Servo drive heat dissipation device of joint module and robot joint module

Abstract

The utility model discloses a servo drive heat dissipation device of a joint module and a robot joint module. The servo drive heat dissipation device comprises a joint control board and a power drive board which are electrically connected with each other. The power drive board heat dissipation aluminum alloy piece is fixed to the shell inner wall fixing platform of the integrated joint module and makes contact with the power drive board. The power drive board, the joint control board and the power drive board heat dissipation aluminum alloy piece are connected through heat conduction prism bolts. And the MOS tube heat dissipation aluminum alloy piece is fixed on the power drive board heat dissipation aluminum alloy piece and is in contact with the MOS tube. The shell makes contact with a metal shell at the robot joint, and heat of the integrated joint module is conducted to the metal shell of the robot joint from the shell. In this way, heat generated in the joint module can be quickly conducted out to the shell, the phenomenon of heat accumulation is reduced, the problem that an integrated joint module control system is unstable due to overheating is solved, and it is ensured that the robot joint module works stably and reliably.

Description

Technical Field

[0001] This utility model relates to the field of robot technology, specifically to a servo drive heat dissipation device for a joint module and a robot joint module. Background Technology

[0002] With continuous industrial development, robots are increasingly widely used in industrial and other fields, leading to ever-increasing performance requirements. Currently, mainstream servo-integrated joint modules have limited space, and within this limited space, they integrate reducers, servo motors, brakes, encoders, power drive boards, and main control boards, resulting in a high degree of integration. Among these, the reducer, servo motor, brake, driver, and main control board are all heat-generating components. As temperature rises, the lifespan of electronic components shortens exponentially, affecting the robot's performance. Therefore, it is necessary to prevent excessively high internal temperatures within the integrated joint module.

[0003] Meanwhile, as the power output of robots increases, the requirements for the output power of integrated joint module circuit boards also become higher. This makes the heat dissipation of robot joint module circuit boards even more critical. Under the premise of equal heat generation capacity, the quality of heat dissipation has become a major factor in improving the output power of robot joint modules. Utility Model Content

[0004] The problem to be solved by this utility model is to provide a servo drive heat dissipation device for a joint module and a robot joint module.

[0005] To solve the above problems, this utility model provides a servo drive heat dissipation device for a joint module and a robot joint module. To achieve the above objectives, the technical solution adopted by this utility model to solve its technical problems is as follows:

[0006] A servo-driven heat dissipation device for a joint module includes: an axial space expansion mechanism, comprising a power drive plate and a joint control plate arranged parallel to each other with an axial gap, wherein the power drive plate and the joint control plate are connected to each other by a heat-conducting prism bolt and the axial gap between them is defined; and a circumferential area expansion mechanism, comprising a coaxially arranged drive plate heat dissipation aluminum alloy component and a housing, wherein both the drive plate heat dissipation aluminum alloy component and the housing are cylindrical shells with an opening at one end, the power drive plate and the joint control plate are located inside the cylindrical shell of the drive plate heat dissipation aluminum alloy component, and the outer wall of the drive plate heat dissipation aluminum alloy component and the inner wall of the housing form a concave-convex contact that expands the contact area; wherein one end of the heat-conducting prism bolt contacts the bottom surface of the inner wall of the drive plate heat dissipation aluminum alloy component and forms an axial gap between the power drive plate and the joint control plate.

[0007] As a further improvement of this utility model, the joint control board and the power drive board are electrically connected; a processor heat dissipation aluminum alloy component is fixed on the heat dissipation aluminum alloy component of the drive board, and the processor heat dissipation aluminum alloy component is in contact with the joint control board processor of the joint control board; a MOS tube heat dissipation aluminum alloy component is fixed on the heat dissipation aluminum alloy component of the drive board, and the MOS tube heat dissipation aluminum alloy component is in contact with the MOS tube on the power drive board; the power drive board, the joint control board, and the heat dissipation aluminum alloy component of the drive board are thermally connected by thermally conductive prismatic bolts.

[0008] As a further improvement of this utility model, the heat-conducting prism bolt includes a prism bolt and a round-headed hexagonal socket head cap screw. The power drive board is fixed to the drive board mounting threaded hole on the heat dissipation aluminum alloy part of the drive board using the prism bolt. The joint control board is fixed to the power drive board by means of the round-headed hexagonal socket head cap screw and the prism threaded hole on one end of the prism bolt.

[0009] As a further improvement of this utility model, the inner wall of the outer shell is provided with a heat dissipation groove, and the side of the heat dissipation aluminum alloy part of the drive plate is provided with heat dissipation fins. The heat dissipation groove and the heat dissipation fins are mutually concave and convex and form surface contact; the length extension direction of the heat dissipation groove and the heat dissipation fins is parallel to the axis of the outer shell.

[0010] As a further improvement of this utility model, the inner wall of the outer shell has a fixing platform that extends radially inward. From the axial perspective of the outer shell, the fixing platform is C-shaped, and the bottom of the outer wall of the heat dissipation aluminum alloy part of the drive plate contacts and is fixed to the fixing platform.

[0011] As a further improvement of this utility model, a power device is provided on the side of the power drive board facing the joint control board, and the side of the power drive board away from the joint control board is in contact with the heat dissipation aluminum alloy part of the drive board.

[0012] As a further improvement of this utility model, the heat dissipation aluminum alloy component of the MOSFET and the MOSFET on the power drive board form surface contact through a liquid metal heat-conducting sheet; the heat dissipation aluminum alloy component of the processor and the control board processor on the joint control board form surface contact through a liquid metal heat-conducting sheet.

[0013] As a further improvement of this utility model, the axial length of the heat dissipation aluminum alloy part of the drive board is smaller than the axial length of the outer shell, and the heat dissipation groove is a rectangular groove.

[0014] As a further improvement of this utility model, both the joint control board and the power drive board are made of aluminum substrate.

[0015] On the other hand, a robot joint module includes a servo drive heat dissipation device for the aforementioned joint module.

[0016] The beneficial technical effects of using the servo drive heat dissipation device for a joint module according to this application include:

[0017] First, the power drive board and the joint control board are connected by thermally conductive prism bolts, forming an axial gap between them. This avoids localized heat accumulation caused by direct contact of the circuit boards and provides physical space for airflow heat dissipation.

[0018] Secondly, the cylindrical nested structure expands the heat conduction area because the heat dissipation aluminum alloy component of the drive plate is coaxially nested with the outer shell to form a cylindrical shell. Its outer wall and the inner wall of the outer shell are in contact through concave and convex fit, breaking through the limitations of planar contact and significantly increasing the heat conduction contact area.

[0019] Finally, the thermal resistance is shortened by using a directional heat conduction path, because one end of the heat-conducting prism bolt directly contacts the bottom surface of the inner wall of the heat dissipation aluminum alloy component of the drive board, which directionally conducts the heat from the circuit board to the heat dissipation component, reducing intermediate thermal resistance links. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a perspective view of one embodiment of the servo drive heat dissipation device for the joint module of this utility model.

[0022] Figure 2 This is an exploded view of one embodiment of the servo drive heat dissipation device for the joint module of this utility model.

[0023] Figure 3 This is a perspective view of the outer casing of one embodiment of the servo drive heat dissipation device for the joint module of this utility model.

[0024] Figure 4 This is a perspective view of the heat dissipation aluminum alloy part of the drive board in one embodiment of the servo drive heat dissipation device for the joint module of this utility model.

[0025] Figure 5 This is an assembly drawing of the processor heat dissipation aluminum alloy part, MOS tube heat dissipation aluminum alloy part, joint control board and power drive board, which is an embodiment of the servo drive heat dissipation device of the joint module of this utility model.

[0026] Figure 6 This is a perspective view of a heat-conducting prism bolt, representing one embodiment of the servo drive heat dissipation device for the joint module of this utility model.

[0027] 1-Outer shell; 101-Fixed platform; 102-Driver board heat dissipation aluminum alloy component mounting threaded hole; 103-Heat dissipation groove; 2-Driver board heat dissipation aluminum alloy component; 201-Driver board mounting threaded hole; 202-Driver board heat dissipation aluminum alloy component mounting through hole; 203-MOS transistor heat dissipation aluminum alloy component mounting threaded hole; 204-Processor heat dissipation aluminum alloy component mounting threaded hole; 205-Heat dissipation fins; 206-Driver board heat dissipation aluminum alloy component through hole; 3-Power drive board; 301-MOS transistor; 4-Joint control board; 401-Control board processor; 5-MOS transistor heat dissipation aluminum alloy component; 6-Processor heat dissipation aluminum alloy component; 7-Thermal conductive prism bolt; 701-Pyramid bolt; 702-Round head hexagon socket bolt; 703-Pyramid threaded hole. Detailed Implementation

[0028] The present invention will be further described in detail below with reference to specific embodiments:

[0029] To achieve the purpose of this utility model, a servo drive heat dissipation device for an integrated joint module includes a housing 1, a joint control board 4, a processor heat dissipation aluminum alloy component 6, a power drive board 3, a drive board heat dissipation aluminum alloy component 2, a MOSFET heat dissipation aluminum alloy component 5, and a thermally conductive prismatic bolt 7. The joint control board 4 and the power drive board 3 are electrically connected. The drive board heat dissipation aluminum alloy component 2 is fixed on a fixing platform 101 inside the housing 1 and is in contact with the power drive board 3 for heat dissipation. The processor heat dissipation aluminum alloy component 6 is fixed to the drive board heat dissipation aluminum alloy component 2 and is in contact with the processor 401 of the joint control board for heat dissipation. The MOSFET heat dissipation aluminum alloy component 5 is fixed to the drive board heat dissipation aluminum alloy component 2 and is in contact with the MOSFET 301 on the power drive board 3 for heat dissipation. The power drive board 3, the joint control board 4, and the drive board heat dissipation aluminum alloy component 2 are connected by the thermally conductive prismatic bolt 7 for heat conduction and fixation.

[0030] In addition, the diameters of the power drive board 3 and the joint control board 4 are smaller than the diameter of the inner wall of the heat dissipation aluminum alloy part 2 of the drive board.

[0031] The heat dissipation aluminum alloy component 2 of the drive board is fixed to the fixed platform 101 of the outer shell 1 and contacts the power drive board 3. At the same time, the heat dissipation aluminum alloy component 6 of the processor and the heat dissipation aluminum alloy component 5 of the MOSFET are respectively fixed on the heat dissipation aluminum alloy component 2 of the drive board and contact the processor 401 and the MOSFET 301 of the control board. With the help of the heat-conducting prism bolt 7, the power drive board 3, the joint control board 4 and the heat dissipation component 2 are connected in series, and finally a directional heat conduction path from the heat source to the outer shell 1 is formed, which directly solves the heat dissipation problem of the power drive board 3.

[0032] In some other embodiments of this utility model, the processor heat dissipation aluminum alloy component 6 contacts the control board processor 401 on the joint control board 4 via a liquid metal heat-conducting sheet for heat dissipation by conduction. The drive board heat dissipation aluminum alloy component 2 contacts the power drive board 3 via a liquid metal heat-conducting sheet for heat dissipation by thermal conduction. The MOSFET heat dissipation aluminum alloy component 5 contacts the MOSFET 301 on the power drive board 3 via a liquid metal heat-conducting sheet for heat dissipation by thermal conduction. The fixing points of the processor heat dissipation aluminum alloy component 6 and the MOSFET heat dissipation aluminum alloy component 5 to the drive board heat dissipation aluminum alloy component 2 are all connected via liquid metal heat-conducting sheets for heat dissipation by thermal conduction. The heat dissipation groove 103 inside the housing 1 contacts the heat dissipation fins 205 on the outside of the drive board heat dissipation aluminum alloy component 2 via a liquid metal heat-conducting sheet for heat dissipation by thermal conduction.

[0033] In addition, the aluminum alloy heat sink 6 for the processor is L-shaped or Z-shaped.

[0034] The beneficial effects of adopting the above technical solution are: by filling the liquid metal heat-conducting sheet, the contact area is guaranteed, the contact thermal resistance is significantly reduced, and the heat conduction efficiency of each layer is improved.

[0035] In some other embodiments of this utility model, the power drive board 3, the joint control board 4, and the drive board heat dissipation aluminum alloy component 2 are fixed together by thermally conductive prism bolts 7. The MOSFET heat dissipation aluminum alloy component 5 and the processor heat dissipation aluminum alloy component 6 are both fixed to the drive board heat dissipation aluminum alloy component 2 by thermally conductive prism bolts 7. The drive board heat dissipation aluminum alloy component 2 is fixed to the fixing platform 101 inside the outer casing 1 by thermally conductive prism bolts 7.

[0036] The beneficial effects of adopting the above technical solution are: while ensuring the stability of the mechanical connection, the heat-conducting prism bolt 7 provides an auxiliary heat conduction channel using the metal bolt material.

[0037] In some other embodiments of this utility model, the joint control board 4 is an aluminum substrate. The power drive board 3 is an aluminum substrate. The aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. The aluminum substrate consists of a three-layer structure, namely a circuit layer, an insulating layer, and a metal base layer.

[0038] The beneficial effect of adopting the above technical solution is that, by utilizing the high thermal conductivity of its metal base layer, the heat generated by the circuit layer can be quickly conducted laterally to the heat dissipation aluminum alloy component 2 of the drive board.

[0039] In some other embodiments of this invention, the MOSFET heat sink aluminum alloy component 5 is in close contact with the MOSFET 301 on the power drive board 3 via a liquid metal heat-conducting sheet. The processor heat sink aluminum alloy component 6 is in close contact with the control board processor 401 on the joint control board 4 via a liquid metal heat-conducting sheet. The liquid metal heat-conducting sheet is a sheet-like thermal interface material made of a low-melting-point metal alloy, such as gallium-based or indium-based. It is liquid or semi-liquid at room temperature or operating temperature. Its core function is to fill the micro-gaps between the processor, MOSFET, and other heat-generating components and the heat sink, forming an efficient heat conduction channel through the high thermal conductivity and fluidity of the metal, significantly reducing the interface thermal resistance.

[0040] The beneficial effects of adopting the above technical solution are: the heat dissipation aluminum alloy component 5 of the MOSFET and the MOSFET 301, and the heat dissipation aluminum alloy component 6 of the processor and the processor 401 of the control board are all in close contact through liquid metal heat-conducting sheets, which specifically reduces the interface thermal resistance of high heat-generating components.

[0041] In other embodiments of this utility model, such as Figure 6 As shown, the heat-conducting prism bolt 7 is composed of a prism bolt 701 and a round-headed hexagonal socket bolt 702. The power drive plate 3 is fixed to the heat dissipation aluminum alloy part 2 of the drive plate through the drive plate mounting thread hole 201 using the prism bolt 701. The joint control plate 4 is fixed to the power drive plate 3 through the prism thread hole 703 using the round-headed hexagonal socket bolt 702.

[0042] Furthermore, the two axial ends of the prism bolt 701 abut against the power drive plate 3 and the joint control plate 4, respectively, meaning the axial distance between the power drive plate 3 and the joint control plate 4 is equal to the axial length of the prism bolt 701. Additionally, one end of the prism threaded hole 703 is recessed to form a blind hole, while the other end extends axially to form a convex cylinder. The blind hole assembles with the round-headed hexagonal socket bolt 702 and provides clamping and limiting for the joint control plate 4. The end of the convex cylinder abuts against the heat dissipation aluminum alloy component 2 of the drive plate, ensuring an axial clearance also exists between the power drive plate 3 and the heat dissipation aluminum alloy component 2.

[0043] Several heat-conducting prism bolts 7 are arranged in a ring array, and the preferred number of heat-conducting prism bolts 7 is three.

[0044] The beneficial effects of adopting the above technical solution are as follows: the prism bolt 701 fixes the power drive plate 3 to the heat dissipation aluminum alloy part 2 of the drive plate, and the round head hexagon socket bolt 702 fixes the joint control plate 4 to the power drive plate 3. The layered bolt design simplifies the assembly process and conducts heat from the joint control plate 4 to the heat dissipation system through the metal bolt material.

[0045] In some other embodiments of this utility model, the power drive board 3 has two opposing sides, wherein the side near the joint control board 4 is provided with power devices, and the other side is in contact with the heat dissipation aluminum alloy part 2 of the drive board.

[0046] The beneficial effects of adopting the above technical solution are: the power devices of the power drive board 3 are concentrated on one side close to the joint control board 4, while the other side directly contacts the heat dissipation aluminum alloy part 2 of the drive board. This layout can isolate the thermal interference of the power devices to the control board, while shortening the heat dissipation path.

[0047] In some other embodiments of this utility model, the fixed platform 101 is disposed inside the housing 1. A servo drive heat dissipation device for an integrated joint module is located inside the housing 1. The heat dissipation aluminum alloy part 2 has a side extension that contacts the inner wall of the housing 1, increasing the heat conduction area.

[0048] The beneficial effects of adopting the above technical solution are: the side extension of the heat dissipation aluminum alloy part 2 of the drive board is in direct contact with the inner wall of the outer shell 1, breaking through the planar limitation of the fixed platform 101 and increasing the contact area between the heat dissipation part 2 and the outer shell 1.

[0049] In some other embodiments of this utility model, the outer shell 1 has a heat dissipation groove 103 inside, and the heat dissipation aluminum alloy part 2 of the drive board has heat dissipation fins 205 on its side. The heat dissipation groove 103 and the heat dissipation fins 205 cooperate to increase the heat conduction area.

[0050] In addition, the heat dissipation groove 103 is a rectangular groove. The axial length of the heat dissipation groove 103 is greater than the axial length of the heat dissipation fin 205. The axial length of the heat dissipation fin 205 is equal to the axial length of the heat dissipation aluminum alloy part 2 of the drive board. The end of the heat dissipation groove 103 near the bottom surface of the inner wall of the outer casing 1 does not contact the bottom surface of the inner wall of the outer casing 1.

[0051] The beneficial effects of adopting the above technical solution are: the heat dissipation groove 103 inside the outer shell 1 matches the shape of the heat dissipation fins 205 of the heat dissipation aluminum alloy part 2 of the drive board, forming a three-dimensional interlaced interface, which further expands the heat exchange area.

[0052] In some other embodiments of this utility model, the outer shell 1 is in contact with the metal shell of the robot joint, so that the heat of the integrated joint module is conducted from the outer shell 1 to the metal shell of the robot joint.

[0053] The beneficial effects of adopting the above technical solution are: the outer shell 1 is in direct contact with the metal shell of the robot joint, and the heat inside the module is finally conducted to the metal structure of the robot body, and the larger external heat dissipation surface is used to prevent heat accumulation.

[0054] like Figures 1 to 4 As shown, the servo drive heat dissipation device of the integrated joint module of this application includes a housing 1, a drive board heat dissipation aluminum alloy part 2, a power drive board 3, a joint control board 4, a MOSFET heat dissipation aluminum alloy part 5, a processor heat dissipation aluminum alloy part 6, and a heat-conducting prism bolt 7.

[0055] like Figure 3 As shown, the outer casing 1 is as follows Figure 3 The upper part is equipped with a fixed platform 101, a drive board heat dissipation aluminum alloy mounting threaded hole 102, and a heat dissipation groove 103. The outer side of the outer shell 1 is in direct contact with the metal shell of the robot joint, which is conducive to the rapid heat dissipation inside the integrated joint module.

[0056] like Figure 4 As shown, the driver board heat dissipation aluminum alloy component 2 is provided with driver board mounting threaded holes 201, driver board heat dissipation aluminum alloy component mounting through holes 202, MOSFET heat dissipation aluminum alloy component mounting threaded holes 203, processor heat dissipation aluminum alloy component mounting threaded holes 204, heat dissipation fins 205, and driver board heat dissipation aluminum alloy component through holes 206. The driver board heat dissipation aluminum alloy component 2 is fixed to the driver board heat dissipation aluminum alloy component mounting threaded holes 102 on the fixing platform 101 inside the outer casing 1 using thermally conductive bolts through the driver board heat dissipation aluminum alloy component mounting through holes 202. The fixing platform 101 not only facilitates the installation of the driver board heat dissipation aluminum alloy component 2, but also increases the contact area between the driver board heat dissipation aluminum alloy component 2 and the outer casing 1, thereby improving heat dissipation efficiency. The extension of the driver board heat dissipation aluminum alloy component 2 is provided with heat dissipation fins 205, which cooperate with the heat dissipation grooves 103 inside the outer casing 1, greatly increasing the contact area between the driver board heat dissipation aluminum alloy component 2 and the outer casing 1, and improving heat dissipation efficiency. The annular gap in the fixed platform 101 corresponds to the through hole 206 of the heat dissipation aluminum alloy component of the drive board, allowing air to circulate on both sides and facilitating heat dissipation.

[0057] like Figure 5 As shown, the power drive board 3 and the joint control board 4 are respectively equipped with a MOSFET 301 and a control board processor 401. Both the power drive board 3 and the joint control board 4 are aluminum substrates. The aluminum substrate consists of a circuit layer, an insulating layer, and a metal base layer. The metal base layer is usually made of aluminum, which has better heat dissipation performance than traditional PCB boards. Copper is used as the conductive medium in the circuit layer. Copper has relatively low resistance, which not only meets the requirements of high current use but also fundamentally reduces the heat generation problem of the circuit. At the same time, the high thermal conductivity of copper can quickly conduct heat to the metal base layer. The power drive board 3 and the joint control board 4 are electrically connected. The power drive board 3 has two opposing sides. The side closer to the joint control board 4 is equipped with power devices, and the other side is in contact with the heat dissipation aluminum alloy part 2 of the drive board. This ensures the connection between the power drive board 3 and the joint control board 4 and facilitates better heat dissipation of the power drive board 3.

[0058] like Figure 6As shown, the heat-conducting prism bolt 7 is equipped with a prism bolt 701, a round-head hexagon socket bolt 702, and a prism threaded hole 703. The power drive plate 3 is fixed to the heat dissipation aluminum alloy part 2 of the drive plate using the prism bolt 701 through the drive plate mounting threaded hole 201. The joint control plate 4 is fixed to the power drive plate 3 using the round-head hexagon socket bolt 702 through the prism threaded hole 703. The structure of the heat-conducting prism bolt 7 ensures a tight connection between the power drive plate 3 and the heat dissipation aluminum alloy part 2 of the drive plate, as well as a tight connection between the joint control plate 4 and the power drive plate 3, ensuring structural stability. Furthermore, the heat-conducting prism bolt 7 can conduct heat from the joint control plate 4 to the heat dissipation aluminum alloy part 2 of the drive plate, facilitating heat dissipation.

[0059] like Figure 2 As shown, the MOSFET heat sink aluminum alloy component 5 has through holes. The MOSFET heat sink aluminum alloy component 5 can be fixed to the driver board heat sink aluminum alloy component 2 by screwing a thermally conductive bolt through the through holes and into the mounting threaded hole 203. The heat dissipation plane of the MOSFET heat sink aluminum alloy component 5 is in contact with the MOSFET 301. The MOSFET 301 controls the switching of the motor. During high-frequency switching, conduction losses are generated. The higher the switching frequency and the larger the output current, the more severe the heat generation. Therefore, heat dissipation of the MOSFET 301 is particularly important. The above design dissipates heat from the MOSFET 301 through the aluminum substrate while also providing direct heat dissipation through the MOSFET heat sink aluminum alloy component 5 in contact with the MOSFET 301, ensuring the long-term use of the MOSFET 301 and increasing the service life of the integrated joint module.

[0060] like Figure 2 As shown, the processor heat dissipation aluminum alloy component 6 has through holes. The processor heat dissipation aluminum alloy component 6 can be fixed to the drive board heat dissipation aluminum alloy component 2 by screwing thermally conductive bolts through the through holes and into the mounting threaded holes 204. The heat dissipation surface of the processor heat dissipation aluminum alloy component 6 is in contact with the control board processor 401. As the main heat-generating component on the joint control board 4 and the main control chip of the integrated joint module, heat dissipation of the control board processor 401 is essential. This method can achieve better heat dissipation for the control board processor 401 and increase the service life of the integrated joint module.

[0061] In a preferred embodiment of this application, the processor heat sink aluminum alloy component 6 is in contact with the control board processor 401 on the joint control board 4 via a liquid metal heat-conducting sheet. The driver board heat sink aluminum alloy component 2 is in contact with the power driver board 3 via a liquid metal heat-conducting sheet. The MOSFET heat sink aluminum alloy component 5 is in contact with the MOSFET 301 on the power driver board 3 via a liquid metal heat-conducting sheet. The fixing points of the processor heat sink aluminum alloy component 6 and the MOSFET heat sink aluminum alloy component 5 to the driver board heat sink aluminum alloy component 2 are all connected via liquid metal heat-conducting sheets. The heat dissipation groove 103 and the fixing platform 101 inside the housing 1 are in contact with the heat dissipation fins 205 on the outside of the driver board heat sink aluminum alloy component 2 and the bottom surface of the driver board heat sink aluminum alloy component 2 via liquid metal heat-conducting sheets. Liquid metal thermal pads are a type of highly efficient thermal interface material, specifically designed to fill the tiny gaps between heat-generating components and heat-dissipating parts in electronic devices, thereby improving heat transfer efficiency. Their core components are typically low-melting-point alloys in a liquid or semi-liquid state, possessing thermal conductivity far exceeding that of traditional silicone grease and silicone pads. Using liquid metal thermal pads can significantly improve the heat dissipation efficiency of components.

[0062] The key features of the servo drive heat dissipation device for the joint module in this application are as follows: First, both the power drive board 3 and the joint control board 4 use aluminum substrates, improving heat dissipation efficiency. Second, the integrated joint module shell 1 is in contact with the metal shell of the robot joint, allowing heat to be quickly dissipated. Third, a heat dissipation groove 103 is provided on the inner side of the integrated joint module shell 1. Correspondingly, heat dissipation fins 205 are provided on the outer side of the drive board heat dissipation aluminum alloy component 2, increasing the contact area between the drive board heat dissipation aluminum alloy component 2 and the integrated joint module shell 1, thus improving heat conduction efficiency. Finally, as a larger heat dissipation component on the power drive board 3, while dissipating heat from the MOSFET 301 through the aluminum substrate, the MOSFET heat dissipation aluminum alloy component 5 is also in direct contact with the MOSFET 301, increasing the heat dissipation effect on the MOSFET 301 and extending the service life of the integrated joint module. Without affecting the performance of the integrated joint module, liquid metal heat-conducting sheets are used as heat conduction media at each connection surface. Utilizing the excellent thermal conductivity of the liquid metal heat-conducting sheets, the overall performance of the integrated joint module is greatly improved.

[0063] A robot joint module includes a servo drive and heat dissipation device for the joint module. The robot joint module is an integrated joint module that can be used in humanoid bipedal or quadrupedal robots.

[0064] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A servo-driven heat dissipation device for a joint module, characterized in that, include: An axial space expansion mechanism includes a power drive plate and a joint control plate arranged in parallel to each other and having an axial gap. The power drive plate and the joint control plate are connected to each other by heat-conducting prism bolts and the mutual axial gap is defined. The circumferential area enlargement mechanism includes a coaxially arranged drive plate heat dissipation aluminum alloy component and a housing. Both the drive plate heat dissipation aluminum alloy component and the housing are cylindrical shells with an opening at one end. The power drive plate and the joint control plate are located inside the cylindrical shell of the drive plate heat dissipation aluminum alloy component. The outer wall of the drive plate heat dissipation aluminum alloy component and the inner wall of the housing form a concave-convex mating contact that expands the contact area. One end of the heat-conducting prism bolt contacts the bottom surface of the inner wall of the heat dissipation aluminum alloy component of the drive plate, forming an axial gap between the power drive plate and the joint control plate.

2. The servo drive heat dissipation device for the joint module according to claim 1, characterized in that: The joint control board is electrically connected to the power drive board; The heat dissipation aluminum alloy component of the drive board is fixed with the heat dissipation aluminum alloy component of the processor, and the heat dissipation aluminum alloy component of the processor is in contact with the joint control board processor of the joint control board. The heat dissipation aluminum alloy component of the drive board is fixed with a heat dissipation aluminum alloy component of the MOS transistor, and the heat dissipation aluminum alloy component of the MOS transistor is in contact with the MOS transistor on the power drive board. The power drive board, joint control board, and heat dissipation aluminum alloy component of the drive board are connected by thermally conductive prismatic bolts.

3. The servo drive heat dissipation device for the joint module according to claim 2, characterized in that: The heat-conducting prismatic bolt includes a prismatic bolt and a round-headed hexagonal socket head cap screw. The power drive board is fixed to the drive board mounting threaded hole on the heat dissipation aluminum alloy part of the drive board using the prismatic bolt. The joint control board is fixed to the power drive board by means of the round-headed hexagonal socket head cap screw and the prismatic threaded hole on one end of the prismatic bolt.

4. The servo drive heat dissipation device for the joint module according to claim 1, characterized in that: The inner wall of the outer shell has a heat dissipation groove, and the side of the heat dissipation aluminum alloy component of the drive board has heat dissipation fins. The heat dissipation groove and the heat dissipation fins are in concave-convex fit with each other and form surface contact. The length extension direction of the heat dissipation groove and heat dissipation fins is parallel to the axis of the outer casing.

5. The servo drive heat dissipation device for the joint module according to claim 1, characterized in that: The inner wall of the outer shell has a fixed platform extending radially inward. From the axial perspective of the outer shell, the fixed platform is C-shaped, and the bottom of the outer wall of the heat dissipation aluminum alloy component of the drive plate is in contact with and fixed to the fixed platform.

6. The servo drive heat dissipation device for the joint module according to claim 1, characterized in that: The power drive board has power devices on the side facing the joint control board, and the side of the power drive board away from the joint control board is in contact with the heat dissipation aluminum alloy part of the drive board.

7. The servo drive heat dissipation device for the joint module according to claim 2, characterized in that: The heat dissipation aluminum alloy component of the MOS transistor forms a surface contact with the MOS transistor on the power drive board through a liquid metal heat-conducting sheet; the heat dissipation aluminum alloy component of the processor forms a surface contact with the control board processor on the joint control board through a liquid metal heat-conducting sheet.

8. The servo drive heat dissipation device for the joint module according to claim 4, characterized in that: The axial length of the heat dissipation aluminum alloy component of the drive board is less than the axial length of the outer shell, and the heat dissipation groove is a rectangular groove.

9. The servo drive heat dissipation device for the joint module according to claim 1, characterized in that: Both the joint control board and the power drive board are made of aluminum substrate.

10. A robot joint module, characterized in that, A servo drive heat dissipation device comprising the joint module according to any one of claims 1 to 9.

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