Supporting device for semiconductor cleaning equipment and semiconductor cleaning equipment

Abstract

The utility model provides a supporting device for semiconductor cleaning equipment and the semiconductor cleaning equipment, and the supporting device comprises a disc body and a supporting member which is arranged on the disc body and is used for supporting a wafer; and the disc body is provided with a notch for allowing fingers of the manipulator to pass through the notch in the wafer taking or placing process of the manipulator. According to the supporting device used for the semiconductor cleaning equipment, the outer edge of the disc body used for supporting the wafer is provided with the gap used for avoiding the finger of the mechanical arm, and the gap allows the finger of the mechanical arm to pass through the gap in the wafer taking or placing process of the mechanical arm. And the problem that the manipulator interferes with the disc body in the wafer taking or placing process is effectively avoided. Compared with a wafer supporting device in the prior art, on one hand, the structure of the supporting device is simplified, on the other hand, the wafer taking step is simplified, the process rhythm is improved, and the wafer cleaning efficiency is further improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a support device for semiconductor cleaning equipment and semiconductor cleaning equipment. Background Technology

[0002] In the semiconductor device manufacturing process, if the non-cleaned surfaces are not adequately protected during wafer cleaning, cleaning solution from the cleaning surfaces can flow back to the non-cleaned surfaces, causing contamination. Severe contamination can seriously affect subsequent processes. Therefore, protecting the non-cleaned surfaces of the wafer is extremely important.

[0003] In existing technologies, the wafer cleaning process requires first placing the wafer to be cleaned horizontally on a support device using a robotic arm, and then cleaning the cleaning surface of the wafer. During the cleaning process, liquid or gas is used to protect the non-cleaned surface of the wafer. When using gas to protect the non-cleaned surface of the wafer, due to the easy diffusion and leakage characteristics of gas, the usual approach is to reduce the distance between the wafer and the support pad, thus creating a small space between the wafer and the support pad to facilitate gas filling. However, this leads to a problem: due to the small distance between the wafer and the support pad, there is no space for the robotic arm to pick up the wafer. To solve this problem, an auxiliary mechanism needs to be set up below the support device to support the wafer and create a space for picking up the wafer. This makes the structure of the wafer support device more complex, and the supporting action of the auxiliary mechanism will prolong the wafer cleaning process time, thereby reducing the process cycle time and reducing cleaning efficiency. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a support device and a semiconductor cleaning device for semiconductor cleaning equipment, which effectively protects the non-cleaned surface during the wafer cleaning process while realizing rapid wafer pick-up and placement.

[0005] To achieve the above objectives, the first aspect of this utility model provides a support device for a semiconductor cleaning equipment, comprising:

[0006] Disk body,

[0007] A support member, disposed on the disk body, is used to support the wafer;

[0008] The disc body has a notch to allow the robotic arm's fingers to pass through during the robotic arm's picking up or placing of the disc.

[0009] Preferably, the notch is located at the outer edge of the disc body and extends through the disc body.

[0010] Preferably, the disc body has a plurality of notches, which are spaced apart along the outer edge of the disc body.

[0011] Preferably, a protective space is formed between the disk and the wafer, the protective space being used to contain protective gas; an air inlet is provided on the side of the disk opposite to the wafer, the air inlet being connected to an external gas source; and an air outlet is formed between the outer edge of the disk and the outer edge of the wafer.

[0012] Preferably, the air inlet is equipped with a gas diversion component; the gas diversion component includes an air inlet and a flow restrictor, the flow restrictor being disposed at the center of the air inlet, thereby limiting the airflow speed at the air inlet by blocking part of the airflow.

[0013] Preferably, the flow limiting part divides the air inlet into a first air inlet and a second air inlet; both the first air inlet and the second air inlet are arc-shaped structures.

[0014] Preferably, the disc body is provided with a plurality of support members, and the plurality of support members are spaced apart along the edge of the disc body.

[0015] Preferably, the disk body comprises:

[0016] The first disc is used to isolate liquid splashes during the cleaning process; the support member is disposed on the first disc.

[0017] A second disk body is disposed above the first disk body to form the protective space between itself and the uncleaned surface of the wafer; a plurality of the notches are spaced apart on the outer edge of the second disk body;

[0018] A connecting part is disposed between the first disk body and the second disk body for connecting the first disk body and the second disk body;

[0019] The air inlet is located on the side of the second disk opposite to the wafer.

[0020] Preferably, the first disc body, the second disc body, and the connecting part are integrally formed.

[0021] The second aspect of this utility model provides a semiconductor cleaning device, including a support device as described in the first aspect of this utility model.

[0022] The beneficial effects of this invention are as follows: The support device for semiconductor cleaning equipment of this invention has a notch on the outer edge of the wafer support tray to avoid interference with the robotic arm's fingers. This notch allows the robotic arm's fingers to pass through during wafer picking or placing, effectively preventing interference between the robotic arm and the tray. Compared to existing wafer support devices, this invention eliminates the conventional auxiliary mechanism (the mechanism that lifts the wafer from the tray), allowing the robotic arm to directly pick up and place the wafer. This simplifies the structure of the support device and the wafer picking steps, improving process cycle time and further enhancing the efficiency of wafer cleaning. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of a single-layer disk body used as a support device for semiconductor cleaning equipment according to an embodiment of the present invention;

[0024] Figure 2 This is a side view of a single-layer disk body of a support device for a semiconductor cleaning equipment according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the structure of the double-layer disk body of the support device for semiconductor cleaning equipment according to an embodiment of the present invention;

[0026] Figure 4 This is a side view of the double-layer disk body of the support device for a semiconductor cleaning equipment according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the robotic arm's plate-laying process in an embodiment of this utility model;

[0028] Figure 6 This is a schematic diagram of the robotic arm picking up the slice in an embodiment of this utility model.

[0029] Figure label:

[0030] 1-Disc body; 11-Notch; 12-Air inlet; 13-Gas diverter; 131-First air inlet; 132-Second air inlet; 133-Flow limiting part; 14-First disc body; 15-Second disc body; 16-Connecting part;

[0031] 2-Supporting components;

[0032] 3- Robotic hand; 31- Robotic hand body; 32- Fingers

[0033] 4-Wafer;

[0034] 5-Protective space; 6-Air outlet. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0036] Please see Figure 1 The present invention provides a support device for a semiconductor cleaning equipment, comprising: a disk body 1 and a support member 2; the disk body 1 is disposed in the cleaning chamber of the cleaning equipment. The support member 2 is disposed on the disk body 1 for supporting a wafer 4; the disk body 1 has a notch 11 for allowing the fingers 32 of the robotic arm 3 to pass through the notch 11 during wafer picking or placing.

[0037] In this embodiment, the disk body 1 has a single-layer structure, and the notch 11 is provided on the outer edge of the disk body 1 and penetrates the disk body 1. The disk body 1 has a plurality of notches 11, which are spaced apart along the outer edge of the disk body 1.

[0038] The robotic arm 3 includes a robotic arm body 31 and four fingers 32. The fingers 32 are radially arranged and fixedly connected to the robotic arm body 31, and the four fingers 32 are spaced apart on the inner edge of the robotic arm body 31. When the robotic arm 3 transfers the wafer 4, the wafer 4 is supported by the four fingers 32 to achieve the movement of the wafer.

[0039] After the cleaning process begins, the robotic arm 3 performs the wafer placement action: the robotic arm 3 uses multiple fingers 32 to support the wafer 4 and enter the cleaning chamber. After aligning each finger 32 with the corresponding notch 11 on the disk 1, the robotic arm 3's fingers 32 begin to descend with the wafer 4. When the wafer contacts the support 2, the descent stops, while the robotic arm 3 continues to descend below the disk 1. During this process, the multiple fingers 32 pass through the corresponding notch 11. At this point, the robotic arm 3 has placed the wafer and then moves horizontally outside the disk 1 before exiting the cleaning chamber.

[0040] Once wafer 4 is cleaned, robotic arm 3 performs the wafer removal action: After entering the cleaning chamber, robotic arm 3 extends from below the tray 1. Once its fingers 32 align with the corresponding notches 11 on the tray 1, robotic arm 3 begins to rise until it lifts the wafer. During this process, multiple fingers 32 pass through the corresponding notches 11 on the tray 1. After lifting the wafer, robotic arm 3 removes it from the cleaning chamber, thus completing the wafer cleaning process.

[0041] In this embodiment, the notch 11 can effectively avoid the fingers 32 of the robotic arm 3 during the process of picking up or placing the wafer, thus preventing interference between the disc body 1 and the robotic arm 3.

[0042] See Figure 1 , Figure 2 In this embodiment, a protective space 5 is formed between the disk 1 and the wafer 4, and the protective space 5 is used to contain protective gas. An air inlet 12 is provided on the side of the disk 1 opposite to the wafer, and the air inlet 12 is connected to an external gas source (not shown). An air outlet channel 6 is formed between the outer edge of the disk 1 and the outer edge of the wafer. Specifically, the air inlet 12 is used to introduce the protective gas transmitted from the external gas source into the protective space 5. After entering the protective space 5, the protective gas evenly covers the non-cleaned surface of the wafer, forming a uniform gas protective film, effectively preventing the cleaning fluid from contacting the non-cleaned surface of the wafer.

[0043] Protective gases are generally dry, pure inert gases, such as nitrogen, to prevent chemical reactions between the gas and the wafer or the introduction of new impurities.

[0044] Because gases are easily diffused and leaky, it is necessary to minimize the distance between wafer 4 and disk 1, thereby creating a small space between them to facilitate gas filling. In this embodiment, the distance between disk 1 and wafer ranges from 0.1 to 1.2 mm, preferably 0.2 mm. This distance range creates a small protective space 5 between disk 1 and wafer, allowing the protective gas to quickly fill this space and provide protection. This avoids problems such as slow protective gas filling speed, excessive leakage, and poor protective effect caused by an excessively large distance between disk 1 and wafer.

[0045] In some embodiments, the side of the disk 1 opposite to the uncleaned surface of the wafer is a concave surface, and the concave surface and the wafer form the protective space 5. The air inlet 12 is located at the center of the concave surface. Compared with a flat surface, the concave surface can increase the distance between the air inlet 12 and the uncleaned surface of the wafer, which is conducive to the uniform diffusion of protective gas at the air inlet 12 to all parts of the protective space 5.

[0046] See Figure 1In some embodiments, the air inlet 12 is equipped with a gas diversion component 13; the gas diversion component 13 ensures that the protective gas can uniformly cover the uncleaned surface of the wafer. Further, in this embodiment, the gas diversion component 13 includes an air inlet and a flow restrictor 133, the flow restrictor 133 being disposed at the center of the air inlet, blocking part of the airflow to limit the airflow velocity at the air inlet 12. This prevents excessive airflow from impacting the uncleaned surface of the wafer and causing wafer vibration. In this embodiment, the air inlet and the flow restrictor 133 are integrally formed.

[0047] See Figure 1 In some embodiments, the flow restrictor 133 divides the air inlet into a first air inlet 131 and a second air inlet 132; both the first air inlet 131 and the second air inlet 132 are arc-shaped structures. The arc-shaped first air inlet 131 and the second air inlet 132 form an approximately annular air inlet, and the structure of the annular air inlet helps to ensure that the protective gas can uniformly cover the uncleaned surface of the wafer 4.

[0048] In some embodiments, the disk body 1 is provided with a plurality of support members 2, which are spaced apart along the edge of the disk body 1. In this embodiment, the disk body 1 is provided with 6 support members 2, which cooperate with each other to support the wafer.

[0049] See Figure 3 , Figure 4 In some embodiments, the disk body 1 has a double-layer structure, specifically including: a first disk body 14, a connecting part 16, and a second disk body 15.

[0050] The first disk 14 is used to isolate liquid splashes during the cleaning process; the support member 2 is disposed on the first disk 14; the second disk 15 is disposed above the first disk 14 to form the protective space 5 between it and the non-cleaned surface of the wafer; four notches 11 are spaced apart on the outer edge of the second disk 15; the distance between the first disk 14 and the second disk 15 is greater than the thickness of the robotic arm's fingers to ensure that the robotic arm's fingers do not contact the first disk 14 or the second disk 15 when moving horizontally. A connecting part 16 is disposed between the first disk 14 and the second disk 15 to connect the first disk 14 and the second disk 15; the connecting part 16 has an air intake channel (not shown), one end of which is connected to an air inlet 12, and the other end is connected to an external air source. The air inlet 12 is disposed on the side of the second disk 15 opposite to the wafer.

[0051] See Figure 5When the robotic arm 3 performs the wafer placement action, it uses multiple fingers 32 to support the wafer and guide it into the cleaning chamber. After aligning each finger 32 with the corresponding notch 11 on the second tray 15, the robotic arm 3's fingers 32 begin to descend with the wafer. The descent stops when the wafer contacts the support member 2, while the robotic arm 3 continues to descend between the first tray 14 and the second tray 15. During this process, the multiple fingers 32 pass through the corresponding notch 11. At this point, the robotic arm 3 has placed the wafer and then moves horizontally outside the tray 1 before exiting the cleaning chamber.

[0052] See Figure 6 When the robotic arm 3 performs the wafer picking action, it enters the cleaning chamber and extends between the first tray 14 and the second tray 15. Once its individual fingers 32 align with the corresponding notches 11 on the second tray 15, the robotic arm 3 begins to rise until it lifts the wafer. During this process, multiple fingers 32 pass through the corresponding notches 11 on the second tray 15. After lifting the wafer, the robotic arm 3 removes it from the cleaning chamber, thus completing the wafer cleaning process.

[0053] In some embodiments, the first disc body 14, the second disc body 15, and the connecting portion 16 are integrally formed.

[0054] In some embodiments, the diameter of the second disk 15 is larger than the diameter of the wafer. In order to make the position of the support member 2 on the first disk 14 meet the requirements for supporting the wafer, an avoidance notch is also provided on the outer edge of the second disk 15. A portion of the support member 2 passes through the avoidance notch through the second disk 15 to meet the radial distance required to support the wafer.

[0055] A second aspect of this invention provides a semiconductor cleaning apparatus that employs the support device for semiconductor cleaning described in the first aspect of this invention. The semiconductor cleaning apparatus includes a cleaning chamber, and the support device is disposed inside the cleaning chamber.

[0056] In summary, the support device for semiconductor cleaning equipment of this invention provides a notch on the outer edge of the wafer support tray to avoid interference with the robotic arm's fingers. This notch allows the robotic arm's fingers to pass through during wafer handling, effectively preventing interference between the robotic arm and the tray. Compared to existing wafer support devices, this invention eliminates the conventional auxiliary mechanism (the mechanism that lifts the wafer from the tray), allowing the robotic arm to directly handle the wafers. This simplifies the structure of the support device and the wafer handling steps, improving process cycle time and further enhancing wafer cleaning efficiency. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0057] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A support device for semiconductor cleaning equipment, characterized in that, include: Disk body, A support member, disposed on the disk body, is used to support the wafer; The disc body has a notch to allow the robotic arm's fingers to pass through during the robotic arm's picking up or placing of the disc.

2. The support device for semiconductor cleaning equipment according to claim 1, characterized in that: The notch is located on the outer edge of the disc body and extends through the disc body.

3. The support device for semiconductor cleaning equipment according to claim 2, characterized in that: The disc body has multiple notches, which are spaced apart along the outer edge of the disc body.

4. The support device for semiconductor cleaning equipment according to claim 1, characterized in that: A protective space is formed between the disk and the wafer, and the protective space is used to contain a protective gas. The disk body has an air inlet on the side opposite to the wafer, and the air inlet is connected to an external air source; An air venting channel is formed between the outer edge of the disk and the outer edge of the wafer.

5. The support device for semiconductor cleaning equipment according to claim 4, characterized in that: The air inlet is equipped with a gas diversion component; The gas diversion component includes an air inlet and a flow restrictor. The flow restrictor is located at the center of the air inlet and limits the airflow speed at the air inlet by blocking part of the airflow.

6. The support device for semiconductor cleaning equipment according to claim 5, characterized in that: The flow-limiting section divides the air inlet into a first air inlet and a second air inlet; both the first air inlet and the second air inlet are arc-shaped structures.

7. The support device for semiconductor cleaning equipment according to claim 1, characterized in that: The disc body is provided with a plurality of support members, which are spaced apart along the edge of the disc body.

8. The support device for semiconductor cleaning equipment according to claim 4, characterized in that: The disk body includes: The first disc is used to isolate liquid splashes during the cleaning process; the support member is disposed on the first disc. A second disk body is disposed above the first disk body to form the protective space between itself and the uncleaned surface of the wafer; a plurality of the notches are spaced apart on the outer edge of the second disk body; A connecting part is disposed between the first disk body and the second disk body for connecting the first disk body and the second disk body; The air inlet is located on the side of the second disk opposite to the wafer.

9. The support device for semiconductor cleaning equipment according to claim 8, characterized in that: The first disc body, the second disc body, and the connecting part are integrally formed.

10. A semiconductor cleaning device, characterized in that: Includes a support device for a semiconductor cleaning apparatus as described in any one of claims 1-9.

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