Mining circuit board with embedded heat dissipation structure
By designing the circuit board body and heat dissipation mechanism, the problems of copper block deformation and glue overflow during the lamination process of mining circuit boards are solved, thereby improving heat dissipation efficiency and reliability, and enabling tool-free disassembly and vertical heat dissipation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU BIAOPINJIE ELECTRONIC TECH CO LTD
- Filing Date
- 2025-05-21
- Publication Date
- 2026-05-05
AI Technical Summary
In a mining environment, the copper blocks of the circuit board are prone to deformation and glue overflow during the lamination process, which affects the normal use of the circuit board.
The design incorporates a combination of the circuit board body and the circuit board heat dissipation mechanism, including a mechanical interlocking structure of the glue overflow groove, side groove and extrusion block, a curved surface fit support of the arc groove and arc block, and a guiding structure of the guide rod and insert-type heat sink, which improves the bending strength of the copper block and prevents glue overflow.
It effectively prevents copper block deformation and adhesive overflow, improves the heat dissipation efficiency and reliability of the circuit board, and enables tool-free disassembly and assembly and vertical heat dissipation channels.
Smart Images
Figure CN224205307U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, specifically to a mining circuit board with an embedded heat dissipation structure. Background Technology
[0002] A multilayer printed circuit board, also known as a multilayer circuit board or PCB, is a type of printed circuit board with two or more layers. It consists of connecting wires on several insulating substrates and pads for assembling and soldering electronic components. It serves both to conduct the circuitry between the layers and to insulate the circuits between them.
[0003] A search revealed a patent document, CN 218959192 U, which discloses a heat dissipation structure for an internal circuit board. This utility model discloses a heat dissipation structure for an internal circuit board, comprising: a concave heat dissipation base and a circuit board, on which several heat-generating electronic components are mounted. Heat-conducting sheets are embedded in the circuit board, corresponding one-to-one with each heat-generating electronic component. The heat-conducting sheets are located at the bottom of the heat-generating electronic components, with both ends passing through the circuit board and adhering to the concave heat dissipation base. Several strip-shaped through holes are provided on the sidewalls of the concave heat dissipation base, and a heat dissipation top plate is provided at the top of the concave heat dissipation base. A cooling fan electrically connected to the circuit board is located on the top plate, directly above the circuit board. The beneficial effects of this utility model are: it allows direct heat conduction from the bottom of the heat-generating electronic components to the concave heat dissipation base, which then conducts heat to the inverter's housing. Furthermore, the use of cooling fans on the sidewalls and top of the heat-generating electronic components achieves comprehensive heat dissipation, significantly improving heat dissipation efficiency.
[0004] When the circuit board is in an environment such as a mine, copper blocks need to be embedded inside the circuit board during the use of the above technical solution. During the pressing process, the copper blocks are prone to deformation and glue overflow is likely to occur between the copper blocks and the embedded copper cavity, which will affect the normal use of the circuit board.
[0005] Therefore, it is necessary to invent a mining circuit board with an embedded heat dissipation structure to solve the above problems. Utility Model Content
[0006] The purpose of this utility model is to provide a mining circuit board with an embedded heat dissipation structure. By cooperating with the circuit board body and the circuit board heat dissipation mechanism, the problem of easy deformation of the copper block and easy overflow of glue between the copper block and the embedded copper cavity during the pressing process in the prior art is solved, which affects the normal use of the circuit board.
[0007] To achieve the above objectives, this utility model provides the following technical solution: a mining circuit board with an embedded heat dissipation structure, comprising a circuit board body, an internal heat dissipation mechanism, a weather-resistant layer fixedly connected to the top wall of the circuit board body, an anti-corrosion layer fixedly connected to the bottom end of the weather-resistant layer, a waterproof layer fixedly connected to the bottom end of the anti-corrosion layer, a substrate fixedly connected to the bottom end of the waterproof layer, an overflow groove provided below the substrate and a heat dissipation copper block installed inside the overflow groove, the overflow groove below the substrate being opened at the bottom of the circuit board body, several sets of side grooves being opened on both sides of the heat dissipation copper block, a pressing block being engaged inside the side groove and fixedly connected to the inner side wall of the circuit board body, the overflow groove preventing glue overflow while the cooperation between the side groove and the pressing block preventing deformation of the heat dissipation copper block.
[0008] Preferably, an arc-shaped block is fixedly connected to the bottom wall of the circuit board body, and an arc-shaped groove is opened at the bottom of the heat dissipation copper block. The arc-shaped block and the arc-shaped groove correspond to each other, and the cooperation between the arc-shaped block and the arc-shaped groove further prevents the heat dissipation copper block from deforming.
[0009] Preferably, four sets of guide rods are fixedly connected to the bottom of the circuit board body, and a heat sink is provided below the circuit board body to assist in heat dissipation of the circuit board body.
[0010] Preferably, a riser is fixedly connected to the top of the insert-type heat sink, and a thermal pad is fixedly connected to the top of the insert-type heat sink, so that the heat of the circuit board body can be conducted to the surface of the insert-type heat sink through the thermal pad.
[0011] Preferably, the outer sides of both ends of the riser are provided with a snap-fit groove, and a folding ear buckle is provided above the snap-fit groove. The folding ear buckle is fixedly connected to the bottom end of the circuit board body. The circuit board body and the insert-type heat sink are installed through the cooperation of the folding ear buckle and the snap-fit groove.
[0012] Preferably, the inner side of the folding ear buckle is provided with a second snap-fit groove, which snaps into the first snap-fit groove, thereby achieving mutual positioning of the circuit board body and the insert-type heat sink through the second snap-fit groove and the first snap-fit groove.
[0013] Preferably, both the riser and the insert-type heat sink have guide grooves on their tops. The guide grooves and guide rods are interlocked, and the installation of the circuit board body and the insert-type heat sink is guided by the cooperation of the guide rods and guide grooves.
[0014] The technical effects and advantages provided by this utility model in the above technical solution are as follows:
[0015] 1. By cooperating with the circuit board body and the circuit board heat dissipation mechanism, and through the mechanical interlocking structure of the glue overflow groove, side groove, and extrusion block, the problems of copper block pressing deformation and glue overflow pollution are solved simultaneously. The curved groove and curved block form a curved surface fit support, which improves the bending strength of the heat dissipation copper block.
[0016] 2. Through the cooperation of parts such as guide rods, the guiding structure of guide rods and guide slots ensures the assembly accuracy of the circuit board body and the plug-in heat sink. The elastic snap-fit structure of the folding ear buckle and the snap-fit slot one and snap-fit slot two enables tool-free disassembly and assembly. A vertical heat dissipation channel is formed by the thermal pad and the plug-in heat sink. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0019] Figure 2 This is a schematic diagram of the main structure of the circuit board of this utility model;
[0020] Figure 3 This is a schematic diagram of the folding ear buckle structure of this utility model;
[0021] Figure 4 For the present utility model Figure 2 Enlarged structural diagram at point A in the middle.
[0022] Explanation of reference numerals in the attached figures:
[0023] 1. Circuit board body; 2. Circuit board heat dissipation mechanism; 201. Weather-resistant layer; 202. Anti-corrosion layer; 203. Waterproof layer; 204. Substrate; 205. Heat dissipation copper block; 206. Side groove; 207. Extrusion block; 208. Arc-shaped block; 209. Arc-shaped groove; 210. Glue overflow groove; 3. Guide rod; 4. Folding ear buckle; 5. Snap-fit groove one; 6. Guide groove; 7. Thermal pad; 8. Elevator frame; 9. Insert-type heat dissipation frame; 10. Snap-fit groove two. Detailed Implementation
[0024] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.
[0025] This utility model provides, for example Figure 1-4The diagram shows a mining circuit board with an embedded heat dissipation structure, comprising a circuit board body 1, an internal heat dissipation mechanism 2, and a weather-resistant layer 201 fixedly connected to the top wall of the circuit board body 1. An anti-corrosion layer 202 is fixedly connected to the bottom end of the weather-resistant layer 201, and a waterproof layer 203 is fixedly connected to the bottom end of the anti-corrosion layer 202. A substrate 204 is fixedly connected to the bottom end of the waterproof layer 203. An overflow groove 210 is provided below the substrate 204, and a heat dissipation copper block 205 is installed inside the overflow groove 210. The overflow groove 210 is located at the bottom of the circuit board body 1. Several sets of side grooves 206 are provided on both sides of the heat dissipation copper block 205. A pressing block 207 is engaged inside the side groove 206. 07 is fixedly connected to the inner wall of the circuit board body 1. The overflow groove 210 prevents glue overflow, and the side groove 206 cooperates with the pressing block 207 to prevent the heat dissipation copper block 205 from deforming. An arc-shaped block 208 is fixedly connected to the bottom wall of the circuit board body 1. An arc-shaped groove 209 is opened at the bottom of the heat dissipation copper block 205. The arc-shaped block 208 and the arc-shaped groove 209 correspond to each other. The cooperation between the arc-shaped block 208 and the arc-shaped groove 209 further prevents the heat dissipation copper block 205 from deforming. Through the cooperation between the circuit board body 1 and the circuit board heat dissipation mechanism 2, the mechanical interlocking structure of the overflow groove 210, the side groove 206, and the pressing block 207 simultaneously solves the problems of copper block pressing deformation and glue overflow pollution. The arc-shaped groove 209 and the arc-shaped block 208 form a curved surface fit support, which improves the bending strength of the heat dissipation copper block 205.
[0026] Refer to the instruction manual appendix Figure 1-4Four sets of guide rods 3 are fixedly connected to the bottom of the circuit board body 1. A heat sink 9 is installed below the circuit board body 1 to assist in heat dissipation of the circuit board body 1. A riser 8 is fixedly connected to the top of the heat sink 9, and a thermal pad 7 is fixedly connected to the top of the heat sink 9 to conduct heat from the circuit board body 1 to the surface of the heat sink 9. The riser 8 has a snap-fit groove 5 on the outer side of both ends. A folding ear buckle 4 is provided above the snap-fit groove 5. The folding ear buckle 4 is fixedly connected to the bottom of the circuit board body 1. The circuit board body 1 and the heat sink 9 are installed by the cooperation of the folding ear buckle 4 and the snap-fit groove 5. A snap-fit groove is provided on the inner side of the folding ear buckle 4. The second slot 10 and the first slot 5 interlock with each other, thereby limiting the mutual positioning of the circuit board body 1 and the insert-type heat sink 9. The top of both the riser 8 and the insert-type heat sink 9 are provided with guide slots 6, which interlock with the guide rods 3. The cooperation between the guide rods 3 and the guide slots 6 guides the installation of the circuit board body 1 and the insert-type heat sink 9. Through the cooperation of the guide rods 3 and other parts, the guiding structure of the guide rods 3 and the guide slots 6 ensures the assembly accuracy of the circuit board body 1 and the insert-type heat sink 9. The elastic interlocking structure of the folding buckle 4 and the first slot 5 and the second slot 10 enables tool-less disassembly and assembly. A vertical heat dissipation channel is formed by the thermal pad 7 and the insert-type heat sink 9.
[0027] The working principle of this practical application is as follows:
[0028] Refer to the instruction manual appendix Figure 1-4 During the installation of the circuit board body 1, the molten adhesive is physically blocked after flowing into the overflow groove 210 to prevent it from overflowing onto the surface of the substrate 204. The extrusion block 207 is embedded in the side groove 206 to form a radial constraint, which counteracts the deformation stress in the vertical direction of the press and simultaneously solves the problems of copper block pressing deformation and overflow contamination. The curved groove 209 and the curved block 208 form a curved surface fit support, which improves the bending strength of the heat dissipation copper block 205. Furthermore, the elastic snap-fit structure of the folding ear buckle 4 and the snap-fit groove 1 5 and snap-fit groove 2 10 enables tool-less disassembly and assembly. The thermal pad 7 and the insert-type heat sink 9 form a vertical heat dissipation channel and fill the gap between the circuit board body 1 and the insert-type heat sink 9 to reduce the interface thermal resistance and optimize the heat transfer path, thereby improving the reliability of the structure.
[0029] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.
Claims
1. A mining circuit board with an embedded heat dissipation structure, comprising a circuit board body (1), characterized in that: The circuit board body (1) is provided with a circuit board heat dissipation mechanism (2). The circuit board heat dissipation mechanism (2) includes a weather-resistant layer (201) fixedly connected to the top wall of the circuit board body (1). The bottom end of the weather-resistant layer (201) is fixedly connected to an anti-corrosion layer (202). The bottom end of the anti-corrosion layer (202) is fixedly connected to a waterproof layer (203). The bottom end of the waterproof layer (203) is fixedly connected to a substrate (204). An overflow groove (210) is provided below the substrate (204), and a heat dissipation copper block (205) is installed inside the overflow groove (210). The overflow groove (210) below the substrate (204) is opened at the bottom of the circuit board body (1). Several sets of side grooves (206) are opened on both sides of the heat dissipation copper block (205). An extrusion block (207) is snapped into the side groove (206), and the extrusion block (207) is fixedly connected to the inner side wall of the circuit board body (1).
2. A mining circuit board with an embedded heat dissipation structure according to claim 1, characterized in that: An arc-shaped block (208) is fixedly connected to the bottom wall of the circuit board body (1), and an arc-shaped groove (209) is opened at the bottom of the heat dissipation copper block (205), with the arc-shaped block (208) corresponding to the arc-shaped groove (209).
3. A mining circuit board with an embedded heat dissipation structure according to claim 1, characterized in that: Four sets of guide rods (3) are fixedly connected to the bottom of the circuit board body (1), and a heat sink (9) is provided below the circuit board body (1).
4. A mining circuit board with an embedded heat dissipation structure according to claim 3, characterized in that: The top of the insert-type heat sink (9) is fixedly connected to a riser (8), and the top of the insert-type heat sink (9) is fixedly connected to a thermal pad (7).
5. A mining circuit board with an embedded heat dissipation structure according to claim 4, characterized in that: The heightening bracket (8) has a snap-fit groove (5) on the outer side of both ends, and a folding ear buckle (4) is provided above the snap-fit groove (5). The folding ear buckle (4) is fixedly connected to the bottom end of the circuit board body (1).
6. A mining circuit board with an embedded heat dissipation structure according to claim 5, characterized in that: The inner side of the folding buckle (4) is provided with a second snap-fit groove (10), which snaps into the first snap-fit groove (5).
7. A mining circuit board with an embedded heat dissipation structure according to claim 4, characterized in that: The top of both the height-increasing frame (8) and the insert-type heat sink (9) is provided with a guide groove (6), and the guide groove (6) and the guide rod (3) are interlocked.