Chip aging detection test bench

Abstract

The utility model discloses a chip aging detection test bed, which comprises a test bed body and a backup plate arranged at the rear side of the upper end of the test bed body, when the chip aging detection test bed is used, chips of different models are firstly placed in the placing grooves in the first placing plate, the second placing plate and the third placing plate, then the first placing plate and the second placing plate are inserted into the insertion holes in the upper ends of the second placing plate and the third placing plate through the insertion columns respectively, and when the insertion columns enter the insertion holes, the first placing plate and the second placing plate are inserted into the insertion holes. When a chip is placed in the heating device, elastic protrusions on the outer sides of the inserting columns can be clamped into clamping holes in a second placing plate and a third placing plate, so that the first placing plate, the second placing plate and the third placing plate are connected together, then the first placing plate is placed at the upper end of a supporting plate, and the chip is placed in the heating device; through the arrangement of the first placing plate, the second placing plate, the third placing plate and the placing groove, the detection of the chip aging detection test bench on a plurality of chips of different models is enhanced.

Description

Technical Field

[0001] This utility model belongs to the field of chip testing technology, specifically relating to a chip aging test bench. Background Technology

[0002] Chip aging test benches simulate extreme environments of high temperature, high humidity, and high pressure to accelerate chip aging tests, evaluating their performance and durability after prolonged use. This testing method can quickly identify potential defects in chips, providing important evidence for quality control during product development and production. Existing chip aging test benches are mainly composed of components such as support pads, support columns, test bench body, back plate, LCD screen, control buttons, cabinet door, cover, connecting plate, heating tube, connecting column, mounting plate, heating device, and partition. Existing chip aging test benches can generally only test a single type of chip, so a single chip aging test bench is essential. Utility Model Content

[0003] The purpose of this invention is to provide a chip aging test bench to solve the problem mentioned in the background art that existing chip aging test benches can generally only test a single type of chip.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a chip aging test bench, comprising...

[0005] The experimental table body and the backing plate located at the upper rear side of the experimental table body;

[0006] An LCD screen is provided at the front of the backrest, and control buttons are provided at the front of the backrest and on the left and right sides of the LCD screen.

[0007] A partition is installed inside the experimental platform body, a heating device is installed at the upper end of the partition, a cover is connected to the upper end of the heating device and located inside the experimental platform body, and a heating tube is installed inside the heating device.

[0008] A support plate is installed on the inner side of the heating device, a third placement plate is placed at the upper end of the support plate, a second placement plate is placed above the third placement plate, and a first placement plate is placed above the second placement plate.

[0009] The first, second, and third placement plates are provided with placement grooves at their upper inner positions, and sensors are installed at the bottom of the placement grooves. Handles are provided at the upper end of the first placement plate and on the left and right sides of the placement grooves.

[0010] The first and second placement plates are connected to the four corners at the bottom. The second and third placement plates are provided with insertion holes inside the upper end and outside the insertion holes. The second and third placement plates are provided with locking holes on the left and right sides. The locking holes are provided with elastic protrusions inside the locking holes and outside the insertion holes.

[0011] The experimental table body is provided with a cabinet door at the front, and the heating device is electrically connected to an external power source.

[0012] The arrangement of the first placement plate, the second placement plate, the third placement plate, and the placement slot enhances the chip aging test bench's ability to test multiple chips of different models. The placement of the posts, holes, elastic protrusions, and locking holes enhances the stability of the connection between the first placement plate, the second placement plate, and the third placement plate, as well as the ease of disassembly.

[0013] An installation groove is provided inside the insertion post, and a spring is installed inside the installation groove. The spring and the elastic protrusion are connected by adhesive bonding.

[0014] A connecting plate is provided at the bottom of the heating device, and a connecting column is provided at the upper end of the connecting plate and at the lower end of the support plate. The connecting column is fixedly connected to the support plate and the connecting plate by welding. The connection column and the support plate enhance the stability of the first placement plate.

[0015] A mounting plate is connected to the lower end of the heating device and at the upper end of the partition. Mounting holes are provided inside the mounting plate and at the four corners of the mounting plate.

[0016] A connecting hole is provided inside the upper end of the partition plate at a position corresponding to the mounting hole, and internal threads are provided on the inner wall of the mounting hole and the connecting hole.

[0017] A fastening nut is installed inside the mounting hole and the connecting hole at the upper end of the mounting plate, and the outer wall of the fastening nut is provided with an external thread.

[0018] The fastening nut connects to the mounting hole and the internal thread of the connecting hole via the external thread on the outer wall, thereby fixing the mounting plate to the upper end of the partition and thus fixing the heating device to the upper end of the partition. The installation and disassembly of the heating device are enhanced by the mounting plate, mounting hole, connecting hole and fastening nut.

[0019] Support columns are welded at the four corners of the lower end of the experimental platform body, and support pads are fitted at the lower ends of the support columns.

[0020] The support column is made of stainless steel, and the support pad is made of rubber. The support column and support pad enhance the stability of the chip aging test bench.

[0021] Compared with the prior art, the present invention provides a chip aging test bench, which has the following beneficial effects:

[0022] This invention improves a chip aging test bench. When using the chip aging test bench, chips of different models are first placed into placement slots inside the first, second, and third placement plates. Then, the first and second placement plates are inserted into insertion holes at their upper ends via inserts. When the inserts enter the insertion holes, elastic protrusions on the outer sides of the inserts engage with locking holes inside the second and third placement plates, thus connecting the first, second, and third placement plates together. Finally, the first placement plate is placed on top of a support plate, allowing the chips to be placed inside the heating device. Next, the cover is closed, and the heating device is connected to an external power source. The heating device is then activated via the control button. The heating wire inside the heating tube heats up when energized, causing the heating tube to heat up and consequently the interior of the heating device to heat up. Based on the temperature feedback from the sensor, the chip is tested at different temperatures. The setup of the first placement board, second placement board, third placement board, and placement slot enhances the chip aging test bench's ability to test multiple chips of different models. The placement of the posts, holes, elastic protrusions, and locking holes enhances the stability of the connection between the first, second, and third placement boards and the ease of disassembly. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the chip aging test bench of this utility model.

[0024] Figure 2 This is a structural schematic diagram of the internal front view of the chip aging test bench of this utility model.

[0025] Figure 3 This is an enlarged structural diagram of the first, second, and third placement plates of the chip aging test bench of this utility model.

[0026] Figure 4 This is a schematic diagram showing the disassembled structure of the first placement plate, the second placement plate, and the third placement plate of the chip aging test bench of this utility model.

[0027] In the diagram: 1. Support pad; 2. Support column; 3. Experimental table body; 4. Backrest; 5. LCD screen; 6. Control button; 7. Lid; 8. Cabinet door; 9. First placement plate; 10. Second placement plate; 11. Third placement plate; 12. Connecting plate; 13. Heating tube; 14. Connecting column; 15. Mounting plate; 16. Heating device; 17. Partition; 18. Support plate; 19. Elastic protrusion; 20. Sensor; 21. Placement slot; 22. Handle; 23. Insertion column; 24. Locking hole; 25. Insertion hole. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] This utility model provides, for example Figure 1-4The chip aging test bench shown includes a test bench body 3 and a backing plate 4 located at the upper rear side of the test bench body 3; a liquid crystal display screen 5 is provided at the front of the backing plate 4, and control buttons 6 are provided at the left and right sides of the liquid crystal display screen 5 at the front of the backing plate 4; a partition 17 is installed inside the test bench body 3, a heating device 16 is installed at the upper end of the partition 17, a cover 7 is connected to the upper end of the heating device 16 and located inside the test bench body 3, and a heating tube 13 is installed inside the heating device 16; a support plate 18 is installed inside the heating device 16, a third placement plate 11 is placed at the upper end of the support plate 18, a second placement plate 10 is placed above the third placement plate 11, and a first placement plate 9 is placed above the second placement plate 10; placement grooves 21 are provided at the upper interior of the first placement plate 9, the second placement plate 10, and the third placement plate 11, and the bottom of the placement grooves 21 are... A sensor 20 is installed. A handle 22 is provided at the upper end of the first placement plate 9, located on the left and right sides of the placement slot 21. Insert pins 23 are connected to the four corners at the lower ends of the first placement plate 9 and the second placement plate 10. Insertion holes 25 are provided inside the upper end of the second placement plate 10 and the third placement plate 11, located outside the insert pins 23. Locking holes 24 are provided on the left and right sides of the second placement plate 10 and the third placement plate 11. Springs are provided inside the locking holes 24, located outside the insert pins 23. The test bench body 3 has a cabinet door 8 at the front and a heating device 16 that is electrically connected to an external power source. The setup of the first placement plate 9, the second placement plate 10, the third placement plate 11 and the placement slot 21 enhances the chip aging test bench's ability to test multiple chips of different models. The setup of the insertion post 23, the insertion hole 25, the elastic protrusion 19 and the locking hole 24 enhances the stability of the connection between the first placement plate 9, the second placement plate 10 and the third placement plate 11 and the ease of disassembly.

[0030] like Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, to enhance the testing of multiple chips of different models using the chip aging test bench, different models of chips are first placed into the placement slots 21 inside the first placement plate 9, the second placement plate 10, and the third placement plate 11. Then, the first placement plate 9 and the second placement plate 10 are inserted into the insertion holes 25 inside the upper ends of the second placement plate 10 and the third placement plate 11 respectively via the insertion pins 23. When the insertion pins 23 enter the insertion holes 25, the elastic protrusions 19 on the outer side of the insertion pins 23 will engage with the locking holes 24 inside the second placement plate 10 and the third placement plate 11, thus connecting the first placement plate 9, the second placement plate 10, and the third placement plate 11 together. Finally, the first placement plate 9 is placed on the upper end of the support plate 18, so that the chips are placed in the support plate. Inside the heating device 16, the cover 7 is then placed on top, and the heating device 16 is connected to an external power source. The heating device 16 is then activated via the control button 6. The heating wire inside the heating tube 13 becomes hot after being energized, causing the heating tube 13 to heat up, which in turn causes the interior of the heating device 16 to heat up. The chip is then tested at different temperatures based on the temperature feedback from the sensor 20. The arrangement of the first placement plate 9, the second placement plate 10, the third placement plate 11, and the placement slot 21 enhances the chip aging test bench's ability to test multiple chips of different models. The arrangement of the insertion post 23, the insertion hole 25, the elastic protrusion 19, and the locking hole 24 enhances the stability of the connection between the first placement plate 9, the second placement plate 10, and the third placement plate 11 and the ease of disassembly.

[0031] An installation groove is provided inside the insertion post 23, and a spring is installed inside the installation groove. The spring and the elastic protrusion 19 are connected by adhesive bonding. A connecting plate 12 is provided at the bottom of the heating device 16. A connecting post 14 is provided at the upper end of the connecting plate 12 and at the lower end of the support plate 18. The connecting post 14 is fixedly connected to the support plate 18 and the connecting plate 12 by welding. The connection post 14 and the support plate 18 enhance the stability of the first placement plate 9.

[0032] like Figure 2 As shown, in order to enhance the stability of the first placement plate 9, when using the chip aging test bench, the connecting post 14 is first fixedly connected to the support plate 18 and the connecting plate 12 by welding. Then, the connecting plate 12 is placed at the bottom inside the heating device 16, so that the support plate 18 is placed inside the heating device 16. Next, the first placement plate 9 is placed on the upper end of the support plate 18, so that the chip is placed inside the heating device 16. The stability of the first placement plate 9 is enhanced by the setting of the connecting post 14 and the support plate 18.

[0033] A mounting plate 15 is connected to the lower end of the heating device 16 and the upper end of the partition 17. Mounting holes are provided inside the mounting plate 15 and at its four corners. Connecting holes are provided inside the upper end of the partition 17 and at positions corresponding to the mounting holes. Internal threads are provided on the inner walls of the mounting holes and connecting holes. Fastening nuts are installed inside the mounting holes and connecting holes and at the upper end of the mounting plate 15. External threads are provided on the outer walls of the fastening nuts. The fastening nuts are connected to the internal threads on the inner walls of the mounting holes and connecting holes through the external threads on the outer walls, thereby fixing the mounting plate 15 to the upper end of the partition 17, and thus fixing the heating device 16 to the upper end of the partition 17. The installation of the mounting plate 15, mounting holes, connecting holes, and fastening nuts enhances the ease of installation and disassembly of the heating device 16.

[0034] like Figure 2 As shown, to enhance the ease of installation and disassembly of the heating device 16, when using the chip aging test bench, the heating device 16 is first connected to the mounting plate 15. Then, the heating device 16 is placed on the upper end of the partition 17 via the mounting plate 15, so that the mounting hole inside the mounting plate 15 is aligned with the connecting hole inside the upper end of the partition 17. Next, the fastening nut is inserted into the mounting hole and the connecting hole. The fastening nut is connected to the internal thread of the mounting hole and the connecting hole through the external thread of the outer wall, thereby fixing the mounting plate 15 on the upper end of the partition 17, and thus fixing the heating device 16 on the upper end of the partition 17. The installation and disassembly of the heating device 16 are enhanced by the arrangement of the mounting plate 15, the mounting hole, the connecting hole, and the fastening nut.

[0035] Support columns 2 are welded at the four corners of the lower end of the experimental platform body 3. Support pads 1 are fitted at the lower end of the support columns 2. The support columns 2 are made of stainless steel and the support pads 1 are made of rubber. The support columns 2 and support pads 1 enhance the stability of the chip aging test platform.

[0036] like Figure 1 and Figure 2 As shown, in order to enhance the stability of the chip aging test bench, when using the chip aging test bench, firstly, the support pad 1 is fitted onto the bottom of the support column 2, then the support column 2 is welded to the four corners at the bottom of the test bench body 3, and then the chip aging test bench is placed in contact with the ground through the support pad 1, so that the chip aging test bench is placed on the ground through the support column 2. The setting of the support column 2 and the support pad 1 enhances the stability of the chip aging test bench.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A chip aging test bench, characterized in that: include The experimental table body (3) and the backing plate (4) located at the upper rear side of the experimental table body (3); A liquid crystal display screen (5) is provided at the front of the back plate (4), and control buttons (6) are provided at the front of the back plate (4) and on the left and right sides of the liquid crystal display screen (5). A partition (17) is installed inside the experimental platform body (3). A heating device (16) is installed at the upper end of the partition (17). A cover (7) is connected to the upper end of the heating device (16) and located inside the experimental platform body (3). A heating tube (13) is installed inside the heating device (16). A support plate (18) is installed on the inner side of the heating device (16), a third placement plate (11) is placed at the upper end of the support plate (18), a second placement plate (10) is provided above the third placement plate (11), and a first placement plate (9) is provided above the second placement plate (10). The first placement plate (9), the second placement plate (10) and the third placement plate (11) are provided with placement grooves (21) at the upper inner positions. A sensor (20) is installed at the bottom of the placement groove (21). A handle (22) is provided at the upper end of the first placement plate (9) and at the left and right sides of the placement groove (21). Insert pins (23) are connected to the four corners at the lower end of the first placement plate (9) and the second placement plate (10). Insert holes (25) are provided inside the upper end of the second placement plate (10) and the third placement plate (11) and outside the insert pins (23). Locking holes (24) are provided on the left and right sides of the second placement plate (10) and the third placement plate (11). Elastic protrusions (19) are provided inside the locking holes (24) and outside the insert pins (23). The experimental table body (3) is provided with a cabinet door (8) at the front, and the heating device (16) is electrically connected to an external power source. The arrangement of the first placement plate (9), the second placement plate (10), the third placement plate (11) and the placement slot (21) enhances the ability of the chip aging test bench to test multiple chips of different models. The arrangement of the insert (23), the socket (25), the elastic protrusion (19) and the card hole (24) enhances the stability of the connection between the first placement plate (9), the second placement plate (10) and the third placement plate (11) and the ease of disassembly.

2. The chip aging test bench according to claim 1, characterized in that: An installation groove is provided inside the insertion post (23), and a spring is installed inside the installation groove. The spring and the elastic protrusion (19) are connected by adhesive bonding.

3. The chip aging test bench according to claim 1, characterized in that: A connecting plate (12) is provided at the bottom of the heating device (16). A connecting column (14) is provided at the upper end of the connecting plate (12) and at the lower end of the support plate (18). The connecting column (14) is fixedly connected to the support plate (18) and the connecting plate (12) by welding. The stability of the first placement plate (9) is enhanced by the setting of the connecting column (14) and the support plate (18).

4. The chip aging test bench according to claim 3, characterized in that: A mounting plate (15) is connected to the lower end of the heating device (16) and the upper end of the partition plate (17). Mounting holes are provided inside the mounting plate (15) and at the four corners of the mounting plate (15).

5. The chip aging test bench according to claim 4, characterized in that: A connecting hole is provided inside the upper end of the partition (17) at a position corresponding to the mounting hole, and an internal thread is provided on the inner wall of the mounting hole and the connecting hole.

6. The chip aging test bench according to claim 5, characterized in that: A fastening nut is installed inside the mounting hole and the connecting hole and at the upper end of the mounting plate (15), and an external thread is provided on the outer wall of the fastening nut.

7. The chip aging test bench according to claim 6, characterized in that: The fastening nut is connected to the mounting hole and the inner thread of the connecting hole through the external thread of the outer wall, so that the mounting plate (15) is fixed at the upper end of the partition (17), and the heating device (16) is fixed at the upper end of the partition (17). The installation and disassembly of the heating device (16) are enhanced by the setting of the mounting plate (15), the mounting hole, the connecting hole and the fastening nut.

8. The chip aging test bench according to claim 3, characterized in that: Support columns (2) are welded at the four corners of the lower end of the experimental platform body (3), and support pads (1) are sleeved at the lower end of the support columns (2).

9. A chip aging test bench according to claim 8, characterized in that: The support column (2) is made of stainless steel and the support pad (1) is made of rubber. The stability of the chip aging test bench is enhanced by the setting of the support column (2) and the support pad (1).

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