Vacuum adsorption type wafer taking and placing clamp

Abstract

The utility model relates to the technical field of semiconductor manufacturing, in particular to a vacuum adsorption type wafer taking and placing clamp, which comprises a clamp body formed by connecting an upper clamping part and a lower clamping part through one side end part, a hollow cavity is arranged in the clamp body, a control hole is arranged at the top of the upper clamping part, an adsorption hole is arranged at the end part of the lower clamping part, and the control hole is communicated with the adsorption hole. The control hole and the adsorption hole are externally connected with negative pressure through the hollow cavity, and when the end of the upper clamping part is attached to the end of the lower clamping part, a gap exists between the upper clamping part and the lower clamping part. According to the utility model, stable taking and placing of wafers are realized through vacuum adsorption and gap design, contact stress is buffered in combination with a sealing gasket, wafer damage is effectively avoided, meanwhile, operation precision and safety are improved through design of positioning pins and arc-shaped edges, and the problem that wafers fall off or are damaged due to non-uniform clamping force of a traditional clamp is solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a vacuum adsorption type wafer pick-and-place fixture. Background Technology

[0002] In semiconductor manufacturing processes, wafer handling operations must meet extremely high precision and safety requirements. For example, in the gold bump fabrication process, wafers undergo multiple processes such as sputtering, photoresist coating, electroplating, and etching. In these processes, wafer handling is a critical step, and it is essential to ensure that the wafers are not damaged. Currently, existing wafer grippers rely on operators pushing the gripper to pick up wafers. The gripper is essentially a tweezer-like structure formed by two clamping parts. One side is an opening position used to open and close to grip the wafer, while the other side is a connecting position with a pusher that passes through both clamping parts. The pusher abuts against each clamping part, and as it moves left and right at the connecting position, the two clamping parts open and close. However, since the clamping parts are generally made of plastic or metal strips with a certain degree of toughness, using the pusher to clamp them results in a relatively large clamping force at the point of contact between the two clamping parts. Since this clamping position is precisely where the wafer is gripped, it may cause damage to the wafer during clamping. To prevent damage, operators may clamp the wafer away from the ends of the clamping parts, but this sometimes results in insufficient clamping force, causing the wafer to fall out. Therefore, optimizing the gripper structure to ensure stable wafer clamping is a technical problem that needs to be solved. Utility Model Content

[0003] The purpose of this invention is to provide a vacuum adsorption type wafer pick-and-place fixture to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a vacuum adsorption type wafer pick-and-place fixture, comprising a clamping body formed by an upper clamping part and a lower clamping part connected by one end. The clamping body is provided with a hollow cavity. The upper clamping part is provided with a control hole on its top, and the lower clamping part is provided with an adsorption hole at its end. Both the control hole and the adsorption hole are connected to negative pressure outside the hollow cavity. When the ends of the upper clamping part and the lower clamping part are in contact, there is a gap between the upper clamping part and the lower clamping part.

[0005] Preferably, the front end of the lower clamping part is provided with two spaced positioning pins, which do not contact the upper clamping part.

[0006] Preferably, the positioning pin has a height of 5mm, a diameter of 2.5mm, and a distance of 18mm between the positioning pin and the front end of the lower clamping part.

[0007] Preferably, both the end of the upper clamping part and the end of the lower clamping part are provided with sealing gaskets.

[0008] Preferably, the thickness of the sealing gasket does not exceed 2 mm.

[0009] Preferably, the pore diameter of the adsorption pore does not exceed 5 mm.

[0010] Preferably, the adsorption holes are a plurality of holes and are evenly distributed at the end edge of the lower clamping part.

[0011] Preferably, the end edges of the upper clamping portion and the lower clamping portion are arc-shaped.

[0012] Compared with the prior art, this utility model provides a vacuum adsorption type wafer pick-and-place fixture, which has the following beneficial effects:

[0013] 1. By using vacuum adsorption and gap design, direct compression of the wafer by mechanical clamping force is avoided;

[0014] 2. The locating pins and the curved edge work together to improve wafer positioning accuracy;

[0015] 3. The sealing gasket is combined with the evenly distributed adsorption pores to ensure adsorption stability and damage resistance;

[0016] 4. The hollow chamber structure optimizes the negative pressure distribution, improving the efficiency of picking and placing items. Attached Figure Description

[0017] Figure 1 This is a top view of the present invention;

[0018] Figure 2 This is the front view of the present invention;

[0019] Figure 3 for Figure 2 Sectional view of AA.

[0020] Explanation of reference numerals in the attached drawings: 1. Upper clamping part; 2. Lower clamping part; 3. Clamping body; 4. Hollow cavity; 5. Control hole; 6. Adsorption hole; 7. Positioning pin; 8. Sealing gasket. Detailed Implementation

[0021] The technical solutions of the present utility model will now be described with reference to the accompanying drawings in the embodiments of the present utility model:

[0022] like Figure 1-3 As shown: The vacuum adsorption wafer pick-and-place fixture of this utility model includes a clamping body 3 formed by connecting an upper clamping part 1 and a lower clamping part 2 through one end. The clamping body 3 is provided with a hollow chamber 4, and the hollow chamber 4 is connected to a vacuum pump through a vacuum tube to form a vacuum adsorption system.

[0023] The upper clamping part 1 has a control hole 5 on its top as a negative pressure adjustment interface. The lower clamping part 2 has an adsorption hole 6 at its end. The diameter of the adsorption hole 6 does not exceed 5mm. There are several adsorption holes 6, which are evenly distributed on the edge of the lower clamping part 2 to ensure that the adsorption force evenly covers the wafer surface. Both the control hole 5 and the adsorption hole 6 are connected to the negative pressure outside the hollow chamber 4 to form a vacuum adsorption channel. The edge of the upper clamping part 1 and the lower clamping part 2 is arc-shaped. When the ends of the upper clamping part 1 and the lower clamping part 2 are in contact, there is a gap between the upper clamping part 1 and the lower clamping part 2 to avoid hard contact that scratches the wafer surface.

[0024] The front end of the lower clamping part 2 is provided with two spaced positioning pins 7 to limit the horizontal position of the wafer. The height of the positioning pin 7 is H, which is 5mm, and the diameter of the positioning pin 7 is 2.5mm. The distance between the positioning pin 7 and the front end of the lower clamping part 2 is D, which is 18mm. This distance D is set to prevent the circuits on the wafer from being clamped. When the ends of the upper clamping part 1 and the lower clamping part 2 are in contact, only the edge of the wafer is clamped. The axial direction of the positioning pin 7 is perpendicular to the lower clamping part 2 and does not contact the upper clamping part 1.

[0025] Both the end of the upper clamping part 1 and the end of the lower clamping part 2 are provided with sealing gaskets 8 to prevent air leakage and buffer contact stress. The sealing gaskets 8 are made of wear-resistant silicone material and the thickness of the sealing gaskets 8 does not exceed 2mm.

[0026] Operating procedures and working principles:

[0027] Step 1: Vacuum adsorption start-up

[0028] Start the vacuum pump and evacuate the hollow chamber 4 through the vacuum tube to create a negative pressure environment. At this time, the adsorption pores 6 generate a uniform adsorption force under the action of negative pressure.

[0029] Step 2: Wafer Positioning and Clamping

[0030] Position the wafer horizontally close to the front end of the lower clamping part 2, aligning the positioning holes on the wafer edge with the positioning pins 7 and engaging them. Close the clamping body 3, bringing the ends of the upper clamping part 1 and the lower clamping part 2 into contact. The operator covers the control hole 5 with their finger to further increase the negative pressure in the hollow chamber 4, and the adsorption hole 6 stably adsorbs the wafer onto the end of the lower clamping part 2.

[0031] Step 3: Wafer Transfer and Release

[0032] After the pick-up and drop-off action is completed, the control hole 5 is released, the hollow chamber 4 returns to normal pressure, the adsorption force disappears, and the wafer is smoothly released from the fixture. The sealing gasket 8 buffers the pressure during the contact process to avoid damage from hard contact.

[0033] The beneficial effects of this invention are as follows: Vacuum adsorption and gap design avoid direct squeezing of the wafer by mechanical clamping force; the locating pin and the arc edge work together to improve wafer positioning accuracy; the combination of the sealing gasket and the uniformly distributed adsorption holes ensures adsorption stability and damage prevention performance; the hollow chamber structure optimizes the negative pressure distribution and improves pick-and-place efficiency.

[0034] This invention achieves stable wafer handling through vacuum adsorption and gap design. Combined with a sealing gasket to buffer contact stress, it effectively prevents wafer damage. Meanwhile, the positioning pin and curved edge design improve operational accuracy and safety, solving the problem of wafer detachment or damage caused by uneven clamping force in traditional fixtures. This invention is particularly suitable for wafer handling operations in gold bump fabrication processes, significantly reducing wafer breakage rates and improving production efficiency.

[0035] The above embodiments are merely some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

Claims

1. A vacuum adsorption type wafer pick-and-place jig, comprising a clamping body (3) formed by connecting an upper clamping part (1) and a lower clamping part (2) through one end, characterized in that: The clamp (3) has a hollow chamber (4) inside. The upper clamping part (1) has a control hole (5) on its top. The lower clamping part (2) has an adsorption hole (6) at its end. Both the control hole (5) and the adsorption hole (6) are connected to negative pressure outside the hollow chamber (4). When the ends of the upper clamping part (1) and the lower clamping part (2) are in contact, there is a gap between the upper clamping part (1) and the lower clamping part (2).

2. The vacuum adsorption wafer pick-and-place fixture according to claim 1, characterized in that: The lower clamping part (2) has two spaced positioning pins (7) at its front end, and the positioning pins (7) do not contact the upper clamping part (1).

3. The vacuum adsorption wafer pick-and-place fixture according to claim 2, characterized in that: The positioning pin (7) has a height of 5mm, a diameter of 2.5mm, and a distance of 18mm between the positioning pin (7) and the front end of the lower clamping part (2).

4. The vacuum adsorption wafer pick-and-place fixture according to claim 1, characterized in that: Both the end of the upper clamping part (1) and the end of the lower clamping part (2) are provided with sealing gaskets (8).

5. The vacuum adsorption wafer pick-and-place fixture according to claim 4, characterized in that: The thickness of the sealing gasket (8) does not exceed 2 mm.

6. The vacuum adsorption type wafer pick-and-place fixture according to claim 1, characterized in that: The pore diameter of the adsorption pore (6) does not exceed 5 mm.

7. The vacuum adsorption type wafer pick-and-place fixture according to claim 6, characterized in that: The adsorption holes (6) are several and are evenly distributed at the end edge of the lower clamping part (2).

8. The vacuum adsorption type wafer pick-and-place fixture according to claim 1, characterized in that: The end edges of the upper clamping part (1) and the lower clamping part (2) are arc-shaped.

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