Laser packaging device for semiconductor
By adjusting the angle between the reflective surface and the inner wall of the cavity, and by using multiple laser source mechanisms and collimating lenses, the problem of ineffective laser alignment in laser packaging devices was solved, thus achieving controllable laser emission and efficient semiconductor packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ASPIN OPTOELECTRONICS TECHNOLOGY CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-05
AI Technical Summary
In existing laser packaging devices, the laser cannot be effectively aligned, and the reflection angle is fixed, resulting in poor packaging performance.
The angle between the reflective surface and the inner wall of the cavity is adjusted to a range of 30°-80° using an adjustment component. The laser emission direction is controlled by the cooperation of the laser chip and the reflective surface component. The packaging effect is improved by combining multiple laser source mechanisms and collimating lenses.
The laser packaging device achieves adjustable emission direction, improving the semiconductor packaging effect and enhancing packaging reliability and efficiency.
Smart Images
Figure CN224204579U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of laser packaging, and in particular to a laser packaging device for semiconductors. Background Technology
[0002] Currently, optoelectronic semiconductor devices such as LEDs and OLEDs are widely used in various aspects of life. They are characterized by high efficiency, low energy consumption, and long lifespan, and have broad commercial prospects.
[0003] The most common packaging method for optoelectronic semiconductors is to use laser heating to form a seal. A high-energy laser heats and softens a glass slurry, creating a hermetically sealed gap between the cover glass containing the slurry and the substrate glass of the device. The laser must penetrate the glass to heat and melt the slurry; however, in existing laser packaging technologies, the laser cannot be effectively aligned, and the reflection angle is fixed. Utility Model Content
[0004] To address the issue of semiconductor packaging effectiveness, this application provides a laser packaging apparatus for semiconductors.
[0005] The semiconductor laser packaging apparatus provided in this application adopts the following technical solution:
[0006] include:
[0007] Base;
[0008] The laser source mechanism is located inside the base;
[0009] The light window is located on the base and above the laser source mechanism;
[0010] The laser source mechanism includes a laser chip installed in the base, a reflector installed in the base, a lead wire running through the base, and an adjustment component for adjusting the angle of the reflector. One end of the lead wire is connected to an external device, and the other end is electrically connected to the laser chip. The laser chip has two emission sources, each of which emits laser light. The laser light is reflected by the reflector to the light window.
[0011] By adopting the above technical solution and adjusting the components, the angle between the reflective surface and the inner wall of the cavity can be maintained within the range of 30°-80°. This allows the laser emitted from the laser chip to be reflected by the reflective surface and emitted along the top of the laser packaging device, achieving top-out light. This controls the emission direction of the laser from the laser packaging device, facilitating better packaging and improving the packaging effect of the semiconductor.
[0012] In one possible implementation, there are multiple laser light source mechanisms, which are spaced apart along the width direction of the base.
[0013] In one possible implementation, the laser chip of any laser source mechanism is staggered from the adjacent reflector, such that the distance between two adjacent laser chips in the width direction of the base is equal.
[0014] In one possible implementation, the regulating component includes:
[0015] The motor is mounted at the bottom of the base;
[0016] The protective shell is fixedly installed inside the base;
[0017] The output shaft is rotatably housed within the protective casing, with one end connected to the output terminal of the motor.
[0018] The rotating shaft is housed within the protective casing.
[0019] The first bevel gear is fixedly mounted on the output shaft;
[0020] The second bevel gear is fixedly mounted on the rotating shaft;
[0021] The turntables are symmetrically and fixedly mounted on the rotating shaft.
[0022] The connecting rod is connected to the turntable at one end and hinged to the reflector at the other end;
[0023] The protective shell has an opening at one end, and the reflector is located inside the opening. Pins are fixed on both ends of the reflector, and one end of the pin is rotatably mounted on the end wall of the protective shell.
[0024] In one possible implementation, the regulating component further includes:
[0025] The first limiting rod is fixedly installed inside the protective shell;
[0026] The second limiting rod is fixed inside the protective shell.
[0027] In one possible implementation, a hook is provided on the end of the connecting rod away from the reflector, and a through hole is provided on the turntable for inserting the hook.
[0028] In one possible implementation, a guide block is provided on the connecting rod, and a guide groove that mates with the guide block is provided on the end wall of the protective shell.
[0029] In one possible implementation, the semiconductor laser packaging apparatus further includes a collimating lens disposed on the side of the optical window away from the base.
[0030] In one possible implementation, the collimating lens includes a lens body and multiple collimating units. The lens body is snapped onto an optical window, and the multiple collimating units are all disposed on the lens body. There are multiple laser source mechanisms, and each laser source mechanism corresponds to one collimating unit.
[0031] In one possible implementation, the laser packaging device for semiconductors further includes a frame, an optical window mounted in the frame, a retaining ring on the frame, and a slot on the base that mates with the retaining ring.
[0032] In summary, this application includes the following beneficial technical effects: By adjusting the components, the angle between the reflective surface and the inner wall of the accommodating cavity is maintained within the range of 30°-80°. This allows the laser emitted from the laser chip to be reflected by the reflective surface and emitted along the top of the laser packaging device, achieving top-out light emission. When the angle of the reflector needs to be adjusted, the drive motor rotates the output shaft, the first bevel gear rotates the second bevel gear, causing the rotating shaft to rotate the turntable. Simultaneously, the rotation of the turntable pulls the connecting rod, which in turn rotates the reflector, thereby adjusting the angle of the reflector and controlling the laser emission direction from the laser packaging device. This facilitates better packaging and improves the packaging effect of the semiconductor. Attached Figure Description
[0033] Figure 1 This is an overall schematic diagram based on an embodiment of this application;
[0034] Figure 2 This is a cross-sectional schematic diagram of an embodiment, mainly showing the laser source mechanism;
[0035] Figure 3 yes Figure 2 An enlarged schematic diagram of part A;
[0036] Figure 4 This is a cross-sectional schematic diagram of an embodiment, mainly showing the adjustment components;
[0037] Figure 5 yes Figure 4 An enlarged schematic diagram of part B.
[0038] Reference numerals: 1. Base; 2. Support leg; 3. Frame; 4. Light window; 5. Collimating lens; 6. Receiving cavity; 7. Laser chip; 8. Reflector; 9. Lead wire; 10. Heat sink plate; 11. Lens body; 12. Collimating unit; 13. Snap ring; 14. Snap slot; 15. Motor; 16. Protective shell; 17. Output shaft; 18. Rotating shaft; 19. First bevel gear; 20. Second bevel gear; 21. Turntable; 22. Connecting rod; 23. First limiting rod; 24. Second limiting rod; 25. Hook; 26. Through hole; 27. Guide block; 28. Guide groove; 29. Reflecting surface. Detailed Implementation
[0039] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.
[0040] First, those skilled in the art should understand that these embodiments are merely used to explain the technical principles of the embodiments of this application and are not intended to limit the scope of protection of the embodiments of this application. Those skilled in the art can make adjustments as needed to adapt to specific application scenarios.
[0041] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.
[0042] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0043] Reference Figure 1-5 A laser packaging device for semiconductors includes a base 1, support legs 2, a laser source mechanism, a frame 3, an optical window 4, and a collimating lens 5. Four support legs 2 are located at the four corners of the base 1. The base 1 has a receiving cavity 6, within which the laser source mechanism is located. The frame 3 is mounted on the base 1, and the optical window 4 is fixedly located within the frame 3. The collimating lens 5 is located on the side of the optical window 4 furthest from the base 1. Specifically, the laser source mechanism includes a laser chip 7 mounted within the base 1, a reflector 8 mounted within the base 1, a lead 9 extending through the base 1, and an adjustment assembly for adjusting the angle of the reflector 8. One end of the lead 9 is connected to an external device, and the other end is electrically connected to the laser chip 7. The laser chip 7 has two emission sources, each emitting laser light, which is reflected by the reflector 8 to the optical window 4.
[0044] There are multiple laser source mechanisms, which are spaced apart along the width of the base 1.
[0045] The laser chip 7 of any laser source mechanism is staggered from the adjacent reflector 8, with the spacing between two adjacent laser chips 7 in the width direction of the base 1 increasing. This increases the spacing between two adjacent laser chips 7, making the distribution of multiple laser chips 7 more dispersed. The heat emitted by multiple laser chips 7 is thus distributed over a larger area, expanding the heat transfer channel and reducing the thermal resistance of multiple laser chips 7. The heat emitted by the laser chips 7 is more easily transferred to the external environment through the base 1, reducing the temperature of the laser chips 7 and extending their service life.
[0046] The laser source mechanism also includes a heat sink plate 10, which is disposed within the receiving cavity 6. The laser chip 7 is disposed on the heat sink plate 10, and the heat sink plate 10 is used to dissipate heat from the laser chip 7. The heat emitted by the laser chip 7 can be transferred to the base 1 through the heat sink plate 10, and then exchanged with the external environment through the base 1, thereby achieving heat dissipation of the laser chip 7.
[0047] The collimating lens 5 includes a lens body 11 and multiple collimating units 12. The lens body 11 is snapped onto the optical window 4. Each collimating unit 12 is disposed on the lens body 11, with one collimating unit 12 corresponding to each laser source mechanism. All collimating units 12 protrude from the lens body 11 and can be integrally formed with the lens body 11. The collimating lens 5 can collimate the laser emitted by the laser source mechanism, thereby improving the laser imaging quality. The collimating lens 5 can be bonded to the optical window 4, for example, using UV (Ultraviolet Rays) curing adhesive or other thermosetting adhesives or other adhesives that have good adhesion to glass-like materials and low stress.
[0048] The frame 3 is provided with a retaining ring 13, and the base 1 is provided with a retaining groove 14 that cooperates with the retaining ring 13. This facilitates the disassembly and maintenance of the light window 4.
[0049] The adjustment assembly includes a motor 15, a protective housing 16, an output shaft 17, a rotating shaft 18, a first bevel gear 19, a second bevel gear 20, a turntable 21, a connecting rod 22, a first limiting rod 23, and a second limiting rod 24. The motor 15 is mounted on the bottom of the base 1. The protective housing 16 is fixedly disposed within the receiving cavity 6. The output shaft 17 is rotatably disposed within the protective housing 16, with one end connected to the output end of the motor 15. The rotating shaft 18 is rotatably disposed within the protective housing 16. The first bevel gear 19 is fixedly disposed on the output shaft 17, and the second bevel gear 20 is fixedly disposed on the output shaft 17. A rotating disk 21 is symmetrically fixed on a rotating shaft 18. One end of a connecting rod 22 is connected to the rotating disk 21, and the other end is hinged to the reflector 8. A first limiting rod 23 and a second limiting rod 24 are fixed inside the protective shell 16. The two ends of the reflector 8 abut against the first limiting rod 23 and the second limiting rod 24, respectively. The first limiting rod 23 limits the lowest angle of the reflector 8, and the second limiting rod 24 limits the highest angle of the reflector 8. The protective shell 16 has an opening at one end, and the reflector 8 is located inside the opening. Pins are fixed at both ends of the reflector 8, with one end of the pin rotatably mounted on the end wall of the protective shell 16. When the angle of the reflector 8 needs to be adjusted, the drive motor 15 drives the output shaft 17 to rotate, the first bevel gear 19 drives the second bevel gear 20 to rotate, causing the rotating shaft 18 to drive the turntable 21 to rotate. While the turntable 21 rotates, it pulls the connecting rod 22. The moving connecting rod 22 drives the reflector 8 to rotate, thereby adjusting the angle of the reflector 8, thereby controlling the laser emission direction from the laser packaging device, which facilitates better packaging and improves the packaging effect of semiconductors.
[0050] A hook 25 is provided on the end of the connecting rod 22 away from the reflector 8. A through hole 26 is provided on the turntable 21 for inserting the hook 25. A guide block 27 is provided on the connecting rod 22. A guide groove 28 that cooperates with the guide block 27 is provided on the end wall of the protective shell 16.
[0051] The reflector 8 includes a reflective surface 29, which faces the light emission port of the laser chip 7. Through the adjustment mechanism, the angle between the reflective surface 29 and the inner wall of the receiving cavity 6 is maintained between 30° and 80°. This allows the laser emitted from the laser chip 7 to be reflected by the reflective surface 29 and emitted along the top of the laser packaging device, achieving top-out light emission.
[0052] The base 1 is made of ceramic material, such as alumina or aluminum nitride ceramic. Ceramic materials are low in cost, which can reduce the cost of the laser packaging device. In other embodiments, the base 1 can also be made of copper to improve its thermal conductivity, such as oxygen-free copper or tungsten copper.
[0053] In the description of the embodiments of this application, it should be noted that the terms "inner" and "outer" and other terms indicating direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.
[0054] In the description of this application, the references to terms such as "an embodiment," "some embodiments," "in this embodiment," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0055] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A laser packaging device for semiconductors, characterized in that: include: Base (1); The laser source mechanism is located inside the base (1); A light window (4) is provided on the base (1) and located above the laser light source mechanism; The laser source mechanism includes a laser chip (7) installed in the base (1), a reflector (8) installed in the base (1), a lead wire (9) passing through the base (1), and an adjustment component for adjusting the angle of the reflector (8); one end of the lead wire (9) is connected to an external device, and the other end is electrically connected to the laser chip (7). The laser chip (7) has two emission sources, each of which is used to emit laser light, which is reflected by the reflector (8) to the light window (4).
2. The semiconductor laser packaging apparatus according to claim 1, characterized in that: The number of laser light source mechanisms is multiple, and the multiple laser light source mechanisms are spaced apart along the width direction of the base (1).
3. The semiconductor laser packaging apparatus according to claim 2, characterized in that: The laser chip (7) of any of the laser light source mechanisms is staggered from the adjacent reflector (8) so as to define the spacing between two adjacent laser chips (7) in the width direction of the base (1).
4. The semiconductor laser packaging apparatus according to claim 1, characterized in that: The adjustment component includes: The motor (15) is mounted on the bottom of the base (1); A protective shell (16) is fixedly disposed inside the base (1); The output shaft (17) is rotatably disposed inside the protective shell (16), and one end is connected to the output end of the motor (15); A rotating shaft (18) is rotatably disposed within the protective shell (16); The first bevel gear (19) is fixedly mounted on the output shaft (17); The second bevel gear (20) is fixedly mounted on the rotating shaft (18); A turntable (21) is symmetrically fixed on the rotating shaft (18); The connecting rod (22) is connected at one end to the turntable (21) and at the other end to the reflector (8); The protective shell (16) has an opening at one end, and the reflector (8) is located in the opening. Pins are fixed on both ends of the reflector (8), and one end of the pin is rotatably mounted on the end wall of the protective shell (16).
5. The laser packaging apparatus for semiconductors according to claim 4, characterized in that: The adjustment component further includes: The first limiting rod (23) is fixedly installed inside the protective shell (16); The second limiting rod (24) is fixedly installed inside the protective shell (16).
6. The laser packaging apparatus for semiconductors according to claim 4, characterized in that: The connecting rod (22) is provided with a hook (25) at the end away from the reflector (8), and the turntable (21) is provided with a through hole (26) for inserting the hook (25).
7. The laser packaging apparatus for semiconductors according to claim 6, characterized in that: The connecting rod (22) is provided with a guide block (27), and the end wall of the protective shell (16) is provided with a guide groove (28) that cooperates with the guide block (27).
8. The laser packaging apparatus for semiconductors according to claim 1, characterized in that: The semiconductor laser packaging device further includes a collimating lens (5), which is disposed on the side of the optical window (4) away from the base (1).
9. The laser packaging apparatus for semiconductors according to claim 8, characterized in that: The collimating lens (5) includes a lens body (11) and multiple collimating units (12). The lens body (11) is snapped into the light window (4). The multiple collimating units (12) are all disposed on the lens body (11). There are multiple laser light source mechanisms, and each laser light source mechanism corresponds to one collimating unit (12).
10. The laser packaging apparatus for semiconductors according to claim 1, characterized in that: The semiconductor laser packaging device further includes a frame (3), the optical window (4) is installed inside the frame (3), the frame (3) is provided with a retaining ring (13), and the base (1) is provided with a slot (14) that cooperates with the retaining ring (13).