Film expanding device

Abstract

The utility model discloses a film expanding device, and belongs to the technical field of semiconductors. The film expanding device comprises a workbench and a film expanding assembly, the workbench comprises a first plate, the film expanding assembly comprises a lifting driving module, a lifting frame, a pressing ring and a blocking ring, the blocking ring and the lifting driving module are both arranged on the first plate, and the lifting frame is in transmission connection with the lifting driving module; the projection of the lifting frame in the vertical direction is located on the peripheral side of the projection of the blocking ring, the lifting driving module is used for driving the lifting frame to move in the vertical direction, the pressing ring is fixedly arranged on the lifting frame, and the outer contour projection of the blocking ring in the vertical direction is located in the inner contour projection of the pressing ring. The side, facing the first plate, of the pressing ring is used for installing an adhesive film bonded with a chip. According to the utility model, the stretching efficiency of the adhesive film is improved, the uniform stress of the adhesive film is ensured, and the subsequent chip can be conveniently and quickly taken.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a film expansion device. Background Technology

[0002] With the rapid development of electronic technology and the continuous improvement of user demands for product performance and functionality, chip-wafer bonding technology plays an increasingly crucial role in the semiconductor manufacturing process. In practice, to achieve the goal of precisely bonding multiple chips sequentially onto a wafer, it is first necessary to understand the relationship between the chip and the wafer. A chip is essentially a tiny unit cut from a whole wafer through a series of precision processes.

[0003] Because wafers are relatively fragile and need to be kept stable during the dicing process to prevent unnecessary movement of the chips after dicing, which could affect dicing accuracy and subsequent processes, they are usually first attached to a special adhesive film. This film provides stable support for the wafer, ensuring that it remains relatively stationary during dicing. Subsequently, using high-precision dicing equipment, the wafer attached to the adhesive film is diced into several individual chips according to the preset chip size and layout.

[0004] However, after dicing, the chips, which were originally tightly packed together, form a continuous, monolithic structure, making it extremely difficult to accurately remove individual chips. Using conventional direct-removal methods can easily damage the chips or lead to removal failures due to their close arrangement, thus affecting the efficiency of the entire production process and product quality.

[0005] To address this challenge, the industry has proposed a method involving stretching and expanding the adhesive film. Specifically, when the film is stretched, its surface deforms, causing the initially closely spaced chips to gradually increase in distance as the film expands. As the distance increases, the chips gradually separate, creating sufficient gaps. These gaps facilitate the subsequent precise removal of individual chips using automated equipment or manual tools, significantly improving the accuracy and efficiency of chip handling.

[0006] However, existing technologies primarily rely on manually stretching the adhesive film to increase the spacing between chips on its surface. This manual method has several drawbacks. Firstly, manually stretching the film requires significant manpower and time; operators must dedicate considerable time and effort to this task, increasing production costs and reducing overall production efficiency. Secondly, manual operation makes it difficult to ensure the uniformity and stability of the film stretching, potentially leading to uneven forces on the film during the stretching process. This increases the risk of film damage and further reduces the efficiency of subsequent chip removal.

[0007] This section provides background information related to this application, which is not necessarily prior art. Utility Model Content

[0008] The purpose of this invention is to provide a film expansion device that not only improves the stretching efficiency of the adhesive film, but also ensures that the adhesive film is subjected to uniform force, making it easier for the chip to be quickly removed.

[0009] To achieve the above objectives, the following technical solution is provided:

[0010] The film expansion device includes:

[0011] The workbench, including the first panel;

[0012] The film expansion assembly includes a lifting drive module, a lifting frame, a pressure ring, and a blocking ring. The blocking ring and the lifting drive module are both disposed on the first plate. The lifting frame is connected to the lifting drive module in a transmission manner. The projection of the lifting frame in the vertical direction is located around the projection of the blocking ring. The lifting drive module is used to drive the lifting frame to move in the vertical direction. The pressure ring is fixedly disposed on the lifting frame, and the outer contour of the blocking ring in the vertical direction is projected within the inner contour projection of the pressure ring. The side of the pressure ring facing the first plate is used to install the adhesive film on which the chip is bonded.

[0013] As an optional embodiment of the film expansion device, the pressure ring and the blocking ring are coaxially arranged, and two support plates are spaced apart on the side of the pressure ring facing the first plate. A receiving space for the adhesive film is formed between the support plates and the pressure ring, allowing the adhesive film to be inserted into the receiving space. The two support plates are used to overlap with the outer ring edge of the adhesive film. The film expansion assembly further includes:

[0014] An annular mounting base is disposed on the first plate and located around the periphery of the blocking ring;

[0015] Several elastic support components are circumferentially spaced on the annular mounting base. The head of each elastic support component extends vertically beyond the blocking ring. The elastic support components are used to lift the outer ring edge of the adhesive film from the carrier plate and press it against the pressure ring.

[0016] As an optional solution for the film expansion device, the annular mounting base is provided with a plurality of through holes spaced circumferentially, and the elastic support assembly includes:

[0017] The pressure rod has its tail end inserted into the through hole;

[0018] A helical spring is sleeved on the pressure rod, one end of the helical spring is connected to the head of the pressure rod, and the other end of the helical spring is connected to the annular mounting base. The head of the pressure rod extends beyond the blocking ring in the vertical direction.

[0019] As an optional solution for the film expansion device, the lifting frame is provided with threaded holes, and the lifting drive module includes:

[0020] A transmission screw, one end of which is rotatably mounted on the first plate, and the other end of which is threadedly connected to the threaded hole.

[0021] As an optional solution for the film expansion device, the lifting drive module includes:

[0022] A drive motor is mounted on the first plate and is connected to the transmission screw.

[0023] As an optional solution for the film expansion device, the lifting frame is provided with a number of vertically extending lifting guide rods, and the first plate is provided with a number of sleeves with first guide holes, and the lifting guide rods pass through the corresponding first guide holes.

[0024] As an optional solution for the film expansion device, the pressure ring is provided with a number of second guide holes spaced apart circumferentially, and the first plate is provided with a number of guide posts, which are used to pass through the corresponding second guide holes.

[0025] As an optional solution for the film expansion device, the worktable further includes a second plate, the first plate is disposed on the second plate and is rotatable, the first plate has a first clearance through hole, the second plate has a second clearance through hole, and the first clearance through hole communicates with the second clearance through hole.

[0026] As an optional solution for the film expansion device, the worktable further includes:

[0027] A rotation drive module is used to drive the first plate to rotate relative to the second plate. The fixed end of the rotation drive module is connected to the second plate, and the output end of the rotation drive module is connected to the first plate for transmission.

[0028] As an optional solution for the film expansion device, the rotation drive module includes:

[0029] An adapter base, one end of which is fixedly connected to the side of the second plate;

[0030] A linear motion module is mounted on the adapter base;

[0031] An active moving component is connected to the slider of the linear motion module, and the active moving component can slide along the tangential direction of the first clearance through hole;

[0032] A driven moving member is disposed on the active moving member, and the driven moving member is capable of sliding along the radial direction of the first clearance through hole;

[0033] An adapter is provided, one end of which is fixedly connected to the first plate, and the other end of which is hinged to the driven moving member.

[0034] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0035] The film expansion device provided by this utility model has a blocking ring and a lifting drive module installed on the first plate of the worktable. The lifting frame is connected to the lifting drive module in a transmission manner. The projection of the lifting frame in the vertical direction is located around the projection of the blocking ring. The pressure ring is fixedly set on the lifting frame, and the inner diameter of the pressure ring is larger than the outer diameter of the blocking ring. After the adhesive film with the chip attached is installed on the side of the pressure ring facing the first plate, the lifting drive module drives the lifting frame and the adhesive film on the pressure ring to automatically descend in the vertical direction. After the blocking ring contacts the adhesive film, the blocking ring is used to prevent the adhesive film from descending further, while the pressure ring presses down on the adhesive film area located outside the blocking ring, thereby stretching the adhesive film. By controlling the descent speed, the adhesive film can be stretched evenly, increasing the spacing between the chips on the upper surface of the adhesive film, which facilitates the rapid removal of chips later. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0037] Figure 1This is a first-view assembly schematic diagram of the film expansion device in an embodiment of this utility model;

[0038] Figure 2 This is a second-view assembly schematic diagram of the film expansion device in an embodiment of this utility model;

[0039] Figure 3 This is a partial structural diagram of the expansion device in this embodiment of the invention, showing the cooperation between the lifting frame, the pressure ring, and the blocking ring.

[0040] Figure 4 This is a bottom view of the lifting frame, pressure ring, and bearing plate assembled in an embodiment of this utility model;

[0041] Figure 5 This is a cross-sectional view of the film spreading device in an embodiment of the present invention (the two ends of the adhesive film are respectively placed on two support plates);

[0042] Figure 6 This is a partial structural diagram of the film expansion device with respect to the elastic support component in an embodiment of this utility model (the adhesive film is pressed against the lower end face of the pressure ring).

[0043] Figure label:

[0044] 1000, adhesive film;

[0045] 1. Workbench; 2. Film expansion assembly;

[0046] 11. First plate; 12. Second plate; 13. Rotary drive module; 131. Adapter base; 132. Linear motion module; 133. Active moving component; 134. Driven moving component; 135. Adapter component;

[0047] 21. Lifting drive module; 211. Transmission screw; 212. Drive motor; 22. Lifting frame; 221. Threaded hole; 222. Lifting guide rod; 23. Pressure ring; 231. Second guide hole; 24. Blocking ring; 25. Bearing plate; 26. Annular mounting base; 27. Elastic support assembly; 271. Pressing rod; 272. Helical spring; 28. Sleeve; 29. ​​Guide column. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0049] In the description of this utility model, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0050] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0051] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0052] To improve the stretching efficiency of the adhesive film, ensure uniform stress on the film, and facilitate rapid chip removal, this embodiment provides a film expansion device, which is described below in conjunction with... Figures 1 to 6 The specific content of this embodiment will be described in detail. It should be noted that the lifting direction and vertical direction mentioned in this embodiment are... Figure 1 The Z direction in the equation.

[0053] Example 1

[0054] The film expansion device provided in this embodiment is a specialized device for expanding the adhesive film 1000 with adhered chips to increase the chip spacing and facilitate subsequent chip handling. The expansion device mainly consists of two key parts: a worktable 1 and an expansion assembly 2. These parts work together to complete the expansion task of the adhesive film 1000.

[0055] The worktable 1 serves as the foundation and rotation drive of the entire device, featuring a rational structural design and stable, reliable function. The worktable 1 includes a first plate 11, which not only provides the mounting base for the film expansion assembly 2 but also participates in the overall rotational movement of the worktable 1, enabling the conversion of the adhesive film 1000 between different workstations and facilitating subsequent chip processing steps. Of course, the worktable 1 can also be a conventional worktable.

[0056] The film expansion assembly 2 is the core component for achieving the expansion function of the film 1000. The film expansion assembly 2 includes a lifting drive module 21, a lifting frame 22, a pressure ring 23, and a blocking ring 24. Both the blocking ring 24 and the lifting drive module 21 are securely mounted on the first plate 11. This layout ensures that the entire film expansion assembly 2 is tightly integrated with the worktable 1, guaranteeing the overall stability of the device and smooth collaborative operation. The lifting frame 22 is located above the blocking ring 24, with its projection along the vertical direction (Z-direction) located around the projection of the blocking ring 24. The lifting frame 22 and the lifting drive module 21 are connected via a transmission mechanism. The lifting drive module 21, as a power source, precisely drives the lifting frame 22 to move vertically. This vertical movement control is a crucial step in the film expansion process, determining the degree and effect of the film 1000's expansion. The pressure ring 23 is fixedly mounted on the lifting frame 22, forming an integral structure with it. For example, the pressure ring 23 and the lifting frame 22 are detachably connected by bolts or screws. Meanwhile, the outer contour projection of the blocking ring 24 in the vertical direction falls within the inner contour projection of the pressure ring 23; that is, the inner diameter of the pressure ring 23 is larger than the outer diameter of the blocking ring 24. This dimensional design provides space for the expansion of the adhesive film 1000. When relative movement occurs between the pressure ring 23 and the blocking ring 24, the adhesive film 1000 can be stretched smoothly.

[0057] In actual operation, the adhesive film 1000 with the chip attached is first installed on the side of the pressure ring 23 facing the first plate 11. Then, the lifting drive module 21 starts working, driving the lifting frame 22 and the adhesive film 1000 on the pressure ring 23 to automatically descend vertically. As the pressure ring 23 descends, the adhesive film 1000 gradually approaches the blocking ring 24. When the blocking ring 24 contacts the adhesive film 1000, the blocking ring 24 begins to function, preventing the adhesive film 1000 from descending further. At this time, the pressure ring 23 continues to descend due to its transmission connection with the lifting drive module 21. By precisely controlling the descent speed of the pressure ring 23, the adhesive film 1000 can be uniformly stretched between the blocking ring 24 and the pressure ring 23. This uniform stretching method can effectively increase the spacing between the chips on the upper surface of the adhesive film 1000, making the arrangement of the chips more loose, which greatly facilitates the rapid handling of subsequent chips. For example, in subsequent processes such as chip packaging, a larger chip spacing can avoid mutual interference between chips and improve the accuracy and efficiency of handling. In summary, the film expansion device provided in this embodiment, through the coordinated operation of the worktable 1 and the film expansion component 2, and by utilizing the ingenious design between the lifting drive module 21, the lifting frame 22, the pressure ring 23 and the blocking ring 24, achieves uniform expansion of the adhesive film 1000 with the chip attached, providing strong support for the subsequent processing of the chip.

[0058] Optionally, the pressure ring 23 and the blocking ring 24 are coaxially arranged. This coaxial design ensures that the adhesive film 1000 is subjected to uniform force during expansion, avoiding problems such as film 1000 cracking or chip damage caused by uneven force. Further, two support plates 25 are spaced apart on the side of the pressure ring 23 closest to the first plate 11. Specifically, the support plates 25 are fixed to the pressure ring 23, and the pressure ring 23 is detachably connected to the lifting frame 22. By disassembling the pressure ring 23, a shape-changing effect can be achieved, which helps the film expansion device to stretch and expand adhesive films 1000 of different sizes, expanding the scope of application and application scenarios. A receiving space for the adhesive film 1000 is formed between the support plates 25 and the pressure ring 23. The adhesive film 1000 can be horizontally inserted into the receiving space, and the outer ring edge of the adhesive film 1000 overlaps with the two support plates 25. The film expansion assembly 2 also includes an annular mounting base 26 and several elastic support components 27. An annular mounting base 26 is disposed on the first plate 11 and located around the periphery of the blocking ring 24. A plurality of elastic support components 27 are circumferentially spaced on the annular mounting base 26, and the elastic support components 27 are used to press the outer circumferential edge of the adhesive film 1000 against the pressure ring 23. In this embodiment, the carrier plate 25 is an L-shaped piece, with its vertical section fixedly connected to the pressure ring 23, and its horizontal section parallel to the lower end face of the pressure ring 23. A receiving space for the adhesive film 1000 is cleverly formed between the two carrier plates 25 and the pressure ring 23. The design of this receiving space has unique advantages; its opening direction and size allow the adhesive film 1000 to easily enter the receiving space in a horizontal insertion manner. (Reference) Figure 5 Combination Figure 6As shown, for example, two support plates 25 are arranged on the left and right sides of the lower end face of the pressure ring 23, that is, the opening of the accommodating space for horizontal insertion of the adhesive film 1000 is in the front-to-back direction (i.e., perpendicular to the drawing paper). Moreover, when the adhesive film 1000 is installed in place, its outer ring edge overlaps with the two support plates 25. This overlap not only provides stable support for the adhesive film 1000, preventing it from shaking or shifting, but also ensures the flatness of the adhesive film 1000 within the accommodating space, laying a good foundation for subsequent uniform expansion operations. To further enhance the stability and reliability of the adhesive film 1000 during the film expansion process, the film expansion assembly 2 is additionally equipped with an annular mounting base 26 and several elastic support components 27. The annular mounting base 26 is firmly set on the first plate 11, and its position is precisely located on the periphery of the blocking ring 24. This layout creates a reasonable spatial relationship between the annular mounting base 26 and components such as the blocking ring 24 and the pressure ring 23, providing favorable conditions for the installation and function of the elastic support components 27. Several elastic support components 27 are circumferentially spaced on the annular mounting base 26. This circumferential spacing ensures that the force exerted by the elastic support components 27 on the adhesive film 1000 is evenly distributed across the entire outer ring edge. Initially, the head of the elastic support component 27 extends vertically beyond the blocking ring 24. The core function of the elastic support component 27 is to lift the outer ring edge of the adhesive film 1000 from the support plate 25 and press it tightly against the pressure ring 23. Specifically, this lifting is achieved because the projection of the elastic support component 27 in the vertical direction is spaced apart from the projection of the support plate 25, preventing structural interference between the elastic support component 27 and the support plate 25 during the lifting process. During loading, a robotic arm transfers the adhesive film 1000 between the pressure ring 23 and the support plate 25, with the support plate 25 bearing the adhesive film 1000, meaning the lower surface of the outer ring edge of the adhesive film 1000 overlaps with the upper surface of the horizontal section of the support plate 25. Initially, the elastic support component 27 does not contact the adhesive film 1000. Before the pressure ring 23 initiates its downward press and the adhesive film 1000 contacts the blocking ring 24, the elastic support component 27 presses the outer ring edge of the adhesive film 1000 against the pressure ring 23 to prevent displacement of the outer ring edge during the downward press. The elastic support component 27, with its own elastic properties, applies a continuous and uniform pressure to the outer ring edge of the adhesive film 1000. This pressure not only maintains good contact between the adhesive film 1000 and the pressure ring 23, preventing localized loosening or wrinkling of the adhesive film 1000 during expansion, but also adaptively adjusts according to the thickness and material characteristics of the adhesive film 1000, ensuring effective fixation for adhesive films 1000 of different specifications. Through this structural design, the adhesive film 1000 maintains a stable posture during the expansion process, and when the lifting drive module 21 drives the pressure ring 23 to descend, the adhesive film 1000 can be uniformly stretched under uniform pressure.This uniform stretching effect is directly reflected in the uniform increase in the spacing between chips on the upper surface of the adhesive film 1000, providing a reliable guarantee for the rapid and accurate removal of chips. Compared with the traditional method of fixing the adhesive film 1000, this method of fixing the outer ring edge of the adhesive film 1000 using the elastic support component 27 greatly improves the stability and expansion effect of the adhesive film 1000 during the film expansion process, reduces problems such as chip damage and difficulty in removal caused by the adhesive film 1000 being poorly fixed or unevenly expanded, and significantly improves the working efficiency and product quality of the entire film expansion device.

[0059] Furthermore, the annular mounting base 26 is circumferentially spaced with several through holes. The elastic support assembly 27 includes a pressure rod 271 and a coil spring 272. The tail of the pressure rod 271 passes through the through hole. The coil spring 272 is sleeved on the pressure rod 271, with one end connected to the head of the pressure rod 271 and the other end connected to the annular mounting base 26. At this time, the head of the pressure rod 271 extends vertically beyond the blocking ring 24. The annular mounting base 26 is circumferentially spaced with several through holes, and the opening positions of these through holes are evenly distributed on the annular mounting base 26, providing uniform support points for the subsequent installation of the elastic support assembly 27. This ensures that the force exerted by each elastic support assembly 27 on the outer ring edge of the adhesive film 1000 is evenly distributed, avoiding excessive or insufficient local pressure. The elastic support assembly 27 consists of two key components: the pressure rod 271 and the coil spring 272. The tail of the pressure rod 271 passes through the through hole, allowing it to move to a certain extent within the hole, thus providing a spatial basis for the elastic deformation of the elastic support assembly 27. The head of the pressure rod 271 directly contacts the outer ring edge of the diaphragm 1000, transmitting the pressure generated by the elastic support assembly 27 to the diaphragm 1000 and fixing it in place. The helical spring 272 is fitted onto the pressure rod 271. As the core elastic element of the elastic support assembly 27, it plays a crucial role in storing and releasing energy. One end of the helical spring 272 is connected to the head of the pressure rod 271, ensuring that the helical spring 272 can effectively transmit the force to the pressure rod 271 when deformed under stress. The other end of the helical spring 272 is connected to the annular mounting base 26. This fixed connection allows the helical spring 272 to expand and contract with the annular mounting base 26 as a support point when under stress. In actual operation, after the adhesive film 1000 is installed into the receiving space of the pressure ring 23, the pressure ring 23 carries the adhesive film 1000 down together, and the heads of the pressing rods 271 of each elastic support component 27 contact the outer ring edge of the adhesive film 1000. Due to the tension generated during the subsequent film expansion process, the adhesive film 1000 will exert a downward force on the pressing rods 271. At this time, the pressing rods 271 move downward in the through hole, compressing the helical spring 272 sleeved on it. When the helical spring 272 is compressed, it will generate an elastic restoring force in the opposite direction of compression. This elastic restoring force is transmitted to the adhesive film 1000 through the pressing rods 271, pressing the outer ring edge of the adhesive film 1000 tightly against the pressure ring 23. After the film expansion operation is completed, the pressure ring 23 rises, the tension on the film 1000 decreases or disappears, and the helical spring 272 gradually extends under its own elastic restoring force, pushing the pressure rod 271 to move upward, so that the pressure between the head of the pressure rod 271 and the outer ring edge of the film 1000 gradually decreases, thereby facilitating the subsequent disassembly and replacement of the film 1000.

[0060] Furthermore, the lifting frame 22 is provided with a threaded hole 221, and in this embodiment, a cylinder with the threaded hole 221 is installed on the lifting frame 22. The lifting drive module 21 includes a transmission screw 211, one end of which is rotatably mounted on the first plate 11, and the other end of which is threadedly connected to the threaded hole 221. Exemplarily, the threaded hole 221 of the lifting frame 22 undergoes surface hardening treatment and precision grinding to ensure that the meshing accuracy with the transmission screw 211 reaches the micron level, effectively eliminating the backlash in traditional transmission methods. The transmission screw 211 in the lifting drive module 21 adopts a trapezoidal thread or ball screw structure, and one end of which is reliably rotatably connected to the first plate 11 through a high-precision bearing assembly. This design not only ensures the axial positioning accuracy of the screw, but also eliminates radial backlash through the preload of the bearing, making the transmission process smoother. The other end of the transmission screw 211 and the threaded hole 221 of the lifting frame 22 form a helical pair transmission system.

[0061] Furthermore, the lifting drive module 21 includes a drive motor 212, which is mounted on the first plate 11 and is connected to the transmission screw 211. When the drive motor 212 drives the transmission screw 211 to rotate, the rotational motion is converted into the linear motion of the lifting frame 22 through the helix angle of the precision thread.

[0062] Furthermore, the lifting frame 22 is provided with several vertically extending lifting guide rods 222, and the first plate 11 is provided with several sleeves 28 with first guide holes. The lifting guide rods 222 pass through the corresponding first guide holes. The lifting frame 22 and the first plate 11 are motion-constrained by multiple sets of guiding mechanisms, with four (or more or less depending on load requirements) high-strength lifting guide rods 222 arranged at equal intervals in the vertical direction. These lifting guide rods 222 are cold-drawn and their surfaces are hard anodized, which ensures the rigidity and wear resistance of the rod body and reduces the coefficient of motion friction through surface microstructure optimization. The first plate 11 is provided with four sets of sleeves 28 corresponding to the lifting guide rods 222. Each set of sleeves 28 has a double-layer structure: the inner layer is a high-precision bronze bushing (or a self-lubricating bearing), and the outer layer is a steel support frame. The inner hole of the bushing is honed to form a surface roughness of 0.2μm-0.5μm, forming a precise sliding fit with the guide rod. For example, the first guide hole adopts D9 grade tolerance control (hole diameter tolerance ±0.005mm), and the hole opening is equipped with a 3° chamfered guide structure. Combined with the tapered guide head at the lower end of the lifting guide rod 222, automatic centering function with millimeter-level gaps is achieved, with an assembly error tolerance of ±0.1mm. Four sets of guide mechanisms form a four-point spatial constraint, effectively resisting the lateral torque generated during lifting.

[0063] Furthermore, the pressure ring 23 is circumferentially spaced with several second guide holes 231, and the first plate 11 is provided with several guide posts 29. The guide posts 29 are used to pass through the corresponding second guide holes 231. The guiding system constructed between the pressure ring 23 and the first plate 11 realizes motion constraint and dynamic balance control. For example, the surface of the pressure ring 23 is processed by laser precision machining technology, and 6-12 second guide holes 231 (optimized according to the size of the pressure ring 23) are distributed at equal angles along the circumference. These second guide holes 231 are provided with a 3°-5° chamfered guiding structure at the entrance end, and high-strength guide posts are provided at corresponding positions on the first plate 11. The actual gap between the guide posts 29 and the second guide holes 231 is controlled within the range of 0.002mm-0.005mm. Through the circumferentially distributed array of guide posts 29, a spatial six-point (or more) constraint system is formed.

[0064] Furthermore, the worktable 1 also includes a second plate 12. The first plate 11 is mounted on the second plate 12 and is rotatable. The first plate 1111 and the second plate 1212 are rotatably connected, allowing the first plate 1111 to rotate flexibly relative to the second plate 1212, thus providing a structural basis for subsequent chip angle adjustment. The first plate 11 has a first clearance through hole at its center, and the second plate 12 has a second clearance through hole at its center. The first clearance through hole and the second clearance through hole are connected. This design ensures that subsequent operations, such as the ejector pin lifting the chip, can be performed smoothly.

[0065] Furthermore, when retrieving the chip, attention must be paid to its placement angle, which involves adjusting the chip's placement angle. The worktable 1 also includes a rotary drive module 13, used to drive the first plate 11 to rotate relative to the second plate 12. The fixed end of the rotary drive module 13 is connected to the second plate 12, and the output end of the rotary drive module 13 is connected to the first plate 11 via a transmission connection. Through this transmission connection, when the rotary drive module 13 is working, it can transmit its power to the first plate 11, causing the first plate 11 to rotate according to the set requirements.

[0066] Exemplarily, in this embodiment, the rotary drive module 13 includes an adapter base 131, a linear motion module 132, an active moving member 133, a driven moving member 134, and an adapter 135. One end of the adapter base 131 is fixedly connected to the side of the second plate 12. The linear motion module 132 is disposed on the adapter base 131. The active moving member 133 is connected to the slider of the linear motion module 132, and the active moving member 133 can slide along the tangential direction of the first clearance through hole. The driven moving member 134 is disposed on the active moving member 133, and the driven moving member 134 can slide along the radial direction of the first clearance through hole. One end of the adapter 135 is fixedly connected to the first plate 11, and the other end of the adapter 135 is hinged to the driven moving member 134. The active moving member 133 is connected to the slider of the linear motion module 132. The linear motion module 132 can be a lead screw and slide module, which is connected to a servo motor to improve the rotational accuracy of the first plate 11. The linear motion module 132 is mounted on the adapter base 131, making full use of the structural features and spatial position of the adapter base 131 to provide a stable mounting foundation for the linear motion module 132. The driven moving part 134 can slide along the radial direction of the first clearance through hole. The driven moving part 134 is mounted on the active moving part 133, and the driven moving part 134 and the active moving part 133 form a close linkage relationship. While the active moving part 133 drives the driven moving part 134 to slide along the tangential direction, the radial sliding of the driven moving part 134 can produce a compound motion effect, providing flexible and variable motion output for the entire rotary drive module 13. This is used to drive the first plate 11 to rotate relative to the second plate 12, which can adjust the angle of the chip on the carrier tray, making it easier to adapt to the gripping mechanism, improving the chip transfer efficiency and the subsequent chip-wafer bonding efficiency. The adapter 135 serves as a crucial bridge connecting the first plate 11 and the driven moving member 134 in the rotary drive module 13. The other end of the adapter 135 is hinged to the driven moving member 134. The hinged structure offers significant flexibility and freedom. When the driven moving member 134 moves under the drive of the active moving member 133, the hinged structure can adapt to the movement trajectory and posture changes of the driven moving member 134, achieving a smooth transition and power transmission between the two. Simultaneously, the hinged structure can also buffer and absorb impacts and vibrations generated during movement to a certain extent, reducing damage and wear to other components and improving the reliability and service life of the entire rotary drive module 13. For example, the driven moving member 134 is a pin, with its lower end slidably connected to the guide rail on the active moving member 133. The inner ring of the bearing is fitted onto the upper end of the pin, and the outer ring of the bearing is embedded in the other end of the adapter 135.

[0067] Example 2

[0068] This embodiment provides a film expansion device. Compared with Embodiment 1, the basic structure of the film expansion device provided in this embodiment is the same as that in Embodiment 1. Only the specific structural design of the rotation drive module 13 is different. This embodiment will not describe the structure that is the same as that in Embodiment 1 again.

[0069] For example, the outer edge of the first plate 11 is provided with transmission teeth in the circumferential direction. The rotary drive module 13 includes a movable rack, which is slidably disposed on the second plate 12. The movable rack can move along the tangential direction of the first clearance through hole, and the movable rack meshes with the transmission teeth. The movable rack is connected to the power mechanism for transmission, and the first plate 11 is driven to adjust its angle using a gear and rack transmission method.

[0070] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments. Many other equivalent embodiments may be included without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A film expansion device, characterized in that, include: Workbench (1), including first plate (11); The film expansion assembly (2) includes a lifting drive module (21), a lifting frame (22), a pressure ring (23), and a blocking ring (24). The blocking ring (24) and the lifting drive module (21) are both disposed on the first plate (11). The lifting frame (22) is connected to the lifting drive module (21) in a transmission manner. The projection of the lifting frame (22) in the vertical direction is located on the periphery of the projection of the blocking ring (24). The lifting drive module (21) is used to drive the lifting frame (22) to move in the vertical direction. The pressure ring (23) is fixedly disposed on the lifting frame (22), and the outer contour of the blocking ring (24) in the vertical direction is projected into the inner contour projection of the pressure ring (23). The side of the pressure ring (23) facing the first plate (11) is used to install the adhesive film (1000) with the chip attached.

2. The film expansion device according to claim 1, characterized in that, The pressure ring (23) and the blocking ring (24) are coaxially arranged. Two support plates (25) are spaced apart on the side of the pressure ring (23) facing the first plate (11). The support plates (25) and the pressure ring (23) form a receiving space for the adhesive film (1000). The adhesive film (1000) can be inserted into the receiving space. The two support plates (25) are used to overlap with the outer ring edge of the adhesive film (1000). The film expansion assembly (2) also includes: An annular mounting base (26) is disposed on the first plate (11) and located around the blocking ring (24); Several elastic support components (27) are circumferentially spaced on the annular mounting base (26). The head of the elastic support component (27) extends beyond the blocking ring (24) in the vertical direction. The elastic support component (27) is used to lift the outer ring edge of the adhesive film (1000) from the bearing plate (25) and press it against the pressure ring (23).

3. The film expansion device according to claim 2, characterized in that, The annular mounting base (26) is provided with a plurality of through holes spaced apart circumferentially, and the elastic support assembly (27) includes: The counterweight rod (271) has its tail end inserted into the through hole; A helical spring (272) is sleeved on the pressure rod (271). One end of the helical spring (272) is connected to the head of the pressure rod (271), and the other end of the helical spring (272) is connected to the annular mounting base (26). The head of the pressure rod (271) extends vertically beyond the blocking ring (24).

4. The film expansion device according to claim 2, characterized in that, The lifting frame (22) is provided with a threaded hole (221), and the lifting drive module (21) includes: A transmission screw (211) is provided, one end of which is rotatably mounted on the first plate (11), and the other end of which is threadedly connected to the threaded hole (221).

5. The film expansion device according to claim 4, characterized in that, The lifting drive module (21) includes: A drive motor (212) is mounted on the first plate (11) and is connected to the transmission screw (211) for transmission.

6. The film expansion device according to claim 2, characterized in that, The lifting frame (22) is provided with a number of vertically extending lifting guide rods (222), and the first plate (11) is provided with a number of sleeves (28) with first guide holes. The lifting guide rods (222) are inserted into the corresponding first guide holes.

7. The film expansion device according to claim 2, characterized in that, The pressure ring (23) is provided with a plurality of second guide holes (231) spaced circumferentially, and the first plate (11) is provided with a plurality of guide posts (29), which are used to pass through the corresponding second guide holes (231).

8. The film expansion apparatus according to any one of claims 1-7, characterized in that, The workbench (1) further includes a second plate (12), the first plate (11) is disposed on the second plate (12) and is rotatable, the first plate (11) has a first clearance through hole, the second plate (12) has a second clearance through hole, and the first clearance through hole communicates with the second clearance through hole.

9. The film expansion device according to claim 8, characterized in that, The workbench (1) also includes: A rotation drive module (13) is used to drive the first plate (11) to rotate relative to the second plate (12). The fixed end of the rotation drive module (13) is connected to the second plate (12), and the output end of the rotation drive module (13) is connected to the first plate (11) in a transmission connection.

10. The film expansion device according to claim 9, characterized in that, The rotation drive module (13) includes: An adapter base (131) is fixedly connected at one end to the side of the second plate (12); A linear motion module (132) is mounted on the adapter base (131); An active moving part (133) is connected to the slider of the linear motion module (132), and the active moving part (133) can slide along the tangential direction of the first clearance through hole; A driven moving member (134) is disposed on the active moving member (133), and the driven moving member (134) is capable of sliding along the radial direction of the first clearance through hole; The adapter (135) is fixedly connected at one end to the first plate (11) and hinged at the other end to the driven moving member (134).

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