Chip independent temperature control system

Abstract

The utility model relates to the technical field of chip testing, in particular to an independent temperature control system for a chip. The chip independent temperature control system comprises a heating assembly, the heating assembly comprises at least one circuit board, at least two heaters and at least two temperature sensors, any heater is used for bearing a corresponding to-be-detected chip, and any temperature sensor is arranged on the heater and used for detecting the temperature of the corresponding heater; any heater and any temperature sensor are electrically connected with the corresponding circuit board; and any circuit board is set to adjust the heating power of the corresponding heater according to the temperature of any heater connected with the circuit board. The system can independently adjust and control the test temperatures of different chips to be tested, so that the temperatures of the different chips to be tested are kept consistent, and the accuracy of a test result is prevented from being influenced by the temperature difference between the different chips to be tested.

Description

Technical Field

[0001] This application relates to the field of chip testing technology, and more specifically, to a chip independent temperature control system. Background Technology

[0002] With the rapid development of the semiconductor industry, improved chip performance is often accompanied by higher power consumption and heat generation. Especially during chip-level batch aging tests, maintaining a stable test environment temperature becomes particularly important for chips with high thermal loads.

[0003] However, most existing temperature testing systems for chips or wafers are designed for low-load chip products. In these application scenarios, the heat generated by the chip or wafer during the entire testing process is relatively small, and the temperature difference between chips is relatively easy to control. An integrated temperature control system can meet the requirements.

[0004] When dealing with high-power, heat-generating chips, existing integrated temperature control solutions fall short in terms of heat dissipation capacity and precise temperature control of individual chips. The lack of an effective single-chip temperature regulation mechanism can lead to significant temperature variations, which not only affects the consistency and accuracy of test results but may also damage the chip due to overheating, reducing the quality and yield of the test screening. Utility Model Content

[0005] This application provides at least one chip independent temperature control system, which can independently adjust and control the test temperature of different chips under test, so as to keep the temperature of different chips under test consistent and avoid the accuracy of test results being affected by temperature differences between different chips under test.

[0006] This application provides a chip-independent temperature control system, including: a heating assembly, the heating assembly including at least one circuit board, at least two heaters and at least two temperature sensors, each heater being used to carry a corresponding chip under test, each temperature sensor being disposed on the heater for detecting the temperature of the corresponding heater, each heater and each temperature sensor being electrically connected to the corresponding circuit board; each circuit board being configured to adjust the heating power of the corresponding heater according to the temperature of the connected heater.

[0007] In one alternative embodiment, any two adjacent circuit boards are spaced apart, and at least two heaters corresponding to the same circuit board are spaced apart along the extension direction of the circuit board.

[0008] In one alternative embodiment, the temperature sensor is inserted into the corresponding heater.

[0009] In one alternative embodiment, the system further includes a cooling assembly comprising a cooling plate, wherein any of the heaters is attached to the surface of the cooling plate.

[0010] In one optional embodiment, the cooling plate is provided with a refrigerant channel, one end of which is provided with a medium inlet and the other end with a medium outlet, the flow rate of the medium is a preset flow rate value, and the temperature of the medium inlet is a preset temperature value.

[0011] In one alternative embodiment, the cooling plate has a groove on its surface facing the heating assembly, and any of the circuit boards is mounted in the groove.

[0012] In one alternative embodiment, the system further includes a positioning component, the positioning component including a positioning plate that covers a portion of the heating component, the positioning plate being provided with at least two positioning slots, and any one of the heaters being embedded in the corresponding positioning slot.

[0013] In one alternative implementation, the depth of the positioning groove is no greater than the height of the heater.

[0014] In one alternative embodiment, the system further includes a chip fixing assembly configured to fix each of the chips under test to a corresponding heater.

[0015] In one alternative embodiment, the heater is provided with a through hole;

[0016] The chip fixing assembly includes an air extraction pipe and a connector. The air extraction pipe is disposed inside the cooling plate and communicates with the through hole. The connector is disposed circumferentially on the cooling plate and communicates with the air extraction pipe. The connector is used to connect the air extraction pipe to a vacuum pumping device.

[0017] The above-mentioned technical solution of this application has the following beneficial technical effects:

[0018] The chip-independent temperature control system of this application embodiment comprises multiple independent temperature control units formed by a circuit board, heater, and temperature sensor. Each temperature control unit independently adjusts the heating power of each heater to regulate the heater temperature, thereby achieving independent adjustment of the test temperature of the corresponding chip under test. This balances the individual differences of different chips under test during testing, enabling diversified testing. Furthermore, independent temperature control not only offsets the heat generation changes caused by different chip characteristics, but more importantly, it maintains the temperature by adjusting the heater heating power through temperature feedback when the heat generation surges during chip power-on testing or when the heat generation drops sharply due to possible chip failure. This prevents temperature differences between chips under test from affecting water cooling and disrupting the temperature control system balance, thus affecting the accuracy of other chip test results and improving the accuracy of chip testing.

[0019] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this application and, together with the specification, serve to explain the technical solutions of this application. It should be understood that the following drawings only show some embodiments of this application and should not be considered as limiting the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 An exploded view of a chip-independent temperature control system provided in an embodiment of this application is shown;

[0022] Figure 2 It shows Figure 1 Assembly diagram of the provided chip-independent temperature control system;

[0023] Figure 3 It shows Figure 2 A cross-sectional view of the provided chip-independent temperature control system;

[0024] In the picture:

[0025] 1. Chip under test;

[0026] 100. Positioning component; 101. Positioning plate; 102. Positioning groove;

[0027] 200. Heating assembly; 201. Circuit board; 202. Heater; 2021. Through hole; 203. Temperature sensor;

[0028] 300. Cooling assembly; 301. Cooling plate; 302. Refrigerant channel; 303. Medium inlet; 304. Medium outlet; 305. Groove; 306. First through hole; 307. Second through hole;

[0029] 400. Chip fixing assembly; 401. Air extraction pipe; 402. Connector; 403. Branch pipe. Detailed Implementation

[0030] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps set forth in these embodiments do not limit the scope of the present application.

[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0033] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0034] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] refer to Figures 1 to 3 This application provides a chip-independent temperature control system, including a heating assembly 200. The heating assembly 200 includes at least one circuit board 201, at least two heaters 202, and at least two temperature sensors 203. Each heater 202 is used to support a corresponding chip under test 1. Each temperature sensor 203 is disposed on a heater 202 to detect the temperature of the corresponding heater 202. Each heater 202 and each temperature sensor 203 are electrically connected to the corresponding circuit board 201. Each circuit board 201 is configured to adjust the heating power of the corresponding heater 202 according to the temperature of the connected heater 202. That is, each temperature sensor 203 can feed back the temperature information of the corresponding heater to the circuit board 201, so that the circuit board 201 can adjust the heating power of the corresponding heater 202 according to the internal PID adjustment setting rules, thereby realizing independent adjustment and control of the heating power of each heater 202. This embodiment exemplarily shows that the number of circuit boards 201 is three, the number of heaters 202 is forty-two, and each circuit board 201 is electrically connected to fourteen heaters 202. In actual implementation, it is not limited to this.

[0036] This chip-independent temperature control system comprises multiple independent temperature control units, consisting of a circuit board 201, a heater 202, and a temperature sensor 203. Each temperature control unit independently adjusts the heating power of each heater 202 to regulate its temperature, thereby independently regulating the test temperature of the corresponding chip under test (DUT). This balances individual differences among different DUTs during testing, enabling diverse testing. Furthermore, independent temperature control not only counteracts heat generation variations caused by different chip characteristics but, more importantly, maintains the temperature even during sudden increases in heat generation upon chip power-on testing or sudden decreases in heat generation due to potential chip failure. Temperature feedback allows for adjustment of the heater 202's heating power to maintain the temperature, preventing temperature differences between DUTs from affecting water cooling and disrupting the temperature control system's balance, thus improving the accuracy of other chip test results and enhancing overall chip testing accuracy.

[0037] In this embodiment, the circuit board 201 has opposing first and second sides, and each heater 202 is electrically connected to the second side of the corresponding circuit board 201. Specifically, a connecting line is provided on the side of the heater 202, and one end of the connecting line extends to the second side of the corresponding circuit board 201 for electrical connection. Of course, the connection position and connection structure between the circuit board 201 and the heater 202 can be selected according to the actual situation and are not limited to the methods discussed above.

[0038] In this embodiment, any two adjacent circuit boards 201 are spaced apart, and at least two heaters 202 corresponding to the same circuit board 201 are spaced apart along the extension direction of the circuit board 201. That is, each heater 202 can form an array of chip test positions. In a specific configuration, each circuit board 201 can have a row of heaters 202 on each of its two sides. Of course, the arrangement of the circuit boards 201 and heaters 202 can be selected according to the actual situation and is not limited to the methods discussed above.

[0039] In this embodiment, the heater 202 can be a custom ceramic heater (i.e., a ceramic plate with a built-in heating wire). When using a custom ceramic heater, the high-power chip can be placed directly above the heater, and the application of high thermal conductivity ceramics simultaneously meets the requirements for thermal conductivity, temperature control, and wear resistance. In practical applications, the custom ceramic heater can specifically be an aluminum nitride ceramic heater. The thermal conductivity of aluminum nitride ceramics is typically between 170-230 W / (m·K), ensuring rapid and uniform heat distribution throughout the heating area, avoiding localized overheating or cold spots. Furthermore, aluminum nitride ceramics also possess advantages such as high resistivity, good mechanical strength, wear and crack resistance, and chemical stability.

[0040] In this embodiment, the temperature sensor 203 can be inserted into the heater 202, or it can be sintered into the heater 202. Because the temperature sensor 203 is located inside the heater, it can more directly sense the actual temperature of the heating element, rather than indirectly obtaining data through heat conducted to the surface. Compared to surface mounting, internal mounting can reduce the influence of the external environment (such as airflow, humidity changes, etc.) on temperature measurement, providing more stable readings. In specific settings, the temperature sensor 203 can be a thermocouple. Thermocouples have a simple structure, small size, and fast response speed, enabling them to quickly reflect temperature changes.

[0041] In this embodiment, the system further includes a cooling assembly 300, which includes a cooling plate 301. Any heater 202 is attached to the surface of the cooling plate 301, and the cooling plate 301 is used to cool the heater 202 to reduce the temperature of the heater 202.

[0042] In this embodiment, a refrigerant channel 302 is provided in the cooling plate 301, through which a refrigerant medium passes to cool the heater 202. One end of the refrigerant channel 302 has a medium inlet 303 for the refrigerant medium to flow into it, and the other end has a medium outlet 304 for the refrigerant medium to flow out. The flow rate is a preset value, and the temperature of the medium inlet 303 is a preset temperature value. During use, by increasing or decreasing the flow rate and temperature of the medium, the cooling power of the cooling plate 301 can be changed, thereby adjusting the heat dissipation of the chip under test 1. Of course, in other embodiments, the cooling plate 301 can also employ other cooling methods, such as a thermoelectric cooler (TEC).

[0043] In this embodiment, a groove 305 is provided on the surface of the cooling plate 301 facing the heating assembly 200, and any circuit board 201 is installed in the groove 305. In a specific configuration, installing the circuit board 201 in the groove 305 can avoid interference between the circuit board 201 and the connection line of the heater 202 caused by the circuit board 201 protruding, thereby facilitating the connection between the circuit board 201 and the connection line of each heater 202.

[0044] In this embodiment, the system further includes a positioning component 100, which includes a positioning plate 101 that covers a portion of the heating component 200. The positioning plate 101 is provided with at least two positioning slots 102, and any heater 202 is embedded in the corresponding positioning slot 102. In practical use, the positioning slots 102 can be used to position the heaters 202 so that the user can place the chip under test 1 onto the corresponding heater 202.

[0045] In this embodiment, the positioning plate 101 and the cooling plate 301 are connected. In the connected state, the positioning plate 101 and the cooling plate 301 clamp the heating component 200 to fix it in place. This arrangement eliminates the need for a separate connection between the heating component 200 and the cooling plate 301, reducing the number of fasteners used, improving assembly efficiency, and allowing for quick assembly and disassembly of the heating component 200, facilitating maintenance and replacement. In a specific configuration, the positioning plate 101 and the cooling plate 301 can be fixed together using bolts. Of course, the connection method between the positioning plate 101 and the cooling plate 301 can be selected according to actual conditions and is not limited to the methods discussed above.

[0046] In this embodiment, the depth of the positioning groove 102 is not less than the height of the heater 202. That is, in the assembled state, the side of the heater 202 away from the cooling plate 301 can be flush with the side of the positioning plate 101 away from the cooling plate 301, or the side of the heater 202 away from the cooling plate 301 can protrude from the side of the positioning plate 101 away from the cooling plate 301.

[0047] In this embodiment, a limiting structure is provided on the inner wall of the positioning groove 102. This limiting structure physically restricts the heater 202, limiting the height at which the heater 202 is embedded within the positioning groove 102. For example, a step or flange can be provided on the inner wall of the positioning groove 102 to physically limit the height of the heater 202 embedded within the positioning groove 102. Alternatively, the height of the heater 202 within the positioning groove 102 can be limited by changing its inner diameter. This arrangement ensures that the height of each heater 202 remains consistent, thereby ensuring that the heat conduction path from each heating zone to the cooling plate 301 is the same, avoiding localized temperature differences.

[0048] In this embodiment, the system further includes a chip fixing component 400, which is configured to fix each chip under test 1 to its corresponding heater 202. This configuration ensures that the chip under test 1 is fixed to its corresponding heater 202, preventing the chip under test 1 from moving relative to the heater 202 and affecting the detection quality.

[0049] In this embodiment, the heater 202 is provided with a through hole 2021. The chip fixing assembly 400 includes a vacuum pipe 401 and a connector 402. The vacuum pipe 401 is disposed within the cooling plate 301 and communicates with the through hole 2021. The connector 402 is disposed circumferentially around the cooling plate 301 and communicates with the vacuum pipe 401. The connector 402 is used to connect the vacuum pipe 401 to a vacuuming device. In use, by vacuuming with the vacuuming device, a negative pressure can be formed at the through hole 2021, thereby adsorbing the chip under test 1 at that position. That is, the chip fixing assembly 400 can fix each chip under test 1 to its corresponding heater 202 by vacuuming. This arrangement not only ensures close contact between the chip and the heating block, but also reduces air gaps or impurities in between, thereby improving heat conduction efficiency. Furthermore, compared to using mechanical clamps, vacuum adsorption can avoid physical damage to the chip during clamping, and also helps to improve the chip assembly and disassembly efficiency. In addition, since the exhaust pipe 401 is located inside the cooling plate 301, the influence of the external environment (high temperature) on the pipe can be reduced, which helps to maintain the working performance of the chip fixing assembly 400.

[0050] In this embodiment, there are multiple exhaust pipes 401, and each exhaust pipe 401 is connected to multiple through holes 2021. For example, the number of exhaust pipes 401 is one-third of the number of heating modules, and each exhaust pipe 401 is connected to three through holes 2021.

[0051] In this embodiment, the surface of the cooling plate 301 facing the heating assembly 200 is provided with at least one first through hole 306, each first through hole 306 corresponding to a through hole 2021, and each first through hole 306 communicating with the corresponding through hole 2021. The exhaust pipe 401 is provided with at least one branch pipe 403, each branch pipe 403 communicating with a first through hole 306, so that the exhaust pipe 401 is connected to the corresponding through hole 2021. In a specific configuration, the exhaust pipe 401 is provided with three branch pipes 403, so that the exhaust pipe 401 can be connected to three through holes.

[0052] In this embodiment, at least one second through hole 307 is provided on the side of the cooling plate 301. Any suction pipe 401 is connected to a corresponding connector 402 through a second through hole 307. That is, the connector 402 of each suction pipe 401 can be located on the outside of the cooling plate 301, which facilitates the connection of the connector 402 to the suction equipment.

[0053] One or more embodiments in this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of one or more embodiments in this specification should be included within the protection scope of this application.

[0054] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A chip-independent temperature control system, characterized in that, include: A heating assembly includes at least one circuit board, at least two heaters, and at least two temperature sensors. Each heater is used to carry a corresponding chip under test, and each temperature sensor is disposed on the heater to detect the temperature of the corresponding heater. Each heater and each temperature sensor are electrically connected to the corresponding circuit board. Each of the circuit boards is configured to adjust the heating power of the corresponding heater according to the temperature of any of the connected heaters.

2. The chip-independent temperature control system according to claim 1, characterized in that, Any two adjacent circuit boards are spaced apart, and at least two heaters corresponding to the same circuit board are spaced apart along the extension direction of the circuit board.

3. The chip-independent temperature control system according to claim 1, characterized in that, The temperature sensor is inserted into the corresponding heater.

4. The chip-independent temperature control system according to claim 1, characterized in that, The system also includes a cooling assembly, which includes a cooling plate, and any of the heaters is attached to the surface of the cooling plate.

5. The chip-independent temperature control system according to claim 4, characterized in that, The cooling plate is provided with a refrigerant channel, one end of which is provided with a medium inlet and the other end with a medium outlet. The flow rate of the medium is a preset flow rate value, and the temperature of the medium inlet is a preset temperature value.

6. The chip-independent temperature control system according to claim 4, characterized in that, The cooling plate has a groove on its surface facing the heating component, and any of the circuit boards is mounted in the groove.

7. The chip-independent temperature control system according to claim 1, characterized in that, The system also includes a positioning component, which includes a positioning plate that covers a portion of the heating component. The positioning plate has at least two positioning slots, and any one of the heaters is embedded in the corresponding positioning slot.

8. The chip-independent temperature control system according to claim 7, characterized in that, The depth of the positioning groove is no greater than the height of the heater.

9. The chip-independent temperature control system according to claim 1, characterized in that, The system also includes a chip fixing assembly, which is configured to fix each of the chips under test to the corresponding heaters.

10. The chip-independent temperature control system according to claim 9, characterized in that, The heater is provided with a through hole; The chip fixing assembly includes an air extraction pipe and a connector. The air extraction pipe is disposed inside the cooling plate and communicates with the through hole. The connector is disposed circumferentially on the cooling plate and communicates with the air extraction pipe. The connector is used to connect the air extraction pipe to a vacuum pumping device.

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