Closed water channel cooling structure, power module and electronic equipment
The closed-channel cooling structure manufactured by stamping solves the problems of low cooling efficiency and high material cost caused by the gaps in the existing power module water cooling structure, achieving the effects of efficient heat dissipation and cost reduction.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XINGAN TECH CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-05-05
AI Technical Summary
The existing water cooling structure of the power module has gaps that result in low cooling efficiency, and the use of heavy copper plates in the existing closed water channels increases costs.
The water channel base plate and heat dissipation pins are manufactured by stamping, which reduces gaps and uses thinner materials. Reflow welding is used to ensure reliable connection and form a closed water channel structure.
It improves cooling efficiency, reduces thermal resistance, lowers weight and cost, and meets the needs of electronic devices in complex environments.
Smart Images
Figure CN224205477U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of power modules, and specifically relates to a closed-loop water cooling structure, a power module, and electronic equipment. Background Technology
[0002] In high-power applications such as motor control, new energy vehicles, inverters, and photovoltaic energy storage, heat dissipation of power modules (such as IGBTs and SiC MOSFETs) is crucial. Water cooling has become the mainstream solution for high-power scenarios due to its efficient and uniform cooling capabilities.
[0003] Existing water cooling structures for power modules include two types. One is an open-channel system, where the power module exposes its heat dissipation surface or heat sink pins, forming a water channel with the die-cast housing. Cooling water flows along the channel to carry away heat. This type of die-cast housing is typically heavy, and to prevent collisions with the heat sink pins during assembly, gaps must be maintained between the heat sink pins and the die-cast housing. These gaps include those on both sides of the heat sink pins and those between the bottom of the heat sink pins and the die-cast housing. Furthermore, the draft angle created by the die-casting process results in particularly large side gaps. When the coolant flows, the presence of these gaps allows coolant to easily flow through them, reducing the cooling effect.
[0004] Another type is a closed water channel, which uses copper plates to be brazed together on the radiator to form a closed water channel. Due to process limitations, thicker copper plates are required, which not only greatly increases the weight but also increases the cost.
[0005] Therefore, a new type of water-cooling structure is needed to solve the above problems. Utility Model Content
[0006] To address the shortcomings of the prior art, this application provides a closed-loop cooling structure, a power module, and electronic equipment. The water channel base plate is obtained using a stamping process, allowing the water channel to be closer to the radiator's heat dissipation pins, reducing the gap and enhancing heat exchange. Furthermore, it reduces weight and material usage, thus lowering costs.
[0007] The technical effect to be achieved in this application is accomplished through the following solution:
[0008] According to a first aspect of this application, a closed-loop cooling structure is provided, including a radiator body mounted on a power module and a water channel base plate. The radiator body is provided with a matrix of heat dissipation pins. The water channel base plate is integrally formed by stamping. Water inlets and outlets are provided on the water channel base plate on the front and rear sides of the heat dissipation pins. The bottom end of the heat dissipation pin is connected to the bottom surface of the water channel base plate.
[0009] Preferably, the waterway bottom plate is made of aluminum alloy, copper, stainless steel or SPCC sheet by stamping.
[0010] Preferably, the waterway bottom plate is made of sheet metal with a thickness of 0.5mm-3mm by stamping.
[0011] Preferably, the bottom plate of the waterway is stamped to form a waterway groove, and the inlet and outlet are located at the front and rear ends of the waterway groove.
[0012] Preferably, the top of the water channel bottom plate is bent outward to form a fixing part, and the fixing part is welded to the radiator body.
[0013] Preferably, the bottom of the heat dissipation pin is welded to the bottom surface of the water channel groove by reflow soldering.
[0014] Preferably, the cross-section of the heat dissipation pin is one of a circle, an ellipse, or a polygon.
[0015] Preferably, the heat dissipation pin is a wavy heat dissipation strip, the trough of the heat dissipation strip is connected to the bottom surface of the water channel base plate, and the crest of the heat dissipation strip is fixedly connected to the radiator body.
[0016] According to a second aspect of this application, a power module is provided that employs the aforementioned closed-loop water cooling structure.
[0017] According to a third aspect of this application, an electronic device is provided, comprising a power module manufactured using the aforementioned closed-channel cooling structure.
[0018] According to one embodiment of this application, the beneficial effects of employing this closed-loop cooling structure are as follows:
[0019] Using an integrated stamped sealed water channel can reduce the gap between the water channel sides and the heat dissipation pin. The bottom end of the heat dissipation pin is in contact with the bottom surface of the water channel base plate, avoiding the gap between the heat dissipation pin and the water channel base plate, allowing more coolant to flow through the heat dissipation surface, which can reduce the thermal resistance between the radiator and the coolant by more than 5%.
[0020] Using a one-piece stamped closed water channel can reduce material consumption, use thinner stamped plates, reduce the overall weight of the cooling equipment, and lower costs. Attached Figure Description
[0021] To more clearly illustrate the embodiments of this application or the existing technical solutions, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of a closed water channel cooling structure in one embodiment of this application;
[0023] Figure 2 for Figure 1 A side view of the bottom slab of the middle channel;
[0024] Figure 3 for Figure 1 Schematic diagram of the heat dissipation pin structure;
[0025] Figure 4 This is a side view of the heat dissipation pin structure in another embodiment. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0027] like Figures 1 to 3 As shown, a closed-loop cooling structure in one embodiment of this application includes a radiator body 100 and a water channel base plate 200 mounted on a power module. The radiator body 100 is provided with a matrix arrangement of heat dissipation pins 110. The water channel base plate 200 is integrally formed by stamping. The water channel base plate 200 on the front and rear sides of the heat dissipation pins 110 is provided with a water inlet 210 and a water outlet 220. The bottom end of the heat dissipation pins 110 is connected to the bottom surface of the water channel base plate 200.
[0028] In this embodiment, the waterway bottom plate 200 is made of 0.5mm-3mm sheet material by stamping. The sheet material is, for example, aluminum alloy, copper, stainless steel or SPCC sheet (cold-rolled carbon steel sheet material). The surface of the copper sheet is treated by nickel plating, tin plating or the like.
[0029] The water channel base plate 200 is stamped to form a water channel groove 201, with an inlet 210 and an outlet 220 located at the front and rear ends of the water channel groove 201. The depth of the water channel groove 201 is consistent with the length of the heat dissipation pin 110, allowing the bottom of the heat dissipation pin 110 to make tight contact with the bottom of the water channel, avoiding gaps. This ensures that the coolant can only flow through the gaps between the heat dissipation pins 110 to carry away heat, increasing the flow rate on the heat dissipation surface and thus greatly improving the heat dissipation efficiency.
[0030] Furthermore, the heat dissipation pin 110 contacts the water channel base plate 200, which can conduct heat to the water channel base plate 200, greatly increasing the heat dissipation area and helping the coolant to absorb heat efficiently.
[0031] In order to improve the connection reliability between the heat dissipation pin 110 and the water channel base plate 200, and to improve the heat conduction efficiency, the bottom of the heat dissipation pin 110 is welded to the bottom surface of the water channel groove 201 by reflow soldering.
[0032] For example, a specific soldering method is to first apply solder paste (solder paste + flux) to the bottom of the heat sink pin 110, and after the water channel base plate 200 is installed, melt the solder paste by heating and then cool it to form a reliable connection.
[0033] To facilitate the connection between the water channel base plate 200 and the radiator body 100, the top of the water channel base plate 200 is bent outward to form a fixing part 202, which is then welded to the radiator body 100.
[0034] The surface of the fixing part 202 is flat and can fit against the bottom surface of the radiator body 100. It is fixedly connected by brazing or reflow soldering to ensure the sealing effect and heat conduction efficiency, so that the heat of the radiator body 100 can be smoothly transferred to the water channel bottom plate 200, increasing the heat dissipation surface and further improving the heat dissipation efficiency.
[0035] The welded radiator body 100 and the water channel base plate 200 form a complete racetrack-shaped weld surface, ensuring a strong connection and the ability to withstand high coolant pressure. An anti-misalignment groove 101 is provided on one side of the radiator body 100.
[0036] In one embodiment of this application, the heat dissipation pins 110 have a cross-section that is circular, elliptical, or polygonal, and are arranged in a matrix-like staggered pattern. The bottom surface of the heat dissipation pins 110 is horizontal, allowing them to make close contact with the water channel bottom plate 200. The heat dissipation pins 110 have a cylindrical structure with a circular, elliptical, or polygonal cross-section, making them easy to machine on a single piece of sheet metal. The integrated structure also facilitates heat transfer.
[0037] In another embodiment, such as Figure 4 As shown, the heat dissipation pin 110 is a wavy heat dissipation strip 111, which is a metal strip processed into a wavy shape and then fixed to the radiator body 100 by welding or other methods. The troughs of the heat dissipation strip 111 are connected to the bottom surface of the water channel base plate 200, and the crests of the heat dissipation strip 111 are fixedly connected to the radiator body 100. Adjacent heat dissipation strips 111 are arranged alternately, that is, the crest of one wave is located at the trough of the next wave.
[0038] The wavy heat sink 111 is easy to manufacture, which helps reduce processing costs and improve production efficiency. The wavy heat sink 111 can also increase the contact area with the coolant, which helps to improve heat dissipation efficiency and maintain high heat dissipation efficiency even at low flow rates;
[0039] The wavy heat dissipation pin 110 has a certain degree of elasticity, which can accept greater installation errors and allow extrusion deformation between the water channel base plate 200 and the heat dissipation pin 110, thus making the device suitable for use in vibration environments (such as new energy vehicle motors).
[0040] The closed-loop cooling structure of this embodiment can be applied to traditional power modules, which can improve the heat dissipation efficiency of the power modules and help improve their performance.
[0041] Electronic devices using the aforementioned power modules can adapt to more complex and harsh environments, thus improving the reliability of electronic devices.
[0042] According to one embodiment of this application, the beneficial effects of employing this closed-loop cooling structure are as follows:
[0043] Using an integrated stamped sealed water channel can reduce the gap between the water channel sides and the heat dissipation pin. The bottom end of the heat dissipation pin is in contact with the bottom surface of the water channel base plate, avoiding the gap between the heat dissipation pin and the water channel base plate, allowing more coolant to flow through the heat dissipation surface, which can reduce the thermal resistance between the radiator and the coolant by more than 5%.
[0044] Using a one-piece stamped closed water channel can reduce material consumption, use thinner stamped plates, reduce the overall weight of the cooling equipment, and lower costs.
[0045] It should be noted that the above detailed descriptions are exemplary and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0046] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0047] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented in sequences other than those illustrated or described herein.
[0048] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or apparatus.
[0049] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, such as rotated 90 degrees or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.
[0050] In the detailed description above, reference has been made to the accompanying drawings, which form part of this document. In the drawings, similar symbols typically identify similar parts unless the context otherwise indicates otherwise. The illustrated embodiments described in the detailed specification, drawings, and claims are not intended to be limiting. Other embodiments may be used and other changes may be made without departing from the spirit or scope of the subject matter presented herein.
[0051] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A closed-loop water cooling structure, comprising a radiator body mounted on a power module and a water channel base plate, wherein the radiator body is provided with a matrix of heat dissipation pins, characterized in that, The water channel base plate is integrally formed by stamping. The water channel base plate on both the front and rear sides of the heat dissipation pin is provided with water inlet and water outlet. The bottom end of the heat dissipation pin is connected to the bottom surface of the water channel base plate.
2. The closed-loop cooling structure according to claim 1, characterized in that, The waterway bottom plate is made of aluminum alloy, copper, stainless steel or SPCC sheet by stamping.
3. The closed-loop water channel cooling structure according to claim 2, characterized in that, The waterway bottom plate is made of sheet metal with a thickness of 0.5mm-3mm by stamping.
4. The closed-loop water channel cooling structure according to claim 3, characterized in that, The bottom plate of the waterway is stamped to form a waterway groove, and the inlet and outlet are located at the front and rear ends of the waterway groove.
5. The closed-loop cooling structure according to claim 3, characterized in that, The top of the water channel bottom plate is bent outwards to form a fixing part, which is welded to the radiator body.
6. The closed-loop cooling structure according to claim 4, characterized in that, The bottom of the heat dissipation pin is welded to the bottom surface of the water channel groove by reflow soldering.
7. The closed-loop water channel cooling structure according to claim 1, characterized in that, The cross-section of the heat dissipation pin is one of a circle, an ellipse, or a polygon.
8. The closed-loop cooling structure according to claim 1, characterized in that, The heat dissipation pin is a wavy heat dissipation strip, the trough of the heat dissipation strip is connected to the bottom surface of the water channel base plate, and the crest of the heat dissipation strip is fixedly connected to the radiator body.
9. A power module, characterized in that, The closed-loop cooling structure according to any one of claims 1 to 8 is adopted.
10. An electronic device, characterized in that, A power module manufactured using the closed-loop cooling structure described in any one of claims 1 to 8.