Heat dissipation structure for vehicle lamp driving module

Abstract

The utility model relates to the technical field of automobile parts, and discloses a heat dissipation structure for an automobile lamp driving module, which comprises a thermoelectric separation PCB (printed circuit board) (1), a high-power DCDC chip (2), heat-conducting glue (3) and a shielding heat dissipation cover (4). The high-power DCDC chip heat dissipation device is scientific in design, simple and compact in structure, has shielding and heat dissipation functions, is convenient to install and use, is safe and reliable in function, can quickly lead out heat generated by the working of a high-power DCDC chip, effectively reduces the temperature of the chip, improves the heat dissipation efficiency, prolongs the service life of the chip, and is low in cost and durable.

Description

Technical Field

[0001] This utility model relates to the field of automotive parts technology, and in particular to a heat dissipation structure for a vehicle headlight drive module. Background Technology

[0002] Existing technologies have adopted various technical measures to solve the problem of heat dissipation in vehicle lights:

[0003] Changzhou Xingyu Automotive Lighting Co., Ltd.'s patent application (202311293829.0) describes a design that encapsulates a matrix LED light source on a PCB board, with heat pipe components installed inside a heat sink. The PCB board is mounted at the front of the heat sink, and a fan is installed at the rear. This design rapidly dissipates the heat generated by the matrix LEDs after they are lit, thus reducing the LED temperature. This design overcomes the drawbacks of traditional matrix LED heat sinks, such as large size and weight, high cost, the inability to quickly conduct heat generated by the matrix LEDs to the heat sink leading to heat accumulation, and the fan occupying space inside the lamp when mounted below the heat sink, or having its airflow obstructed by the heat sink substrate when mounted behind the heat sink. Furthermore, using a heat sink and fan would make the automotive light structure more complex and increase costs.

[0004] The patent application (202420856195.9) of Easystar Optoelectronics (Guangdong) Co., Ltd. employs a structural design with dual cooling fans and pin header connections. On one hand, the pin header connection between the conductive and heat dissipation components creates a gap, increasing the heat dissipation area within the housing. On the other hand, one cooling fan is connected to one side of the conductive component, and the other to one side of the light-emitting component, rapidly cooling the conductive and light-emitting components installed within the housing from two directions. Furthermore, the simultaneous operation of both cooling fans accelerates airflow within the cavity, allowing other components installed within the housing to also be rapidly cooled. This achieves rapid heat dissipation and cooling of the LED automotive light, preventing damage due to prolonged insufficient cooling and extending its lifespan. This design overcomes the drawback of small LEDs, which make it difficult to effectively dissipate heat during operation, leading to increased internal temperature and accelerated aging, thus reducing the lifespan of the LED automotive light. Additionally, using fans would make the light structure more complex and increase costs. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a heat dissipation structure for vehicle lighting drive modules to solve the problem.

[0006] The technical solution adopted in this utility model is as follows:

[0007] A heat dissipation structure for a vehicle lighting drive module includes a thermoelectric separation PCB board, a high-power DC-DC chip, thermally conductive adhesive, and a shielding heat sink. The shielding heat sink has a heat-absorbing surface and a heat-conducting surface, which is integrally covered by the high-power DC-DC chip. The heat-absorbing surface is recessed and bonded to the upper surface of the high-power DC-DC chip via thermally conductive adhesive. The heat-conducting surface is also recessed and bonded to the metal substrate of the thermoelectric separation PCB board via thermally conductive adhesive.

[0008] This utility model relates to a heat dissipation structure for vehicle lighting drive modules. It is scientifically designed, simple and compact in structure, and has both shielding and heat dissipation functions. It is easy to install and use, safe and reliable in operation, and can quickly dissipate the heat generated by high-power DC-DC chips, effectively reducing chip temperature, improving heat dissipation efficiency, extending chip lifespan, and is low in cost and durable. Attached Figure Description

[0009] The accompanying drawings, which are provided to further illustrate this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application.

[0010] Figure 1 This is a schematic diagram of the heat dissipation structure of the present invention used in a vehicle lighting drive module;

[0011] Among them: 1-thermal separation PCB board, 2-high power DC-DC chip, 3-thermal conductive adhesive, 4-shielding heat sink, 4a-heat absorption surface, 4b-thermal conductive surface. Detailed Implementation

[0012] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described below are only used to explain this utility model. In these descriptions, key terms such as "heat-absorbing surface" and "heat-conducting surface" are used only for the convenience of describing this utility model and simplifying the description, and therefore should not be construed as limiting this utility model.

[0013] like Figure 1As shown, this utility model discloses a heat dissipation structure for a vehicle lighting drive module, comprising a thermoelectric separation PCB board 1, a high-power DC-DC chip 2, thermally conductive adhesive 3, and a shielding heat sink 4. The shielding heat sink 4 serves both shielding and heat dissipation functions, featuring a heat-absorbing surface 4a and a heat-conducting surface 4b. It is entirely covered by the high-power DC-DC chip. The heat-absorbing surface 4a is recessed and adheres to the upper surface of the high-power DC-DC chip 2 of the vehicle lighting drive module via the thermally conductive adhesive 3, transferring heat away. The heat-conducting surface 4b is also recessed and adheres to the thermal layer of the metal substrate of the thermoelectric separation PCB board 1 via the thermally conductive adhesive 3, rapidly dissipating heat through thermal conduction. In this embodiment, the thermoelectric separation PCB board 1 is a copper substrate with a structure where the circuit layer and thermal layer are physically separated. The thermal layer can directly contact the heat-generating element, forming a zero-thermal-resistance heat dissipation path. Its thermal conductivity is 380W-400W / m·K, and its thermal resistance is ≤1.0 / W, close to the theoretical limit, allowing heat to be directly dissipated without intermediate losses. This technology is suitable for situations where there is insufficient space inside the lamp to attach a heat sink to the back of a high-power DC-DC chip. This structure utilizes the existing shielding heat shield structure, which not only does not affect the shielding effect, but also can quickly dissipate the heat generated by the high-power DC-DC chip, more effectively reduce the chip temperature, improve heat dissipation efficiency, and extend the chip's lifespan.

[0014] The above description is only a general embodiment of this utility model. For those skilled in the art, there are various other embodiments with modifications and variations, which will not be elaborated here. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model are included within the protection scope claimed by this utility model.

Claims

1. A heat dissipation structure for a vehicle lighting drive module, comprising a thermoelectrically separated PCB board (1), a high-power DC-DC chip (2), thermally conductive adhesive (3), and a shielding heat sink (4), characterized in that, The shielding heat dissipation cover (4) is provided with a heat absorption surface (4a) and a heat conduction surface (4b), and is fully covered by the high-power DC-DC chip. The heat absorption surface (4a) is recessed and is bonded to the upper surface of the high-power DC-DC chip (2) by thermally conductive adhesive (3), and the heat conduction surface (4b) is recessed and is bonded to the metal substrate of the thermoelectric separation PCB board (1) by thermally conductive adhesive (3).

Images