pressure head 121 during movement.

[0055] It should be noted that the number of guide rods 122 and guide holes 141 is not limited to the four provided above, and may be other numbers. This application does not limit the specific number of guide rods 122 and guide holes 141.

[0056] In one embodiment, see Figure 1 , Figure 3 and Figure 6As shown, the pressure head module 120 is provided with a plurality of positioning pins 123, which are spaced apart along the circumferential direction of the pressure head module 120. The carrier 111 has a plurality of positioning holes 1112, which correspond to the plurality of positioning pins 123, and are spaced apart along the circumferential direction of the carrier 111. For example, there are four positioning pins 123, which are respectively located at the four opposite corners of the pressure head module 120, and there are also four positioning holes 1112, which are respectively located at the four opposite corners of the carrier 111, and correspond to the four positioning pins 123. It should be noted that the number of positioning pins 123 and positioning holes 1112 is not limited to the four provided above, and can also be other numbers. This application does not limit the specific number of positioning pins 123 and positioning holes 1112.

[0057] When the pressure head module 120 moves toward the bearing position 1111, the positioning pin 123 can be inserted into the positioning hole 1112. Thus, when the pressure head module 120 moves toward the bearing position 1111, the cooperation between the positioning pin 123 and the positioning hole 1112 improves the positioning accuracy of the pressure head module 120 and the product under test 200 during the pressing test. Furthermore, the insertion and cooperation between multiple positioning pins 123 and multiple positioning holes 1112 not only improves the positioning accuracy of the pressure head module 120 and the product under test 200, but also enhances the stability of the pressure head module 120 during movement.

[0058] Typically, the indenter module 120 is provided with conductive adhesive or conductive cloth. When the indenter module 120 abuts against the product under test 200, the poor surface flatness of the conductive adhesive or conductive cloth results in poor signal conduction between the indenter module 120 and the product under test 200 during the crimping process. Based on this, in one embodiment, see... Figure 1 , Figure 8 and Figure 9 As shown, the crimping mechanism 100 also includes a signal transmission component 150. The crimping head module 120 is provided with a conductive copper foil 124, which is electrically connected to the signal transmission component 150. For example, the conductive copper foil 124 is electrically connected to the signal transmission component 150 via a wire, and when the crimping head module 120 moves towards the bearing position 1111, the conductive copper foil 124 can electrically abut against the product under test 200. Due to the good flatness of the conductive copper foil 124, the contact performance between the conductive copper foil 124 and the test section of the product under test 200 is good when the crimping head module 120 crimps against the product under test 200. The conductive copper foil 124 can transmit the test signal of the product under test 200 to the signal transmission component 150 relatively completely, and the signal transmission component 150 feeds the test signal back to the terminal for analysis to obtain the electrical test performance of the product under test 200.

[0059] In this embodiment, the signal transmission component 150 can be a PCBA (Printed Circuit Board Assembly), FPC (Flexible Printed Circuit), etc. This application does not limit the specific component type of the signal transmission component 150.

[0060] Furthermore, see Figure 1 , Figure 9 and Figure 10 As shown, the conductive copper foil 124 forms the test area. The conductive copper foil 124 is provided with multiple guide strips 1241, which are arrayed on the conductive copper foil 124. When the pressure head module 120 moves towards the bearing position 1111, the multiple guide strips 1241 press down as a whole and conduct electricity to the test end of the product under test 200, transmitting the test signal of the product under test 200 to the signal transmission device 150 to obtain the electrical test performance of the product under test 200.

[0061] The test area composed of conductive copper foil 124 can be circular, square, cross-shaped, etc. For example, multiple guide strips 1241 are distributed at intervals and form test areas of different shapes. This application does not limit the specific shape of the test area composed of conductive copper foil 124, and it can be adapted to the shape of the test end of the product under test 200.

[0062] Further, see Figure 1 As shown, the pressure head module 120 is provided with foam inside, so that when the pressure head module 120 comes into contact with the product under test 200, the foam can buffer the instantaneous contact force between the pressure head module 120 and the product under test 200, and protect the pressure head module 120 and the product under test 200.

[0063] In one embodiment, see Figure 1 As shown, the crimping mechanism 100 also includes a drive module 160, which is connected to the crimping head module 120. The drive module 160 is used to drive the crimping head module 120 to move toward or away from the bearing position 1111, so as to enable the crimping head module 120 to perform crimping test on the product 200 under test at the bearing position 1111.

[0064] In this embodiment, the drive module 160 can be a drive motor, a drive cylinder, etc. This application does not limit the specific component type of the drive module 160.

[0065] Further, see Figure 1 and Figure 10As shown, the pressure head module 120 is equipped with an adsorption plate 125, which has multiple adsorption holes 1251. When the pressure head module 120 moves towards the bearing position 1111, the adsorption plate 125 can adsorb onto the product under test 200. That is, the negative pressure of the adsorption holes 1251 adsorbs the pressure head module 120 onto the product under test 200, ensuring a tight fit between the pressure head module 120 and the product under test 200, and improving the testing stability and accuracy of the product under test 200. Exemplarily, the adsorption plate 125 has a negative pressure chamber, and the multiple adsorption holes 1251 are all connected to the negative pressure chamber. A vacuum pump is connected to the outside of the negative pressure chamber. The vacuum pump extracts gas from the negative pressure chamber, changing the environment inside the negative pressure chamber to a negative pressure environment. A sealing structure, such as a sealing ring, is provided at the connection between the vacuum pump and the negative pressure chamber to ensure that the negative pressure environment does not fail due to external gas entering the negative pressure chamber during the process of the vacuum pump extracting gas from the negative pressure chamber. Furthermore, as the pressure head module 120 moves toward the product under test 200, and the pressure head module 120 moves to a position near the product under test 200, the negative pressure environment inside the negative pressure chamber, and multiple adsorption holes 1251 are all connected to the negative pressure chamber, adsorb onto the surface of the product under test 200 through the multiple adsorption holes 1251, so as to ensure a tight fit between the pressure head module 120 and the product under test 200, and improve the testing stability and accuracy of the product under test 200.

[0066] Additionally, see Figure 1 As shown, this application also provides a testing apparatus, which includes a crimping mechanism 100 as described in any of the above technical solutions. The testing apparatus performs an electrical crimping test on the product under test 200 to test the electrical performance of the product under test 200.

[0067] In the aforementioned testing apparatus, the pressure head module 120 moves towards the bearing position 1111 and can press against the product under test 200 to perform an electrical crimp test on the product under test 200. After the crimp test on the product under test 200 is completed, the pressure head module 120 moves away from the bearing position 1111, separating from the product under test 200, facilitating the replacement of the product under test 200. The testing apparatus provided in this application, by configuring different numbers of counterweight modules 130 on the pressure head module 120, adjusts the center of gravity position of the pressure head module 120, ensuring good contact between the pressure head module 120 and the product under test 200, improving the reliability of the electrical crimp test results of the product under test 200. Furthermore, by increasing or decreasing the number of counterweight modules 130 configured on the pressure head module 120, the test pressure applied by the pressure head module 120 to the surface of the product under test 200 can be controlled to meet different testing requirements of the product under test 200.

[0068] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A crimping mechanism, characterized in that, The crimping mechanism includes: A frame, wherein the frame is equipped with a carrier, and the carrier has a bearing position for carrying the product to be tested; A pressure head module is movably mounted on the frame and faces the bearing position. The pressure head module can move towards or away from the bearing position. At least one counterweight module is detachably disposed on the pressure head module and located on the side of the pressure head module opposite to the vehicle.

2. The crimping mechanism according to claim 1, characterized in that, There are multiple counterweight modules, and the multiple counterweight modules are spaced apart along the circumferential direction of the pressure head module.

3. The crimping mechanism according to any one of claims 1 or 2, characterized in that, The counterweight module includes a counterweight frame and multiple counterweights. The counterweight frame is detachably mounted on the pressure head module, and the multiple counterweights are detachably mounted on the counterweight frame.

4. The crimping mechanism according to claim 1, characterized in that, The pressing mechanism further includes a guide plate, which is disposed on the frame and has guide holes; The pressure head module includes a pressure head and a guide rod disposed on the pressure head, the guide rod being movably inserted into the guide hole.

5. The crimping mechanism according to claim 4, characterized in that, The guide hole is a tapered hole; The guide rod includes a connecting part and a mating part. One end of the connecting part is connected to the pressure head, and the mating part is located at the end of the connecting part away from the pressure head. The mating part has a tapered surface that mates with the guide hole. During the movement of the guide rod, the mating part can enter or exit the guide hole.

6. The crimping mechanism according to claim 1, characterized in that, The pressure head module is provided with a plurality of positioning pins, which are spaced apart along the circumferential direction of the pressure head module. The carrier is provided with a plurality of positioning holes, which correspond to the plurality of positioning pins and are spaced apart along the circumferential direction of the carrier. When the pressure head module moves toward the bearing position, the positioning pin can be inserted into the positioning hole.

7. The crimping mechanism according to claim 1, characterized in that, The crimping mechanism also includes a signal transmission component. The crimping head module is provided with a conductive copper foil. The conductive copper foil is electrically connected to the signal transmission component, and when the crimping head module moves toward the bearing position, the conductive copper foil can electrically abut against the product to be tested.

8. The crimping mechanism according to claim 7, characterized in that, The conductive copper foil can be any one of a circle, a square, or a cross shape.

9. The crimping mechanism according to claim 1, characterized in that, The pressure head module is equipped with an adsorption plate with multiple adsorption holes. When the pressure head module moves toward the bearing position, the adsorption plate can adsorb onto the product to be tested.

10. A testing apparatus, characterized in that, The testing apparatus includes: The crimping mechanism as described in any one of claims 1-9.