Wafer processing machine table, wafer and storage box detection system

Abstract

The utility model provides a wafer processing machine table, a wafer and a storage box detection system, and relates to the technical field of semiconductor manufacturing. Comprising a processing cavity; the storage box is arranged in the processing cavity and is used for storing a plurality of wafers; the manipulator is located in the processing cavity, and the manipulator is used for clamping the wafer in the storage box; and the detection device is arranged on the manipulator, and when the manipulator moves to the storage box, the detection device transmits a detection signal into the storage box for detecting the thickness of each wafer. According to the wafer processing machine table, the wafer and the storage box detection system, the thickness of the wafer can be detected in real time in the process that the mechanical arm moves to the storage box, the specific wafer with the abnormal thickness can be found in time, the difficulty of checking the wafer with the abnormal thickness by the machine table is reduced, and therefore the production efficiency of the machine table and the product quality are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to wafer processing equipment and wafer and storage box inspection systems. Background Technology

[0002] In semiconductor manufacturing, the transportation and storage of wafers primarily rely on wafer storage containers. These containers are used to safely transport wafers between different process equipment while minimizing the risk of wafer contamination.

[0003] When a wafer is placed into the machine, the robotic arm will confirm the position of the wafer in the wafer storage box. Due to differences in the internal structure of the wafer storage box and the thickness of the wafer, the robotic arm will identify any abnormalities.

[0004] The robotic arms in existing machines can only identify anomalies, but cannot determine the specific anomaly points and information, making it more complicated to troubleshoot machine anomalies and reducing the machine's wafer processing capacity. Utility Model Content

[0005] This application provides a wafer processing machine, a wafer and storage box inspection system to solve the technical problems mentioned in the background art, such as the complexity of troubleshooting machine abnormalities and the reduction of machine wafer processing capacity.

[0006] The technical solution adopted by this application to solve the above-mentioned technical problems is as follows:

[0007] This application provides a wafer processing machine, comprising: a processing cavity; a storage box disposed in the processing cavity for storing multiple wafers; a robotic arm located in the processing cavity for gripping the wafers in the storage box; and a detection device disposed on the robotic arm, wherein when the robotic arm moves to the storage box, the detection device emits a detection signal into the storage box for detecting the thickness of each wafer.

[0008] Optionally, the detection device includes: a signal transmitter disposed at the center of the robotic arm, which emits a first detection light signal to a signal reflector inside the storage box when the robotic arm moves to the storage box; and multiple signal receivers disposed at arc intervals on the robotic arm and between the signal transmitter and the storage box, for receiving the first detection light signal reflected by the signal reflector and generating multiple thickness data. When any of the thickness data differs from a preset thickness standard data in the signal receiver, a thickness anomaly signal is generated.

[0009] Optionally, the robotic arm includes a base, a first telescopic member, a second telescopic member, and a gripping member; the fixed end of the first telescopic member is connected to the base, and the telescopic end of the first telescopic member extends and retracts along a direction perpendicular to the plane of the base; the fixed end of the second telescopic member is connected to the telescopic end of the first telescopic member, and the telescopic end of the second telescopic member extends and retracts toward the storage box and along a direction parallel to the plane of the base; the gripping member is connected to the telescopic end of the second telescopic member, and the length direction of the robotic arm is consistent with the telescopic direction of the second telescopic member; the signal transmitter is disposed on the gripping member and close to the second telescopic member, and a plurality of signal receivers are disposed at arc intervals on the gripping member close to the signal transmitter.

[0010] Optionally, the storage box includes: a box body with an opening on one side; multiple slots spaced vertically within the box body for placing wafers; a signal reflector disposed on the inner wall of the box body, located on the side opposite to the opening, the signal reflector reflecting a detection signal emitted by the signal transmitter to a signal receiver; when the gripper moves to the opening of the box body, the signal transmitter emits a second detection light signal towards the signal reflector; multiple signal receivers receive the second detection light signal reflected by the signal reflector, generating multiple height data; when the height data differs from the preset height standard data in the signal receivers, a height anomaly signal is generated.

[0011] Optionally, the wafer processing machine also includes a control processor, which is electrically connected to the robotic arm, the signal transmitter, and the signal receiver, respectively. The control processor is used to control the operation of the first telescopic component and the second telescopic component; receive a thickness abnormality signal generated by the signal receiver, and identify the wafer with a thickness abnormality based on the thickness abnormality signal; receive a height abnormality signal generated by the signal receiver, and identify the slot with a height abnormality based on the height abnormality signal.

[0012] Optionally, the wafer processing machine also includes an alarm device electrically connected to the control processor and the signal receiver. The alarm device sounds an alarm when the signal receiver generates the thickness abnormality signal and / or the height abnormality signal.

[0013] Optionally, the alarm device includes a buzzer, which is electrically connected to the control processor and the signal receiver. The buzzer sounds when the signal receiver generates the thickness abnormality signal and / or the height abnormality signal.

[0014] Optionally, the alarm device further includes a warning light, which is electrically connected to the control processor and the signal receiver. When the signal receiver generates the thickness abnormality signal and / or the height abnormality signal, the warning light flashes.

[0015] Optionally, the alarm device further includes a display, which is electrically connected to the control processor and the signal receiver. When the signal receiver generates the thickness abnormality signal and / or the height abnormality signal, the display shows an alarm; when the control processor identifies the wafer with a thickness abnormality, the display shows the corresponding layer number of the wafer; when the control processor identifies the slot with a height abnormality, the display shows the corresponding layer number of the slot.

[0016] This application also provides a wafer and storage box inspection system, including the wafer processing machine as described above, for detecting whether the wafer and the storage box are abnormal.

[0017] The wafer processing machine, wafer and storage box inspection system provided in this application can detect the thickness of the wafer in real time as the robot moves to the storage box by setting a detection device on the robot arm. This allows for timely detection of wafers with abnormal thickness, reducing the difficulty of the machine in troubleshooting wafers with abnormal thickness, thereby improving the machine's production efficiency and product quality. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a partial cross-sectional view of the wafer processing equipment of this application;

[0020] Figure 2 This is a schematic diagram of the robotic arm in this application;

[0021] Figure 3 This is a schematic diagram of the structure of the storage box in this application.

[0022] Icons: 100-Processing chamber; 200-Storage box; 210-Box body; 220-Card slot; 230-Signal reflector; 300-Robot arm; 310-Base; 320-First telescopic component; 330-Second telescopic component; 340-Gripper; 341-Signal transmitter; 342-Signal receiver; 400-Alarm device; 410-Buzzer; 420-Warning light; 430-Display.

[0023] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in this application embodiment are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0026] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0027] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0028] Existing robotic arms in wafer processing machines can only identify anomalies, but cannot determine the specific anomaly point or anomaly information, making troubleshooting complex and reducing the machine's wafer processing capacity. To address these issues, the embodiments of this application refer to... Figures 1 to 3The following technical solutions are provided to overcome the above problems.

[0029] Please refer to Figures 1 to 3 This application provides a wafer processing machine, including: a processing cavity 100; a storage box 200 disposed in the processing cavity 100 for storing multiple wafers; a robot arm 300 located in the processing cavity 100 for gripping the wafers in the storage box 200; and a detection device disposed on the robot arm 300, which transmits a detection signal into the storage box 200 when the robot arm 300 moves to the storage box 200 to detect the thickness of each wafer.

[0030] Specifically, the robotic arm 300 moves to the position of the storage box 200, and the detection device sends a detection signal (such as a light signal, ultrasonic signal, etc.) to the wafers in the storage box 200. The detection device receives the reflected detection signal, and the thickness of each wafer can be calculated based on the time delay or phase change of the detection signal, so as to identify a specific wafer with abnormal thickness in the storage box 200 and prevent wafers with abnormal thickness from entering the subsequent processing.

[0031] Understandably, as the robotic arm 300 moves to the storage box 200, it brings the inspection device to the measurement position. The precise movement of the robotic arm 300 ensures that the inspection device can accurately measure the thickness of each wafer.

[0032] This application provides a wafer processing machine that, by setting a detection device on the robot arm 300, can detect the thickness of the wafer in real time as the robot arm 300 moves to the storage box 200, promptly identify wafers with abnormal thickness, reduce the difficulty of the machine in troubleshooting wafers with abnormal thickness, and thus improve the machine's production efficiency and product quality.

[0033] In one embodiment, the detection device includes: a signal transmitter 341 disposed at the center of the robotic arm 300, which emits a first detection light signal to the signal reflector 230 inside the storage box 200 when the robotic arm 300 moves to the storage box 200; and a plurality of signal receivers 342 disposed at arc intervals on the robotic arm 300 and located between the signal transmitter 341 and the storage box 200, for receiving the first detection light signal reflected by the signal reflector 230 and generating a plurality of thickness data. When any of the thickness data differs from the preset thickness standard data in the signal receiver 342, a thickness abnormality signal is generated.

[0034] Specifically, when the robotic arm 300 moves to the storage box 200, the signal transmitter 341 emits a first detection light signal towards the signal reflector 230 inside the storage box 200. The signal reflector 230 reflects the received first detection light signal back to the robotic arm 300. The signal receiver 342 receives the first detection light signal reflected back from the signal reflector 230. Each signal receiver 342 generates a thickness data based on the received first detection light signal and compares each thickness data with a preset thickness standard data within the signal receiver 342. If any thickness data is inconsistent with the preset standard data, a thickness anomaly signal is generated.

[0035] Understandably, the thickness of a wafer is measured by utilizing the reflection characteristics of light signals between the wafer surface and the signal reflector 230. After the light signal is reflected off the wafer surface, a portion of the signal is reflected back to the signal receiver 342 by the signal reflector 230. By setting multiple signal receivers 342, reflected light signals can be received from different angles, thereby generating multiple thickness data points. This multi-point measurement method can improve the accuracy and reliability of the detection. By comparing the generated thickness data with preset standard data, wafers with abnormal thickness can be quickly identified. This data processing method can promptly detect and mark abnormal wafers, preventing them from entering subsequent processing steps.

[0036] It should be noted that the signal receiver 342 with multi-point measurement and arc-shaped interval setting can receive reflected signals from multiple angles, improving the accuracy and reliability of detection.

[0037] In one embodiment, the robotic arm 300 includes a base 310, a first telescopic member 320, a second telescopic member 330, and a gripping member 340; the fixed end of the first telescopic member 320 is connected to the base 310, and the telescopic end of the first telescopic member 320 extends and retracts along a direction perpendicular to the plane of the base 310; the fixed end of the second telescopic member 330 is connected to the telescopic end of the first telescopic member 320, and the telescopic end of the second telescopic member 330 extends and retracts toward the storage box 200 and along a direction parallel to the plane of the base 310; the gripping member 340 is connected to the telescopic end of the second telescopic member 330, and the length direction of the robotic arm 300 is consistent with the telescopic direction of the second telescopic member 330; the signal transmitter 341 is disposed on the gripping member 340 and close to the second telescopic member 330, and a plurality of signal receivers 342 are arranged in an arc-shaped interval on the gripping member 340 close to the signal transmitter 341.

[0038] Specifically, when the robotic arm 300 moves to the storage box 200, the first telescopic member 320 and the second telescopic member 330 work together to move the gripper 340 to the storage box 200. The signal transmitter 341 emits a first detection light signal to the signal reflector 230 inside the storage box 200. The signal receiver 342 receives the first detection light signal reflected back from the signal reflector 230 and generates thickness data.

[0039] Understandably, the first telescopic member 320 is responsible for vertical movement, enabling the robot arm 300 to reach the height position of the storage box 200, allowing the detection device to sequentially detect the wafers in each layer of the storage box 200. The second telescopic member 330 is responsible for horizontal movement, enabling the gripper 340 to accurately reach the opening of the storage box 200, allowing the robot arm 300 to move precisely to the target position in three-dimensional space, ensuring that the detection device can accurately align with the wafers in the storage box 200.

[0040] In one embodiment, the storage box 200 includes: a box body 210 with an opening on one side; a plurality of slots 220 spaced vertically within the box body 210 for placing wafers; a signal reflector 230 disposed on the inner wall of the box body 210 and located on the side opposite to the opening, the signal reflector 230 for reflecting the detection signal emitted by the signal transmitter 341 to the signal receiver 342; when the gripper 340 moves to the opening of the box body 210, the signal transmitter 341 emits a second detection light signal toward the signal reflector 230; and a plurality of signal receivers 342 receive the second detection light signal reflected by the signal reflector 230, generate a plurality of height data, and generate a height anomaly signal when the height data differs from the preset height standard data in the signal receivers 342.

[0041] Specifically, the storage box 200 has a box body 210 with an opening on one side to facilitate the entry of the gripper 340 of the robot arm 300. Multiple slots 220 are arranged vertically inside the box body 210, each slot 220 is used to hold a wafer. The signal reflector 230 is installed on the inner wall of the box body 210, on the side opposite to the opening, to ensure that the reflected signal can be accurately returned to the direction of the robot arm 300.

[0042] During operation, when the gripper 340 of the robotic arm 300 moves to the opening of the storage box 200, the signal transmitter 341 (e.g., a laser transmitter) emits a second detection light signal towards the signal reflector 230. The signal reflector 230 reflects the received second detection light signal back to the robotic arm 300. The reflected second detection light signal passes through the wafer side in the slot 220. Part of the signal is reflected by the wafer side, and part of the second detection light signal continues to propagate and reaches multiple signal receivers 342. Since the signal receivers 342 are multi-point set, they can receive reflected signals from different angles, thereby providing multiple measurement points. Each signal receiver 342 calculates the height of the card slot 220 based on the characteristics of the received reflected light signal (e.g., time delay, intensity variation, etc.). (For example, the height of the card slot 220 can be calculated by measuring the time delay of the light signal from transmission to reception and combining it with the speed of light propagation in air. Each signal receiver 342 generates one height data, thus obtaining multiple height data.) Each generated height data is compared with the preset height standard data within the signal receiver 342. If any height data is inconsistent with the preset standard data (e.g., exceeds the set tolerance range), a height anomaly signal is generated.

[0043] Understandably, in this embodiment, the design of the signal reflector 230 and multiple signal receivers 342 allows for precise detection of the height of each card slot 220 within the storage box 200, ensuring the consistency of the card slot 220's height and its compatibility with the machine.

[0044] In one embodiment, the wafer processing machine further includes a control processor electrically connected to the robot arm 300, the signal transmitter 341, and the signal receiver 342, respectively. The control processor is used to control the operation of the first telescopic member 320 and the second telescopic member 330; receive a thickness abnormality signal generated by the signal receiver 342, and identify the wafer with a thickness abnormality based on the thickness abnormality signal; and receive a height abnormality signal generated by the signal receiver 342, and identify the slot 220 with a height abnormality based on the height abnormality signal.

[0045] Specifically, the control processor is electrically connected to the robotic arm 300, the signal transmitter 341, and the signal receiver 342, respectively, so that the control processor can control the movement of the robotic arm 300 and receive detection data from the signal receiver 342. The control processor controls the operation of the first telescopic member 320 and the second telescopic member 330, so that the robotic arm 300 can move precisely to the opening of the storage box 200. The control processor receives the thickness abnormality signal and the height abnormality signal generated by the signal receiver 342. Based on the thickness abnormality signal and the height abnormality signal, the control processor identifies the wafer with thickness abnormality and the slot 220 with height abnormality.

[0046] Furthermore, based on the identified anomalies, the control processor can take corresponding measures, such as stopping the gripping action of the robotic arm 300 and issuing an alarm. At the same time, the control processor can feed back the abnormal information to the operator so that the problem can be dealt with in a timely manner.

[0047] It should be noted that the control processor establishes a communication link with the robotic arm 300, signal transmitter 341, and signal receiver 342 via electrical connections to ensure real-time data transmission. The signal receiver 342 sends the detected thickness and height data to the control processor, which analyzes the data according to a preset algorithm and standard data. The control processor compares the received thickness and height data with the preset standard data. If the detected data exceeds the preset normal range, the control processor generates an anomaly signal and identifies the specific location of the anomaly (wafer or slot 220). Based on the detection results, the control processor automatically controls the robotic arm 300's actions, such as stopping the gripper from picking up the abnormal wafer or slot 220, preventing the abnormal wafer from entering subsequent processing steps. This automated control reduces manual intervention and improves production efficiency and reliability.

[0048] In this embodiment, the control processor establishes a communication link with the robot arm 300, the signal transmitter 341, and the signal receiver 342 via electrical connections. For example, the control processor can connect to these devices via an industrial bus or a dedicated communication line.

[0049] In one embodiment, the wafer processing machine also includes an alarm device 400, which is electrically connected to the control processor and the signal receiver 342. When the signal receiver 342 generates the thickness abnormality signal and / or the height abnormality signal, the alarm device 400 issues an alarm.

[0050] Specifically, when the signal receiver 342 detects abnormal wafer thickness and / or abnormal slot 220 height signals, it sends these signals to the control processor. The control processor then determines whether to trigger an alarm based on preset logic. If the control processor receives an abnormal signal, the alarm device 400 is triggered and issues an alarm. The alarm from the alarm device 400 alerts operators or engineers to the abnormal situation so that timely measures can be taken. The control processor can simultaneously record the abnormal information for subsequent analysis and processing.

[0051] In one embodiment, the alarm device 400 includes a buzzer 410, which is electrically connected to the control processor and the signal receiver 342. The buzzer 410 sounds when the signal receiver 342 generates the thickness abnormality signal and / or the height abnormality signal.

[0052] Specifically, when the signal receiver 342 detects an abnormal wafer thickness signal and / or an abnormal slot 220 height signal, it sends these signals to the control processor. The control processor determines whether to trigger an alarm based on preset logic. If the control processor receives an abnormal signal, it sends a trigger signal to the buzzer 410. Upon receiving the trigger signal, the buzzer 410 emits an audible alarm. The buzzer 410 promptly alerts the operator to the abnormal situation through the audible alarm, ensuring that the abnormality can be quickly detected and handled.

[0053] In one embodiment, the alarm device 400 further includes a warning light 420, which is electrically connected to the control processor and the signal receiver 342. When the signal receiver 342 generates the thickness abnormality signal and / or the height abnormality signal, the warning light 420 flashes.

[0054] Specifically, when the signal receiver 342 detects an abnormal wafer thickness signal and / or an abnormal slot 220 height signal, it sends these signals to the control processor. The control processor determines whether to trigger an alarm based on preset logic. If the control processor receives an abnormal signal, it sends a trigger signal to the warning light 420. Upon receiving the trigger signal, the warning light 420 begins to flash, emitting a visual alarm. The warning light 420 promptly alerts the operator to the abnormal situation through visual alarm (flashing), ensuring that the abnormality can be quickly detected and handled.

[0055] In one embodiment, the alarm device 400 further includes a display 430, which is electrically connected to the control processor and the signal receiver 342. When the signal receiver 342 generates the thickness abnormality signal and / or the height abnormality signal, the display 430 displays an alarm. When the control processor identifies a wafer with a thickness abnormality, the display 430 displays the corresponding layer number of the wafer. When the control processor identifies a slot 220 with a height abnormality, the display 430 displays the corresponding layer number of the slot 220.

[0056] Specifically, when the signal receiver 342 detects an abnormal wafer thickness signal and / or an abnormal slot 220 height signal, it sends these signals to the control processor. The control processor determines whether to trigger an alarm based on preset logic. When the control processor identifies a wafer with an abnormal thickness, the display 430 displays the corresponding wafer's layer number.

[0057] For example, display 430 shows "Wafer Abnormality: Layer 3". When the control processor identifies a slot 220 with an abnormal height, display 430 displays the corresponding layer number of slot 220. For example, display 430 shows "Slot 220 Abnormality: Layer 5". Display 430 can display specific abnormality information (such as wafer layer number or slot 220 layer number) to help operators quickly locate problems and reduce troubleshooting time.

[0058] This application provides a wafer and storage box 200 inspection system, including a wafer processing machine as described above, for detecting whether the wafer and the storage box 200 are abnormal.

[0059] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer processing machine, characterized in that, include: Machining the cavity; A storage box, disposed within the processing cavity, is used to store multiple wafers; A robotic arm, located within the processing cavity, is used to grip the wafer within the storage box. A detection device is installed on the robotic arm. When the robotic arm moves to the storage box, the detection device emits a detection signal into the storage box to detect the thickness of each wafer.

2. The wafer processing machine according to claim 1, characterized in that, The detection device includes: A signal transmitter is located at the center of the robotic arm. When the robotic arm moves to the storage box, the signal transmitter emits a first detection light signal to the signal reflector inside the storage box. Multiple signal receivers are arranged in an arc-shaped interval on the robotic arm and located between the signal transmitter and the storage box. They are used to receive the first detection light signal reflected by the signal reflector and generate multiple thickness data. When any of the thickness data is different from the preset thickness standard data in the signal receiver, a thickness abnormality signal is generated.

3. The wafer processing machine according to claim 2, characterized in that, The robotic arm includes a base, a first telescopic component, a second telescopic component, and a gripping component; The fixed end of the first telescopic member is connected to the base, and the telescopic end of the first telescopic member extends and retracts along the plane perpendicular to the base. The fixed end of the second telescopic component is connected to the telescopic end of the first telescopic component, and the telescopic end of the second telescopic component extends and retracts toward the storage box and in a direction parallel to the plane of the base. The gripper is connected to the telescopic end of the second telescopic member, and the length direction of the robot is consistent with the telescopic direction of the second telescopic member; The signal transmitter is disposed on the clamping member and close to the second telescopic member, and a plurality of signal receivers are disposed at arc intervals on the clamping member close to the signal transmitter.

4. The wafer processing machine according to claim 3, characterized in that, The storage box includes: A box with an opening on one side; Multiple slots are arranged vertically and spaced apart inside the housing; the slots are used to hold wafers. A signal reflector is disposed on the inner wall of the housing and located on the side opposite to the opening. The signal reflector is used to reflect the detection signal emitted by the signal transmitter to the signal receiver. When the gripper moves to the opening of the box, the signal transmitter emits a second detection light signal toward the signal reflector. Multiple signal receivers receive the second detection light signal reflected by the signal reflector and generate multiple height data. When the height data is different from the preset height standard data in the signal receiver, a height anomaly signal is generated.

5. The wafer processing machine according to claim 4, characterized in that, It also includes a control processor, which is electrically connected to the robotic arm, the signal transmitter, and the signal receiver, and is used to control the operation of the first telescopic member and the second telescopic member. Receive the thickness anomaly signal generated by the signal receiver, and identify the wafer with a thickness anomaly based on the thickness anomaly signal; The system receives a height anomaly signal generated by the signal receiver and identifies the card slot with an abnormal height based on the height anomaly signal.

6. The wafer processing machine according to claim 5, characterized in that, It also includes an alarm device, which is electrically connected to the control processor and the signal receiver. When the signal receiver generates the thickness abnormality signal and / or the height abnormality signal, the alarm device sounds an alarm.

7. The wafer processing machine according to claim 6, characterized in that, The alarm device includes a buzzer, which is electrically connected to the control processor and the signal receiver. The buzzer sounds when the signal receiver generates the thickness abnormality signal and / or the height abnormality signal.

8. The wafer processing machine according to claim 7, characterized in that, The alarm device also includes a warning light, which is electrically connected to the control processor and the signal receiver. When the signal receiver generates the thickness abnormality signal and / or the height abnormality signal, the warning light flashes.

9. The wafer processing machine according to claim 8, characterized in that, The alarm device also includes a display, which is electrically connected to the control processor and the signal receiver. When the signal receiver generates the thickness abnormality signal and / or the height abnormality signal, the display shows an alarm. When the control processor identifies a wafer with an abnormal thickness, the display shows the corresponding number of layers on the wafer; When the control processor identifies a card slot with an abnormally high height, the display shows the number of layers corresponding to that card slot.

10. A wafer and storage box inspection system, characterized in that, The wafer processing machine according to any one of claims 1 to 5 is used to detect whether the wafer and the storage box are abnormal.

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