Modularized heat preservation and sound insulation board

Abstract

The utility model discloses a modularized heat preservation and sound insulation board which comprises an installation shell and a main board body assembled in the installation shell, a first assembly protruding board is fixedly installed on the front side of one side of the installation shell, and a second assembly protruding board used in cooperation with the first assembly protruding board is fixedly installed on the rear side of the other side of the installation shell. The utility model relates to the technical field of heat preservation and sound insulation boards. According to the modularized heat preservation and sound insulation board, through cooperation of the first assembling protruding board, the second assembling protruding board and the tightening bolts, the heat preservation and sound insulation boards can be assembled in a concave-convex splicing mode, tightening treatment can be conducted during concave-convex assembling, and the sealing performance of the heat preservation and sound insulation boards during assembling is improved through the concave-convex mode; through cooperation of the heating layer and the heating wire, heating treatment can be conducted on the interior of the heat preservation and sound insulation board in the low-temperature environment, and the situation that the sound insulation performance is weakened due to the fact that the sound insulation material is hardened and the elasticity is reduced in the low-temperature environment can be avoided through heating.

Description

Technical Field

[0001] This utility model relates to the field of thermal insulation and sound insulation board technology, specifically a modular thermal insulation and sound insulation board. Background Technology

[0002] Thermal insulation and sound insulation boards are building materials that combine thermal insulation and sound insulation functions, and are widely used in building walls, roofs, floors, and industrial equipment;

[0003] The "Prefabricated Modular Thermal Insulation and Sound Insulation Board" disclosed in publication number "CN221682137U" includes: a thermal insulation and sound insulation board body, with an upper plate and a lower plate on its upper and lower sides respectively; the upper plate is a planar horizontal straight line structure, and a snap-fit ​​assembly is installed on the upper end of the upper plate; the lower plate is bent, and the lower plate is formed with staggered corrugated protrusions and square protrusions on its surface by stamping; the prefabricated modular thermal insulation and sound insulation board has a snap-fit ​​assembly installed on the upper end of the upper plate.

[0004] Traditional thermal insulation and sound insulation panels do not have the function of tightening and reinforcing the joints during use. When the thermal insulation and sound insulation panels are assembled and used, gaps will appear at the joints, which will reduce the thermal insulation and sound insulation performance of the panels. To address this issue, we have designed a modular thermal insulation and sound insulation panel. Utility Model Content

[0005] To address the shortcomings of existing technologies, this utility model provides a modular thermal insulation and sound insulation board, which solves the problem that thermal insulation and sound insulation boards do not have the function of tightening and reinforcing the joints during use, and gaps will appear at the joints when the thermal insulation and sound insulation boards are assembled and used, which will reduce the thermal insulation and sound insulation performance of the thermal insulation and sound insulation boards.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: a modular thermal insulation and soundproofing board, comprising a mounting shell and a main body assembled inside the mounting shell;

[0007] A first mounting plate is fixedly installed on the front side of one side of the mounting housing, and a second mounting plate that cooperates with the first mounting plate is fixedly installed on the rear side of the other side of the mounting housing. Threaded sleeves are fixedly installed at equal intervals on the front side of the second mounting plate. A fixing through hole corresponding to the second mounting plate is opened on the front side of the first mounting plate. Tightening screws are movably installed inside the fixing through hole.

[0008] A rubber sound-absorbing pad is fixedly installed on the front side inside the motherboard body, and a sound-absorbing felt is fixedly installed on the rear side of the rubber sound-absorbing pad. A heating layer is fixedly installed at the center of the motherboard body, and a heating wire is fixedly installed inside the heating layer.

[0009] Preferably, a limiting insert plate is fixedly installed on the rear side of one side of the mounting housing, and a limiting slot for use with the limiting insert plate is opened on the other side of the second mounting protrusion plate.

[0010] Preferably, a sealing gasket is fixedly installed on the front side of the second mounting plate, and the sealing gasket abuts against the back side of the first mounting plate.

[0011] Preferably, an insulation layer is fixedly installed on the rear side of the heating layer.

[0012] Preferably, a moisture-proof layer is fixedly installed on the rear side of the motherboard body.

[0013] Preferably, an adjusting nut is fixedly installed on the front of the tightening screw, and a threaded groove is provided on the back of the tightening screw.

[0014] This utility model provides a modular thermal insulation and soundproofing board. Compared with the prior art, it has the following advantages:

[0015] (1) The modular thermal insulation and sound insulation board can be assembled by means of concave-convex splicing through the cooperation between the first assembly convex plate, the second assembly convex plate and the tightening bolt. The concave-convex assembly can be tightened to ensure that the concave-convex method increases the sealing of the thermal insulation and sound insulation board during assembly, avoids the situation where the gap at the joint is too large during the assembly of the thermal insulation and sound insulation board, which leads to a decrease in thermal insulation and sound insulation performance, and improves the stability of the thermal insulation and sound insulation board in use.

[0016] (2) By combining the heating layer and the heating wire, the interior of the thermal insulation and sound insulation board can be heated when operating in a low-temperature environment. Heating the interior of the thermal insulation and sound insulation board can prevent the sound insulation material from hardening and losing elasticity in a low-temperature environment, thus reducing the sound insulation performance and increasing the stability of the thermal insulation and sound insulation board during use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0018] Figure 2 This is a schematic diagram of the other side of the structure of this utility model.

[0019] Figure 3 This is a schematic diagram of one side of the structure of this utility model.

[0020] Figure 4 This is a schematic cross-sectional view of the mounting housing structure of this utility model.

[0021] Figure 5 This is a schematic cross-sectional view of the motherboard body of this utility model.

[0022] In the diagram: 1. Mounting housing; 101. First mounting convex plate; 102. Second mounting convex plate; 103. Limiting insert plate; 104. Limiting slot; 105. Fixing through hole; 106. Threaded sleeve; 107. Sealing gasket; 108. Tightening screw; 109. Adjusting nut; 2. Main body; 201. Rubber sound insulation pad; 202. Sound insulation felt; 203. Heating layer; 204. Heating wire; 205. Insulation layer; 206. Moisture-proof layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] Example 1

[0025] Please see Figure 1-3 As shown, this embodiment proposes a modular thermal insulation and soundproofing board, including a mounting shell 1 and a main body 2 assembled inside the mounting shell 1. A first mounting protrusion 101 is fixedly installed on the front side of one side of the mounting shell 1, and a second mounting protrusion 102 that cooperates with the first mounting protrusion 101 is fixedly installed on the rear side of the other side of the mounting shell 1. Threaded sleeves 106 are fixedly installed at equal intervals on the front side of the second mounting protrusion 102. The front side of the first mounting protrusion 101 has a fixing through hole 105 corresponding to the second mounting protrusion 102. Tightening screws 108 are movably installed inside the fixing through hole 105.

[0026] In use, the mounting housing 1 can protect the exterior of the thermal insulation and sound insulation panels. The first mounting plate 101 and the second mounting plate 102 on both sides of the mounting housing 1 allow for assembly of the thermal insulation and sound insulation panels using a tongue-and-groove method. The first mounting plate 101 and the second mounting plate 102 increase the contact area during assembly and mating of the mounting housing 1, improving the sealing performance of the mounting housing 1 during assembly and mating. Multiple sets of threaded sleeves 106 are fixedly installed at equal intervals on the front side of the second mounting plate 102, tightening the through-hole of the screw 108. The fixed through hole 105 is bolted to the threaded sleeve 106. By tightening the fit between the screw 108, the threaded sleeve 106, and the fixed through hole 105, the connection between the first assembly protrusion 101 and the second assembly protrusion 102 can be tightened. Tightening the connection between the first assembly protrusion 101 and the second assembly protrusion 102 improves the sealing performance when the housing 1 is assembled and connected, avoids or reduces the reduction of thermal insulation and sound insulation performance at the connection point during use, and ensures the stability of the thermal insulation and sound insulation board in use.

[0027] Example 2

[0028] Based on Example 1, such as Figure 4-5 As shown, a rubber sound insulation pad 201 is fixedly installed on the front side inside the motherboard body 2, a sound insulation felt 202 is fixedly installed on the rear side of the rubber sound insulation pad 201, a heating layer 203 is fixedly installed at the center inside the motherboard body 2, and a heating wire 204 is fixedly installed inside the heating layer 203.

[0029] In use, the main board 2 is fixedly installed inside the mounting housing 1. A rubber sound insulation pad 201 is fixedly installed on the front side of the main board 2. The high internal loss characteristics of the rubber sound insulation pad 201 can absorb and convert vibration energy, effectively suppressing solid-borne sound transmission. A sound insulation felt 202 is fixedly installed inside the rubber sound insulation pad 201. The sound insulation felt 202 is made of high-density material, and the weight of the high-density material itself blocks the propagation of sound waves. Thus, the rubber sound insulation pad 201 and the sound insulation felt 202 can perform sound insulation work on the thermal insulation and soundproofing board during use. A rubber sound insulation pad 201 and the sound insulation felt 202 are fixedly installed in the center of the main board 2. The heating layer 203, and the heating wire 204 inside the heating layer 203 are connected to an external power source via wires. The heating layer 203 and the heating wire 204 can heat the thermal insulation and sound insulation board when used in a low-temperature environment. Heating can prevent the rubber sound insulation pad 201 from gradually hardening in a low-temperature environment, resulting in a decrease in damping performance and a weakening of vibration reduction effect, as well as the sound insulation felt 202 from hardening asphalt in a low-temperature environment, resulting in poor flexibility and sealing, and an increased probability of sound leakage due to gaps. This ensures the stability of the thermal insulation and sound insulation board when used in a low-temperature environment.

[0030] like Figure 1-3 As shown, a limiting insert plate 103 is fixedly installed on the rear side of one side of the mounting housing 1, and a limiting slot 104 is opened on the other side of the second mounting protrusion 102 to cooperate with the limiting insert plate 103.

[0031] When in use, when the housing 1 is assembled, the limiting plate 103 is inserted into the limiting slot 104. The limiting plate 103 and the limiting slot 104 can reinforce the connection when the housing 1 is assembled, ensuring the stability of the thermal insulation and sound insulation board during assembly and preventing the thermal insulation and sound insulation board from being completely deformed during use.

[0032] like Figure 2 As shown, a sealing gasket 107 is fixedly installed on the front side of the second mounting plate 102, and the sealing gasket 107 abuts against the back side of the first mounting plate 101.

[0033] In use, the sealing gasket 107 can flexibly connect the first assembly protrusion 101 and the second assembly protrusion 102. The sealing gasket 107 increases the sealing performance when the first assembly protrusion 101 and the second assembly protrusion 102 are connected, and improves the sealing performance when the first assembly protrusion 101 and the second assembly protrusion 102 are connected to the thermal insulation and sound insulation board.

[0034] like Figure 4-5 As shown, an insulation layer 205 is fixedly installed on the rear side of the heating layer 203.

[0035] When in use, the insulation layer 205 is made of polystyrene foam board. The insulation layer 205 can be used to keep the insulation and sound insulation board warm during the operation, which increases the functionality of the insulation and sound insulation board and improves its practicality.

[0036] like Figure 4-5 As shown, a moisture-proof layer 206 is fixedly installed on the rear side inside the motherboard body 2.

[0037] When in use, the moisture-proof layer 206 is made of PVC moisture-proof board. The moisture-proof layer 206 can be used to prevent moisture from entering the insulation and sound insulation board during operation, thus preventing external moisture from entering the insulation and sound insulation board and causing corrosion and damage, and ensuring the stability of the insulation and sound insulation board during long-term use.

[0038] like Figure 2-3 As shown, an adjusting nut 109 is fixedly installed on the front of the tightening screw 108, and a threaded groove is provided on the back of the tightening screw 108.

[0039] In use, the adjusting nut 109 allows workers to easily rotate the tightening screw 108 using the appropriate tools, thus facilitating the operation of the tightening screw 108 and increasing the speed of the tightening operation at the joint of the thermal insulation and sound insulation board. The threaded groove facilitates the threaded connection between the tightening screw 108 and the threaded sleeve 106, thereby enabling the tightening and loosening of the tightening screw 108.

[0040] Working principle: The mounting shell 1 protects the exterior of the thermal insulation and soundproofing board. The first mounting protrusion 101 and the second mounting protrusion 102 increase the contact area between the mounting shells 1 and improve the sealing performance during the connection. The tightening screw 108 passes through the fixing through hole 105 and is threaded into the threaded sleeve 106, thereby tightening the first mounting protrusion 101 and the second mounting protrusion 102. Tightening the first mounting protrusion 101 and the second mounting protrusion 102 reduces the gap between them, preventing excessive gaps at the joint of the thermal insulation and soundproofing board from affecting the sound insulation performance of the insulation box. The rubber sound insulation pad 201 and the sound insulation felt 202 can perform sound insulation operations. Furthermore, the heating layer 203 and the heating wire 204 can heat the interior of the thermal insulation and soundproofing board when used in low-temperature environments. Heating prevents the sound insulation performance of the rubber sound insulation pad 201 and the sound insulation felt 202 from decreasing in low-temperature environments, ensuring the stability of the thermal insulation and soundproofing board during operation in low-temperature environments.

[0041] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A modular thermal insulation and soundproofing board, characterized in that: Includes the mounting housing and the motherboard body assembled inside the mounting housing; A first mounting plate is fixedly installed on the front side of one side of the mounting housing, and a second mounting plate that cooperates with the first mounting plate is fixedly installed on the rear side of the other side of the mounting housing. Threaded sleeves are fixedly installed at equal intervals on the front side of the second mounting plate. A fixing through hole corresponding to the second mounting plate is opened on the front side of the first mounting plate. Tightening screws are movably installed inside the fixing through hole. A rubber sound-absorbing pad is fixedly installed on the front side inside the motherboard body, and a sound-absorbing felt is fixedly installed on the rear side of the rubber sound-absorbing pad. A heating layer is fixedly installed at the center of the motherboard body, and a heating wire is fixedly installed inside the heating layer.

2. The modular thermal insulation and soundproofing board according to claim 1, characterized in that: A limiting insert plate is fixedly installed on the rear side of one side of the mounting housing, and a limiting slot is opened on the other side of the second mounting protrusion plate to cooperate with the limiting insert plate.

3. The modular thermal insulation and soundproofing board according to claim 1, characterized in that: A sealing gasket is fixedly installed on the front side of the second mounting plate, and the sealing gasket abuts against the back side of the first mounting plate.

4. A modular thermal insulation and soundproofing board according to claim 1, characterized in that: An insulation layer is fixedly installed on the rear side of the heating layer.

5. A modular thermal insulation and soundproofing board according to claim 1, characterized in that: A moisture-proof layer is fixedly installed on the rear side of the motherboard body.

6. A modular thermal insulation and soundproofing board according to claim 1, characterized in that: An adjusting nut is fixedly installed on the front of the tightening screw, and a threaded groove is provided on the back of the tightening screw.

Images