Module-free circuit board structure

Abstract

The circuit board structure comprises a circuit board body, the circuit board body sequentially comprises a first layer circuit board, a first dielectric layer and a second layer circuit board 102 from top to bottom, the circuit board body is provided with eight terminal holes and eight gold pinholes, the eight terminal holes are divided into an upper group and a lower group and are symmetrically arranged, and the gold pinholes are arranged in the upper group and the lower group. The upper-layer terminal holes and the lower-layer terminal holes are respectively provided with four hole positions, and the upper-layer terminal holes and the lower-layer terminal holes are divided into two rows and are arranged in a staggered manner; the eight gold pinholes are arranged between the two layers of terminal holes, the eight gold pinholes are divided into an upper row and a lower row, the first layer of circuit board is provided with four inter-wire-pair crosstalk groups, and the second layer of circuit board 102 is provided with two inter-wire-pair crosstalk groups. According to the circuit board structure of the wiring-free module provided by the utility model, the crosstalk group is constructed by ingeniously utilizing the wiring between the terminal ports, so that the signal interference between adjacent lines is effectively avoided, and the crosstalk influence on signals in the transmission process is greatly reduced.

Description

Technical Field

[0001] This utility model relates to the field of network modules, specifically a circuit board structure for a no-print module. Background Technology

[0002] The stability and efficiency of network communication are crucial to people's lives and work. With the rapid development of network technology, users have increasingly higher requirements for network bandwidth and transmission speed. From the early 100 Mbps networks to the widely used gigabit networks today, and even moving towards 10 Gigabit networks, the amount and frequency of data transmitted over the network are constantly increasing. Against this backdrop, network call-free modules face more severe performance challenges. Among them, anti-crosstalk performance has become one of the key factors affecting the stability of network transmission. Currently, the circuit board structure used in call-free modules is not well laid out, with complex circuit board arrangement and large crosstalk between ports, which affects its overall propagation rate. Therefore, it is urgent to optimize the anti-crosstalk performance of network call-free modules to improve the stability and reliability of network transmission. Utility Model Content

[0003] The purpose of this invention is to provide a circuit board structure that eliminates the need for module assembly, thereby solving the technical problems in the background art.

[0004] To achieve the aforementioned objectives, this utility model provides the following technical solution:

[0005] A circuit board structure for a no-knock module includes a circuit board body. The circuit board body comprises, from top to bottom, a first circuit board layer, a first dielectric layer, and a second circuit board layer 102. The circuit board body has eight terminal holes and eight pin holes. The eight terminal holes are arranged symmetrically in two groups, namely upper-layer terminal holes and lower-layer terminal holes. Each of the upper-layer and lower-layer terminal holes has four holes arranged in two staggered rows. The eight pin holes are located between the two layers of terminal holes, arranged in two rows, namely a first row of pin holes and a second row of pin holes. The eight terminal holes are electrically connected to the eight pin holes via wires. The eight pin holes are designated as the first, second, third, fourth, fifth, sixth, seventh, and eighth pin holes. The first and third pin holes... The fifth and seventh gold pin holes are in the first row of gold pin holes, and the second, fourth, sixth, and eighth gold pin holes are in the second row of gold pin holes. The first, third, and fifth gold pin holes are arranged adjacent to each other, and the fifth and seventh gold pin holes are spaced apart. The distance between the fifth and seventh gold pin holes is the first interval position. The second and fourth gold pin holes are spaced apart. The distance between the second and fourth gold pin holes is the second interval position. The fourth, sixth, and eighth gold pin holes are arranged adjacent to each other. The first, third, and fifth gold pin holes are above the second interval position, and the fourth, sixth, and eighth gold pin holes are below the first interval position. The first layer circuit board has four sets of wire-pair crosstalk groups, and the second layer circuit board 102 has two sets of wire-pair crosstalk groups.

[0006] The eight terminal holes are designated as first terminal hole, second terminal hole, third terminal hole, fourth terminal hole, fifth terminal hole, sixth terminal hole, seventh terminal hole, and eighth terminal hole. The first terminal hole, second terminal hole, third terminal hole, and sixth terminal hole are lower-layer terminal holes, and the fifth terminal hole, fourth terminal hole, seventh terminal hole, and eighth terminal hole are upper-layer terminal holes.

[0007] The four pairs of crosstalk groups located on the first layer of the circuit board are the first pair crosstalk group, the second pair crosstalk group, the third pair crosstalk group, and the fourth pair crosstalk group. The first pair crosstalk group is constructed by the transmission line between the signal terminals of the fourth and eighth pairs of lines. The second pair crosstalk group is constructed by the transmission line between the signal terminals of the fifth and fourth pairs of lines. The third pair crosstalk group is constructed by the transmission line between the signal terminals of the first and third pairs of lines. The fourth pair crosstalk group is constructed by the transmission line between the signal terminals of the third and eighth pairs of lines.

[0008] The two sets of line-pair crosstalk groups located on the second layer circuit board 102 are the fifth line-pair crosstalk group and the sixth line-pair crosstalk group. The fifth line-pair crosstalk group is constructed by the transmission line between the signal terminal of the fifth line pair and the signal terminal of the second line pair, and the sixth line-pair crosstalk group is constructed by the transmission line between the signal terminal of the sixth line pair and the signal terminal of the eighth line pair.

[0009] A first capacitor sheet is provided between the sixth gold pin hole and the sixth terminal hole of the second layer circuit board 102, and the first capacitor sheet is located at the edge of the sixth gold pin hole.

[0010] The linewidths of the first, second, third, fourth, fifth, and sixth line-pair crosstalk groups are 0.17-0.3 mm.

[0011] Compared with the prior art, the circuit board structure of the present invention provides a no-knock module. By cleverly utilizing the wiring between terminal holes to construct crosstalk groups and the reasonable configuration of different crosstalk groups, signal interference between adjacent lines is effectively avoided. This significantly reduces the crosstalk impact on the signal during transmission, allowing the signal to be transmitted more stably and efficiently between the various lines. This greatly improves the data transmission efficiency of the module circuit board and ensures the accuracy and timeliness of information transmission. Attached Figure Description

[0012] Figure 1 : A schematic diagram of the layered structure of the circuit board in this application;

[0013] Figure 2 : A schematic diagram of the front structure of the first layer circuit board;

[0014] Figure 3 : Schematic diagram of the front structure of the second layer circuit board. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0016] Specific Implementation Example 1: Please refer to Figures 1 to 3In this embodiment of the present invention, a circuit board structure for a punch-free module includes a circuit board body 1. The circuit board body 1 consists of a first circuit board 101, a first dielectric layer 103, and a second circuit board 102, arranged from top to bottom. The circuit board body 1 has eight terminal holes and eight pin holes. The eight terminal holes are arranged symmetrically in two groups, namely upper terminal holes and lower terminal holes. Each of the upper and lower terminal holes has four holes arranged in two staggered rows. The eight pin holes are located between the two terminal holes, arranged in two rows, namely a first row of pin holes and a second row of pin holes. The eight terminal holes are electrically connected to the eight pin holes via wires. The eight pin holes are designated as first pin hole S1, second pin hole S2, third pin hole S3, fourth pin hole S4, fifth pin hole S5, sixth pin hole S6, seventh pin hole S7, and eighth pin hole S8. S5 and the seventh gold needle hole S7 are in the first row of gold needle holes. The second gold needle hole S2, the fourth gold needle hole S4, the sixth gold needle hole S6, and the eighth gold needle hole S8 are in the second row of gold needle holes. The first gold needle hole S1, the third gold needle hole S3, and the fifth gold needle hole S5 are arranged adjacent to each other. The fifth gold needle hole S5 and the seventh gold needle hole S7 are spaced apart, and the distance between the fifth gold needle hole S5 and the seventh gold needle hole S7 is the first interval position. The second gold needle hole S2 and the fourth gold needle hole S4 are spaced apart. The spacing between the gold pin hole S2 and the fourth gold pin hole S4 is the second interval position. The fourth gold pin hole S4, the sixth gold pin hole S6 and the eighth gold pin hole S8 are arranged adjacent to each other. The first gold pin hole S1, the third gold pin hole S3 and the fifth gold pin hole S5 are above the second interval position, and the fourth gold pin hole S4, the sixth gold pin hole S6 and the eighth gold pin hole S8 are below the first interval position. The first layer circuit board 101 is provided with four sets of wire pair crosstalk groups, and the second layer circuit board 102 is provided with two sets of wire pair crosstalk groups.

[0017] The eight terminal holes are designated as terminal hole C1, terminal hole C2, terminal hole C3, terminal hole C4, terminal hole C5, terminal hole C6, terminal hole C7, and terminal hole C8. Terminal holes C1, C2, C3, and C6 are the lower-level terminal holes, while terminal holes C5, C4, C7, and C8 are the upper-level terminal holes.

[0018] The signal connection between the first terminal hole C1 and the first gold pin hole S1 is the first wire pair, and the other holes are connected in the same manner. In this application, the four wire pair crosstalk groups located on the first layer circuit board 101 are the first wire pair crosstalk group A1, the second wire pair crosstalk group A2, the third wire pair crosstalk group A3, and the fourth wire pair crosstalk group A4. The first wire pair crosstalk group A1 is constructed by the transmission line between the signal terminal of the fourth wire pair and the signal terminal of the eighth wire pair. The second wire pair crosstalk group A2 is constructed by the transmission line between the signal terminal of the fifth wire pair and the signal terminal of the fourth wire pair. The third wire pair crosstalk group A3 is constructed by the transmission line between the signal terminal of the first wire pair and the signal terminal of the third wire pair. The fourth wire pair crosstalk group A4 is constructed by the transmission line between the signal terminal of the third wire pair and the signal terminal of the eighth wire pair.

[0019] The two sets of inter-pair crosstalk groups located on the second-layer circuit board 102 are the fifth inter-pair crosstalk group B1 and the sixth inter-pair crosstalk group B2. The fifth inter-pair crosstalk group B1 is constructed from the transmission line connecting the signal terminals of the fifth and second line pairs, while the sixth inter-pair crosstalk group B2 is constructed from the transmission line connecting the signal terminals of the sixth and eighth line pairs. These inter-pair crosstalk groups effectively suppress crosstalk, allowing the signal to maintain its original characteristics during transmission, such as correct amplitude, phase, and timing. This ensures that the receiving end can accurately interpret the signal transmitted from the sending end, improving the accuracy of data transmission.

[0020] A first capacitor B3 is provided between the sixth gold pin hole S6 and the sixth terminal hole C6 of the second circuit board 102. The first capacitor B3 is located at the edge of the sixth gold pin hole S6. The capacitor can perform phase compensation by influencing the signal phase, adjust the phase relationship of the signal, and enable the system to reach a stable working state.

[0021] In this application, the linewidths of the first line-pair crosstalk group A1, the second line-pair crosstalk group A2, the third line-pair crosstalk group A3, the fourth line-pair crosstalk group A4, the fifth line-pair crosstalk group B1, and the sixth line-pair crosstalk group B2 are 0.17-0.3 mm. Wider lines increase the capacitance effect. For high-frequency signals, the capacitive reactance of the capacitor decreases, which causes some of the signal energy to be diverted by the capacitor, thus causing signal attenuation. At the same time, different linewidths will change the characteristic impedance of the line. If the characteristic impedance is mismatched, the signal will be reflected during transmission, causing signal distortion and affecting the integrity of the signal. Therefore, it is necessary to precisely control the linewidth to ensure the accurate transmission of high-frequency signals.

[0022] Compared with the prior art, the circuit board structure of the present invention provides a no-knock module. By cleverly utilizing the wiring between terminal holes to construct crosstalk groups and the reasonable configuration of different crosstalk groups, signal interference between adjacent lines is effectively avoided. This significantly reduces the crosstalk impact on the signal during transmission, allowing the signal to be transmitted more stably and efficiently between the various lines. This greatly improves the data transmission efficiency of the module circuit board and ensures the accuracy and timeliness of information transmission.

[0023] It will be apparent to those skilled in the art that this invention is not limited to the details of the foregoing exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0024] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A circuit board structure that eliminates the need for module assembly, characterized in that: The circuit board body comprises, from top to bottom, a first circuit board layer, a first dielectric layer, and a second circuit board layer 102. The circuit board body has eight terminal holes and eight pin holes. The eight terminal holes are arranged symmetrically in two groups, namely upper terminal holes and lower terminal holes. Each of the upper and lower terminal holes has four holes arranged in two staggered rows. The eight pin holes are located between the two terminal holes, arranged in two rows, namely a first row of pin holes and a second row of pin holes. The eight terminal holes are electrically connected to the eight pin holes via wires. The eight pin holes are designated as the first, second, third, fourth, fifth, sixth, seventh, and eighth pin holes. The seventh gold pin hole is in the first row of gold pin holes, and the second, fourth, sixth, and eighth gold pin holes are in the second row of gold pin holes. The first, third, and fifth gold pin holes are arranged adjacent to each other, and the fifth gold pin hole is spaced apart from the seventh gold pin hole. The distance between the fifth and seventh gold pin holes is the first interval position. The second and fourth gold pin holes are spaced apart, and the distance between the second and fourth gold pin holes is the second interval position. The fourth, sixth, and eighth gold pin holes are arranged adjacent to each other, with the first, third, and fifth gold pin holes above the second interval position and the fourth, sixth, and eighth gold pin holes below the first interval position. The first layer circuit board has four sets of wire-pair crosstalk groups, and the second layer circuit board 102 has two sets of wire-pair crosstalk groups.

2. The circuit board structure of the no-print module according to claim 1, characterized in that: The eight terminal holes are designated as first terminal hole, second terminal hole, third terminal hole, fourth terminal hole, fifth terminal hole, sixth terminal hole, seventh terminal hole, and eighth terminal hole. The first terminal hole, second terminal hole, third terminal hole, and sixth terminal hole are lower-layer terminal holes, and the fifth terminal hole, fourth terminal hole, seventh terminal hole, and eighth terminal hole are upper-layer terminal holes.

3. The circuit board structure of the no-print module according to claim 2, characterized in that: The four pairs of crosstalk groups located on the first layer of the circuit board are the first pair crosstalk group, the second pair crosstalk group, the third pair crosstalk group, and the fourth pair crosstalk group. The first pair crosstalk group is constructed by the transmission line between the signal terminals of the fourth and eighth pairs of lines. The second pair crosstalk group is constructed by the transmission line between the signal terminals of the fifth and fourth pairs of lines. The third pair crosstalk group is constructed by the transmission line between the signal terminals of the first and third pairs of lines. The fourth pair crosstalk group is constructed by the transmission line between the signal terminals of the third and eighth pairs of lines.

4. The circuit board structure of the no-print module according to claim 3, characterized in that: The two sets of line-pair crosstalk groups located on the second layer circuit board 102 are the fifth line-pair crosstalk group and the sixth line-pair crosstalk group. The fifth line-pair crosstalk group is constructed by the transmission line between the signal terminal of the fifth line pair and the signal terminal of the second line pair, and the sixth line-pair crosstalk group is constructed by the transmission line between the signal terminal of the sixth line pair and the signal terminal of the eighth line pair.

5. The circuit board structure of the no-print module according to claim 4, characterized in that: A first capacitor sheet is provided between the sixth gold pin hole and the sixth terminal hole of the second layer circuit board 102, and the first capacitor sheet is located at the edge of the sixth gold pin hole.

6. The circuit board structure of the no-print module according to claim 4, characterized in that: The linewidths of the first, second, third, fourth, fifth, and sixth line-pair crosstalk groups are 0.17-0.3 mm.

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