Semiconductor packaging neutralization solution removal frame oxidation equipment

Abstract

The utility model discloses equipment for removing oxidation of a frame by using a neutralizing solution in semiconductor packaging, belonging to the technical field of semiconductor packaging. The equipment comprises a cleaning box which is divided into a neutralizing liquid bin and a pure water washing bin by a partition plate. A heating coil is arranged at the bottom of the neutralizing liquid bin, a temperature sensor is arranged on the side wall, and the temperature can be accurately controlled to be 70-80 DEG C; a motor at the top of the partition plate drives the rotating arm, the lower cylinder and the cleaning frame, and frame parts are converted between the two bins. A plurality of cleaning nozzles are arranged on the side wall of the pure water washing bin. A control panel on the side wall of the cleaning box can comprehensively control operation of all parts, for example, the power of a heating coil is controlled according to the temperature, parameters of a motor, an air cylinder, a spray head and an air heater are set, and the soaking time is timed. The equipment effectively solves the problems that a traditional method is poor in cleaning effect, low in efficiency, inaccurate in control, low in automation degree and the like, the semiconductor packaging frame processing quality and production efficiency are improved, and the product performance and stability are guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a device for removing frame oxidation by a semiconductor packaging neutralization liquid. Background Technology

[0002] In semiconductor packaging, the frame is a critical component, and its performance and quality play a decisive role in the overall performance of the semiconductor device. However, in the packaging process, the frame is prone to oxidation after contact with the neutralizing liquid, which can seriously affect the frame's conductivity, mechanical strength, and compatibility with other components.

[0003] Currently, traditional methods for removing framework oxidation have several problems, including:

[0004] Poor cleaning results: Some conventional cleaning equipment only uses a single water washing method, which cannot completely remove neutralization liquid residue and stubborn oxide layer, resulting in impurities remaining on the frame surface, affecting the quality and stability of semiconductor packaging, and thus reducing the product yield.

[0005] Low processing efficiency: Some traditional equipment lacks reasonable planning and coordination in processes such as cleaning and drying, with each step relatively independent, resulting in a long processing time. This not only reduces production efficiency but also increases production costs, making it difficult to meet the needs of large-scale production.

[0006] Lack of precise control: Traditional equipment lacks precision in controlling key parameters such as temperature, time, and liquid flow rate. For example, inaccurate temperature control during oxide layer removal may lead to incomplete removal or overtreatment, affecting frame performance. Improper time control can also prevent the cleaning or drying process from achieving optimal results.

[0007] Low level of automation: Many existing devices require extensive manual operation, from placing parts and switching processes to adjusting parameters. This not only increases labor costs but also makes it difficult to guarantee consistent product quality due to the variability in manual operation.

[0008] In summary, the development of a device capable of effectively removing frame oxidation, improving cleaning efficiency and quality, achieving precise control, and possessing a high degree of automation is urgently needed. The semiconductor packaging neutralization liquid frame oxidation removal device provided by this invention is designed to solve the above problems and aims to improve the overall level of frame processing in semiconductor packaging processes. Utility Model Content

[0009] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor packaging neutralization liquid removal frame oxidation device.

[0010] To achieve the above objectives, the present invention adopts the following technical solution:

[0011] Overall structure of the equipment

[0012] A device for removing oxidation from a semiconductor packaging frame using a neutralizing liquid includes a cleaning tank with a partition at the center, which divides the cleaning tank into two equal-sized neutralizing liquid chambers and a pure water washing chamber.

[0013] Neutralization tank related structures

[0014] The bottom of the neutralization liquid tank is equipped with a heating coil for heating the neutralization liquid; the side wall of the neutralization liquid tank is also equipped with a temperature sensor, which can monitor the temperature of the neutralization liquid in real time and feed the temperature data back to the control panel so as to achieve precise control of the temperature of the neutralization liquid and keep the neutralization liquid in the appropriate reaction temperature range of 70-80 degrees Celsius.

[0015] Rotating and lifting structure

[0016] A motor is mounted on the top of the partition, and a rotating shaft is coaxially mounted on the top of the motor's shaft. A rotating arm is mounted on the top of the rotating arm. A cylinder is vertically mounted on the top of the rotating arm, and a cleaning frame for placing the frame parts is mounted on the bottom of the cylinder. The motor drives the rotating shaft and rotating arm to rotate, which can switch the cleaning frame between the neutralizing liquid tank and the pure water washing tank; the cylinder can control the lifting and lowering of the cleaning frame, realizing the operation of immersing the cleaning frame into the liquid tank or removing it from the liquid tank.

[0017] Pure water cleaning structure

[0018] The side walls of the pure water washing chamber are equipped with a number of cleaning nozzles. When the washing frame enters the pure water washing chamber, the cleaning nozzles can spray water onto the frame parts according to the set water pressure and time to rinse them and remove residual neutralizing liquid and impurities.

[0019] Other structures

[0020] The cleaning tank has a control panel on its side wall. This panel receives temperature data from the temperature sensor and controls the heating power of the heating coil according to the preset temperature range. It also sets and controls the motor's rotation speed and angle, the cylinder's lifting stroke and speed, the water spray pressure and time from the cleaning nozzles, and the hot air blower's operating time and speed. It also has a soaking timer function; when the preset soaking time of 3-5 minutes is reached, the cylinder is raised. A hot air blower is also located on one side of the cleaning frame to dry the cleaned frame parts.

[0021] The beneficial effects of this utility model are as follows:

[0022] 1. This semiconductor packaging neutralization solution removal frame oxidation equipment divides the cleaning tank into a neutralization solution chamber and a pure water washing chamber. With the help of heating coils and temperature sensors, the temperature of the neutralization solution is precisely controlled. The cleaning frame is moved between the two chambers by a motor and cylinder. Combined with the rinsing of the cleaning nozzle and the drying of the hot air blower, it achieves efficient synergy between neutralization solution removal and frame oxidation treatment. It effectively solves the problems of poor cleaning effect, low efficiency, inaccurate control and low degree of automation of traditional methods. It significantly improves the frame processing quality and production efficiency, ensures product performance and stability, and reduces labor costs and defect rate.

[0023] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of a semiconductor packaging neutralization liquid removal frame oxidation device proposed in this utility model;

[0025] Figure 2 This is a top view of a semiconductor packaging neutralization liquid removal frame oxidation device proposed in this utility model;

[0026] Figure 3 This is a schematic diagram of the internal cross-sectional structure of a semiconductor packaging neutralization liquid removal frame oxidation device proposed in this utility model.

[0027] In the diagram: 1. Cleaning tank; 2. Baffle; 3. Neutralization liquid tank; 4. Pure water washing tank; 5. Motor; 6. Shaft; 7. Rotating arm; 8. Cylinder; 9. Cleaning frame; 10. Hot air blower; 11. Control panel; 12. Cleaning nozzle; 13. Heating coil; 14. Temperature sensor. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] Example 1, referring to Figures 1 to 3A device for removing oxidation from a semiconductor packaging frame using a neutralizing liquid includes a cleaning tank 1. The cleaning tank 1 has a partition 2 at its center, which divides the cleaning tank 1 into two equal-sized neutralizing liquid tanks 3 and a pure water washing tank 4. The bottom of the neutralizing liquid tank 3 is equipped with a heating coil 13, and the side wall of the neutralizing liquid tank 3 is also equipped with a temperature sensor 14. The top of the partition 2 is equipped with a motor 5, and the top shaft of the motor 5 is coaxially equipped with a rotating shaft 6. The top of the rotating shaft 6 is equipped with a rotating arm 7, and the top of the rotating arm 7 is vertically equipped with a cylinder 8. The bottom of the cylinder 8 is equipped with a cleaning frame 9 for placing the frame parts. The side walls of the pure water washing tank 4 are equipped with a number of cleaning nozzles 12.

[0030] In this embodiment, a control panel 11 is provided on the side wall of the cleaning tank 1, and a hot air blower 10 is also provided on one side of the cleaning frame 9. The control panel 11 is used to receive temperature data from the temperature sensor 14 and control the heating power of the heating coil 13 according to the preset temperature range of 70-80 degrees Celsius. It is also used to set and control the rotation speed and angle of the motor 5, the lifting stroke and speed of the cylinder 8, the water spray pressure and time of the cleaning nozzle 12, and the working time and wind speed of the hot air blower 10. It also has a soaking time timing function. When the preset soaking time of 3-5 minutes is reached, the cylinder 8 is controlled to rise.

[0031] This utility model provides a device for removing oxidation from semiconductor packaging frames using a neutralizing liquid, mainly comprising a cleaning tank 1. A partition 2 is centrally located in the cleaning tank 1, dividing it into two identical neutralizing liquid chambers 3 and a pure water washing chamber 4. The neutralizing liquid chamber 3 has a heating coil 13 at its bottom and a temperature sensor 14 on its side wall. A motor 5 is mounted on the top of the partition 2, with a rotating shaft 6 coaxially connected to the top of the motor 5. A rotating arm 7 is mounted on the top of the rotating shaft 6, and a cylinder 8 is vertically mounted on the top of the rotating arm 7. A cleaning frame 9 for placing frame parts is connected to the bottom of the cylinder 8. The pure water washing chamber 4 has several cleaning nozzles 12 on its side wall. Furthermore, a control panel 11 is located on the side wall of the cleaning tank 1, and a hot air blower 10 is located on one side of the cleaning frame 9.

[0032] Preparation

[0033] Inspection equipment

[0034] The operator first conducts a comprehensive inspection of the equipment, checking whether each component is securely installed, whether the wiring is normal, and whether there are any loose or damaged parts.

[0035] Check the liquid conditions in neutralization tank 3 and pure water washing tank 4 to ensure that neutralization tank 3 is filled with an appropriate amount of neutralization liquid, pure water washing tank 4 has sufficient pure water, and there is no leakage.

[0036] Check the operating status of the heating coil 13, temperature sensor 14, motor 5, cylinder 8, hot air blower 10, and cleaning nozzle 12 to ensure they are working properly.

[0037] Setting parameters

[0038] Various operating parameters are set via the control panel 11 on the side wall of the cleaning tank 1. The target temperature range of the neutralizing liquid is set to 70-80 degrees Celsius, the immersion time of the frame parts in the neutralizing liquid is 3-5 minutes, and parameters such as the rotation speed and angle of the motor 5, the lifting stroke and speed of the cylinder 8, the working time and wind speed of the hot air blower 10, and the water spray pressure and time of the cleaning nozzle 12 are also set.

[0039] Second neutralization liquid treatment stage

[0040] Placement of frame parts

[0041] Carefully place the frame parts containing the neutralizing liquid and the possible oxide layer into the cleaning box 9, ensuring that the parts are arranged neatly and avoiding mutual squeezing or collision.

[0042] Adjust position

[0043] When the equipment is started, cylinder 8 begins to descend according to the preset parameters, adjusting the cleaning frame 9 to a suitable height for subsequent operations.

[0044] Motor 5 starts working, driving the rotating shaft 6 to rotate, which in turn causes the rotating arm 7 to rotate, accurately moving the cleaning frame 9 containing the frame parts above the neutralizing liquid tank 3.

[0045] Cylinder 8 descends again, causing the cleaning frame 9 to be completely immersed in the neutralizing liquid in the neutralizing liquid tank 3.

[0046] Temperature control

[0047] The heating coil 13 at the bottom of the neutralizing liquid tank 3 begins to heat the neutralizing liquid. The temperature sensor 14 monitors the temperature of the neutralizing liquid in real time and feeds the temperature data back to the control panel 11.

[0048] When the temperature is below 70 degrees Celsius, the control panel 11 will automatically control the heating coil 13 to increase the power and speed up the heating process; when the temperature is above 80 degrees Celsius, the heating coil 13 will reduce the power or stop heating to ensure that the neutralizing liquid is always in the appropriate reaction temperature range of 70-80 degrees Celsius, so as to ensure that the neutralizing liquid can more effectively remove the neutralizing liquid and oxide layer on the frame parts.

[0049] Soaking time control

[0050] The timer starts when the cleaning box 9 is immersed in the neutralizing liquid. When the preset immersion time of 3-5 minutes is reached, the control panel 11 will issue a command, and the cylinder 8 will rise to lift the cleaning box 9 out of the neutralizing liquid.

[0051] Triple pure water cleaning stage

[0052] Transfer cleaning box

[0053] The motor 5 continues to rotate, driving the rotating arm 7 to rotate the cleaning frame 9 above the pure water washing chamber 4.

[0054] Cylinder 8 descends, causing the cleaning frame 9 to enter the pure water washing chamber 4.

[0055] Spray cleaning

[0056] Several cleaning nozzles 12 on the side wall of the pure water washing chamber 4 are turned on, spraying water onto the frame parts in the cleaning frame 9 according to the set water pressure and time, and thoroughly rinsing them. The water spray from the cleaning nozzles 12 can effectively remove residual neutralizing liquid, reaction products and other impurities from the parts.

[0057] Four drying stages

[0058] Lift the cleaning frame

[0059] After being cleaned with pure water, cylinder 8 rises, bringing the cleaning frame 9 back to its initial position.

[0060] Start the hot air blower

[0061] The hot air blower 10 on one side of the cleaning frame 9 is started, and the frame parts are dried according to the set wind speed and working time, so that the frame parts reach a dry state, completing the entire process of removing frame oxidation and cleaning and drying.

[0062] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor packaging neutralization solution for removing frame oxidation equipment, comprising a cleaning tank (1), characterized in that, The cleaning tank (1) has a partition (2) in the center. The cleaning tank (1) is divided into two neutral liquid tanks (3) and a pure water washing tank (4) of the same size by the partition (2). The bottom of the neutral liquid tank (3) is provided with a heating coil (13). The side wall of the neutral liquid tank (3) is also provided with a temperature sensor (14). The top of the partition (2) is provided with a motor (5). The top shaft of the motor (5) is coaxially provided with a rotating shaft (6). The top of the rotating shaft (6) is provided with a rotating arm (7). The top of the rotating arm (7) is vertically provided with a cylinder (8). The bottom of the cylinder (8) is provided with a cleaning frame (9) for placing frame parts. The side wall of the pure water washing tank (4) is provided with a number of cleaning nozzles (12).

2. The semiconductor packaging neutralization liquid removal frame oxidation device according to claim 1, characterized in that, The cleaning tank (1) is equipped with a control panel (11) on its side wall.

3. The semiconductor packaging neutralization liquid removal frame oxidation device according to claim 2, characterized in that, A hot air blower (10) is also provided on one side of the cleaning frame (9).

4. The semiconductor packaging neutralization liquid removal frame oxidation device according to claim 3, characterized in that, The control panel (11) is used to receive temperature data from the temperature sensor (14) and control the heating power of the heating coil (13) according to the preset temperature range of 70-80 degrees Celsius; it is also used to set and control the rotation speed and angle of the motor (5), the lifting stroke and speed of the cylinder (8), the water spray pressure and time of the cleaning nozzle (12), and the working time and wind speed of the hot air blower (10). It also has a soaking time timing function, and controls the cylinder (8) to rise when the preset soaking time of 3-5 minutes is reached.

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