Restoration device for restoring silicon wafers in double-half-wafer flower basket
By using a alignment device with X-axis and Y-axis alignment mechanisms in photovoltaic cells, the problem of misalignment of silicon wafers in double half-cell baskets was solved, achieving precise alignment and efficient automated arrangement of silicon wafers, thereby improving production efficiency and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YINGKOU JINCHEN MACHINERY
- Filing Date
- 2025-05-08
- Publication Date
- 2026-05-05
AI Technical Summary
In photovoltaic cells, existing technology lacks an effective device to align the silicon wafers within the double half-cell basket, leading to wafer misalignment and affecting the smooth progress of subsequent processes.
A correction device, including first and second X-axis correction mechanisms and Y-axis correction mechanisms, is used to drive the silicon wafers in the basket with a servo motor, thereby achieving precise correction and ensuring that the silicon wafers are neatly arranged in the X-axis and Y-axis directions.
This method achieves zero misalignment of silicon wafers within the basket, improves the neatness of wafer arrangement, increases work efficiency and automation, and reduces manufacturing costs.
Smart Images
Figure CN224205617U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic cell technology, and in particular to a alignment device for aligning silicon wafers within a double half-cell basket. Background Technology
[0002] In photovoltaic cells, half-wafers are commonly used to manufacture cell strings to improve performance, reliability, and production efficiency. When using half-wafers, the first step is to load the half-wafers into double half-wafer baskets for subsequent transport and handling. However, after transporting the baskets, the wafers within need to be aligned to prevent misalignment, ensuring they are neatly arranged when removed from the baskets in subsequent processes. Therefore, a alignment device capable of aligning the wafers within the baskets is urgently needed. Summary of the Invention
[0003] This application provides a correction device for aligning silicon wafers within a double half-wafer basket, to solve the problems existing in related technologies. The technical solution is as follows:
[0004] This application provides a alignment device for aligning silicon wafers within a double half-wafer basket, comprising:
[0005] The first X-axis alignment mechanism includes a first alignment drive component and a first alignment component. The first alignment drive component is connected to the first alignment component, and the first alignment drive component drives the first alignment component to move along the X-axis direction.
[0006] The second X-axis correction mechanism includes a second correction drive component and a second correction component. The second correction drive component is connected to the second correction component, and the second correction drive component drives the second correction component to move along the X-axis direction.
[0007] The first correction component and the second correction component are disposed opposite to each other, and there is a correction position between the first correction component and the second correction component.
[0008] In one implementation, it further includes:
[0009] The first Y-axis correction mechanism is connected to the first X-axis correction mechanism, and the first Y-axis correction mechanism drives the first X-axis correction mechanism to move in the Y-axis direction.
[0010] The second Y-axis correction mechanism is connected to the second X-axis correction mechanism, and the second Y-axis correction mechanism drives the second X-axis correction mechanism to move in the Y-axis direction.
[0011] In one embodiment, the first X-axis correction mechanism further includes a first correction body, the first correction drive component is fixed to the first correction body, and the first Y-axis correction mechanism is connected to the first correction body; the second X-axis correction mechanism further includes a second correction body, the second correction drive component is fixed to the second correction body, and the second Y-axis correction mechanism is connected to the second correction body.
[0012] In one embodiment, the first correction drive assembly includes a first drive motor, a first drive gear, and a first drive rack. The first drive motor is fixed to the first correction body, the first drive motor is connected to the first drive gear, the first drive gear meshes with the first drive rack, and the first correction assembly is connected to the first drive rack.
[0013] In one embodiment, the first alignment component includes a first alignment connecting plate, a first slide rail, and a first alignment plate. The first alignment connecting plate is connected to the first drive rack. The first slide rail is disposed on the first alignment body. The first alignment connecting plate is slidably connected to the first slide rail. The first alignment plate is connected to the first alignment connecting plate.
[0014] In one embodiment, the first correction component further includes a first correction limiting plate and a first correction fixing plate. The first correction limiting plate is fixed to the first correction body. There are multiple first correction fixing plates and multiple first correction plates. The first correction connecting plate is connected to the corresponding first correction plate through the first correction fixing plate. The first correction limiting plate is provided with multiple first limiting grooves, and the multiple first correction fixing plates are respectively located in the multiple first limiting grooves.
[0015] In one embodiment, the second correction drive assembly includes a second drive motor, a second drive gear, and a second drive rack. The second drive motor is fixed to the second correction body, the second drive motor is connected to the second drive gear, the second drive gear meshes with the second drive rack, and the second correction assembly is connected to the second drive rack.
[0016] In one embodiment, the second alignment component includes a second alignment connecting plate, a second slide rail, and a second alignment plate. The second alignment connecting plate is connected to the second drive rack. The second slide rail is disposed on the second alignment body. The second alignment connecting plate is slidably connected to the second slide rail. The second alignment plate is connected to the second alignment connecting plate.
[0017] In one embodiment, the second correction component further includes a second correction limiting plate and a second correction fixing plate. The second correction limiting plate is fixed to the second correction body. There are multiple second correction fixing plates and multiple second correction plates. The second correction connecting plate is connected to the corresponding second correction plate through the second correction fixing plate. The second correction limiting plate is provided with multiple second limiting grooves, and the multiple second correction fixing plates are respectively located in the multiple second limiting grooves.
[0018] In one embodiment, there are four second correction plates, which are L-shaped, with two adjacent second correction plates arranged symmetrically and the other two adjacent second correction plates arranged symmetrically.
[0019] The advantages or beneficial effects of the above technical solutions include at least the following:
[0020] The alignment device in this application embodiment includes a first X-axis alignment mechanism and a second X-axis alignment mechanism. The first X-axis alignment mechanism includes a first alignment drive component and a first alignment component, and the second X-axis alignment mechanism includes a second alignment drive component and a second alignment component. When using this alignment device to align silicon wafers in a double-half basket, the basket is first moved to the alignment position between the first alignment component and the second alignment component. Then, the first alignment drive component drives the first alignment component to align the silicon wafers in the basket in the X-axis direction, while the second alignment drive component drives the second alignment component to align the silicon wafers in the basket in the X-axis direction. This application embodiment can align silicon wafers in a double-half basket, ensuring that the silicon wafers in the basket are neatly arranged without misalignment or displacement.
[0021] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description
[0022] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.
[0023] Figure 1 A schematic diagram of the alignment device used for aligning silicon wafers within a double half-basket.
[0024] Figure 2 Another schematic diagram of the alignment device used for aligning silicon wafers within a double half-basket;
[0025] Figure 3 A schematic diagram of the combination of the first X-axis alignment mechanism and the first Y-axis alignment mechanism;
[0026] Figure 4 This is a schematic diagram of another combination of the first X-axis alignment mechanism and the first Y-axis alignment mechanism;
[0027] Figure 5 A schematic diagram of the combination of the second X-axis alignment mechanism and the second Y-axis alignment mechanism;
[0028] Figure 6 This is a schematic diagram of another combination of the second X-axis alignment mechanism and the second Y-axis alignment mechanism;
[0029] Explanation of reference numerals in the attached figures:
[0030] 1. First X-axis alignment mechanism; 2. Second X-axis alignment mechanism; 11. First alignment drive assembly; 12. First alignment component; 21. Second alignment drive assembly; 22. Second alignment component; 13. First alignment body; 110. First drive motor; 111. First drive gear; 112. First drive rack; 113. Motor mounting base; 120. First alignment connecting plate; 121. First slide rail; 122. First alignment plate; 123. First alignment limit. Position plate; 124, First alignment fixing plate; 125, First limiting groove; 23, Second alignment body; 210, Second drive motor; 211, Second drive gear; 212, Second drive rack; 220, Second alignment connecting plate; 221, Second slide rail; 222, Second alignment plate; 223, Second alignment limiting plate; 224, Second alignment fixing plate; 225, Second limiting groove; 3, First Y-axis alignment mechanism; 4, Second Y-axis alignment mechanism; 5, Flower basket. Detailed Implementation
[0031] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.
[0032] like Figures 1 to 6As shown, this application embodiment provides a alignment device for aligning silicon wafers within a double half-wafer basket, including a first X-axis alignment mechanism 1 and a second X-axis alignment mechanism 2. The first X-axis alignment mechanism 1 includes a first alignment drive component 11 and a first alignment component 12, connected to each other, with the first alignment drive component 11 driving the first alignment component 12 to move along the X-axis. The second X-axis alignment mechanism 2 includes a second alignment drive component 21 and a second alignment component 22, connected to each other, with the second alignment drive component 21 driving the second alignment component 22 to move along the X-axis. The first alignment component 12 and the second alignment component 22 are disposed opposite to each other, with an alignment position between them.
[0033] When using this alignment device to align the silicon wafers within the double-half basket 5, the basket 5 is first moved to the alignment position between the first alignment component 12 and the second alignment component 22. Then, the first alignment drive component 11 drives the first alignment component 12 to align the silicon wafers within the basket 5 in the X-axis direction, while simultaneously, the second alignment drive component 21 drives the second alignment component 22 to align the silicon wafers within the basket 5 in the X-axis direction. This embodiment of the application can align the silicon wafers within the double-half basket 5, ensuring that the silicon wafers within the basket 5 are neatly arranged without misalignment or displacement.
[0034] The first X-axis alignment mechanism 1 further includes a first alignment body 13, and the first alignment drive assembly 11 is fixed to the first alignment body 13. To drive the first alignment assembly 12 to move, the first alignment drive assembly 11 includes a first drive motor 110, a first drive gear 111, and a first drive rack 112. The first drive motor 110 is fixed to the first alignment body 13. Preferably, the first drive motor 110 can be fixed to the first alignment body 13 via a motor mounting bracket 113. The output end of the first drive motor 110 is connected to the first drive gear 111, the first drive gear 111 meshes with the first drive rack 112, and the first alignment assembly 12 is connected to the first drive rack 112. After the first drive motor 110 starts, it drives the first drive gear 111 to rotate, the first drive gear 111 drives the first drive rack 112 meshing with it to move, and thus drives the first alignment assembly 12 connected to the first drive rack 112 to move.
[0035] Further, the first alignment component 12 includes a first alignment connecting plate 120, a first slide rail 121, and a first alignment plate 122. The first alignment connecting plate 120 is bolted to the first drive rack 112, and the first slide rail 121 is disposed on the first alignment body 13. Specifically, the first slide rail 121 is disposed along the width direction of the first alignment body 13, and the first slide rail 121 is fixed to the first alignment body 13 by bolts or the like. The first alignment connecting plate 120 is slidably connected to the first slide rail 121 by a slider, and the first alignment plate 122 is connected to the first alignment connecting plate 120. Preferably, there may be four first alignment connecting plates 120, and the four first alignment connecting plates 120 are connected to each other, and each of the four first alignment connecting plates 120 is connected to the slide rail by a slider.
[0036] In one embodiment, there may be two first slide rails 121. The two first slide rails 121 are fixed to the upper and lower parts of the first correction body 13, respectively. The upper and lower ends of the four first correction connecting plates 120 are slidably connected to the two first slide rails 121 by sliders.
[0037] The first alignment component 12 further includes a first alignment limiting plate 123 and a first alignment fixing plate 124. The first alignment limiting plate 123 is fixed to the first alignment body 13 by bolts. There are multiple first alignment fixing plates 124 and first alignment plates 122. The first alignment connecting plate 120 is connected to the corresponding first alignment plate 122 through the first alignment fixing plate 124. Specifically, there are eight first alignment fixing plates 124 and four first alignment plates 122. The upper and lower parts of the four first alignment connecting plates 120 are connected to the corresponding first alignment plates 122 through the eight first alignment fixing plates 124 respectively. The first alignment connecting plates 120, the first alignment fixing plates 124, and the first alignment plates 122 can be fixed together by bolts.
[0038] To limit the movement of the first alignment fixing plate 124, eight first limiting grooves 125 are provided on the first alignment limiting plate 123, and the eight first alignment fixing plates 124 are respectively located in the eight first limiting grooves 125. The first limiting grooves 125 extend along the width direction of the first alignment limiting plate 123. Since the first alignment fixing plates 124 are located in the first limiting grooves 125, the first alignment fixing plates 124 can move within the first limiting grooves 125, thus limiting their movement position.
[0039] During the process of the first drive motor 110 driving the first drive rack 112 to move through the first drive gear 111, the first drive rack 112 drives the first alignment connecting plate 120 to move along the first slide rail 121. The first alignment connecting plate 120 drives the first alignment plate 122 to move through the first alignment fixing plate 124, and the first alignment plate 122 aligns the silicon wafers in the basket 5.
[0040] The second X-axis alignment mechanism 2 further includes a second alignment body 23, and the second alignment drive assembly 21 is fixed to the second alignment body 23. To drive the second alignment assembly 22 to move, the second alignment drive assembly 21 includes a second drive motor 210, a second drive gear 211, and a second drive rack 212. The second drive motor 210 is fixed to the second alignment body 23. Preferably, the second drive motor 210 can be fixed to the second alignment body 23 via a motor mounting bracket 113. The output end of the second drive motor 210 is connected to the second drive gear 211, the second drive gear 211 meshes with the second drive rack 212, and the second alignment assembly 22 is connected to the second drive rack 212.
[0041] After the second drive motor 210 is started, the second drive motor 210 drives the second drive gear 211 to rotate, the second drive gear 211 drives the second drive rack 212 that meshes with it to move, and in turn drives the second alignment component 22 to move.
[0042] The second alignment component 22 includes a second alignment connecting plate 220, a second slide rail 221, and a second alignment plate 222. The second alignment connecting plate 220 is connected to the second drive rack 212. The second slide rail 221 is disposed on the second alignment body 23. The second alignment connecting plate 220 is slidably connected to the second slide rail 221 via a slider. The second alignment plate 222 is connected to the second alignment connecting plate 220. The second slide rail 221 is fixed along the width direction of the second alignment body 23, and the second slide rail 221 and the second alignment body 23 can be fixed together by bolts. In one embodiment, there can be four second alignment connecting plates 220, which can be connected by bolts or the like. Alternatively, the four second alignment connecting plates 220 can be an integral structure. All four second alignment connecting plates 220 are connected to the second slide rail 221 via sliders. There can be two second slide rails 221, which are located at the upper and lower parts of the second correction body 23, respectively. The upper and lower ends of the four second correction connecting plates 220 are connected to the two second slide rails 221 through sliders.
[0043] The second alignment component 22 also includes a second alignment limiting plate 223 and a second alignment fixing plate 224. The second alignment limiting plate 223 is fixed to the second alignment body 23 by bolts. There are eight second alignment fixing plates 224 and four second alignment plates 222. The upper and lower parts of the four second alignment connecting plates 220 are respectively connected to the corresponding second alignment plates 222 through the eight second alignment fixing plates 224. The second alignment connecting plates 220, the second alignment fixing plates 224, and the second alignment plates 222 can also be connected by bolts.
[0044] To limit the movement of the second alignment fixing plate 224, the second alignment limiting plate 223 is provided with eight second limiting grooves 225, and the eight second alignment fixing plates 224 are respectively located in the eight second limiting grooves 225. The second limiting grooves 225 extend along the width direction of the second alignment limiting plate 223. Since the second alignment fixing plates 224 are located in the second limiting grooves 225, the second alignment fixing plates 224 can only move within the second limiting grooves 225, thereby limiting their movement.
[0045] In one embodiment, both the first alignment plate 122 and the second alignment plate 222 are L-shaped. Two adjacent first alignment plates 122 are symmetrically arranged, as are two other adjacent first alignment plates 122. Similarly, two adjacent second alignment plates 222 are symmetrically arranged, as are two other adjacent second alignment plates 222. When the silicon wafer is aligned using the first alignment plates 122 and the second alignment plates 222, the silicon wafer is positioned between two symmetrically arranged first alignment plates 122 or second alignment plates 222. Since there are four first alignment plates 122 and four second alignment plates 222, two rows of half-wafers can be aligned simultaneously.
[0046] In one embodiment, the alignment device can align the silicon wafer not only in the X-axis direction but also in the Y-axis direction. Therefore, the alignment device further includes a first Y-axis alignment mechanism 3 and a second Y-axis alignment mechanism 4. The first Y-axis alignment mechanism 3 is connected to the first alignment body 13 of the first X-axis alignment mechanism 1, and the first Y-axis alignment mechanism 3 drives the first X-axis alignment mechanism 1 to move in the Y-axis direction. The second Y-axis alignment mechanism 4 is connected to the second alignment body 23 of the second X-axis alignment mechanism 2, and the second Y-axis alignment mechanism 4 drives the second X-axis alignment mechanism 2 to move in the Y-axis direction. The first Y-axis alignment mechanism 3 and the second Y-axis alignment mechanism 4 can be connected and fixed to an external gantry or similar device.
[0047] In this application embodiment, both the first drive motor 110 and the second drive motor 210 are servo motors. The first Y-axis alignment mechanism 3 and the second Y-axis alignment mechanism 4 are existing linear modules. Specifically, the linear module can also be a linear module that achieves linear motion by rotating a lead screw driven by a servo motor.
[0048] In use, the alignment device of this embodiment first moves the basket 5 to the alignment position between the first alignment component 12 and the second alignment component 22 by an external conveying mechanism. At this time, the half-wafer is located between two adjacent first alignment plates 122 and two adjacent second alignment plates 222. Then, the first Y-axis alignment mechanism 3 drives the first X-axis alignment mechanism 1 to move along the Y-axis direction, and the second Y-axis alignment mechanism 4 drives the second Y-axis alignment mechanism 2 to move along the Y-axis direction, thereby aligning the long side of the silicon wafer through the first alignment plates 122 and the second alignment plates 222. Then, the first alignment drive component 11 drives the first alignment component 12 to move, and the second alignment component 22 drives the second alignment component 22 to move, thereby aligning the two short sides of the silicon wafer. After the silicon wafer is aligned, the first Y-axis alignment mechanism 3 drives the first X-axis alignment mechanism 1 to move away from the basket 5, while the second Y-axis alignment mechanism 4 also drives the second X-axis alignment mechanism 2 to move closer to the basket 5. Finally, move flower basket 5 to the next workstation.
[0049] Because the silicon wafers inside basket 5 are aligned, the wafers subsequently removed from basket 5 are guaranteed to be neat and orderly. The alignment device can automatically align the silicon wafers, achieving a high degree of automation, improving work efficiency, and reducing manufacturing costs. Driven by a servo motor, the accuracy and stability of the alignment are ensured.
[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.
[0051] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.
[0052] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A alignment device for aligning silicon wafers within a double half-wafer basket, characterized in that, include: The first X-axis alignment mechanism includes a first alignment drive component and a first alignment component. The first alignment drive component is connected to the first alignment component, and the first alignment drive component drives the first alignment component to move along the X-axis direction. The second X-axis correction mechanism includes a second correction drive component and a second correction component. The second correction drive component is connected to the second correction component, and the second correction drive component drives the second correction component to move along the X-axis direction. The first correction component and the second correction component are disposed opposite to each other, and there is a correction position between the first correction component and the second correction component.
2. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 1, characterized in that, Also includes: The first Y-axis correction mechanism is connected to the first X-axis correction mechanism, and the first Y-axis correction mechanism drives the first X-axis correction mechanism to move in the Y-axis direction. The second Y-axis correction mechanism is connected to the second X-axis correction mechanism, and the second Y-axis correction mechanism drives the second X-axis correction mechanism to move in the Y-axis direction.
3. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 2, characterized in that, The first X-axis correction mechanism further includes a first correction body, the first correction drive component is fixed on the first correction body, and the first Y-axis correction mechanism is connected to the first correction body; the second X-axis correction mechanism further includes a second correction body, the second correction drive component is fixed on the second correction body, and the second Y-axis correction mechanism is connected to the second correction body.
4. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 3, characterized in that, The first correction drive assembly includes a first drive motor, a first drive gear, and a first drive rack. The first drive motor is fixed on the first correction body. The first drive motor is connected to the first drive gear. The first drive gear meshes with the first drive rack. The first correction assembly is connected to the first drive rack.
5. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 4, characterized in that, The first alignment component includes a first alignment connecting plate, a first slide rail, and a first alignment plate. The first alignment connecting plate is connected to the first drive rack. The first slide rail is disposed on the first alignment body. The first alignment connecting plate is slidably connected to the first slide rail. The first alignment plate is connected to the first alignment connecting plate.
6. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 5, characterized in that, The first correction component further includes a first correction limiting plate and a first correction fixing plate. The first correction limiting plate is fixed to the first correction body. There are multiple first correction fixing plates and multiple first correction plates. The first correction connecting plate is connected to the corresponding first correction plate through the first correction fixing plate. The first correction limiting plate is provided with multiple first limiting grooves, and the multiple first correction fixing plates are respectively located in the multiple first limiting grooves.
7. The alignment device for aligning silicon wafers within a double half-wafer basket according to any one of claims 3 to 5, characterized in that, The second correction drive assembly includes a second drive motor, a second drive gear, and a second drive rack. The second drive motor is fixed on the second correction body. The second drive motor is connected to the second drive gear. The second drive gear meshes with the second drive rack. The second correction assembly is connected to the second drive rack.
8. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 7, characterized in that, The second alignment component includes a second alignment connecting plate, a second slide rail, and a second alignment plate. The second alignment connecting plate is connected to the second drive rack. The second slide rail is disposed on the second alignment body. The second alignment connecting plate is slidably connected to the second slide rail. The second alignment plate is connected to the second alignment connecting plate.
9. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 8, characterized in that, The second correction component also includes a second correction limiting plate and a second correction fixing plate. The second correction limiting plate is fixed on the second correction body. There are multiple second correction fixing plates and multiple second correction plates. The second correction connecting plate is connected to the corresponding second correction plate through the second correction fixing plate. The second correction limiting plate is provided with multiple second limiting grooves, and the multiple second correction fixing plates are respectively located in the multiple second limiting grooves.
10. The alignment device for aligning silicon wafers within a double half-wafer basket according to claim 9, characterized in that, There are four second correction plates. The second correction plates are in an L-shaped structure, with two adjacent second correction plates arranged symmetrically and the other two adjacent second correction plates arranged symmetrically.