Silicon wafer restoration device
By designing a silicon wafer alignment device, which utilizes lifting and side alignment mechanisms to achieve automated and neat placement of silicon wafers, the problem of uneven placement of silicon wafers during transfer is solved, improving efficiency and saving labor costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YINGKOU JINCHEN MACHINERY
- Filing Date
- 2025-05-07
- Publication Date
- 2026-05-05
AI Technical Summary
During the production of solar cells, silicon wafers are often misaligned when transferred to the wafer cassette, resulting in low efficiency and increased labor costs.
A silicon wafer alignment device was designed, including an alignment body, an end alignment mechanism, and a side alignment mechanism. The end alignment mechanism is driven to rise and fall by a lifting component, and the side alignment mechanism is used to align the left and right sides of the silicon wafer, thereby achieving automated alignment.
It improves the automation level of silicon wafer alignment, saves labor costs, increases work efficiency, and reduces friction between the silicon wafer and the alignment block through the inclined surface design.
Smart Images
Figure CN224205578U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic cell technology, and in particular to a silicon wafer alignment device. Background Technology
[0002] The core of a solar cell is the silicon wafer, which is manufactured through a series of complex processes. During solar cell production, the silicon wafer needs to be transferred between different processes and different support devices; for example, it needs to be transferred from a basket to a wafer cassette. Currently, vacuum suction cups are generally used to pick up the silicon wafers and place them into the cassette. However, this often leads to uneven placement. To avoid this, the silicon wafers are usually manually aligned, which increases labor costs and is inefficient. Summary of the Invention
[0003] This application provides a silicon wafer alignment device to solve the problems existing in related technologies. The technical solution is as follows:
[0004] This application provides a silicon wafer alignment device, including:
[0005] Correcting the subject;
[0006] An end-alignment mechanism includes a lifting component and an end-alignment component. The lifting component is disposed on the alignment body and connected to the end-alignment component. The lifting component drives the end-alignment component to move up and down. The end-alignment component includes an end-alignment drive and an end-alignment block. The end-alignment drive is connected to the end-alignment block. The end-alignment block has an inclined surface that slopes upwards away from the end-alignment drive.
[0007] A side alignment mechanism is disposed on the alignment body. The side alignment mechanism includes a left alignment component and a right alignment component, and the end alignment component is located between the left alignment component and the right alignment component.
[0008] In one embodiment, the lifting assembly includes a lifting drive component, a lifting connecting plate, and a lifting fixing plate. The lifting drive component is fixed to the alignment body, the lifting connecting plate is connected to the lifting drive component, the lifting fixing plate is connected to the lifting connecting plate, the lifting connecting plate is located between the lifting drive component and the lifting fixing plate, and the end alignment drive component is fixed to the lifting connecting plate.
[0009] In one embodiment, the end alignment mechanism further includes a guide assembly connected to the lifting connecting plate.
[0010] In one embodiment, the guiding assembly includes a guiding base and a guiding shaft. The guiding base is fixed to the alignment body. One end of the guiding shaft passes through the guiding base and is slidably connected to the guiding base. The other end of the guiding shaft is connected to the lifting connecting plate. The driving shaft of the lifting drive passes through the guiding base and is connected to the lifting connecting plate.
[0011] In one embodiment, a linear bearing is fixed on the guide base, and the guide shaft is slidably connected to the linear bearing.
[0012] In one embodiment, there are multiple end alignment components, which are spaced apart along the length of the lifting and fixing plate.
[0013] In one embodiment, the left-side alignment component includes a left-side alignment drive, a left-side slide rail, a left-side alignment bracket, and a left-side alignment guide wheel. The left-side alignment drive and the left-side slide rail are both fixed to the alignment body. The left-side alignment drive is connected to the left-side alignment bracket. The left-side alignment drive drives the left-side alignment bracket to move towards or away from the end alignment component. The left-side alignment bracket is slidably connected to the left-side slide rail, and the left-side alignment guide wheel is movably connected to the left-side alignment bracket.
[0014] In one embodiment, the left-side alignment bracket is provided with a plurality of spaced-apart left-side alignment plates, and the number of left-side alignment guide wheels is plurality of each left-side alignment guide wheel being movably disposed on the plurality of left-side alignment plates; the left-side alignment plates are provided with left-side adjustment grooves arranged along the width direction of the left-side alignment plates, and the left-side alignment bracket is provided with left-side adjustment holes; the left-side alignment plates are movably connected to the left-side alignment bracket through the left-side adjustment grooves and the left-side adjustment holes.
[0015] In one embodiment, the right-side alignment component includes a right-side alignment drive, a right-side slide rail, a right-side alignment bracket, and a right-side alignment guide wheel. The right-side alignment drive and the right-side slide rail are both fixed to the alignment body. The right-side alignment drive is connected to the right-side alignment bracket. The right-side alignment drive drives the right-side alignment bracket to move towards or away from the end alignment component. The right-side alignment bracket is slidably connected to the right-side slide rail, and the right-side alignment guide wheel is movably connected to the right-side alignment bracket.
[0016] In one embodiment, the right-side alignment bracket is provided with a plurality of spaced-apart right-side alignment plates, and the number of right-side alignment guide wheels is plurality of each right-side alignment guide wheel being movably disposed on the plurality of right-side alignment plates; the right-side alignment plates are provided with right-side adjustment grooves arranged along the width direction of the right-side alignment plates, and the right-side alignment bracket is provided with right-side adjustment holes; the right-side alignment plates are movably connected to the right-side alignment bracket through the right-side adjustment grooves and the right-side adjustment holes.
[0017] The advantages or beneficial effects of the above technical solutions include at least the following:
[0018] The silicon wafer alignment device of this application embodiment includes an alignment main body, an end alignment mechanism, and a side alignment mechanism. The end alignment component is driven upward by a lifting component to align one end of the silicon wafer. The left and right alignment components of the side alignment mechanism align the left and right sides of the silicon wafer, respectively. This silicon wafer alignment device can simultaneously align the end, left, and right sides of the silicon wafer, exhibiting a high degree of automation. Compared to manual alignment, it saves labor costs and improves work efficiency. In this embodiment, the end alignment block is provided with an inclined surface to prevent friction between the silicon wafer and the end alignment block when the wafer is picked up by a suction cup or similar device and moved upward after alignment.
[0019] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0020] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0021] Figure 1 This is a schematic diagram of the first structure of the silicon wafer alignment device;
[0022] Figure 2 This is a schematic diagram of the second structure of the silicon wafer alignment device;
[0023] Figure 3 This is a schematic diagram of the third structure of the silicon wafer alignment device;
[0024] Figure 4 A schematic diagram showing the operating status of the silicon wafer alignment device;
[0025] Explanation of reference numerals in the attached figures:
[0026] 1. Alignment body; 2. End alignment mechanism; 3. Side alignment mechanism; 21. Lifting assembly; 22. End alignment assembly; 221. End alignment drive; 222. End alignment block; 223. Inclined surface; 31. Left alignment assembly; 32. Right alignment assembly; 211. Lifting drive; 212. Lifting connecting plate; 213. Lifting fixing plate; 23. Guide assembly; 231. Guide base; 232. Guide shaft; 233. Linear bearing; 311. Left alignment drive; 312. Left slide rail; 313. Left alignment bracket; 314. Left alignment guide wheel; 315. Left alignment plate; 3151. Left adjustment groove; 321. Right alignment drive; 322. Right slide rail; 323. Right alignment bracket; 324. Right alignment guide wheel; 325. Right alignment plate; 3251. Right adjustment groove; 4. Silicon wafer. Detailed Implementation
[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0028] like Figures 1 to 4 As shown in the figure, this application provides a silicon wafer alignment device, including an alignment body 1, an end alignment mechanism 2, and a side alignment mechanism 3. The end alignment mechanism 2 includes a lifting component 21 and an end alignment component 22. The lifting component 21 is disposed on the alignment body 1 and connected to the end alignment component 22, driving the end alignment component 22 to move up and down. The end alignment component 22 includes an end alignment drive component 221 and an end alignment block 222. The end alignment drive component 221 is connected to the end alignment block 222, and the end alignment block 222 has an inclined surface 223 that slopes obliquely upwards away from the end alignment drive component 221. The side alignment mechanism 3 is disposed on the alignment body 1 and includes a left alignment component 31 and a right alignment component 32. The end alignment component 22 is located between the left and right alignment components 31 and 32.
[0029] The silicon wafer alignment device of this embodiment includes an alignment body 1, an end alignment mechanism 2, and a side alignment mechanism 3. The end alignment component 22 is driven upward by a lifting component 21 to align one end of the silicon wafer 4. The left and right alignment components 31 and 32 of the side alignment mechanism 3 align the left and right sides of the silicon wafer 4, respectively. This silicon wafer alignment device can simultaneously align the end, left, and right sides of the silicon wafer 4, exhibiting a high degree of automation. Compared to manual alignment, it saves labor costs and improves work efficiency. In this embodiment, an inclined surface 223 is provided on the end alignment block 222 to prevent friction between the silicon wafer 4 and the end alignment block 222 when the silicon wafer 4 is picked up by a suction cup or similar device and moved upward after alignment.
[0030] In one embodiment, to drive the end alignment component 22 to rise and fall, the lifting component 21 includes a lifting drive component 211, a lifting connecting plate 212, and a lifting fixing plate 213. The lifting drive component 211 is fixed to the alignment body 1, the lifting connecting plate 212 is connected to the output end of the lifting drive component 211, and the lifting fixing plate 213 is connected to the lifting connecting plate 212. The lifting connecting plate 212 is located between the lifting drive component 211 and the lifting fixing plate 213, and the end alignment drive component 221 is fixed to the lifting connecting plate 212.
[0031] Preferably, the lifting drive component 211 is a cylinder, and the output end of the cylinder is connected to a floating joint, which is connected to the lifting connecting plate 212. The lifting drive component 211 can be fixed to the alignment body 1 by bolts or the like. The lifting fixing plate 213 and the lifting connecting plate 212 can also be connected and fixed by bolts or the like.
[0032] To guide the movement of the lifting connecting plate 212, the end alignment mechanism 2 further includes a guide component 23, which is connected to the lifting connecting plate 212. During the lifting process, as the lifting drive component 211 moves the lifting connecting plate 212 up and down, the guide component 23 guides the lifting connecting plate 212, preventing positional deviations during movement and ensuring its stability.
[0033] In one embodiment, the guide assembly 23 includes a guide base 231 and a guide shaft 232. The guide base 231 is fixed to the alignment body 1 by screws or the like. One end of the guide shaft 232 passes through the guide base 231 and is slidably connected to it. The other end of the guide shaft 232 is connected to the lifting connecting plate 212. The drive shaft of the lifting drive component 211 passes through the guide base 231 and is connected to the lifting connecting plate 212. Further, a linear bearing 233 is fixed on the guide base 231, and the guide shaft 232 is slidably connected to the linear bearing 233. The linear bearing 233 can also be fixed to the guide base 231 by screws or the like. The guide shaft 232 can be connected to the lifting connecting plate 212 by screws, and the guide shaft 232 can also be installed in the lifting connecting plate 212 through mounting holes or mounting slots.
[0034] Preferably, there are two guide shafts 232, which are located on opposite sides of the lifting drive component 211. This embodiment guides the lifting connecting plate 212 from two different positions, ensuring greater stability during movement.
[0035] In one embodiment, there are multiple end-alignment components 22, which are spaced apart along the length of the lifting and fixing plate 213. Multiple end-alignment components 22 can simultaneously align multiple silicon wafers 4. Preferably, there are four end-alignment components 22, thereby simultaneously aligning four silicon wafers 4. In this application, the end-alignment components 22 are located at the front end of the silicon wafer 4, thereby aligning the front end of the silicon wafer 4.
[0036] The end-alignment drive 221 of the end-alignment assembly 22 is fixed to the lifting and fixing plate 213 by bolts and connecting plates. The end-alignment drive 221 drives the end-alignment block 222 to move forward or backward, thereby aligning the front end of the silicon wafer 4.
[0037] To align the left side of the silicon wafer 4, the left-side alignment assembly 31 includes a left-side alignment drive 311, a left-side slide rail 312, a left-side alignment bracket 313, and a left-side alignment guide wheel 314. The left-side alignment drive 311 and the left-side slide rail 312 are both fixed to the alignment body 1 by bolts or the like. The left-side alignment drive 311 is connected to the left-side alignment bracket 313, and the left-side alignment drive 311 drives the left-side alignment bracket 313 to move closer to or further away from the end alignment assembly 22. The left-side alignment bracket 313 and the left-side slide rail 312 are slidably connected by a slider, and the left-side alignment guide wheel 314 is movably connected to the left-side alignment bracket 313. Preferably, there are two left-side slide rails 312, located on opposite sides of the left-side alignment drive 311. The left-side alignment drive 311 is a cylinder, which is connected to the left-side alignment bracket 313 by a connecting plate and bolts.
[0038] To achieve the movable connection between the left-side alignment guide wheel 314 and the left-side alignment bracket 313, multiple spaced-apart left-side alignment plates 315 are provided on the left-side alignment bracket 313. The number of left-side alignment guide wheels 314 is multiple, and each of the multiple left-side alignment guide wheels 314 is movably mounted on one of the multiple left-side alignment plates 315. Since there are four end alignment components 22, there are also four left-side alignment plates 315, each located on the side of one of the four end alignment components 22. Each left-side alignment plate 315 is provided with three left-side alignment guide wheels 314, which are slidably connected to each other via a rotating shaft.
[0039] To enable the left-side alignment component 31 to be compatible with silicon wafers 4 of different sizes, in one embodiment, the left-side alignment plate 315 is provided with a left-side adjustment groove 3151 arranged along the width direction of the left-side alignment plate 315, and the left-side alignment bracket 313 is provided with a left-side adjustment hole. The left-side alignment plate 315 is movably connected to the left-side alignment bracket 313 through the left-side adjustment groove 3151 and the left-side adjustment hole. The left-side adjustment groove 3151 on the left-side alignment plate 315 is connected to the left-side adjustment hole by bolts. After removing or loosening the bolts, the position of the left-side alignment plate 315 can be adjusted, thus making the left-side alignment component 31 suitable for use with silicon wafers 4 of different sizes. There can be two left-side adjustment grooves 3151, located between adjacent left-side alignment guide rollers 314.
[0040] To align the right side of silicon wafer 4, the right-side alignment assembly 32 includes a right-side alignment drive 321, a right-side slide rail 322, a right-side alignment bracket 323, and a right-side alignment guide wheel 324. The right-side alignment drive 321 and the right-side slide rail 322 are both fixed to the alignment body 1 by bolts, etc. The right-side alignment drive 321 is connected to the right-side alignment bracket 323, and the right-side alignment drive 321 drives the right-side alignment bracket 323 to move closer to or further away from the end alignment assembly 22. The right-side alignment bracket 323 is slidably connected to the right-side slide rail 322, and the right-side alignment guide wheel 324 is movably connected to the right-side alignment bracket 323. The right-side alignment drive 321 is a cylinder, which is connected to the right-side alignment bracket 323 by bolts and a connecting plate, etc. There are two right-side alignment guide wheels 324, located on opposite sides of the right-side alignment drive 321.
[0041] To achieve the movable connection between the right-side alignment guide wheel 324 and the right-side alignment bracket 323, multiple spaced-apart right-side alignment plates 325 are provided on the right-side alignment bracket 323. The number of right-side alignment guide wheels 324 is multiple, and each right-side alignment guide wheel 324 is movably mounted on one of the multiple right-side alignment plates 325. Since there are four end alignment components 22, there are also four right-side alignment plates 325, located on the sides of the four end alignment components 22. Each right-side alignment plate 325 is provided with three right-side alignment guide wheels 324, which are slidably connected to each other via a rotating shaft. The positions of the four right-side alignment plates 325 are respectively opposite to the positions of the four left-side alignment plates 315.
[0042] To enable the right-side alignment component 32 to be compatible with silicon wafers 4 of different sizes, in one embodiment, the right-side alignment plate 325 is provided with a right-side adjustment groove 3251 arranged along the width direction of the right-side alignment plate 325, and the right-side alignment bracket 323 is provided with a right-side adjustment hole. The right-side alignment plate 325 is movably connected to the right-side alignment bracket 323 through the right-side adjustment groove 3251 and the right-side adjustment hole. The right-side adjustment groove 3251 on the right-side alignment plate 325 is connected to the right-side adjustment hole by bolts. After removing or loosening the bolts, the position of the right-side alignment plate 325 can be adjusted, thus making the right-side alignment component 32 suitable for use with silicon wafers 4 of different sizes. There can be two right-side adjustment grooves 3251, located between adjacent right-side alignment guide wheels 324.
[0043] The silicon wafer alignment device of this embodiment can be used in conjunction with the silicon wafer 4 conveyor line. The end alignment component 22 is located in the middle of the conveyor line, and the left alignment component 31 and the right alignment component 32 are located on the left and right sides of the conveyor line, respectively. In use, after the silicon wafer 4 is conveyed from the carrying basket through the conveyor line, when four silicon wafers 4 are in place, the lifting drive 211 drives the end alignment component 22 to rise, while the end alignment drive 221 drives the end alignment block 222 to move closer to the end of the silicon wafer 4. Then, the left alignment drive 311 drives the left alignment guide wheel 314 to align the left side of the silicon wafer 4, while the right alignment drive 321 drives the right alignment guide wheel 324 to align the right side of the silicon wafer 4. After the silicon wafer 4 is aligned, the silicon wafer 4 suction cup picks up the silicon wafer 4 and places it into the stacking box.
[0044] The silicon wafer alignment device of this application embodiment can simultaneously align four silicon wafers 4, and can align three sides of the silicon wafer 4. It has a high degree of automation, improves the efficiency of silicon wafer 4 alignment, and saves labor costs. The left alignment guide wheel 314 and the right alignment guide wheel 324 are both silicone wheels, which can effectively prevent the risk of damaging the silicon wafer 4.
[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.
[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0047] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A silicon wafer alignment device, characterized in that, include: Correcting the subject; An end-alignment mechanism includes a lifting component and an end-alignment component. The lifting component is disposed on the alignment body and connected to the end-alignment component. The lifting component drives the end-alignment component to move up and down. The end-alignment component includes an end-alignment drive and an end-alignment block. The end-alignment drive is connected to the end-alignment block. The end-alignment block has an inclined surface that slopes upwards away from the end-alignment drive. A side alignment mechanism is disposed on the alignment body. The side alignment mechanism includes a left alignment component and a right alignment component, and the end alignment component is located between the left alignment component and the right alignment component.
2. The silicon wafer alignment device according to claim 1, characterized in that, The lifting assembly includes a lifting drive component, a lifting connecting plate, and a lifting fixing plate. The lifting drive component is fixed to the alignment body. The lifting connecting plate is connected to the lifting drive component. The lifting fixing plate is connected to the lifting connecting plate. The lifting connecting plate is located between the lifting drive component and the lifting fixing plate. The end alignment drive component is fixed to the lifting connecting plate.
3. The silicon wafer alignment device according to claim 2, characterized in that, The end alignment mechanism also includes a guide component, which is connected to the lifting connecting plate.
4. The silicon wafer alignment device according to claim 3, characterized in that, The guiding assembly includes a guiding base and a guiding shaft. The guiding base is fixed to the straightening body. One end of the guiding shaft passes through the guiding base and is slidably connected to the guiding base. The other end of the guiding shaft is connected to the lifting connecting plate. The driving shaft of the lifting drive component passes through the guiding base and is connected to the lifting connecting plate.
5. The silicon wafer alignment device according to claim 4, characterized in that, A linear bearing is fixed on the guide base, and the guide shaft is slidably connected to the linear bearing.
6. The silicon wafer alignment device according to any one of claims 2 to 5, characterized in that, There are multiple end-alignment components, and the multiple end-alignment components are spaced apart along the length direction of the lifting and fixing plate.
7. The silicon wafer alignment device according to any one of claims 1 to 5, characterized in that, The left-side alignment component includes a left-side alignment drive, a left-side slide rail, a left-side alignment bracket, and a left-side alignment guide wheel. The left-side alignment drive and the left-side slide rail are both fixed to the alignment body. The left-side alignment drive is connected to the left-side alignment bracket. The left-side alignment drive drives the left-side alignment bracket to move closer to or further away from the end alignment component. The left-side alignment bracket is slidably connected to the left-side slide rail, and the left-side alignment guide wheel is movably connected to the left-side alignment bracket.
8. The silicon wafer alignment device according to claim 7, characterized in that, The left-side alignment bracket is provided with multiple spaced-apart left-side alignment plates, and there are multiple left-side alignment guide wheels, which are movably mounted on the multiple left-side alignment plates respectively. The left-side alignment plates are provided with left-side adjustment grooves along the width direction of the left-side alignment plates, and the left-side alignment bracket is provided with left-side adjustment holes. The left-side alignment plates are movably connected to the left-side alignment bracket through the left-side adjustment grooves and the left-side adjustment holes.
9. The silicon wafer alignment device according to any one of claims 1 to 5, characterized in that, The right-side alignment component includes a right-side alignment drive, a right-side slide rail, a right-side alignment bracket, and a right-side alignment guide wheel. The right-side alignment drive and the right-side slide rail are both fixed to the alignment body. The right-side alignment drive is connected to the right-side alignment bracket. The right-side alignment drive drives the right-side alignment bracket to move closer to or further away from the end alignment component. The right-side alignment bracket is slidably connected to the right-side slide rail, and the right-side alignment guide wheel is movably connected to the right-side alignment bracket.
10. The silicon wafer alignment device according to claim 9, characterized in that, The right-side alignment bracket is provided with multiple spaced-apart right-side alignment plates, and there are multiple right-side alignment guide wheels, which are movably mounted on the multiple right-side alignment plates respectively. The right-side alignment plates are provided with right-side adjustment grooves along the width direction of the right-side alignment plates, and the right-side alignment bracket is provided with right-side adjustment holes. The right-side alignment plates are movably connected to the right-side alignment bracket through the right-side adjustment grooves and right-side adjustment holes.