PCBA bump electromagnetic shielding controller and automobile

Abstract

The utility model belongs to the technical field of controller electromagnetic shielding and circuit boards, and particularly relates to a PCBA bump electromagnetic shielding controller and an automobile. The PCBA salient point electromagnetic shielding controller comprises an upper shell and a PCBA assembly, the PCBA assembly comprises an electronic chip, a ground bar exposed copper, a solder ball and a circuit board. The electronic chip is arranged in the circuit area of the circuit board; the ground bar exposed copper is arranged on the circuit board and surrounds the circuit area; the plurality of solder balls are arranged on the ground bar exposed copper at preset intervals; the upper shell is connected with the PCBA assembly, and the upper shell is in contact with the solder ball to form an electromagnetic shielding structure, so that a controller electromagnetic shielding technical scheme which is good in electromagnetic protection reliability and low in cost is realized.

Description

Technical Field

[0001] This utility model belongs to the field of controller electromagnetic shielding and circuit board technology, and particularly relates to a PCBA bump electromagnetic shielding controller and automobile. Background Technology

[0002] With the rapid development of automotive intelligence, the integration of chips is becoming increasingly sophisticated. High-speed digital signals (such as PWM, CLK, and ADC sampling) and analog signals (sensor inputs) inside the vehicle controller are susceptible to coupling interference from external electromagnetic fields (such as inverters and wireless equipment), leading to signal distortion. This can significantly impact the intelligent driving decision-making of the entire vehicle, especially the judgment of information at the signal end. However, proper electromagnetic shielding can effectively reduce the noise floor. For example, the shielding body can absorb / reflect interference, thereby reducing the noise level of the ADC sampling circuit, improving the signal-to-noise ratio (SNR), and reducing the error rate of signal acquisition. Therefore, electromagnetic shielding of the controller is of great significance.

[0003] Currently, most controllers employ shielding materials for EMC structural shielding, such as conductive foam, SMT chip foam, and conductive adhesives, to fill gaps and reduce leakage. While these methods offer some electromagnetic protection, their reliability is poor for automotive-grade products. For instance, conductive foam struggles to provide comprehensive shielding for irregularly shaped grooves and requires high precision in conformability and housing structure processing, necessitating additional assembly stations. SMT chip foam, used for extended periods under high-temperature conditions in automotive equipment, is prone to aging and shedding, potentially causing short circuits to electronic components. Conductive adhesives, composed of a mixture of numerous metal particles and liquid silicone substrate, are relatively hard, making surface roughness difficult to control. Furthermore, the line contact structure makes it susceptible to gaps during installation due to uneven surfaces, resulting in low yield rates. This solution also requires the purchase of expensive dispensing equipment, necessitating continuous debugging and incurring high equipment and management costs.

[0004] Therefore, there is a need to provide a controller electromagnetic shielding technology solution that offers high reliability and low cost. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a PCBA bump electromagnetic shielding controller and an automobile.

[0006] This utility model provides a PCBA bump electromagnetic shielding controller, which includes an upper housing and a PCBA assembly;

[0007] The PCBA assembly includes electronic chips, exposed copper ground wires, solder balls, and circuit boards;

[0008] The electronic chip is disposed in the circuit area of ​​the circuit board;

[0009] The exposed copper strip is disposed around the circuit area on the circuit board;

[0010] Several of the solder balls are arranged at a preset interval on the exposed copper of the ground strip;

[0011] The upper housing is connected to the PCBA assembly, and the upper housing contacts the solder ball to form an electromagnetic shielding structure.

[0012] In one possible implementation, a lower housing is also included, which is fastened to the upper housing to form a cavity;

[0013] The PCBA assembly is located within the cavity.

[0014] In one possible implementation, the upper housing, the PCBA assembly, and the lower housing are fixed together by screws.

[0015] In one possible implementation, the upper housing, the PCBA assembly, and the lower housing are provided with screw holes for inserting screws.

[0016] In one possible implementation, both the upper housing and the lower housing are aluminum alloy housings.

[0017] In one possible implementation, the upper housing and the solder ball are in point-to-surface contact.

[0018] In one possible implementation, the exposed copper strip surrounds the circuit area on the circuit board to form a closed-loop structure.

[0019] In one possible implementation, the preset spacing is a fixed spacing.

[0020] In one possible implementation, the preset spacing is a range of spacing between two different spacings.

[0021] This utility model also provides an automobile equipped with a PCBA bump electromagnetic shielding controller as described above.

[0022] The technical solution provided by this utility model has at least the following beneficial effects:

[0023] By incorporating a combination of exposed copper grounding strips and solder balls in the PCBA assembly, along with upper and lower housings, radiation source leakage can be effectively prevented. The vertical contact between the solder balls and the upper housing is a benign point-to-surface contact, which is beneficial for blocking or weakening electromagnetic field propagation. Furthermore, it has low requirements for housing structure manufacturability; only the spacing between each solder ball needs to be controlled, and screws are used for tightening to ensure the shielding performance of the product. The solder balls are tin bumps that shield high-frequency electromagnetic fields through reflection and eddy current loss, have good temperature resistance, and offer high reliability for mass production. Attached Figure Description

[0024] Figure 1 An exploded view of the PCBA bump electromagnetic shielding controller provided in this embodiment of the utility model;

[0025] Figure 2 A partial structural diagram of the PCBA assembly provided in an embodiment of this utility model;

[0026] Figure 3 A top view of the PCBA bump electromagnetic shielding controller provided in an embodiment of this utility model;

[0027] Figure 4 Provided for the embodiments of this utility model Figure 3 A cross-sectional view along the AA direction;

[0028] In the attached diagram, 100 is the upper housing; 200 is the PCBA assembly; 210 is the electronic chip; 220 is the exposed copper ground strip; 230 is the solder ball; 240 is the circuit board; 300 is the lower housing; 400 is the screw; and 401 is the screw hole. Detailed Implementation

[0029] To enhance understanding of this utility model, it will be described in further detail below with reference to the accompanying drawings and embodiments. These embodiments are only used to explain this utility model and do not limit the scope of protection of this utility model.

[0030] Please refer to Figures 1 to 4 The present invention provides a PCBA bump electromagnetic shielding controller, including an upper housing 100 and a PCBA assembly 200;

[0031] The PCBA assembly 200 includes an electronic chip 210, exposed copper ground strip 220, solder balls 230, and circuit board 240.

[0032] The electronic chip 210 is disposed in the circuit area of ​​the circuit board 240;

[0033] The exposed copper strip 220 is disposed around the circuit area on the circuit board 240;

[0034] A plurality of the solder balls 230 are arranged at a preset interval on the exposed copper of the ground strip 220;

[0035] The upper housing 100 is connected to the PCBA assembly 200, and the upper housing 100 contacts the solder ball 230 to form an electromagnetic shielding structure.

[0036] In this embodiment, the upper housing 100 can be made of metal or a good conductor. The electronic chip 210 is a conventional chip configured according to specific functional requirements, such as a high-frequency chip. The exposed copper strip 220 can be understood as a copper strip connecting the ground wire, which can be achieved by etching based on the copper-clad surface of the PCB board. The solder balls 230 are solder bumps. The circuit board 240 is a conventional PCB board. The upper housing 100 and the PCBA assembly 200 are in vertical contact and have a left-right clearance fit. The solder balls 230 of the PCBA assembly 200 can be connected to the exposed copper strip 220 of the circuit board 240 by applying solder paste to the SMT stencil. When the electronic chip 210 is a high-frequency chip that radiates electromagnetic energy, assuming that the upper housing 100 is an aluminum alloy housing, the upper housing 100, together with the solder balls 230 on the top surface (front side) of the PCBA assembly 200, forms a shielding structure around the high-frequency chip. The solder balls 230 are electrically connected to the upper housing 100, and the upper housing 100 can be effectively grounded, thus forming a Faraday cage, which effectively prevents radiation leakage. At the same time, by simply controlling the spacing between adjacent solder balls 230, the value of radiation at high frequencies can be controlled at the design end.

[0037] In one possible implementation, a lower housing 300 is also included, which is fastened to the upper housing 100 to form a cavity;

[0038] The PCBA assembly 200 is located within the cavity.

[0039] In this embodiment, the lower housing 300 can be made of metal or a good conductor. The lower housing 300 and the upper housing 100 are overlapped, forming a ring around the PCBA assembly 200. This effectively prevents radiation leakage from the bottom side (reverse side) of the PCBA assembly 200, which has good contact with the upper housing 100. It should be noted that the combination of the upper housing 100, lower housing 300, solder balls 230, etc., also provides excellent electrostatic protection and electromagnetic shielding against external electromagnetic interference. It should also be noted that the housing materials of the upper housing 100 and lower housing 300 can be replaced with plastic parts with a metal coating. For example, the interior of the upper housing 100 and lower housing 300 could be made of plastic with a metal coating on the surface.

[0040] In one possible implementation, the upper housing 100, the PCBA assembly 200, and the lower housing 300 are fixed together by screws 400.

[0041] In this embodiment, under the tightening force of the screws 400, the contact effect between the solder balls 230 and the contact surface of the upper housing 100 is better, which can better block the radiation source leakage of the PCBA assembly 200. It should be noted that the upper housing 100, PCBA assembly 200, and lower housing 300 are not limited to screw fixation, but can also be connected and fixed by means of clips, riveting, etc.

[0042] In one possible implementation, the upper housing 100, the PCBA assembly 200, and the lower housing 300 are provided with screw holes 401 for inserting screws 400.

[0043] In this embodiment, there can be multiple screws 400, which can be evenly distributed. In one specific embodiment, four screws 400 can be used. The upper housing 100, PCBA assembly 200, and lower housing 300 are each provided with screw holes 401 at their four corners. The four screws 400 pass through the four screw holes 401 of the upper housing 100, PCBA assembly 200, and lower housing 300 respectively, so that the upper housing 100, PCBA assembly 200, and lower housing 300 are tightly and firmly connected as one unit.

[0044] In one possible implementation, both the upper housing 100 and the lower housing 300 are aluminum alloy housings.

[0045] In this embodiment, the PCBA bump electromagnetic shielding controller is composed of two aluminum alloy housings and PCBA assembly 200, which can provide excellent electrostatic protection and electromagnetic shielding.

[0046] In one possible implementation, the upper housing 100 and the solder ball 230 are in point-to-surface contact.

[0047] In this embodiment, the solder ball 230 and the surface of the upper housing 100 are in point-to-surface contact, which can ensure sufficient contact between the two. Compared with pure planar rigid contact, point-to-surface contact has a better contact effect.

[0048] In one possible implementation, the exposed copper strip 220 forms a closed-loop structure around the circuit area on the circuit board 240.

[0049] In this embodiment, the exposed copper ground strip 220 is ring-shaped and surrounds the circuit area. It should be noted that the exposed copper ground strip 220 can be determined according to the peripheral shape of the electronic components on the circuit board 240, including but not limited to irregular structures.

[0050] In one possible implementation, the preset spacing is a fixed spacing.

[0051] In this embodiment, the fixed spacing is determined according to the actual shielding requirements. The spacing between any two adjacent solder balls 230 is the fixed spacing, thereby achieving that all solder balls 230 are set at equal intervals.

[0052] In one possible implementation, the preset spacing is a range of spacing between two different spacings.

[0053] In this embodiment, the two different spacings can be understood as the maximum and minimum allowable distances between two adjacent solder balls 230. Depending on actual implementation needs, the distance between any two adjacent solder balls 230 only needs to be between the maximum and minimum values; equal distances are not required.

[0054] This utility model also provides an automobile equipped with a PCBA bump electromagnetic shielding controller as described above.

[0055] The above embodiments should not limit the present invention in any way. All technical solutions obtained by equivalent substitution or equivalent conversion fall within the protection scope of the present invention.

Claims

1. A PCBA bump electromagnetic shielding controller, characterized in that, Including the upper housing and PCBA assembly; The PCBA assembly includes electronic chips, exposed copper ground wires, solder balls, and circuit boards; The electronic chip is disposed in the circuit area of ​​the circuit board; The exposed copper strip is disposed around the circuit area on the circuit board; Several of the solder balls are arranged at a preset interval on the exposed copper of the ground strip; The upper housing is connected to the PCBA assembly, and the upper housing contacts the solder ball to form an electromagnetic shielding structure.

2. The PCBA bump electromagnetic shielding controller according to claim 1, characterized in that, It also includes a lower housing, which is fastened to the upper housing to form a cavity; The PCBA assembly is located within the cavity.

3. The PCBA bump electromagnetic shielding controller according to claim 2, characterized in that, The upper housing, the PCBA assembly, and the lower housing are fixed together by screws.

4. The PCBA bump electromagnetic shielding controller according to claim 3, characterized in that, The upper housing, the PCBA assembly, and the lower housing are provided with screw holes for inserting screws.

5. The PCBA bump electromagnetic shielding controller according to claim 2, characterized in that, Both the upper and lower housings are made of aluminum alloy.

6. The PCBA bump electromagnetic shielding controller according to claim 1, characterized in that, The upper housing and the solder ball are in point-to-surface contact.

7. The PCBA bump electromagnetic shielding controller according to claim 1, characterized in that, The exposed copper strip on the circuit board forms a closed-loop structure around the circuit area.

8. The PCBA bump electromagnetic shielding controller according to claim 1, characterized in that, The preset spacing is a fixed spacing.

9. The PCBA bump electromagnetic shielding controller according to claim 1, characterized in that, The preset spacing is the range of spacing between two different spacings.

10. A car, characterized in that, The PCBA is equipped with an electromagnetic shielding controller for bumps as described in any one of claims 1 to 9.

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