Charging pile electronic control board convenient for heat dissipation

Abstract

The utility model relates to a charging pile electronic control board convenient for heat dissipation in the field of electronic control boards, which comprises a substrate for circuit conduction, an electronic element is welded on the surface of the substrate, a heat conducting plate is attached to the back of the substrate, and the heat conductivity coefficient of the heat conducting plate is larger than that of the substrate. The surface of the side, away from the base plate, of the heat conduction plate perpendicularly extends to form a plurality of cooling fins, all the cooling fins are arranged in parallel at equal intervals in the length direction of the heat conduction plate, a through airflow channel is formed between every two adjacent cooling fins, the extending direction of the airflow channels is matched with the direction of an air channel in the charging pile, and a heat conduction glue layer is arranged between the heat conduction plate and the base plate. The heat conduction glue layer completely covers the back projection area of the substrate, the heat pipe set is embedded in the heat conduction plate and extends into the heat dissipation fins, and through the collaborative design of the heat conduction plate, the heat pipe set and the heat dissipation fins, the heat dissipation efficiency is remarkably improved.

Description

Technical Field

[0001] This utility model relates to the field of electronic control boards, and in particular to an electronic control board for charging piles that facilitates heat dissipation. Background Technology

[0002] As the core equipment for supplying electric power to electric vehicles, the charging pile's internal electronic control board undertakes key functions such as power distribution, communication control, and safety monitoring. The power devices integrated on the control board's substrate, such as IGBT modules and rectifier bridges, generate a large amount of heat during operation, and the heat dissipation efficiency directly affects the charging pile's reliability and lifespan.

[0003] Existing technologies suffer from insufficient heat dissipation efficiency. The substrate itself has limited thermal conductivity, and heat accumulates in areas with dense electronic components, forming local hot spots. There is a lack of efficient heat dissipation mechanisms, making it difficult for heat to be dissipated from the heat source to the outside in a timely manner, resulting in low heat dissipation efficiency. Utility Model Content

[0004] In order to overcome the shortcomings of existing technical solutions, this utility model provides a charging pile electronic control board that is easy to dissipate heat, which can effectively solve the technical problem of insufficient heat dissipation efficiency.

[0005] The technical solution adopted by this utility model to solve its technical problem is:

[0006] An electronic control board for a charging pile with convenient heat dissipation includes a substrate for circuit conduction, electronic components soldered on the surface of the substrate, a heat-conducting plate attached to the back of the substrate, the thermal conductivity of the heat-conducting plate being greater than that of the substrate, a plurality of heat dissipation fins extending vertically from the side of the heat-conducting plate away from the substrate, all heat dissipation fins being arranged equidistantly and parallel along the length of the heat-conducting plate, and a through airflow channel being formed between adjacent heat dissipation fins, the extension direction of the airflow channel matching the direction of the internal airflow of the charging pile, a thermally conductive adhesive layer being disposed between the heat-conducting plate and the substrate, the thermally conductive adhesive layer completely covering the back projection area of ​​the substrate, and a heat pipe assembly embedded inside the heat-conducting plate, the heat pipe assembly extending into the interior of the heat dissipation fins.

[0007] Furthermore, the heat pipe assembly includes at least two parallel vacuum heat pipes whose extension direction is perpendicular to the arrangement direction of the heat dissipation fins.

[0008] Furthermore, the heat pipe assembly is arranged in multiple meandering zigzag lines inside the heat-conducting plate and heat dissipation fins.

[0009] Furthermore, the top of the heat dissipation fins is provided with a baffle, and the extension direction of the baffle forms an acute angle with the airflow channel.

[0010] Furthermore, the edge of the heat-conducting plate is provided with an upwardly bent fixed flange, which engages with the side of the substrate.

[0011] Furthermore, a metal mesh is embedded within the thermally conductive adhesive layer.

[0012] Compared with the prior art, the beneficial effects of this utility model are: through the coordinated design of heat-conducting plate, heat pipe assembly and heat dissipation fins, the heat dissipation efficiency is significantly improved. The heat-conducting plate constructs a high-efficiency heat conduction substrate, fully covering the back of the substrate, and quickly dissipating the heat of the substrate. The heat pipe assembly realizes directional heat diffusion, which directionally transports heat from the high-temperature area to the heat dissipation fins, breaking down local hot spots. The vertically extended equidistant parallel fins form a through airflow channel, which is matched with the air duct of the charging pile in the same direction, and forces the airflow to directly penetrate the heat dissipation area. Attached Figure Description

[0013] Figure 1 This is the front view of the present invention;

[0014] Figure 2 This is a schematic diagram of the heat dissipation fins and heat pipes in this utility model;

[0015] Figure 3 This is a schematic diagram of the heat-conducting plate and heat pipe in this utility model;

[0016] The numbers in the diagram are: 1-substrate, 2-electronic component, 3-heat conduction plate, 4-heat dissipation fins, 5-thermal conductive adhesive layer, 6-fixing flange, 7-heat pipe assembly. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] The following is combined with Figures 1-3 This invention provides a detailed description of a heat-dissipating electronic control board for a charging pile:

[0019] An electronic control board for a charging pile with convenient heat dissipation includes a substrate 1 for circuit conduction. Electronic components 2 are soldered to the surface of the substrate 1. A heat-conducting plate 3 is attached to the back of the substrate 1. The thermal conductivity of the heat-conducting plate 3 is greater than that of the substrate 1. Several heat dissipation fins 4 are formed vertically extending from the surface of the heat-conducting plate 3 away from the substrate 1. All heat dissipation fins 4 are arranged parallel and equidistantly along the length of the heat-conducting plate 3. A through airflow channel is formed between adjacent heat dissipation fins 4. The extension direction of the airflow channel matches the direction of the internal airflow of the charging pile. A thermally conductive adhesive layer 5 is provided between the heat-conducting plate 3 and the substrate 1. The thermally conductive adhesive layer 5 completely covers the back projection area of ​​the substrate 1. A heat pipe assembly 7 is embedded inside the heat-conducting plate 3 and extends into the heat dissipation fins 4.

[0020] Through the collaborative design of heat-conducting plate 3, heat pipe assembly 7 and heat dissipation fins 4, heat dissipation efficiency is significantly improved. Heat-conducting plate 3 constructs a highly efficient heat conduction substrate, fully covering the back of substrate 1, and quickly dissipating heat from substrate 1. Heat pipe assembly 7 achieves directional heat diffusion, directionally transporting heat from high-temperature areas to heat dissipation fins 4, breaking down local hot spots. Vertically extended equidistant parallel fins form a through airflow channel, matching the airflow duct of the charging pile in the same direction, forcing airflow to directly penetrate the heat dissipation area.

[0021] The heat pipe assembly 7 includes at least two parallel vacuum heat pipes, whose extension direction is perpendicular to the arrangement direction of the heat dissipation fins 4. The heat pipe assembly 7 and the heat dissipation fins 4 form a cross heat conduction network. The vacuum heat pipes extend perpendicular to the fin arrangement direction, allowing heat to diffuse evenly along the width of the fins, eliminating heat dissipation blind spots. The parallel vacuum heat pipes constitute multiple independent heat transfer paths, maintaining system heat dissipation redundancy even when a single heat pipe fails. The heat pipe assembly 7 is arranged in multiple segments of meandering zigzag paths inside the heat conduction plate 3 and the heat dissipation fins 4. These meandering zigzag paths extend the effective heat conduction length of the heat pipes, increasing the contact time between the working fluid and the high-temperature region.

[0022] The heat-conducting plate 3 has an upwardly bent fixed flange 6 at its edge. The fixed flange 6 engages with the side of the substrate 1, and the upwardly bent flange forms a snap-fit ​​connection with the side of the substrate 1, enabling screwless quick assembly.

[0023] The thermally conductive adhesive layer 5 has an embedded metal mesh, which forms a three-dimensional thermally conductive skeleton in the silicone grease layer, establishing a high thermally conductive bridge between the substrate 1 and the thermally conductive plate 3, reducing the interface thermal resistance by more than 50%.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heat-dissipating electronic control board for a charging pile, comprising a substrate for circuit conduction, wherein electronic components are soldered onto the surface of the substrate, characterized in that: A heat-conducting plate is attached to the back of the substrate. The thermal conductivity of the heat-conducting plate is greater than that of the substrate. Several heat dissipation fins are formed on the side of the heat-conducting plate away from the substrate. All heat dissipation fins are arranged parallel to each other at equal intervals along the length of the heat-conducting plate. A through airflow channel is formed between adjacent heat dissipation fins. The extension direction of the airflow channel matches the direction of the internal air duct of the charging pile. A thermally conductive adhesive layer is provided between the heat-conducting plate and the substrate. The thermally conductive adhesive layer completely covers the back projection area of ​​the substrate. A heat pipe assembly is embedded inside the heat-conducting plate and extends into the heat dissipation fins.

2. The charging pile electronic control board with easy heat dissipation according to claim 1, characterized in that: The heat pipe assembly includes at least two parallel vacuum heat pipes, the extension direction of which is perpendicular to the arrangement direction of the heat dissipation fins.

3. The charging pile electronic control board with easy heat dissipation according to claim 1, characterized in that: The heat pipe assembly is arranged in multiple meandering zigzag lines inside the heat-conducting plate and heat dissipation fins.

4. A heat-dissipating electronic control board for a charging pile according to any one of claims 1-3, characterized in that: The top of the heat dissipation fins is provided with a baffle, and the extension direction of the baffle forms an acute angle with the airflow channel.

5. A heat-dissipating electronic control board for a charging pile according to any one of claims 1-3, characterized in that: The heat-conducting plate has an upwardly bent fixed flange at its edge, which engages with the side of the substrate.

6. A heat-dissipating electronic control board for a charging pile according to any one of claims 1-3, characterized in that: The thermally conductive adhesive layer contains an embedded metal mesh.

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