Image sensor packaging structure with stable transparent cover plate

By using a combination structure of supporting sidewalls and sidewall extension plates in the image sensor packaging structure, the problem of transparent cover plate falling off under vibration environment is solved, the stable fixation of transparent cover plate and the accuracy of light path are achieved, and the imaging accuracy is improved.

CN224205533UActive Publication Date: 2026-05-05HUZHOU HONGWEI ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
HUZHOU HONGWEI ELECTRONIC TECHNOLOGY CO LTD
Filing Date
2025-06-03
Publication Date
2026-05-05

AI Technical Summary

Technical Problem

In existing image sensor packaging structures, the transparent cover plate is prone to detachment under vibration due to unstable support sidewall connections, affecting the normal operation of the sensing chip, and the presence of optical adhesive affects the light path.

Method used

The structure employs a combination of supporting sidewalls and sidewall extension plates. By inserting the sidewall extension plates into the grooves of the supporting sidewalls, the contact area is increased, and the transparent cover is fixedly connected by interference fit and adhesive to ensure stability.

Benefits of technology

This improves the positional stability of the transparent cover relative to the image sensor, avoiding the problem of detachment due to vibration, while ensuring the accuracy of the light path and imaging precision.

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Abstract

The utility model discloses an image sensor packaging structure with a stable transparent cover plate, which relates to the technical field of semiconductor packaging and comprises an image sensor, a substrate, a supporting side wall, a side wall extension plate and the transparent cover plate. The image sensor is connected to the substrate through a plurality of leads; the image sensor comprises a photosensitive area; the supporting side wall is arranged on the upper surface of the image sensor; the supporting side wall is annular; the photosensitive area is located in the annular supporting side wall; the lead is positioned outside the annular support side wall; a groove is formed in the lower side of the side wall extension plate; the upper ends of the supporting side walls can be inserted into the grooves to be fixed. The transparent cover plate is fixed on the upper surface of the side wall extension plate. According to the image sensor packaging structure with the stable transparent cover plate provided by the utility model, the problem that the sensing chip cannot work normally due to the fact that the transparent cover plate is easy to fall off due to external environment vibration in the prior art is solved; according to the utility model, the position relation of the transparent cover plate relative to the image sensor is more stable.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a transparent cover plate-stabilized image sensor packaging structure. Background Technology

[0002] An image sensor is a core component of an image device that converts optical sensing signals into electronic signals. When packaging an image sensor, it is usually electrically connected to the substrate, typically by wire bonding. Pads or other electrical connection points are provided on the substrate to connect the image sensor to external electronic circuits, enabling signal sensing, processing, and interaction.

[0003] Image sensor packaging structures typically require the use of sealant to seal the leads to ensure their stability. Then, a sidewall plate is placed around the photosensitive area of ​​the image sensor above the image sensor chip as a support sidewall. A transparent cover plate is placed on the support sidewall. The support sidewall limits the distance between the transparent cover plate and the photosensitive area of ​​the image sensor to avoid ghosting.

[0004] However, the transparent cover is supported by the upper surface of the supporting sidewall, and the entire weight of the transparent cover is provided by the supporting sidewall. Since the connection part is very small, only the upper edge of the supporting sidewall, the connection stability is poor. When this equipment is used in environments with vibration, the connection is prone to loosening and separation due to vibration, and the transparent cover may detach from the supporting sidewall, causing changes in the position and angle of the transparent cover. These changes in position may affect the normal operation of the sensing chip. For example, the image sensor packaging structure disclosed in Chinese patent application number 202320773884.9 utilizes optical adhesive placed on the upper side of the photosensitive area of ​​the image sensor, and then a transparent cover is fixed on the upper side of the optical adhesive. However, the presence of the optical adhesive, even though it is translucent, still affects the path of light, affecting the image sensor's reception of light. Utility Model Content

[0005] To address the aforementioned technical issues, the transparent cover plate and stable image sensor packaging structure provided by this utility model can make the positional relationship between the transparent cover plate and the image sensor more stable.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] This utility model provides a stable image sensor packaging structure with a transparent cover, comprising an image sensor, a substrate, a supporting sidewall, a sidewall extension plate, and a transparent cover plate. The image sensor is connected to the substrate via several leads. The image sensor includes a photosensitive area. The side of the image sensor on which the photosensitive area is located is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor. The supporting sidewall is annular. The photosensitive area is located within the annularity of the supporting sidewall. The leads are located outside the annularity of the supporting sidewall. A groove is formed on the lower side of the sidewall extension plate. The groove matches the upper end of the supporting sidewall. The upper surface of the sidewall extension plate is a plane. The upper surface area of ​​the sidewall extension plate is larger than the upper surface area of ​​the upper end of the sidewall. The sidewall extension plate is fixed above the supporting sidewall. The upper end of the supporting sidewall can be inserted into the groove for fixation. The transparent cover plate is fixed to the upper surface of the sidewall extension plate.

[0008] The transparent cover plate provides a stable image sensor packaging structure. Preferably, the supporting sidewall is a square tube; the lower side of the sidewall extension plate is provided with a downwardly extending protrusion; the protrusion is a square tube; the lower side of the protrusion is provided with the groove; the groove matches the end shape of the supporting sidewall; the inner and outer walls of the square tube of the supporting sidewall are both in contact with the sidewall of the groove.

[0009] The transparent cover plate provides a stable image sensor packaging structure. Preferably, the upper side of the sidewall extension plate is a square plate; a light-transmitting hole is opened in the middle of the square plate; the lower bottom surface of the transparent cover plate is fixed against the upper surface of the square plate; the transparent cover plate can cover the light-transmitting hole; the light-transmitting hole is aligned with the center of the photosensitive area.

[0010] The transparent cover plate provides a stable image sensor packaging structure. Preferably, the upper surface of the square plate is provided with a receiving groove; the shape of the receiving groove is the same as the shape of the transparent cover plate; the light-transmitting hole is opened at the bottom of the receiving groove.

[0011] The transparent cover plate of the image sensor packaging structure provided by this utility model preferably has the side wall extension plate and the supporting side wall fixedly connected by adhesive.

[0012] The transparent cover plate provides a stable image sensor packaging structure. Preferably, the outer diameter of the upper end of the supporting sidewall is interference-fitted with the inner diameter of the groove.

[0013] The above technical solution has the following advantages or beneficial effects:

[0014] This utility model discloses a transparent cover plate-stabilized image sensor packaging structure, relating to the field of semiconductor packaging technology. It includes an image sensor, a substrate, a supporting sidewall, a sidewall extension plate, and a transparent cover plate. The image sensor is connected to the substrate via several leads. The image sensor includes a photosensitive area; the side of the image sensor where the photosensitive area is located is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor; the supporting sidewall is annular; the photosensitive area is located within the annularity of the supporting sidewall; the leads are located outside the annularity of the supporting sidewall; a groove is formed on the lower side of the sidewall extension plate; the groove matches the upper end of the supporting sidewall; the upper surface of the sidewall extension plate is a plane; the upper surface area of ​​the sidewall extension plate is larger than the upper surface area of ​​the upper end of the sidewall; the sidewall extension plate is fixed above the supporting sidewall; the upper end of the supporting sidewall can be inserted into the groove for fixation; the transparent cover plate is fixed to the upper surface of the sidewall extension plate. The transparent cover plate provided by this invention provides a stable image sensor packaging structure, which solves the problem in the prior art that the transparent cover plate is prone to falling off due to external environmental vibrations, causing the sensing chip to malfunction. This invention can make the positional relationship between the transparent cover plate and the image sensor more stable. Attached Figure Description

[0015] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0016] Figure 1 This is a schematic diagram of the overall structure of the transparent cover plate-stabilized image sensor packaging structure provided in Embodiment 1 of this utility model. Detailed Implementation

[0017] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without inventive effort are within the protection scope of the present utility model.

[0018] Example 1:

[0019] The transparent cover plate provides a stable image sensor packaging structure in Embodiment 1 of this utility model, such as... Figure 1As shown, the system includes an image sensor 1, a substrate 2, a supporting sidewall 3, a sidewall extension plate 4, and a transparent cover plate 5. The image sensor 1 is connected to the substrate 2 via several leads 6. The image sensor 1 includes a photosensitive area 11. The side of the image sensor 1 on which the photosensitive area 11 is located is the upper surface of the image sensor 1. The supporting sidewall 3 is located on the upper surface of the image sensor 1. The supporting sidewall 3 is annular. The photosensitive area 11 is located inside the annular shape of the supporting sidewall 3. The leads 6 are located outside the annular shape of the supporting sidewall 3. A groove 41 is provided on the lower side of the sidewall extension plate 4. The groove 41 matches the upper end of the supporting sidewall 3. The upper surface of the sidewall extension plate 4 is a plane. The area of ​​the upper surface of the sidewall extension plate 4 is larger than the area of ​​the upper surface of the sidewall. The sidewall extension plate 4 is fixed above the supporting sidewall 3. The upper end of the supporting sidewall 3 can be inserted into the groove 41 for fixation. The transparent cover plate 5 is fixed on the upper surface of the sidewall extension plate 4.

[0020] When the transparent cover plate of the stable image sensor packaging structure provided in Embodiment 1 of this utility model is working, the signal will pass through the transparent cover plate 5 and be received by the photosensitive area 11.

[0021] In actual assembly, the supporting sidewall 3 is first fixed to the image sensor. Filler adhesive is applied to the outside of the lead wire 6 between the substrate 2 and the image sensor 1. After the filler adhesive has cured, the sidewall extension plate 4 is then applied to the upper side of the supporting sidewall 3 to avoid the sidewall extension plate 4 extending horizontally from affecting the use of the filler adhesive.

[0022] Unlike existing technologies that use several sidewalls to support the transparent cover plate 5 at the edge, this embodiment provides a sidewall extension plate 4 on the supporting sidewall 3. The supporting sidewall 3 is connected by the sidewall extension plate 4. By inserting the upper end of the supporting sidewall 3 into the groove 41 on the lower side of the sidewall extension plate 4, the contact area between the two is increased, thereby achieving a stable connection between the sidewall extension plate 4 and the supporting sidewall 3. Then, the transparent cover plate 5 is fixed on the upper surface of the sidewall extension plate 4, which has a larger supporting surface, so that the transparent cover plate 5 can be fixed more stably and the connection is less likely to separate due to vibration.

[0023] The transparent cover plate provided in Embodiment 1 of this utility model provides a stable image sensor packaging structure, which solves the problem in the prior art that the transparent cover plate is prone to falling off due to external environmental vibration, causing the sensing chip to malfunction. This utility model can make the positional relationship between the transparent cover plate and the image sensor more stable.

[0024] As a preferred embodiment, in this case, the supporting sidewall 3 is a square tubular shape; a downwardly extending protrusion 42 is provided on the lower side of the sidewall extension plate 4; the protrusion is a square tubular shape; a groove 41 is formed on the lower side of the protrusion 42; the groove 41 matches the shape of the upper end of the supporting sidewall 3; the inner and outer walls of the square tubular supporting sidewall 3 are both in contact with the sidewall of the groove 41. The square tubular supporting sidewall 3 is simultaneously in contact with the inner and outer walls of the groove 41, forming a three-dimensional spatial constraint (the vertical, horizontal and longitudinal directions are all restricted), which has better resistance to torsion and shear compared to single-sided contact support (such as the structure in the prior art where the transparent cover plate is directly fixed to the upper surface of the supporting sidewall 3).

[0025] In this embodiment, the upper side of the sidewall extension plate 4 is a square plate; a light-transmitting hole 431 is opened in the middle of the square plate; the bottom surface of the transparent cover plate 5 is fixed against the upper surface of the square plate; the transparent cover plate 5 can cover the light-transmitting hole 431; the light-transmitting hole 431 is aligned with the center of the photosensitive area 11. In actual use, after the light passes through the transparent cover plate 5, it passes through the light-transmitting hole 431 of the square plate and illuminates the photosensitive area 11; in this embodiment, the groove 41 of the square structure and the supporting sidewall 3 form a unique alignment relationship (four sides aligned), which can automatically correct the positional deviation during assembly, avoid the tilt of the light path caused by the angle deviation, and avoid the misalignment of the light-transmitting hole and the photosensitive area.

[0026] As a preferred embodiment, in this case, a receiving groove 432 is formed on the upper surface of the square plate; the shape of the receiving groove 432 is the same as that of the transparent cover plate 5; the light-transmitting hole 431 is formed at the bottom of the receiving groove 432. The shape-matching receiving groove 432 provides a mechanical positioning reference for the transparent cover plate 5, avoiding offset and tilting problems caused by tolerances, ensuring that the optical axis of the transparent cover plate is strictly aligned with the optical axis of the photosensitive area below (the light-transmitting hole 431 is aligned with the center of the photosensitive area 11), and improving imaging accuracy.

[0027] To further improve the connection stability between the side wall extension plate 4 and the supporting side wall 3, as a preferred embodiment, the side wall extension plate 4 and the supporting side wall 3 are fixedly connected by adhesive.

[0028] In this embodiment, the upper outer diameter of the supporting sidewall 3 is interference-fitted with the inner diameter of the groove 41. The interference fit generates radial compressive stress through elastic deformation between the parts, forming a mechanical lock between the supporting sidewall 3 and the sidewall extension plate 4 without adhesive. This avoids positional deviations caused by uneven adhesive filling or curing deformation, resulting in smaller optical axis deviations between the transparent cover and the photosensitive area, and higher precision. In addition, since no adhesive is required, no additional tooling for dispensing adhesive is needed during assembly. The alignment of the sidewall extension plate and the supporting sidewall can be ensured solely by the interference fit, improving assembly efficiency.

[0029] In summary, this utility model discloses a transparent cover plate-stabilized image sensor packaging structure, relating to the field of semiconductor packaging technology. It includes an image sensor, a substrate, a supporting sidewall, a sidewall extension plate, and a transparent cover plate. The image sensor is connected to the substrate via several leads. The image sensor includes a photosensitive area. The side of the image sensor where the photosensitive area is located is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor. The supporting sidewall is annular. The photosensitive area is located within the annularity of the supporting sidewall. The leads are located outside the annularity of the supporting sidewall. A groove is formed on the lower side of the sidewall extension plate. The groove matches the upper end of the supporting sidewall. The upper surface of the sidewall extension plate is a plane. The upper surface area of ​​the sidewall extension plate is larger than the upper surface area of ​​the upper end of the sidewall. The sidewall extension plate is fixed above the supporting sidewall. The upper end of the supporting sidewall can be inserted into the groove for fixation. The transparent cover plate is fixed to the upper surface of the sidewall extension plate. The transparent cover plate provided by this invention provides a stable image sensor packaging structure, which solves the problem in the prior art that the transparent cover plate is prone to falling off due to external environmental vibrations, causing the sensing chip to malfunction. This invention can make the positional relationship between the transparent cover plate and the image sensor more stable.

[0030] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A transparent cover plate stabilized image sensor packaging structure, characterized in that, Includes an image sensor, a substrate, supporting sidewalls, sidewall extension plates, and a transparent cover plate; The image sensor is connected to the substrate via several leads; The image sensor includes a photosensitive area; the side of the image sensor on which the photosensitive area is disposed is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor; The supporting sidewall is annular; the photosensitive area is located inside the annular support sidewall; the lead wire is located outside the annular support sidewall. The sidewall extension plate has a groove on its lower side; the groove matches the upper end of the supporting sidewall; the upper surface of the sidewall extension plate is a plane; the upper surface area of ​​the sidewall extension plate is larger than the upper surface area of ​​the upper end of the sidewall; the sidewall extension plate is fixed above the supporting sidewall; the upper end of the supporting sidewall can be inserted into the groove for fixation. The transparent cover plate is fixed to the upper surface of the side wall extension plate.

2. The transparent cover plate-stabilized image sensor packaging structure as described in claim 1, characterized in that, The supporting sidewall is a square tubular shape; The sidewall extension plate has a downwardly extending protrusion on its lower side; the protrusion is a square tube; the groove is formed on the lower side of the protrusion; the groove matches the end shape of the supporting sidewall; the inner and outer walls of the square tube of the supporting sidewall are both in contact with the sidewall of the groove.

3. The transparent cover plate-stabilized image sensor packaging structure as described in claim 2, characterized in that, The upper side of the sidewall extension plate is a square plate; a light-transmitting hole is opened in the middle of the square plate; the bottom surface of the transparent cover plate is fixed against the upper surface of the square plate; the transparent cover plate can cover the light-transmitting hole; the light-transmitting hole is aligned with the center of the photosensitive area.

4. The transparent cover plate-stabilized image sensor packaging structure as described in claim 3, characterized in that, The upper surface of the square plate is provided with a receiving groove; The shape of the receiving groove is the same as that of the transparent cover plate; the light-transmitting hole is opened at the bottom of the receiving groove.

5. The transparent cover plate-stabilized image sensor packaging structure as described in claim 1, characterized in that, The side wall extension plate is fixedly connected to the supporting side wall by adhesive.

6. The transparent cover plate-stabilized image sensor packaging structure as described in claim 2, characterized in that, The outer diameter of the upper end of the supporting sidewall is interference-fitted with the inner diameter of the groove.

Citation Information

Patent Citations

  • Image sensor packaging structure

    CN219350231U