Chip loading device

Abstract

The utility model relates to a chip mounting device, which comprises a first driving mechanism, a second driving mechanism, a third driving mechanism and an adsorption mechanism, and is characterized in that the first driving mechanism is in driving connection with the second driving mechanism, the second driving mechanism is in driving connection with the third driving mechanism, and the third driving mechanism is in driving connection with the adsorption mechanism; the first driving mechanism is used for driving the second driving mechanism, the third driving mechanism and the adsorption mechanism to move in the first direction, the second driving mechanism is used for driving the third driving mechanism and the adsorption mechanism to move in the second direction, and the third driving mechanism is used for driving the adsorption mechanism to move in the third direction. The chip loading device can independently control the movement of the adsorption mechanism in three directions, so that the accurate position adjustment of the adsorption mechanism in a three-position space can be realized, and the movement precision of the adsorption mechanism can be improved. Due to the fact that the movement in each direction is mutually independent, the movement in different directions can be conveniently combined, various complex adsorption paths are achieved, and the adsorption mechanism can conveniently adsorb the chips and load the chips.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a wafer loading apparatus. Background Technology

[0002] Die mounters, also known as chip bonders, chip attachers, or die attachers, are primarily used to pick up semiconductor chips from wafers and then fix them onto lead frames, substrates, or other carriers using methods such as dispensing adhesive. They are the most common die mounting equipment and are widely used in various integrated circuit packaging processes. The most important module in a die mounter is the die mounting assembly, which is the key component of the equipment and is used to pick up and place the chips. Current die mount assemblies have relatively simple movement patterns, making it difficult to achieve complex die mounting paths. Furthermore, the positioning accuracy of current die mount assemblies is not high enough, affecting the quality and consistency of the die mounting process.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0004] Therefore, it is necessary to provide a new type of wafer loading device to address the problems that current wafer loading devices have a relatively simple movement mode, making it difficult to achieve complex wafer loading paths, and that the positioning accuracy of current wafer loading devices is not high enough, affecting the quality and consistency of wafer loading.

[0005] A tablet loading apparatus includes a first driving mechanism, a second driving mechanism, a third driving mechanism, and an adsorption mechanism. The first driving mechanism is driven and connected to the second driving mechanism, the second driving mechanism is driven and connected to the third driving mechanism, and the third driving mechanism is driven and connected to the adsorption mechanism. The first driving mechanism is used to drive the second driving mechanism, the third driving mechanism, and the adsorption mechanism to move along a first direction. The second driving mechanism is used to drive the third driving mechanism and the adsorption mechanism to move along a second direction. The third driving mechanism is used to drive the adsorption mechanism to move along a third direction.

[0006] In one embodiment, the adsorption mechanism includes a rotary drive component and an adsorption component. The rotary drive component is connected to the third drive mechanism, and the adsorption component is rotatably connected to the third drive mechanism. The rotary drive component drives the adsorption component to rotate around the third drive mechanism.

[0007] In one embodiment, the adsorption mechanism further includes a shock absorber connected to the outside of the adsorption assembly and extending along the third direction.

[0008] In one embodiment, the rotary drive assembly includes a rotary driver and a transmission component, the suction assembly includes a suction nozzle and a rotating shaft, the rotary driver is fixed to the third drive mechanism, the rotary driver is driven to the transmission component, the transmission component is driven to the rotating shaft, the rotating shaft is rotatably connected to the third drive mechanism, and the rotating shaft is connected to the suction nozzle.

[0009] In one embodiment, the transmission component includes a timing belt, a first timing pulley, and a second timing pulley. The first timing pulley is connected to the output end of the rotary driver, which drives the first timing pulley to rotate. The second timing pulley is connected to one end of the rotating shaft along the third direction, and the other end of the rotating shaft along the third direction is connected to the suction nozzle. The timing belt is wound around both the first timing pulley and the second timing pulley.

[0010] In one embodiment, the adsorption mechanism further includes a Z-axis driver and a transfer assembly, the Z-axis driver being connected to the third driving mechanism and driven to the transfer assembly, and the adsorption assembly being rotatably connected to the transfer assembly.

[0011] In one embodiment, the first drive mechanism includes an X-axis driver, an X-axis lead screw, and an X-axis slide. The X-axis driver is drivenly connected to the X-axis lead screw, the X-axis lead screw is drivenly connected to the X-axis slide, and the X-axis slide is connected to the second drive mechanism.

[0012] In one embodiment, the mounting device further includes two bases and two X-axis sliding components. The two bases are spaced apart along the second direction, and the X-axis sliding components are respectively connected to the bases. The first driving mechanism is connected to the X-axis sliding components on both sides along the second direction.

[0013] In one embodiment, the second drive mechanism includes a Y-axis motor module, the first drive mechanism is driven to the base of the Y-axis motor module, and the slide of the Y-axis motor module is driven to the third drive mechanism.

[0014] In one embodiment, the third driving mechanism includes a Z-axis motor module, the second driving mechanism is driven connected to the base of the Z-axis motor module, and the slide of the Z-axis motor module is driven connected to the adsorption mechanism.

[0015] The first, second, and third drive mechanisms of the aforementioned wafer mounting device independently control the movement of the adsorption mechanism in three directions, enabling precise position adjustment of the adsorption mechanism in three-dimensional space and improving the accuracy of its movement. Because the movement in each direction is independent, it is easy to combine movements in different directions to achieve various complex adsorption paths, facilitating the adsorption mechanism's adsorption of chips and wafer mounting. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.

[0017] Figure 1 This is a perspective view of a mounting device provided in an embodiment of this application.

[0018] Figure 2 This is a three-dimensional schematic diagram of an adsorption mechanism provided in an embodiment of this application.

[0019] Figure 3 This is a front view of an adsorption mechanism provided in an embodiment of this application.

[0020] Explanation of reference numerals in the attached drawings: 100, loading device; 1, first drive mechanism; 11, X-axis driver; 12, X-axis lead screw; 2, second drive mechanism; 21, Y-axis motor module; 3, third drive mechanism; 31, Z-axis motor module; 4, adsorption mechanism; 41, rotary drive assembly; 411, rotary driver; 412, transmission component; 4121, synchronous belt; 4122, first synchronous pulley; 4123, second synchronous pulley; 42, adsorption assembly; 421, suction nozzle; 422, rotating shaft; 43, anti-collision component; 44, Z-axis driver; 45, adapter assembly; 5, base; 6, X-axis sliding assembly. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] Please see Figure 1This application provides a wafer loading apparatus 100, which includes a first driving mechanism 1, a second driving mechanism 2, a third driving mechanism 3, and an adsorption mechanism 4. The first driving mechanism 1 is driven and connected to the second driving mechanism 2, the second driving mechanism 2 is driven and connected to the third driving mechanism 3, and the third driving mechanism 3 is driven and connected to the adsorption mechanism 4. The first driving mechanism 1 drives the second driving mechanism 2, the third driving mechanism 3, and the adsorption mechanism 4 to move along a first direction. The second driving mechanism 2 drives the third driving mechanism 3 and the adsorption mechanism 4 to move along a second direction. The third driving mechanism 3 drives the adsorption mechanism 4 to move along a third direction. The first driving mechanism 1, the second driving mechanism 2, and the third driving mechanism 3 are responsible for motion control in three directions, respectively. This three-dimensional motion control structure enables precise position adjustment of the adsorption mechanism 4 in space. For example, during the wafer loading process, whether accurately picking up the chip onto the adsorption mechanism 4 or precisely placing the chip at a designated position, it can be achieved through the precise driving of each driving mechanism. The motion in each direction is independent of each other, making it convenient to combine motions in different directions, allowing the adsorption mechanism 4 to move along various complex trajectories. This means that the die-loading apparatus 100 can adapt to the die-loading needs of chips with different shapes and layouts. For example, when faced with irregularly arranged chips or special die-loading path requirements, the die-loading apparatus 100 can flexibly control the movement of the adsorption mechanism 4 to accurately complete the chip pick-up and placement operations, improving the versatility and adaptability of the die-loading apparatus 100. The first drive mechanism 1, the second drive mechanism 2, and the third drive mechanism 3 can quickly respond and adjust the position of the adsorption mechanism 4, reducing the waiting time during the die-loading process. The entire process from picking up the chip to placing it in the designated position can be completed in a short time, thereby improving the die-loading efficiency.

[0023] In this embodiment of the application, the first direction is as follows: Figure 1 The X direction is shown, and the second direction is as follows. Figure 1 As shown in the Y direction, the third direction is as follows: Figure 1 The Z direction is shown.

[0024] Please see Figure 1In some embodiments, the die-loading apparatus 100 further includes two bases 5 and two X-axis sliding components 6. The two bases 5 are spaced apart along a second direction, and the X-axis sliding components 6 are respectively connected to the bases 5. The first drive mechanism 1 is connected to the X-axis sliding components 6 on both sides along the second direction. The two bases 5 are spaced apart along the second direction, further providing a support base for the entire die-loading apparatus 100. The first drive mechanism 1 is connected to the two bases 5 through the X-axis sliding components 6, so that the first drive mechanism 1 can obtain more stable support when driving the subsequent mechanism to move along the first direction, reducing shaking and vibration. This is very important for improving die-loading accuracy, especially in high-speed or high-precision die-loading scenarios, and can avoid chip placement deviations caused by device instability. The X-axis sliding components 6 can provide precise linear motion guidance for the first drive mechanism 1, ensuring the accuracy of the first drive mechanism 1's movement along the first direction. Meanwhile, the two bases 5 allow the first drive mechanism 1 to maintain better straightness and flatness during movement, further improving the movement accuracy of the entire die-loading device 100 in the first direction. This enables more accurate control of the position of the adsorption mechanism 4 in the first direction, facilitating high-precision die-loading operations. The two bases 5 and the X-axis sliding assembly 6 jointly bear the weight of the first drive mechanism 1 and the subsequently connected second drive mechanism 2, third drive mechanism 3, and adsorption mechanism 4, providing greater load-bearing capacity compared to a single support point or a simple connection method. This allows the die-loading device 100 to carry heavier adsorption mechanisms 4 or adapt to more complex die-loading tasks, such as when handling larger or heavier chips, while still ensuring the stability and movement accuracy of the device.

[0025] In an optional embodiment, the X-axis sliding assembly 6 may include an X-axis slide rail and an X-axis slide table. The X-axis slide rail is mounted on the base 5, and the X-axis slide table is slidably connected to the X-axis slide rail and connected to the first drive mechanism 1. Alternatively, the X-axis sliding assembly 6 may include an X-axis guide rod and an X-axis guide sleeve. The X-axis guide rod is mounted on the base 5, and the X-axis guide sleeve is slidably connected to the X-axis guide rod and connected to the first drive mechanism 1.

[0026] In an optional embodiment, the second drive mechanism 2, the third drive mechanism 3, and the adsorption mechanism 4 are all located within the gap formed between the two bases 5 along the second direction. This arrangement makes full use of the space between the two bases 5, making the structure of the tablet loading device 100 more compact. Concentrating the second drive mechanism 2, the third drive mechanism 3, and the adsorption mechanism 4 within the gap avoids the space waste caused by a dispersed layout, helps reduce the space occupied by the entire tablet loading device 100, and makes it more suitable for installation on production lines with limited space. Since the second drive mechanism 2, the third drive mechanism 3, and the adsorption mechanism 4 are located between the two bases 5, they can be better supported and constrained by the bases 5 during movement. When these mechanisms move, especially during high-speed movement or high-precision operation, the bases 5 can provide stable reaction forces, reducing the shaking and vibration of the mechanisms, thereby improving the movement stability and accuracy of the entire tablet loading device 100.

[0027] In an optional implementation, the first drive mechanism 1 may be an X-axis linear module, such as a ball screw linear module, a linear motor module, a synchronous belt linear module, a gear and rack linear module, etc.

[0028] Please see Figure 1 In some embodiments, the first driving mechanism 1 includes an X-axis actuator 11, an X-axis lead screw 12, and an X-axis slide (not shown in the figure). The X-axis actuator 11 is driven and connected to the X-axis lead screw 12, the X-axis lead screw 12 is driven and connected to the X-axis slide, and the X-axis slide is connected to the second driving mechanism 2. The second driving mechanism 2, the third driving mechanism 3, and the adsorption mechanism 4 in the wafer loading device 100 all need to be driven by the first driving mechanism 1 to move along the first direction. The weight of these mechanisms and the inertial force generated during the movement constitute a large load. The X-axis lead screw 12 has a large load-bearing capacity and can withstand these loads without significant deformation or damage. The X-axis lead screw 12 has high precision and repeatability. When the X-axis actuator 11 drives the X-axis lead screw 12 to rotate, it can improve the displacement accuracy in the first direction and achieve continuous and smooth transmission, which helps to ensure the stability of the adsorption mechanism 4 in the process of picking up and placing chips, and reduces chip damage or placement deviation caused by unstable movement.

[0029] In an optional implementation, the X-axis driver 11 is a stepper motor or a servo motor, etc.

[0030] In an optional implementation, the second drive mechanism 2 may be a Y-axis linear module, such as a ball screw linear module, a linear motor module, a synchronous belt linear module, a gear and rack linear module, etc.

[0031] Please see Figure 1In some embodiments, the second drive mechanism 2 includes a Y-axis motor module 21, the first drive mechanism 1 is driven and connected to the base of the Y-axis motor module 21, and the slide of the Y-axis motor module 21 is driven and connected to the third drive mechanism 3. The Y-axis motor module 21 can achieve high-precision positioning and high speed of movement in the second direction. At the same time, the Y-axis motor module 21 has high stability and reliability and is easy to integrate and control.

[0032] In an optional implementation, the third drive mechanism 3 may be a Z-axis linear module, such as a ball screw linear module, a linear motor module, a synchronous belt linear module, a gear and rack linear module, etc.

[0033] Please see Figure 1 In some embodiments, the third drive mechanism 3 includes a Z-axis motor module 31, the second drive mechanism 2 is driven and connected to the base of the Z-axis motor module 31, and the slide of the Z-axis motor module 31 is driven and connected to the adsorption mechanism 4. The Z-axis motor module 31 can achieve high-precision positioning and high speed of upward movement of the third party. At the same time, the Z-axis motor module 31 has high stability and reliability and is easy to integrate and control.

[0034] Please see Figure 2 and Figure 3 In some embodiments, the adsorption mechanism 4 includes a rotary drive assembly 41 and an adsorption assembly 42, wherein the rotary drive assembly 41 is connected to the third drive mechanism 3 (see [link to documentation]). Figure 1 The adsorption component 42 is rotatably connected to the third driving mechanism 3, and the rotation driving component 41 is driven to connect to the adsorption component 42, so that the adsorption component 42 rotates around the third direction. The rotation driving component 41 enables the adsorption component 42 to drive the chip to rotate, thereby facilitating the adjustment of the chip's mounting position and improving the chip mounting accuracy.

[0035] Please see Figure 2 and Figure 3In some embodiments, the rotary drive assembly 41 includes a rotary driver 411 and a transmission component 412, and the adsorption assembly 42 includes a suction nozzle 421 and a rotating shaft 422. The rotary driver 411 is fixed to the third drive mechanism 3, and the rotary driver 411 is drivenly connected to the transmission component 412. The transmission component 412 is drivenly connected to the rotating shaft 422, and the rotating shaft 422 is rotatably connected to the third drive mechanism 3 and connected to the suction nozzle 421. The rotary driver 411 can provide precise power output and accurately control the rotation angle and speed. The transmission component 412 can effectively transmit the power of the rotary driver 411 to the rotating shaft 422. The suction nozzle 421 is connected to the rotating shaft 422. Through the action of the rotary driver 411 and the transmission component 412, the suction nozzle 421 can rotate after adsorbing the tablet. This allows for convenient adjustment of the tablet angle to adapt to different assembly requirements. The rotating shaft 422 is rotatably connected to the third drive mechanism 3. This design makes the rotating part relatively independent of other drive mechanisms, reducing mutual interference and influence. Meanwhile, the rotary drive 411 is fixed to the third drive mechanism 3, which can ensure the stable transmission of rotational power, improve the stability and reliability of the entire system, and reduce the probability of failure.

[0036] In alternative embodiments, the transmission component 412 may include a timing belt and a timing pulley. Alternatively, the transmission component 412 may include gears and chains. Or, the transmission component 412 may include a worm gear and a worm wheel, etc.

[0037] In some embodiments, the transmission component 412 includes a synchronous belt 4121, a first synchronous pulley 4122, and a second synchronous pulley 4123. The first synchronous pulley 4122 is connected to the output end of a rotary driver 411, which drives the first synchronous pulley 4122 to rotate. The second synchronous pulley 4123 is connected to one end of a rotating shaft 422 along a third direction, and the other end of the rotating shaft 422 along a third direction is connected to a suction nozzle 421. The synchronous belt 4121 is wound around both the first synchronous pulley 4122 and the second synchronous pulley 4123. It can be understood that the output end of the rotary driver 411 drives the first synchronous pulley 4122 to rotate in a third direction, the first synchronous pulley 4122 drives the synchronous belt 4121 to move, causing the synchronous belt 4121 to drive the second synchronous pulley 4123 to rotate, and then the second synchronous pulley 4123 drives the rotating shaft 422 and the suction nozzle 421 to rotate. The synchronous belt 4121 transmission does not require a large tensioning device like a chain drive, nor does it require a large installation space like a gear drive. The combination of the synchronous belt 4121, the first synchronous pulley 4122, and the second synchronous pulley 4123 enables power transmission within a relatively small space, which is beneficial to the overall structural design of the loading device 100, making it more compact and saving installation space. At the same time, the synchronous belt 4121 enables efficient and smooth transmission.

[0038] Please see Figure 2 In some embodiments, the adsorption mechanism 4 further includes a Z-axis actuator 44 and a transfer component 45. The Z-axis actuator 44 is connected to the third drive mechanism 3 and is driven by the transfer component 45. The adsorption component 42 is rotatably connected to the transfer component 45. The addition of the Z-axis actuator 44 allows the adsorption component 42 to undergo a small displacement along a third direction under the drive of the Z-axis actuator 44. This enables further adjustment of the displacement of the adsorption component 42 in the third direction based on the third drive mechanism 3, thereby improving the adsorption accuracy of the adsorption component 42.

[0039] In an optional implementation, the Z-axis driver 44 is a voice coil motor, a telescopic motor, or a telescopic cylinder, etc.

[0040] Please see Figure 2 In some embodiments, the adsorption mechanism 4 further includes a shock absorber 43, which is connected to the outside of the adsorption assembly 42 and extends in a third direction. The shock absorber 43 prevents excessive downward pressure on the adsorption assembly 42, thus avoiding damage to the adsorption assembly 42.

[0041] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0042] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A wafer loading apparatus, characterized in that, It includes a first driving mechanism, a second driving mechanism, a third driving mechanism, and an adsorption mechanism. The first driving mechanism is driven and connected to the second driving mechanism, the second driving mechanism is driven and connected to the third driving mechanism, and the third driving mechanism is driven and connected to the adsorption mechanism. The first driving mechanism is used to drive the second driving mechanism, the third driving mechanism, and the adsorption mechanism to move along a first direction. The second driving mechanism is used to drive the third driving mechanism and the adsorption mechanism to move along a second direction. The third driving mechanism is used to drive the adsorption mechanism to move along a third direction. The first direction, the second direction, and the third direction intersect each other and are not coplanar.

2. The mounting apparatus according to claim 1, characterized in that, The adsorption mechanism includes a rotary drive component and an adsorption component. The rotary drive component is connected to the third drive mechanism, and the adsorption component is rotatably connected to the third drive mechanism. The rotary drive component drives the adsorption component to rotate around the third drive mechanism.

3. The mounting apparatus according to claim 2, characterized in that, The adsorption mechanism further includes a shock absorber connected to the outside of the adsorption assembly, the shock absorber extending along the third direction.

4. The mounting apparatus according to claim 2, characterized in that, The rotary drive assembly includes a rotary driver and a transmission component. The adsorption assembly includes a suction nozzle and a rotating shaft. The rotary driver is fixed to the third drive mechanism. The rotary driver is driven and connected to the transmission component. The transmission component is driven and connected to the rotating shaft. The rotating shaft is rotatably connected to the third drive mechanism and connected to the suction nozzle.

5. The mounting apparatus according to claim 4, characterized in that, The transmission component includes a timing belt, a first timing pulley, and a second timing pulley. The first timing pulley is connected to the output end of the rotary driver, which drives the first timing pulley to rotate. The second timing pulley is connected to one end of the rotating shaft along the third direction, and the other end of the rotating shaft along the third direction is connected to the suction nozzle. The timing belt is wound around both the first timing pulley and the second timing pulley.

6. The mounting apparatus according to claim 2, characterized in that, The adsorption mechanism further includes a Z-axis driver and a transfer assembly. The Z-axis driver is connected to the third driving mechanism and is driven to the transfer assembly. The adsorption assembly is rotatably connected to the transfer assembly.

7. The mounting apparatus according to claim 1, characterized in that, The first driving mechanism includes an X-axis driver, an X-axis lead screw, and an X-axis slide. The X-axis driver is driven and connected to the X-axis lead screw, the X-axis lead screw is driven and connected to the X-axis slide, and the X-axis slide is connected to the second driving mechanism.

8. The mounting apparatus according to claim 1, characterized in that, The mounting device further includes two bases and two X-axis sliding components. The two bases are spaced apart along the second direction, and the X-axis sliding components are respectively connected to the bases. The first driving mechanism is connected to the X-axis sliding components on both sides along the second direction.

9. The mounting apparatus according to claim 1, characterized in that, The second drive mechanism includes a Y-axis motor module, the first drive mechanism is driven and connected to the base of the Y-axis motor module, and the slide of the Y-axis motor module is driven and connected to the third drive mechanism.

10. The mounting apparatus according to claim 1, characterized in that, The third driving mechanism includes a Z-axis motor module, the second driving mechanism is driven and connected to the base of the Z-axis motor module, and the slide of the Z-axis motor module is driven and connected to the adsorption mechanism.

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