High-yield chip burning equipment

Abstract

The utility model discloses high-yield chip burning equipment, which comprises a burning mechanism with a burning substrate, a three-axis driving component, a burning unit and a pickup unit, the three-axis driving component and the burning unit are respectively mounted on the upper surface of the burning substrate, and the pickup unit is mounted on the three-axis driving component and used for carrying chips into the burning unit. A substrate is arranged on the outer side of the burning substrate, a testing unit and a three-axis driving unit are installed on the substrate, at least two vacuum suction nozzles arranged at intervals are installed on a Z-axis movable block of the three-axis driving unit, and a horizontal carrying module is further installed on the upper surface of the substrate. One end of the horizontal carrying module is connected with the upper surface of the substrate, the other end of the horizontal carrying module extends to the position above the burning substrate and is connected with the burning substrate, and a material conveying carrying table is installed on a movable part of the horizontal carrying module. According to the high-yield chip burning equipment, the production efficiency can be improved, the yield in the whole burning process can be ensured, and the effectiveness of sampling inspection can be improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a high-yield chip programming device. Background Technology

[0002] Chip programming is the process of writing programs, parameters, and files into a microcontroller or ARM controller to achieve the functions and effects of electronic products. During programming, it is necessary to randomly inspect the programmed chips to check the accuracy of the programmed information. In existing technologies, chip inspection is done manually, which reduces the automation level of the entire chip programming process. Therefore, there is an urgent need for a chip programming device that can automatically perform random inspections to ensure the yield rate of chips and improve the randomness of chip inspection. Utility Model Content

[0003] The purpose of this invention is to provide a high-yield chip programming device that can improve production efficiency, ensure the yield rate throughout the programming process, and enhance the effectiveness of sampling inspection.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows: a high-yield chip programming device, comprising: a programming substrate, XY-axis drive components respectively mounted on the upper surface of the programming substrate, a programming unit, and a pickup unit mounted on the XY-axis drive components. The pickup unit is used to transport chips into the programming unit. A substrate is disposed on the outer side of the programming substrate. A test unit and a three-axis drive unit are respectively mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. The other end of the horizontal transport module, which is connected to the upper surface of the substrate, extends above the programming substrate and is connected to the programming substrate. A material transport platform is mounted on the movable part of the horizontal transport module, so that the material transport platform can move between the programming substrate and the substrate with the movable part of the horizontal transport module. The pickup unit is also used to transport chips in the programming unit to the material transport platform. The vacuum nozzles are used to transport chips to be tested on the material transport platform to the test unit.

[0005] The pickup unit, mounted on the XY-axis drive assembly via a bracket, further includes: a vertically arranged upright plate and at least two suction nozzles, each mounted on the upright plate. Each suction nozzle is mounted on a support base, and each support base is movably mounted on the surface of one side of the upright plate via at least one set of cooperating guide rails and sliders. At least two motors corresponding to the suction nozzles are arranged on the other side of the upright plate. A drive wheel mounted on the output shaft of the motor is connected to a driven wheel via a vertically extending synchronous belt. The support base of each suction nozzle is connected to the corresponding synchronous belt via an adapter block passing through the upright plate.

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the upper surface of the material handling platform is provided with at least two carrier slots for chip embedding.

[0008] 2. In the above scheme, there are four vacuum suction nozzles and four bearing grooves opened on the upper surface of the material conveying platform.

[0009] 3. In the above scheme, the vacuum nozzle is also used to transport the chip that has completed testing in the test unit to the material handling platform.

[0010] 4. In the above scheme, the upright plate is provided with at least two clearance holes that cooperate with the adapter block.

[0011] 5. In the above scheme, at least two of the motors are mounted on the upper end of the upright plate via a strip bracket.

[0012] 6. In the above scheme, each of the driven wheels is rotatably mounted on the lower end of the vertical plate and located directly below the corresponding driving wheel.

[0013] 7. In the above scheme, the other end of the adapter block, which is connected to the support base at one end, passes through the vertical plate and is connected to the synchronous belt through a pressure block.

[0014] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0015] This utility model relates to a high-yield chip programming device. On one side of the programming mechanism is a substrate. A testing unit and a three-axis drive unit are mounted on the substrate. At least two spaced vacuum nozzles are mounted on the Z-axis movable block of the three-axis drive unit. A horizontal transport module is also mounted on the upper surface of the substrate. One end of the horizontal transport module is connected to the upper surface of the substrate, and the other end extends above and connects to the programming substrate of the programming mechanism. A material transport platform is mounted on the movable part of the horizontal transport module, allowing the platform to move between the programming substrate and the substrate of the programming mechanism. The picking unit of the programming mechanism is used to transport chips from the programming unit to the material transport platform. The vacuum nozzles are used to transport chips to be tested from the material transport platform to the testing unit. This allows for random and automatic sampling and inspection of programmed chips at any time during the programming process without stopping the programming process. To improve production efficiency and ensure a high yield rate throughout the programming process, the pickup unit, mounted on the XY-axis drive assembly via a bracket, includes: a vertically arranged stand and at least two nozzles, each mounted on the stand. Each nozzle is mounted on a support base, and each support base is movably mounted on one side of the stand via at least one set of cooperating guide rails and sliders. At least two motors, corresponding to the nozzles, are located on the other side of the stand. A drive wheel mounted on the motor output shaft is connected to a driven wheel via a vertically extending synchronous belt. Each nozzle's support base is connected to the corresponding synchronous belt via an adapter block passing through the stand. By independently controlling the vertical movement of the nozzles, chips can be picked up one by one, enabling the pickup of chips from different programming units without interfering with other chips. This improves the randomness of chip sampling and further enhances the effectiveness of the sampling inspection. Attached Figure Description

[0016] Appendix Figure 1 This is a schematic diagram of the high-yield chip programming device of this utility model;

[0017] Appendix Figure 2 This is a schematic diagram of the test unit in the high-yield chip programming device of this utility model;

[0018] Appendix Figure 3 This is a partial structural schematic diagram of the high-yield chip programming device of this utility model;

[0019] Appendix Figure 4 This is a schematic diagram of the pickup unit in the high-yield chip programming device of this utility model;

[0020] Appendix Figure 5 This is an exploded view of the pickup unit in the high-yield chip programming device of this utility model;

[0021] Appendix Figure 6This is a partial structural diagram of the pickup unit in the high-yield chip programming device of this utility model.

[0022] In the attached diagrams: 101, programming substrate; 102, XY axis drive assembly; 103, pickup unit; 104, programming unit; 1, substrate; 2, testing unit; 3, three-axis drive unit; 31, Z-axis movable block; 4, vacuum nozzle; 5, horizontal transport module; 6, material transport platform; 61, bearing groove; 7, material box; 8, bracket; 9, upright plate; 10, nozzle; 11, support base; 121, guide rail; 122, slider; 13, motor; 141, drive wheel; 142, synchronous belt; 143, driven wheel; 15, adapter block; 16, strip bracket; 17, pressure block; Detailed Implementation

[0023] The present invention can be further understood through the specific embodiments given below, but they are not intended to limit the present invention.

[0024] Example 1: A high-yield chip programming device includes: a programming substrate 101, an XY-axis drive assembly 102 respectively mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the XY-axis drive assembly 102. The pickup unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is disposed on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also mounted on the upper surface of board 1. One end of the horizontal transport module 5 is connected to the upper surface of substrate 1, and the other end extends to the top of the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is mounted on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and substrate 1 with the movable part of the horizontal transport module 5. The pickup unit 103 is also used to transport the chip in the programming unit 104 to the material transport platform 6. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the test unit 2.

[0025] The pickup unit 103, mounted on the XY axis drive assembly 102 via a bracket 8, further includes: a vertically arranged upright plate 9 and at least two suction nozzles 10 each mounted on the upright plate 9. Each suction nozzle 10 is mounted on a support base 11. Each support base 11 is movably mounted on the surface of one side of the upright plate 9 via at least one set of mutually cooperating guide rails 121 and sliders 122. At least two motors 13, corresponding to the suction nozzles 10, are provided on the other side of the upright plate 9. A drive wheel 141 mounted on the output shaft of the motor 13 is connected to a driven wheel 143 via a vertically extending synchronous belt 142. The support base 11 of each suction nozzle 10 is connected to the corresponding synchronous belt 142 via an adapter block 15 passing through the upright plate 9.

[0026] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding; a material box 7 is installed on the upper surface of the aforementioned substrate 1, and the vacuum nozzle 4 is also used to transport the chips that have completed testing in the test unit 2 into the material box 7.

[0027] The aforementioned upright plate 9 has at least two clearance holes that cooperate with the adapter block 15; at least two of the aforementioned motors 13 are mounted on the upper end of the upright plate 9 via a strip bracket 16.

[0028] Each of the aforementioned driven wheels 143 is rotatably mounted on the lower end of the vertical plate 9 and located directly below the corresponding driving wheel 141.

[0029] The above-mentioned burning mechanism 100 has at least two burning units 104.

[0030] Example 2: A high-yield chip programming device, comprising: a programming substrate 101, an XY-axis drive assembly 102 respectively mounted on the upper surface of the programming substrate 101, a programming unit 104, and a pickup unit 103 mounted on the XY-axis drive assembly 102. The pickup unit 103 is used to transport the chip into the programming unit 104. A substrate 1 is disposed on the outer side of the programming substrate 101. A test unit 2 and a three-axis drive unit 3 are respectively mounted on the substrate 1. At least two spaced vacuum nozzles 4 are mounted on the Z-axis movable block 31 of the three-axis drive unit 3. A horizontal transport module 5 is also mounted on the upper surface of board 1. One end of the horizontal transport module 5 is connected to the upper surface of substrate 1, and the other end extends to the top of the programming substrate 101 and is connected to the programming substrate 101. A material transport platform 6 is mounted on the movable part of the horizontal transport module 5, so that the material transport platform 6 can move between the programming substrate 101 and substrate 1 with the movable part of the horizontal transport module 5. The pickup unit 103 is also used to transport the chip in the programming unit 104 to the material transport platform 6. The vacuum nozzle 4 is used to transport the chip to be tested on the material transport platform 6 to the test unit 2.

[0031] The pickup unit 103, mounted on the XY axis drive assembly 102 via a bracket 8, further includes: a vertically arranged upright plate 9 and at least two suction nozzles 10 each mounted on the upright plate 9. Each suction nozzle 10 is mounted on a support base 11. Each support base 11 is movably mounted on the surface of one side of the upright plate 9 via at least one set of mutually cooperating guide rails 121 and sliders 122. At least two motors 13, corresponding to the suction nozzles 10, are provided on the other side of the upright plate 9. A drive wheel 141 mounted on the output shaft of the motor 13 is connected to a driven wheel 143 via a vertically extending synchronous belt 142. The support base 11 of each suction nozzle 10 is connected to the corresponding synchronous belt 142 via an adapter block 15 passing through the upright plate 9.

[0032] The upper surface of the aforementioned material handling platform 6 is provided with at least two carrier slots 61 for chip embedding; the aforementioned vacuum nozzle 4 and the carrier slots 61 on the upper surface of the material handling platform 6 are each provided with four slots.

[0033] The aforementioned vacuum nozzle 4 is also used to transport the tested chips in the test unit 2 to the material handling platform 6.

[0034] The aforementioned upright plate 9 has at least two clearance holes that cooperate with the adapter block 15; the other end of the adapter block 15, which is connected to the support base 11 at one end, passes through the upright plate 9 and is connected to the synchronous belt 142 through a pressure block 17.

[0035] Of the surfaces of the pressure block 17 and the adapter block 15 that are respectively disposed on both sides of the synchronous belt 142 and in contact with the synchronous belt 142, at least one surface is configured as a toothed surface.

[0036] Under normal burning conditions:

[0037] The pick-up unit on the XY axis drive assembly sequentially transports the chips to be programmed from the tray or tape to the programming unit on the upper surface of the programming substrate for programming. After programming, the pick-up unit sequentially transports the programmed chips in the programming unit to the empty tray or tape for subsequent unloading operations.

[0038] The programming units mentioned above all fall within the existing basic scope, and the applicant's prior applications have provided specific technical solutions, which will not be repeated in this patent.

[0039] Importantly, during the chip programming process, a random inspection of the programmed chips is necessary to check the accuracy of the programmed information and prevent errors caused by human error, computer viruses, software mutations, or other factors. The specific process is as follows:

[0040] During the normal burning process, perform the following operations at regular intervals (e.g., every hour):

[0041] The horizontal transport module moves the material transport platform to the side of the programming unit. The pick-up unit on the XY axis drive component randomly selects the chip that has been programmed in the programming unit and transports it to the material transport platform.

[0042] In the aforementioned random sampling process, the XY-axis drive assembly drives the entire pickup unit to move horizontally, and then each nozzle moves vertically to independently pick up the chip being sampled. For example, when the pickup unit moves above a programming unit, it drives one nozzle to move vertically downward to pick up the chip in that programming unit. Then, it drives the pickup unit to move above another programming unit, and then another nozzle moves vertically downward to pick up the chip in that programming unit. This allows for the picking up of chips in different programming units without interfering with other chips, improving the randomness of chip sampling and further enhancing the effectiveness of the sampling.

[0043] The horizontal transport module then moves the transport platform carrying the programmed chip to above the substrate. Next, the vacuum nozzle driven by the three-axis drive unit moves the programmed chip on the transport platform to the test unit for testing. Based on the test results, the tested chip is moved to a specific location (such as a qualified product box, an NG product box, or a discharge tray). The test unit and test process described above are all within the scope of existing technology and will not be elaborated here.

[0044] When using the aforementioned high-yield chip programming equipment, it can perform random and automatic sampling inspections of programmed chips at any time during the programming process without stopping the programming operation. This improves production efficiency and ensures a high yield rate throughout the programming process. Furthermore, its pickup unit includes: a vertically arranged stand and at least two nozzles, each mounted on the stand. Each nozzle is mounted on a support base, and each support base is movably mounted on one side of the stand via at least one set of cooperating guide rails and sliders. At least two motors corresponding to the nozzles are arranged on the other side of the stand. A drive wheel mounted on the output shaft of each motor is connected to a driven wheel via a vertically extending synchronous belt. The support base of each nozzle is connected to the corresponding synchronous belt via an adapter block passing through the stand. By independently controlling the vertical movement of the nozzles, chips can be picked up one by one, thereby enabling the pickup of chips in different programming units without interfering with other chips, improving the randomness of chip sampling inspection, and further enhancing the effectiveness of the sampling inspection.

[0045] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high-yield chip programming device, comprising: The programmable substrate (101), an XY-axis drive assembly (102) mounted on the upper surface of the programmable substrate (101), a programming unit (104), and a pickup unit (103) mounted on the XY-axis drive assembly (102), wherein the pickup unit (103) is used to transport the chip into the programming unit (104), characterized in that: a substrate (1) is provided on the outer side of the programmable substrate (101), a test unit (2) and a three-axis drive unit (3) are respectively mounted on the substrate (1), and at least two spaced vacuum nozzles (4) are mounted on the Z-axis movable block (31) of the three-axis drive unit (3), and the upper surface of the substrate (1) is also A horizontal transport module (5) is installed, with one end connected to the upper surface of the substrate (1) and the other end extending above the programming substrate (101) and connected to the programming substrate (101). A material transport platform (6) is installed on the movable part of the horizontal transport module (5), so that the material transport platform (6) can move between the programming substrate (101) and the substrate (1) along with the movable part of the horizontal transport module (5). The pickup unit (103) is also used to transport the chip in the programming unit (104) to the material transport platform (6). The vacuum nozzle (4) is used to transport the chip to be tested on the material transport platform (6) to the test unit (2). The pickup unit (103) mounted on the XY axis drive assembly (102) via a bracket (8) further includes: a vertically arranged plate (9) and at least two suction nozzles (10) each mounted on the plate (9). Each suction nozzle (10) is mounted on a support base (11). Each support base (11) is movably mounted on the surface of one side of the plate (9) via at least one set of mutually cooperating guide rails (121) and sliders (122). At least two motors (13) corresponding to the suction nozzles (10) are provided on the other side of the plate (9). The drive wheel (141) mounted on the output shaft of the motor (13) is connected to a driven wheel (143) via a vertically extending synchronous belt (142). The support base (11) of each suction nozzle (10) is connected to the corresponding synchronous belt (142) via a transition block (15) passing through the plate (9).

2. The high-yield chip programming device according to claim 1, characterized in that: The upper surface of the material handling platform (6) is provided with at least two carrier slots (61) for chip embedding.

3. The high-yield chip programming device according to claim 2, characterized in that: The vacuum nozzle (4) and the bearing groove (61) opened on the upper surface of the material conveying platform (6) are both provided with 4.

4. The high-yield chip programming device according to claim 1, characterized in that: The vacuum nozzle (4) is also used to transport the chip that has been tested in the test unit (2) to the material handling platform (6).

5. The high-yield chip programming device according to claim 1, characterized in that: The upright plate (9) has at least two clearance holes that cooperate with the adapter block (15).

6. The high-yield chip programming device according to claim 1, characterized in that: At least two of the motors (13) are mounted on the upper end of the upright plate (9) via a strip bracket (16).

7. The high-yield chip programming device according to claim 6, characterized in that: Each of the driven wheels (143) is rotatably mounted on the lower end of the upright plate (9) and located directly below the corresponding driving wheel (141).

8. The high-yield chip programming device according to claim 1, characterized in that: The other end of the adapter block (15), which is connected to the support base (11) at one end, passes through the vertical plate (9) and is connected to the synchronous belt (142) through a pressure block (17).

Images