Feeding device

Abstract

The utility model relates to the field of chip production equipment, and discloses a feeding device which can adapt to transportation of chips with different sizes. The vibrating device comprises a vibrating disc, the discharging channel is communicated with an outlet of the vibrating disc, the discharging channel is provided with a bearing surface and a contact surface, the bearing surface is connected with the side wall, far away from the center of the vibrating disc, in the outlet of the vibrating disc, the bearing surface is obliquely arranged, and the bearing surface is used for bearing a main plane of a product; and the contact surface is used for bearing the side surface of the product.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing equipment, and in particular to a feeding device. Background Technology

[0002] In today's era of rapid advancements in electronic technology, chips, as core electronic components, are widely used in various electrical products. A crucial step in the manufacturing process of these products is the precise soldering of chips to wires. Specifically, before the soldering operation begins, the chip must be securely clamped to the end of the cable, and then transported to automated soldering equipment to ensure the efficiency and precision of the soldering process.

[0003] However, most common chip feeding devices on the market currently use vibratory feeders to arrange the chips in an orderly manner through vibration. But the discharge channel of such devices is usually designed to be horizontal, and the side walls of the channel need to fit tightly against the sides of the chip to ensure that the chip maintains the correct orientation during transportation. This design has significant limitations: if the chip size changes, the entire discharge channel needs to be replaced, which not only increases production costs but also greatly reduces production efficiency, causing numerous inconveniences to the company's production process. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a feeding device capable of transporting chips of different sizes.

[0005] On the one hand, according to the feeding device of the present utility model embodiment,

[0006] Vibrating disc;

[0007] The discharge channel is connected to the outlet of the vibratory feeder. The discharge channel is provided with a bearing surface and a contact surface. The bearing surface is connected to the side wall of the outlet of the vibratory feeder away from the center of the vibratory feeder. The bearing surface is inclined and is used to support the main plane of the product. The contact surface is used to support the side of the product.

[0008] According to some embodiments of the present invention, the inclination angle of the bearing surface gradually decreases from the side closer to the vibrating plate to the side farther away from the vibrating plate.

[0009] According to some embodiments of this utility model, the contact surface is inclined.

[0010] According to some embodiments of this utility model, the material platform on the side of the discharge channel away from the vibrating plate is connected to the lower end of the bearing surface on one side, and the adjacent side is connected to the contact surface.

[0011] According to some embodiments of the present invention, a protective cover is also included, which is disposed above the discharge channel.

[0012] According to some embodiments of the present invention, a picking mechanism is also included, the picking mechanism comprising:

[0013] Suction nozzle;

[0014] A pickup power unit is provided, which can drive the nozzle to rotate and move in the radial direction.

[0015] According to some embodiments of the present invention, the picking power component includes a telescopic power unit and a rotational power unit. The telescopic power unit drives the suction nozzle to move closer to or away from the discharge channel, and the rotational power unit drives the suction nozzle and the telescopic power unit to rotate together.

[0016] According to some embodiments of the present invention, a chip clamping mechanism is also included, which is used to clamp the product picked up by the picking mechanism.

[0017] According to some embodiments of the present invention, the chip clamping mechanism includes a clamp for clamping the product, wherein the groove width of the clamp is equal to the width of the chip.

[0018] The embodiments of this utility model have at least the following beneficial effects:

[0019] A vibratory feeder is an auxiliary feeding device for automated assembly or processing machinery. It arranges chip products in an orderly manner. A discharge channel is set at the outlet of the vibratory feeder. The inclination angle of the side wall of the vibratory feeder away from the center is set at the angle of the bearing surface. Through the vibration effect of the vibratory feeder, the chip products can be neatly arranged on the side wall of the bearing surface away from the center. The bearing surface of the discharge channel is connected to the side wall of the vibratory feeder outlet away from the center, allowing the chip products to be discharged from the outlet along the bearing surface. The inclined bearing surface can support the main plane of the chip product, with one side of the chip product abutting against it, so that the chip product can be discharged at an inclination. Since the discharge channel only limits one side of the chip product, and the other side is not limited, it can adapt to chip products of different sizes without changing the discharge channel, thus improving efficiency.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a schematic diagram of the overall structure of the thermistor chip welding production line according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the overall structure of the wire cutting and stripping device according to an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the first wire clamping mechanism and the second wire clamping mechanism according to an embodiment of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the first wire clamping mechanism according to an embodiment of the present invention;

[0026] Figure 5 This is a schematic diagram of the structure of the wire expansion and cutting device according to an embodiment of the present invention;

[0027] Figure 6 This is a schematic diagram of the upper and lower cutting units in an embodiment of the present invention;

[0028] Figure 7 This is a schematic diagram of the overall structure of the shaping device according to an embodiment of the present invention;

[0029] Figure 8 This is a schematic diagram of the chip placement device according to an embodiment of the present invention;

[0030] Figure 9 This is a schematic diagram of the structure of the second soldering device according to an embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the overall structure of the coating device according to an embodiment of the present invention;

[0032] Figure 11 This is a front structural diagram of the coating device according to an embodiment of the present invention;

[0033] Figure 12 for Figure 11 Enlarged structural diagram of the dashed section;

[0034] Figure 13 This is a partial structural schematic diagram of the coating device according to an embodiment of the present invention;

[0035] Figure 14 This is a partial structural schematic diagram of the coating device according to an embodiment of the present invention;

[0036] Figures 15-16 This is a schematic diagram of the material discharge channel.

[0037] Figure label:

[0038] 100 racks;

[0039] Wire cutting and stripping device 200, first wire clamping mechanism 210, first clamp 211, first rotating head 211a, first wire feeding power component 211b, second wire feeding power component 211c, guide part 211d, crimping part 211e, first wire feeding power assembly 212, bending plate 213, wire cutting and stripping mechanism 220, second wire clamping mechanism 230, wire pulling mechanism 240, and wire take-up and release mechanism 250;

[0040] First soldering mechanism 300;

[0041] Wire expansion and cutting device 400, upper cutting unit 420, lower cutting unit 410;

[0042] Shaping device 500, shaping bracket 510, left clamp 520, right clamp 530, fixing block 540;

[0043] Chip placement device 600, picking mechanism 610, chip clamping mechanism 620, vibratory feeder 630, discharge channel 640, bearing surface 641, contact surface 642, material table 643;

[0044] Second soldering device 700, flux tank 710, solder tank 720;

[0045] The following components are included: a coating device 800, a guide rail 810, a stepped groove 811, a gluing mechanism 820, a gluing wheel 821, a pressing wheel 822, a first elastic element 823, a second elastic element 824, a feeding mechanism 830, a feeding plate 831, a feeding power element 832, a feeding mechanism 840, a clamping assembly 841, a feeding power element 842, a cutting mechanism 850, a cutting gap 854, a plate mounting mechanism 860, a plate storage bracket 861, a feeding plate 862, a plate mounting power element 863, and a wire attaching mechanism 870.

[0046] The wire pressing mechanism 900, the wire pressing bracket 910, the first pressing plate 920, the second pressing plate 930, and the detection device 940 are included. Detailed Implementation

[0047] The following will describe several embodiments of the present invention, including embodiments corresponding to the accompanying drawings. It should be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present invention, and should not be construed as limiting the scope of protection of the present invention.

[0048] The following will provide a clear and complete description of the concept, specific structure, and technical effects of this utility model in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of this utility model. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0049] It should be noted that, unless otherwise explicitly defined, when a feature is referred to as "fixed," "connected," or "installed" on another feature, it can be directly fixed or connected to the other feature, or it can be indirectly fixed or connected to the other feature. The terms "fixed," "connected," and "installed" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0050] It should be noted that the descriptions of orientations or positional relationships indicated by terms such as up, down, left, right, top, bottom, front, back, inside, and outside used in this utility model are based on the orientations or positional relationships indicated by the accompanying drawings or embodiments. They are only for the purpose of facilitating the description of this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0051] It should be noted that the term "and / or" used in this utility model includes any combination of one or more of the related listed items, "several" means one or more, "multiple" means two or more, "greater than", "less than", "exceeding" are understood to exclude the number itself, and "above", "below", "within" are understood to include the number itself.

[0052] It should be noted that the use of "first" and "second" in this utility model is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance, or implicitly indicating the number of technical features indicated, or implicitly indicating the order of the technical features indicated.

[0053] It should be noted that, unless otherwise expressly defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and not for limiting the scope of the invention.

[0054] Reference Figures 1-14 A basic embodiment of the first aspect of the present invention provides a thermistor chip welding production line, comprising:

[0055] The rack 100 is equipped with a cable transmission device;

[0056] A wire cutting and stripping device 200 is installed on the frame 100. The wire cutting and stripping device 200 is used to cut the cable and strip the insulation from both ends of the cut cable.

[0057] The first soldering mechanism 300 is located on the frame 100 and is used to solder both ends of the cable.

[0058] The cable expansion and cutting device 400 is located on the frame 100. The cable expansion and cutting device 400 is used to separate the two ends of the first end of the cable and cut the cable.

[0059] A shaping device 500 is located on the frame 100 and is used to shape the two ends of the first end of the cable into a V-shape.

[0060] A chip placement device 600 is disposed on the rack 100. The chip placement device 600 is used to place the chip between the V-shapes at the first end of the cable.

[0061] The second soldering device 700 is located on the frame 100 and is used to solder the first end of the cable and the chip.

[0062] A tape-coating device 800 is installed on the frame 100. The tape-coating device 800 is used to place the cable on the mounting plate and apply it with tape.

[0063] A transport device is used to transport cables from the wire cutting and stripping device 200, sequentially along the first soldering mechanism 300, the wire expansion and cutting device 400, the shaping device 500, the chip placement device 600, the second soldering device 700, and the encapsulation device 800.

[0064] A basic embodiment of the second aspect of the present invention provides a method for welding and processing a thermistor chip, comprising the following steps:

[0065] S100, the wire stripping and cutting device cuts the cable and strips the wires from both ends;

[0066] S200, the first soldering mechanism solders both ends of the cable respectively;

[0067] S300, the shaping device 500 crimps the first end of the cable, making the first end of the cable into a V shape;

[0068] S400, the chip placement device 600 places the chip and inserts the chip into the middle of the first end of the cable;

[0069] S500, the second soldering unit solders cables and chips;

[0070] The S600, with its adhesive coating device, places the cable on a mounting plate and attaches it with tape.

[0071] According to an embodiment of the present invention, by such a configuration, at least the following effects can be achieved: the cable feeding device provides the production line with coiled cables; the wire cutting and stripping mechanism 220 cuts the cables and processes them into two stripped sections; the first soldering mechanism 300 solders the stripped cables, which can protect the exposed structure of the cables while hardening the first end of the cables, preparing them for subsequent steps; the shaping device 500 shapes the first end of the cables into a V-shape, which is beneficial for the subsequent clamping of chips, and the V-shape can be maintained due to the effect of the first soldering; the chip placement device 600 can install the chip between the V-shapes of the first end of the cables, and the stability of the cables is increased due to the effect of soldering, so that the chip can be stably clamped by both ends of the first end of the cables; the second soldering device 700 simultaneously solders the chip at the first end of the cables, so that the chip can be fixed on the cables; and the encapsulation device 800 can place the cables on the mounting plate and fix the cables to the mounting plate with tape, thus completing the production of the thermistors.

[0072] It should be noted that the corresponding product cable is generally composed of two wires. The two wires at the ends become the two ends of the cable. The two ends of the cable are called the first end and the second end. The first end is the main processing part. During processing, the gap between the two wires at the first end of the cable, i.e. the two ends mentioned above, needs to be widened to facilitate subsequent shaping and chip clamping operations.

[0073] It should be noted that the transport device includes grippers and a transfer mechanism. The grippers can hold multiple cut cables simultaneously. The transfer mechanism consists of one or more of the following: a linear motor, a cylinder, a telescopic motor, and a conveyor belt. It can drive the grippers to move up and down, left and right, or forward and backward. Since the transport device is a combination and application of conventional power structures, as can be clearly seen in the figure, or a commonly used technical means, it is not the main content protected by this application, and therefore will not be described in detail.

[0074] In some embodiments, the wire cutting and stripping device 200 includes:

[0075] The first wire clamping mechanism 210 includes a first clamp 211 and a first wire feeding power assembly 212. The first wire feeding power assembly 212 can drive the first clamp 211 to rotate and move in a linear direction.

[0076] The wire cutting and stripping mechanism 220 is used for cutting and stripping cables;

[0077] The second wire clamping mechanism 230 includes a second clamp and a second wire feeding power assembly. The second wire feeding power assembly can drive the second clamp to rotate and move in a linear direction. The first soldering mechanism is located below the first wire clamping mechanism 210 and the second wire clamping mechanism 230.

[0078] The first wire clamping mechanism 210, the wire cutting and stripping mechanism 220, and the second wire clamping mechanism 230 are sequentially arranged on the frame 100.

[0079] In this setup, the wire feeding wheel transports the cable to the first clamping mechanism 210. The further wire feeding wheel then moves the cable from the first clamping mechanism 210 to the wire cutting and stripping mechanism 220. The wire cutting and stripping mechanism 220 then strips the first end of the cable. The cable is then transported to the second clamping mechanism 230, which holds the cable. The wire cutting and stripping mechanism 220 cuts the cable, separating it into two sections. The wire cutting and stripping mechanism 220 then strips the second end of the cable in the second clamping mechanism 230, resulting in a cable with stripped wires at both ends. The first wire feeding power component 212 drives the first clamp 211 to rotate, causing the cable end to face the first soldering mechanism. The first clamp 211 is then driven to move towards the first soldering mechanism, completing the soldering operation on the first end of the cable. The second wire feeding power component works similarly, performing soldering operations on the second end of the cable. The entire device automatically cuts the cable and strips and solders both ends, exhibiting a high degree of automation.

[0080] It should be noted that the first soldering mechanism includes a solder tank 720 containing solder liquid and a flux tank 710 containing flux. The first wire clamping mechanism 210 can move toward the flux tank 710 and the solder tank 720 in turn, so that the end of the cable can be effectively soldered. The second wire clamping mechanism 230 works in the same way.

[0081] It should be noted that wire stripping and cutting mechanisms are a common technical means in the field of cable processing, and the specific steps of wire stripping and cutting by wire stripping and cutting mechanisms do not involve protection content, so the specific structure will not be described in detail.

[0082] In some embodiments, a cable pulling mechanism 240 is further included, which is used to pull the cable of the first clamping mechanism 210 to the second clamping mechanism 230. The distance between the first clamping mechanism 210 and the second clamping mechanism 230 is relatively long, and the cable pulling mechanism 240 can move the cable a long distance to the second clamping mechanism 230, which is convenient for use.

[0083] Furthermore, under the operation of the first wire feeding power assembly 212 and the second wire feeding power assembly, after the first clamp 211 and the second clamp are brought close to each other, the second clamp can clamp the cable, and the cable of the first clamping mechanism 210 can also be pulled to the second clamping mechanism 230.

[0084] In some embodiments, the cable pulling mechanism 240 includes a guide rail and a third clamp. The guide rail is disposed on the frame 100, and the third clamp is transported along the guide rail. The guide rail enables the cable to be transported over long distances along a predetermined route.

[0085] In some embodiments, the first wire feeding power assembly 212 includes:

[0086] The first rotating head 211a is rotatably mounted on the frame 100. The first rotating head 211a is provided with a first sliding groove arranged in a straight line direction. The first clamp 211 slides in the first sliding groove.

[0087] The first wire feeding power component 211b drives the first rotating head 211a to rotate.

[0088] The second wire feeding power component 211c can drive the first chuck 211 to slide based on the first rotating head 211a.

[0089] The second power supply assembly includes:

[0090] The second rotating head is rotatably mounted on the frame 100. The second rotating head is provided with a second slide groove arranged in a straight line, and the second clamp is provided to slide in the first slide groove.

[0091] The third wire feeding power component drives the second rotating head to rotate;

[0092] The fourth wire feeding power component can drive the second chuck to slide based on the second rotating head.

[0093] In this configuration, the rotating head can rotate, changing the orientation of the cable end so that it faces the first soldering mechanism. Based on this orientation, the clamp moves in a straight line, inserting the cable end into the first soldering mechanism, allowing the workpiece to be soldered quickly.

[0094] In some embodiments, the first chuck 211 includes:

[0095] The guide part 211d is provided with a guide hole for guiding the cable. The side wall of the guide part 211d is provided with a through hole that communicates with the guide hole.

[0096] The crimping part 211e can be close to or away from the through hole, and the crimping part 211e is used to crimp the cable in the guide hole.

[0097] In this configuration, the cable can be transported along the guide hole, which acts as a guide. The crimping part 211e is close to the through hole, causing the crimping plate to abut against and press the cable, fixing it in the guide part 211d and preventing cable movement that could affect wire cutting, slicing, soldering, and other steps.

[0098] In some embodiments, the first wire clamping mechanism 210 further includes a bending plate 213, which is disposed on the first clamp 211 and located on the side away from the wire cutting and stripping mechanism 220, and the bending plate 213 is bent downward.

[0099] In this configuration, the bending plate 213 serves to prevent the cable from bending. When the first clamping mechanism 210 rotates toward the first soldering mechanism, it will cause the cable to bend. The bending plate 213 can make the cable bend in a gentle curve rather than bend it directly, thus preventing damage to the cable.

[0100] In some embodiments, two first soldering mechanisms are provided, which are respectively located below the first wire clamping mechanism 210 and the second wire clamping mechanism 230. The two first soldering mechanisms correspond to the first wire clamping mechanism 210 and the second wire clamping mechanism 230, and respectively cut the two ends of the cable and solder them.

[0101] In some embodiments, the wire stripping mechanism 220 includes a first stripping component, a cutting component, and a second stripping component arranged sequentially. The first stripping component is located on the side near the first clamping mechanism 210, and the second stripping component is located on the side near the clamping component. The first stripping mechanism is used to strip the outer sheath of the first end of the cable, the cutting mechanism is used to cut the cable, and the second stripping mechanism is used to strip the outer sheath of the second end of the cut cable.

[0102] In some embodiments, a take-up and release mechanism 250 is further included, the take-up and release mechanism 250 comprising:

[0103] support;

[0104] The wire feed wheel is rotatably mounted on the bracket;

[0105] The first fixed wheel is rotatably mounted on the bracket;

[0106] The take-up assembly includes a tension wheel and a take-up power component. The tension wheel is slidably mounted on the bracket, and the take-up power component is used to drive the take-up wheel to move closer to or away from the tension wheel.

[0107] The second fixed wheel is rotatably mounted on the bracket.

[0108] In this configuration, the cable is transported sequentially along the feed wheel, the first fixed wheel, the take-up assembly, the second fixed wheel, and the first clamping mechanism 210. The feed wheel holds a large amount of cable in advance to prepare for subsequent work. The first fixed wheel plays a role in tightening or loosening the cable. The take-up assembly enables the cable to move on the first clamping mechanism 210 in a direction that is closer to or farther from the stripping and cutting mechanism, which facilitates the stripping and cutting operations.

[0109] In some embodiments, a wire expansion and trimming device 400 is also included, located before the shaping device 500. The wire expansion and trimming device 400 includes:

[0110] The upper cutter unit 420 includes an upper cutter and a wire splitter disposed on the upper cutter. The wire splitter is used to insert between the two ends of the first end of the cable, thereby separating the two ends of the first end of the cable.

[0111] The lower cutting unit 410 includes a lower cutting blade and a wire pressing device that cooperates with the wire separating blade;

[0112] When the upper cutting unit 420 and the lower cutting unit 410 are closed, they can separate the first end of the cable and cut it flat.

[0113] The upper cutter unit 420 and the lower cutter unit 410 reciprocate horizontally under the drive of the cutter power component.

[0114] The structure can be referenced from existing patents, application number: 202321405344.1, patent name: An automatic welding line for thermistor chips. It separates the ends of parallel wires using a wire cutter, and cuts the ends of the parallel wires by closing the upper and lower cutters. This allows for quick separation and even cutting of the parallel wire ends before welding. The wire extension and trimming device 400 separates the two ends of the cable, which is beneficial for subsequent shaping steps. Through the trimming operation, excess cable is cut off, ensuring consistent length at the first end of the cable and improving product quality consistency.

[0115] In some embodiments, a crimping mechanism 900 is further included, disposed after processing by the shaping device, the crimping mechanism 900 including:

[0116] Wire clamp bracket 910;

[0117] The first pressure plate 920 and the second pressure plate 930 are movably disposed on the wire clamping bracket 910, and the first pressure plate 920 and the second pressure plate 930 are provided with a pressing surface on the side that is close to each other.

[0118] The wire pressing power component is used to drive the first pressing plate 920 and the second pressing plate 930 to move closer or further apart, so that the two pressing surfaces respectively abut against the first end of the cable.

[0119] In this configuration, the first pressure plate 920 and the second pressure plate 930 are brought close to each other, so that the first end of the cable is crimped, keeping the first end of the structure on a plane, and ensuring that the V-shaped structure is located on the same vertical plane, preventing the V-shaped mechanism from deforming when the shaping device 500 is detached from the cable.

[0120] In some embodiments, the shaping device 500 includes:

[0121] The shaping bracket 510 is movably mounted on the frame 100;

[0122] The left clamp 520 and the right clamp 530 are rotatably mounted on the shaping bracket 510, with the side of the left clamp 520 and the right clamp 530 close to each other located on the first inclined surface;

[0123] A fixing block 540 is located between the left clamp 520 and the right clamp 530. The fixing block 540 has a second inclined surface in the shape of a V on both sides. In the clamping state, the second inclined surface is parallel to the first inclined surface.

[0124] The shaping power unit is located on the bracket. The shaping power unit is used to drive the shaping bracket 510 to move and drive the left clamp 520 and the right clamp 530 to move closer or further apart, so that the two ends of the first end of the cable are V-shaped.

[0125] The structure can be referenced from existing patents, application number: 202321405432.1, patent name: an automatic welding line for parallel thermistor chip elements. The shaping bracket 510 is movably disposed on the frame 100, which can bring the shaping bracket 510 close to the cable, so that the fixing block 540 can be inserted into the middle of the first end of the cable, and then the left clamp 520 and the right clamp 530 can be closed or separated to realize the automatic formation of a V-shaped structure at the end of the parallel wire, with high working efficiency.

[0126] In some embodiments, the chip placement device 600 includes:

[0127] Feeding device, used to supply chips;

[0128] Pick-up mechanism 610 is used to automatically pick up chips from the feeding device;

[0129] The chip clamping mechanism 620 is used to clamp the chip picked up by the pickup mechanism;

[0130] The chip assembly power unit can drive the pick-up mechanism 610 to move to the chip clamping mechanism 620, and drive the chip clamping mechanism 620 to move between the V-shapes at the first end of the cable.

[0131] In this configuration, the pickup mechanism is equipped with a suction cup to attract the chip. The chip placement device includes a pickup mechanism, a chip clamping mechanism, and a chip assembly power unit. The pickup mechanism is used to automatically pick up the chip, the chip clamping mechanism is used to hold the chip picked up by the pickup mechanism, and the chip assembly power unit can drive the pickup device to move to the clamping mechanism and drive the clamping mechanism to move to the middle of the V-shaped structure at the first end of the cable. After the pickup mechanism picks up the chip, it conveys the chip to the chip clamping mechanism, which clamps the chip and conveys it to the first end of the cable so that the V-shaped end clamps the chip.

[0132] In some embodiments, the feeding device includes:

[0133] Vibrating disc 630;

[0134] The discharge channel 640 is connected to the outlet of the vibratory feeder 630. The discharge channel 640 is provided with a bearing surface 641 and a contact surface 642. The bearing surface 641 is connected to the side wall of the outlet of the vibratory feeder 630 away from the center of the vibratory feeder 630. The bearing surface 641 is inclined and is used to support the main plane of the product. The contact surface 642 is used to support the side of the product.

[0135] In this configuration, the vibratory feeder 630 is an auxiliary feeding device for automatic assembly or processing machinery. It can arrange chip products in an orderly manner. A discharge channel 640 is set at the outlet of the vibratory feeder 630. The inclination angle of the side wall of the vibratory feeder 630 away from the center is set at the angle of the bearing surface 641. Through the vibration effect of the vibratory feeder 630, the chip products can be neatly arranged on the side wall of the bearing surface 641 away from the center. The bearing surface 641 of the discharge channel 640 is connected to the side wall of the outlet of the vibratory feeder 630 away from the center, so that the chip products can be discharged from the outlet along the bearing surface 641. The inclined bearing surface 641 can support the main plane of the chip product, and one side of the chip product abuts against it, so that the chip product can be discharged at an inclination. Since the discharge channel 640 only limits one side of the chip product and does not limit the other side, it can adapt to chip products of different sizes without changing the discharge channel 640, thus improving efficiency.

[0136] It is understood that this application generally deals with chip products, which have a flat structure. The product is mainly divided into a main plane and a side plane. The main plane is a plane that is longer in both length and width, and the side plane is a plane that is shorter in either length or width.

[0137] In some embodiments, the tilt angle of the bearing surface 641 gradually decreases from the side closer to the vibrating disk 630 to the side farther away from the vibrating disk 630. The smaller the tilt angle, the more the main plane of the chip product is tilted upwards, which is beneficial for the picking mechanism to pick up the chip. In addition, since the tilt angle decreases from large to small, the vibration center is located at the vibrating disk 630, and the discharge channel 640 is driven by the vibrating disk 630 to vibrate together, so the vibration capability of the discharge channel 640 itself is small, and the movement capability of the chip is also small. The gradually decreasing tilt angle is beneficial for the chip product to move along the discharge channel 640.

[0138] In some embodiments, the contact surface 642 is inclined. Both the bearing surface 641 and the inclined surface are inclined, and the angle formed by the bearing surface 641 and the inclined surface is close to 90 degrees, so that the contact surface 642 can contact the side of the product.

[0139] In some embodiments, the discharge channel 640 has a material platform 643 on the side away from the vibratory feeder 630. One side of the material platform 643 is connected to the lower end of the bearing surface 641, and the adjacent side is connected to the contact surface 642. The material platform 643 is used to store excess chips. Some chips that cannot be used by the picking mechanism in time are collected through the material platform 643. One side of the material platform 643 is connected to the lower end of the bearing surface 641, allowing the chips to slide down along the bearing surface 641.

[0140] In some embodiments, a protective cover is also included, disposed above the discharge channel 640. The protective cover prevents chips from falling out.

[0141] In some embodiments, a pickup mechanism is also included, the pickup mechanism comprising:

[0142] Suction nozzle;

[0143] The pickup power unit can drive the nozzle to rotate and move in the radial direction.

[0144] The pickup power unit includes a telescopic power unit and a rotary power unit. The telescopic power unit drives the suction nozzle to move closer to or away from the discharge channel 640, and the rotary power unit drives the suction nozzle and the telescopic power unit to rotate together.

[0145] In this configuration, the suction nozzle has negative pressure, which attracts the chip. After rotating and aligning with the discharge channel 640, the nozzle picks up the tilted chip, and then the rotational power unit drives the nozzle to rotate to a horizontal position. The telescopic power unit moves to move closer to the chip, thereby attracting the chip or moving it closer to or away from the chip clamping mechanism.

[0146] In some embodiments, the chip clamping mechanism includes a clamp for clamping the product, the width of which is equal to the width of the chip.

[0147] In some embodiments, a detection device 940 is also included after the chip placement device 600 has processed the chip. The detection device 940 includes a camera for detecting whether the chip is placed in the middle of the V-shaped mechanism of the cable. The camera is a CCD camera, which is capable of capturing images of whether the chip is placed in the end of the V-shape.

[0148] In some embodiments, the second soldering device includes:

[0149] Flux tank 710 is movably mounted on frame 100;

[0150] Solder bath 720 is movably mounted on frame 100;

[0151] A soldering power unit is used to drive the flux bath 710 and the solder bath 720 to move in the vertical direction.

[0152] With this setup, the flux tank 710 and the solder tank 720 can be positioned close to or far from the cable, allowing the first end of the cable to be soldered into place and the chip and cable to be soldered and fixed in place.

[0153] In some embodiments, the overmolding device 800 includes:

[0154] Guide rail 810 is located on frame 100;

[0155] The adhesive mechanism 820 includes an adhesive roller 821, which is used to press the back of the tape so that the tape adheres to the plate.

[0156] The feeding mechanism 830 is located on the frame 100 and is used to feed the adhesive plate to the adhesive mechanism 820.

[0157] The feeding mechanism 840 is located on the frame 100 and is used to feed the plate from the adhesive mechanism 820.

[0158] The cutting mechanism 850 and the frame 100 are provided with a cutting gap 854. The cutter of the cutting mechanism 850 is used to insert into the cutting gap 854 to cut the tape.

[0159] The feeding mechanism 830, the gluing mechanism 820, the cutting mechanism 850 and the cutting mechanism 850 are arranged sequentially on the frame 100 along the guide rail 810.

[0160] In this configuration, the feeding mechanism 830 provides a mounting plate to the adhesive mechanism 820, and the feeding mechanism 840 feeds the mounting plate from the adhesive mechanism 820. When the mounting plate moves along the guide rail 810 past the adhesive mechanism 820, the adhesive roller 821 of the adhesive mechanism 820 can attach the tape to the mounting plate, thus fixing the cable on the mounting plate. After the adhesive bonding step is completed, the feeding mechanism 840 can drive the mounting plate to move, so that a certain gap is formed between the mounting plate and the next mounting plate (hereinafter referred to as the first mounting plate and the second mounting plate). At this time, the feeding mechanism 830 and the feeding mechanism 840 work simultaneously, so that the first mounting plate and the second mounting plate continue to move until the first mounting plate and the second mounting plate are respectively located on both sides of the cutting gap 854. The cutter of the cutting mechanism 850 works to cut the tape, separating the tape on the first mounting plate and the second mounting plate, forming a certain cutting gap between the mounting plates, which is conducive to the insertion of the cutter and the cutting effect is better.

[0161] In some embodiments, the adhesive bonding mechanism 820 further includes a pressure roller 822, which is located on the side of the adhesive roller 821 away from the feeding mechanism 830. The pressure roller 822 is used to press firmly against the back of the adhesive tape, so that the adhesive tape is further adhered to the mounting plate. The pressure roller 822 can further press the adhesive tape, improve the adhesion of the tape, and ensure the adhesive quality.

[0162] In some embodiments, the adhesive bonding mechanism 820 further includes a first elastic element 823, one end of which is connected to the frame 100, and the other end is connected to a pressure roller 822. The first elastic element 823 is driven by elastic force to cause the pressure roller 822 to abut against the bonding plate. The bonding plate has a cable with a diameter greater than the height of the groove on the bonding plate. Driven by elastic force, the pressure roller 822 is kept abutting against the upper surface of the bonding plate and the cable, which enables the tape to adhere well to the bonding plate and improves the quality.

[0163] In some embodiments, the adhesive mechanism 820 further includes a second elastic member 824, one end of which is connected to the frame 100, and the other end is connected to an adhesive wheel 821. The second elastic member 824 is driven by an elastic force to cause the adhesive wheel 821 to abut against the adhesive plate. The adhesive plate has a cable with a diameter greater than the height of the groove on the adhesive plate. Driven by the elastic force, the adhesive wheel is kept abutting against the upper surfaces of the adhesive plate and the cable, which enables the tape to adhere well to the adhesive plate and improves the quality.

[0164] In some embodiments, the guide rail 810 includes two stepped grooves 811, which are used to support the two sides of the plate, and a power drive gap is provided between the two stepped grooves 811. The guide rail 810 has a guiding function, the stepped grooves 811 on both sides are used to place the plate and prevent the plate from falling off, and the power drive gap between the two stepped grooves 811 provides space for the feeding mechanism 830 and the feeding mechanism 840, so that the feeding mechanism 830 and the feeding mechanism 840 can move the plate through the power drive gap.

[0165] In some embodiments, the feeding mechanism 830 includes:

[0166] Feed plate 831 is located on the guide rail;

[0167] The feeding power component 832 is used to drive the feeding plate 831 to move toward or away from the adhesive mechanism 820.

[0168] In this setting, the feeding plate 831 pushes the plate, allowing the unprocessed plate to slide along the guide rail 810.

[0169] In some embodiments, the feeding mechanism 840 includes:

[0170] The clamping assembly 841 includes an upper clamping plate and a lower clamping plate, which can move closer to or further away from each other.

[0171] The feeding power unit 842 is used to drive the clamping assembly 841 plate to move toward or away from the adhesive mechanism 820.

[0172] In this configuration, the clamping assembly 841 clamps the plate, enabling the clamping assembly 841 to move the plate. The feeding power unit 842 drives the clamping assembly 841 to move, so that the processed plate can move away from the adhesive mechanism 820.

[0173] In some embodiments, an upper plate mechanism 860 is also included, the upper plate mechanism 860 comprising:

[0174] A plate storage bracket 861 is provided on the frame 100. The plate storage bracket 861 is provided with a material trough and a feeding trough. The material trough is arranged in the vertical direction, and the feeding trough is located below the material trough and communicates with the material trough. The feeding trough is arranged in the front-back direction.

[0175] Feed plate 862 moves along the feed chute;

[0176] The upper plate power component 863 drives the feeding plate 862 to move towards or away from the guide rail 810.

[0177] In this configuration, the material trough is used to stack multiple plates. The feed plate 862 moves along the feed trough, allowing the plates located below the material trough and in the feed trough to move along the feed trough and be transported to the guide rail 810. The feed plate 862 is retracted, and the plates on the material trough fall due to their own gravity, with the bottommost plate falling into the feed trough.

[0178] In some embodiments, a wire-applying mechanism 870 is also included, the wire-applying mechanism 870 comprising:

[0179] Multiple cable clamps are respectively located on both sides of the guide rail 810, and the cable clamping mechanism 870 can clamp or release the cable;

[0180] The wire-applying power component is used to drive the wire-applying mechanism 870 to move in the up-down direction.

[0181] This setting allows the cable clamp to be used to install the cable in the groove on the mounting plate, making it easier for the subsequent adhesive mechanism 820 to apply tape, thus bonding the cable to the mounting plate.

[0182] In some embodiments, the wire bonding mechanism 870 further includes:

[0183] Multiple cable feed clamps are provided, each corresponding to a cable attaching clamp. The cable feed clamps can hold or release the cable.

[0184] The cable feeding power unit is used to drive the cable feeding clamp to move, so that the cable is transported to the cable attaching clamp.

[0185] In this setting, the feed clamp is used to transport the cable to the wire-attaching clamp.

[0186] It should be noted that in this specification, terms such as "one embodiment", "some embodiments", "basic embodiment", and "extended embodiment" may be used to describe several embodiments of the present invention, and the specific features, structures, materials or characteristics in the several embodiments may be combined in accordance with the principles and spirit of the present invention.

[0187] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above embodiments. As long as they achieve the technical effects of the present invention by the same or equivalent means, any changes, modifications, equivalent substitutions and equivalent variations of these embodiments within the spirit and principles disclosed in the present invention, without departing from the principles and purpose of the present invention, should be included within the scope of protection disclosed in the present invention and should be considered to fall within the protection scope of the present invention.

Claims

1. A feeding device, characterized in that, include: Vibrating disc (630); The discharge channel (640) is connected to the outlet of the vibrating plate (630). The discharge channel (640) is provided with a bearing surface (641) and a contact surface (642). The bearing surface (641) is connected to the side wall of the outlet of the vibrating plate (630) away from the center of the vibrating plate (630). The bearing surface (641) is inclined and is used to support the main plane of the product. The contact surface (642) is used to support the side of the product.

2. The feeding device according to claim 1, characterized in that: The tilt angle of the bearing surface (641) gradually decreases from the side closer to the vibrating plate (630) to the side farther away from the vibrating plate (630).

3. The feeding device according to claim 1, characterized in that: The contact surface (642) is inclined.

4. The feeding device according to claim 1, characterized in that: The discharge channel (640) is located on a material platform (643) on the side away from the vibrating plate (630). One side of the material platform (643) is connected to the lower end of the bearing surface (641), and the adjacent side is connected to the contact surface (642).

5. The feeding device according to claim 1, characterized in that: It also includes a protective cover, which is located above the discharge channel (640).

6. The feeding device according to claim 1, characterized in that: It also includes a pickup mechanism, which includes: Suction nozzle; A pickup power unit is provided, which can drive the nozzle to rotate and move in the radial direction.

7. The feeding device according to claim 6, characterized in that: The picking power unit includes a telescopic power unit and a rotational power unit. The telescopic power unit drives the suction nozzle to move closer to or away from the discharge channel (640), and the rotational power unit drives the suction nozzle and the telescopic power unit to rotate together.

8. The feeding device according to claim 7, characterized in that: It also includes a chip clamping mechanism for clamping the product picked up by the picking mechanism.

9. The feeding device according to claim 8, characterized in that: The chip clamping mechanism includes a clamp for clamping the product, wherein the width of the slot of the clamp is equal to the width of the chip.

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