Printed circuit board detection equipment

Abstract

The utility model discloses printed circuit board detection equipment, which comprises a detection body, an image capturing assembly, a laser distance measuring sensor and a processing assembly, the detection body comprises a working plate and an adjusting module. The workboard carries at least one printed circuit board. The adjusting module adjusts the image capturing assembly and the laser distance measuring sensor to be located above the at least one printed circuit board. The processing assembly obtains a printed circuit board image through the image capturing assembly and obtains the number of pixels of the printed circuit board according to the outline of the printed circuit board. The processing assembly calculates the time of the laser distance measuring sensor from the emission of the emission light to the reception of the reflection light so as to obtain a measured thickness. When the number of pixels of the printed circuit board is larger than a threshold value and the measured thickness is larger than a preset thickness, the processing assembly sends out lamination information to ensure that the lamination phenomenon of the printed circuit board really occurs, and then the detection accuracy of the printed circuit board is improved.

Description

Technical Field

[0001] This utility model relates to a testing device, and more particularly to a printed circuit board testing device. Background Technology

[0002] In the production and processing of printed circuit boards (PCBs), existing testing equipment requires the use of PCB placement machines to place PCBs on the production line or other workstations. During operation, due to working errors, the PCB placement machine may output two PCBs stacked together, which will affect subsequent normal production. Therefore, PCB stacking testing equipment is often set downstream of the PCB placement machine.

[0003] Therefore, the applicant believes that the above-mentioned defects can be improved. So, the applicant has devoted himself to research and applied scientific principles, and finally proposed a utility model with a reasonable design that effectively improves the above-mentioned defects. Utility Model Content

[0004] The present invention provides a printed circuit board testing device that can effectively improve the defects that may be produced by existing printed circuit board testing devices.

[0005] One embodiment of this utility model discloses a printed circuit board (PCB) inspection device, comprising: an inspection body including: a working plate for supporting at least one PCB; and an adjustment module spaced apart from the working plate, wherein the adjustment module has a mounting assembly spaced apart above the working plate along a height direction; an image acquisition component disposed on the mounting assembly; wherein the image acquisition component can face at least one PCB to acquire an image of the PCB; and a laser rangefinder sensor disposed on the mounting assembly, and the laser rangefinder sensor and the image acquisition component spaced apart from each other; wherein the laser rangefinder sensor faces at least one PCB to acquire an image of the PCB. The system emits an emitted light beam and receives a reflected light beam; and a processing component is disposed within the detection body, electrically coupled to an image acquisition component and a laser rangefinder sensor; wherein the processing component acquires an image of a printed circuit board through the image acquisition component, and calculates the number of pixels in the image of the printed circuit board based on the outline of the printed circuit board to obtain a number of pixels of the printed circuit board; wherein the processing component calculates the time between the laser rangefinder sensor emitting the emitted light beam and receiving the reflected light beam to determine a measured thickness; wherein when the processing component compares the number of pixels of the printed circuit board to be greater than a threshold and compares the measured thickness to be greater than a preset thickness, the processing component issues a stacking information to confirm that a stacking has occurred.

[0006] Optionally, the processing component segments the printed circuit board image based on the outline of the printed circuit board to generate a printed circuit board outline image, and the processing component calculates the pixels of the printed circuit board outline image to obtain the number of pixels of the printed circuit board.

[0007] Optionally, the processing component calculates a sensing distance based on the time difference between the emission time of the emitted light and the reception time of the reflected light, and calculates the measured thickness based on the distance between the laser rangefinder and the working board and the sensing distance.

[0008] Optionally, the adjustment module includes a horizontal adjustment component and a vertical adjustment component. The horizontal adjustment component is vertically disposed on the vertical adjustment component. The horizontal adjustment component has two ends located on opposite sides. One end of the horizontal adjustment component is provided with a mounting component, and the other end of the horizontal adjustment component is connected to the vertical adjustment component. The vertical adjustment component can drive the horizontal adjustment component to move along the height direction to determine the distance between the laser rangefinder and the working plate.

[0009] Optionally, the lateral adjustment component can move the mounting component in a lateral direction perpendicular to the height direction so that the mounting component can be positioned above the work plate.

[0010] Optionally, the longitudinal adjustment assembly includes: a fixed block; a guide rod fixedly connected to the fixed block, the guide rod having a threaded groove arranged along the height direction; a threaded rod having two ends located on opposite sides, one end of the threaded rod engaging the threaded groove; a sliding sleeve having a through hole; wherein the other end of the threaded rod rotatably passes through the through hole; a hollow sliding rod, the inner wall of the sliding rod being fixedly connected to the sliding sleeve, and the sliding rod slidably sleeved on the guide rod; a rotating rod having an external thread, the rotating rod rotatably passing through the sliding rod, and spaced apart at the other end of the threaded rod; a driving bevel gear engaging the external thread of the rotating rod; and a driven bevel gear engaging the driving bevel gear and the threaded rod; wherein, when the rotating rod rotates and drives the driving bevel gear to rotate, the driven bevel gear drives the threaded rod to rotate, so that the sliding sleeve and the sliding rod can move up and down along the height direction.

[0011] Optionally, the printed circuit board inspection equipment further includes a color mark sensor, which is disposed on the mounting assembly and spaced apart from the imaging assembly and the laser rangefinder sensor; wherein the color mark sensor senses a trigger point on the working board to drive the imaging assembly and the laser rangefinder sensor to operate.

[0012] Optionally, the color mark sensor senses the trigger point on the work plate to drive the image acquisition component to operate synchronously with the laser rangefinder.

[0013] Optionally, when there are multiple printed circuit boards, each printed circuit board has the same size.

[0014] In summary, the printed circuit board inspection device disclosed in this utility model embodiment ensures that the printed circuit board does indeed have a stacking phenomenon by "when the processing component compares the number of pixels of the printed circuit board to be greater than a threshold and compares the measured thickness to be greater than a preset thickness, the processing component sends stacking information to confirm that stacking has occurred", thereby increasing the detection accuracy of the printed circuit board.

[0015] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, these descriptions and drawings are only used to illustrate this utility model and are not intended to limit the scope of protection of this utility model in any way. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the printed circuit board testing equipment according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic flowchart of the printed circuit board testing method according to an embodiment of the present invention.

[0018] Figure 3 This is a cross-sectional schematic diagram of the longitudinal adjustment component according to an embodiment of the present invention.

[0019] Figure 4 This is a three-dimensional structural diagram of the installation component according to an embodiment of the present utility model.

[0020] Figure 5 This is a circuit block diagram of a printed circuit board testing device according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram illustrating how the processing component of this embodiment segments a printed circuit board image and calculates that the number of pixels on the printed circuit board does not exceed a threshold.

[0022] Figure 7 This is a schematic diagram illustrating how the processing component of this embodiment segments a printed circuit board image and calculates if the number of pixels on the printed circuit board exceeds a threshold.

[0023] Figure 8 This is a schematic diagram of a printed circuit board inspection device according to an embodiment of the present invention, used to inspect the thickness of at least one printed circuit board. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of the "printed circuit board testing equipment" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0025] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0026] Please see Figures 1 to 8 The illustration shows an embodiment of the present invention, which discloses a printed circuit board (PCB) inspection method S100 and a PCB inspection device 100. The PCB inspection method S100 is preferably implemented using the PCB inspection device 100, but the present invention is not limited thereto. In this embodiment, the PCB inspection method S100 includes (or sequentially implements) a preparation step S101, a startup step S103, an image acquisition step S105, a laser ranging step S107, an image detection step S109, and a thickness detection step S110.

[0027] To facilitate understanding of this embodiment, the contents of the preparation step S101, the startup step S103, the image acquisition step S105, the laser ranging step S107, the image detection step S109, and the thickness detection step S110 will be described separately below, and the structure of the printed circuit board inspection device 100 will be introduced as appropriate. However, this utility model is not limited thereto. For example, in other embodiments of this utility model not shown, any step included in the printed circuit board inspection method S100 and the structure of each component of the printed circuit board inspection device 100 can be adjusted, changed, or omitted according to design requirements (for example, the startup step S103 can be omitted or replaced by other steps); or, the printed circuit board inspection method S100 can be implemented with a device different from the printed circuit board inspection device 100.

[0028] The preparation step S101: as follows: Figure 1 and Figure 2 As shown, the printed circuit board inspection device 100 is provided, which in this embodiment includes a detection body 1, an image acquisition component 2 spaced apart from the detection body 1, a laser rangefinder sensor 3 spaced apart from the image acquisition component 2, and a processing component 4 electrically coupled to the image acquisition component 2 and the laser rangefinder sensor 3.

[0029] The detection body 1 includes a working board 11 and an adjustment module 12 spaced apart from the working board 11. The working board 11 is used to support at least one printed circuit board (PCB). It should be noted that the working board 11 is in principle designed to support one PCB; however, sometimes due to operational errors during the operation of the PCB placement machine, two PCBs may be stacked together on the working board 11. Therefore, the PCB detection equipment 100 and the PCB detection method S100 of this embodiment can detect stacking phenomena where the number of at least one PCB on the working board 11 exceeds two.

[0030] The adjustment module 12 includes a mounting component 121. The mounting components 121 are spaced apart above the work plate 11 along a height direction H. That is, the adjustment module 12 can adjust the position of the mounting components 121 so that the mounting components 121 are positioned above the work plate 11. Specifically, the adjustment module 12 includes a horizontal adjustment component 122 and a vertical adjustment component 123 connected to the horizontal adjustment component 122. The horizontal adjustment component 122 is perpendicularly disposed to the vertical adjustment component 123. The horizontal adjustment component 122 has two ends located on opposite sides. One end of the horizontal adjustment component 122 is provided with the mounting component 121, and the other end of the horizontal adjustment component 122 is connected to the vertical adjustment component 123. The horizontal adjustment component 122 can drive the mounting components 121 to move along a horizontal direction C perpendicular to the height direction H, so that the mounting components 121 are positioned above the work plate 11.

[0031] The longitudinal adjustment component 123 has two ends located on opposite sides. One end of the longitudinal adjustment component 123 is fixed to the platform of the detection body 1, and the other end of the longitudinal adjustment component 123 is fixed to the other end of the lateral adjustment component 122. The longitudinal adjustment component 123 can drive the lateral adjustment component 122 to move along the height direction H to determine the distance between the mounting component 121 (i.e., the image acquisition component 2 and the laser rangefinder 3) and the working plate 11.

[0032] In detail, such as Figure 3 As shown, it should be noted that the internal adjustment structures of the longitudinal adjustment component 123 and the lateral adjustment component 122 are identical. The following description of this embodiment mainly focuses on the internal adjustment structure of the longitudinal adjustment component 123, while the internal adjustment structure of the lateral adjustment component 122 will not be described in detail here.

[0033] The longitudinal adjustment assembly 123 includes a fixed block 1231, a guide rod 1232 fixedly connected to the fixed block 1231, a threaded rod 1233 connected to the guide rod 1232, a sliding sleeve 1234 connected to the threaded rod 1233, a sliding rod 1235 connected to the sliding sleeve, a rotating rod 1236 rotatably passing through the sliding rod 1235, a driving bevel gear 1237 connected to the rotating rod 1236, and a driven bevel gear 1238 connected to the driving bevel gear 1237.

[0034] The guide rod 1232 is fixedly connected to the fixing block 1231, and the guide rod 1232 has a threaded groove (not shown) provided along the height direction H. The threaded rod 1233 has two ends located on opposite sides, and one end of the threaded rod 1233 engages with the threaded groove. When the threaded rod 1233 rotates, it can move away from the guide rod 1232 or move closer to the guide rod 1232.

[0035] The sliding sleeve 1234 has a through hole TH. The other end of the threaded rod 1233 is rotatably passed through the through hole TH so that the sliding sleeve 1234 does not rotate with the threaded rod 1233. The sliding rod 1235 is hollow, and the inner wall of the sliding rod 1235 is fixedly connected to the sliding sleeve 1234. The sliding rod 1235 is slidably sleeved on the guide rod 1232. The rotating rod 1236 has an external thread ET.

[0036] The rotating rod 1236 is rotatably mounted on the sliding rod 1235, and the other end of the threaded rod 1233 is spaced apart from the rotating rod 1236. In this embodiment, the rotating rod 1236 has two ends located on opposite sides, one end of the rotating rod 1236 passes through one side of the sliding rod 1235, and the other end of the rotating rod 1236 is connected to a nut 1239. Rotation of the nut 1239 can drive the rotating rod 1236 to rotate.

[0037] The driving bevel gear 1237 engages with the external thread ET of the rotating rod 1236. The driven bevel gear 1238 engages with the driving bevel gear 1237 and the threaded rod 1233. In this embodiment, the driven bevel gear 1238 is vertically arranged to the driving bevel gear 1237, and the driven bevel gear 1238 is vertically arranged to the threaded rod 1233, while the threaded rod 1233 is horizontally arranged to the driving bevel gear 1237.

[0038] As described above, when the rotating rod 1236 is rotated and drives the driving bevel gear 1237 to rotate, the driven bevel gear 1238 is driven to rotate the threaded rod 1233, so that the sliding sleeve 1234 and the sliding rod 1235 can move up and down along the height direction H, thereby achieving the purpose of longitudinal adjustment.

[0039] like Figure 1 , Figure 4 and Figure 5 As shown, the image-capturing component 2 is mounted on the mounting component 121. The image-capturing component 2 can face at least one of the printed circuit boards (PCBs) to acquire an image of the PCB. The laser rangefinder sensor 3 is mounted on the mounting component 121, and the laser rangefinder sensor 3 and the image-capturing component 2 are spaced apart from each other. The laser rangefinder sensor 3 faces at least one of the PCBs to emit a emitted light and receive a reflected light.

[0040] The processing component 4 is disposed within the detection body 1, and is electrically coupled to the image acquisition component 2 and the laser rangefinder 3. The processing component 4 can control the operation of the image acquisition component 2 and the laser rangefinder 3. That is, the processing component 4 can control the image acquisition component 2 to acquire images. The processing component 4 can control the laser rangefinder 3 to emit the emitted light and receive the reflected light.

[0041] In addition, such as Figure 4 As shown, the printed circuit board inspection device 100 further includes a color mark sensor 5. The color mark sensor 5 is disposed on the mounting assembly 121, and the image acquisition assembly 2 and the laser rangefinder sensor 3 are spaced apart from each other by the color mark sensor 5. The color mark sensor 5 senses a trigger point (not shown) on the work board 11 to drive the image acquisition assembly 2 and the laser rangefinder sensor 3 to operate.

[0042] The above is a description of the preparation step S101 (or the printed circuit board inspection device 100) in this embodiment. The printed circuit board inspection method S100 will be used in conjunction with the printed circuit board inspection device 100 to implement the startup step S103, the image acquisition step S105, the laser ranging step S107, the image detection step S109, and the thickness detection step S110. However, in other embodiments not shown in this utility model, the startup step S103, the image acquisition step S105, the laser ranging step S107, the image detection step S109, and the thickness detection step S110 can also be implemented by devices different from the printed circuit board inspection device 100, and this utility model is not limited thereto.

[0043] The startup step S103: The color mark sensor 5 is connected to the trigger point of the working board 11 to drive the image acquisition component 2 and the laser rangefinder 3 to operate.

[0044] In the image acquisition step S105: when the work board 11 carrying at least one of the printed circuit boards (PCBs) is located below the mounting assembly 121, the image acquisition assembly 2 acquires an image of the printed circuit board PCB. In practice, the work board 11 is located on the production line. When the work board 11 carrying at least one of the printed circuit boards (PCBs) is moved by the production line to a position below the image acquisition assembly 2, the image acquisition assembly 2 acquires an image of the printed circuit board PCB, generating a printed circuit board image.

[0045] In the laser ranging step S107: when the working board 11 carrying at least one of the printed circuit boards (PCBs) is located below the mounting assembly 121, the laser ranging sensor 3 emits the emitted light and receives the reflected light to at least one of the printed circuit boards (PCBs).

[0046] In the image detection step S109: the processing component 4 acquires the printed circuit board image through the image acquisition component 2, and the processing component 4 calculates the number of pixels in the printed circuit board image based on the outline of the printed circuit board to obtain a number of pixels in the printed circuit board. The processing component 4 compares whether the number of pixels in the printed circuit board is greater than a threshold to preliminarily detect whether there is a stacking phenomenon on the printed circuit board PCB on the work board 11.

[0047] In this embodiment, the processing component 4 segments the printed circuit board image based on the outline of the printed circuit board (PCB) to generate a PCB outline image. The processing component 4 calculates the pixels of the PCB outline image to obtain the number of pixels of the PCB. Figure 6As shown, the processing component 4 compares the number of pixels on the printed circuit board to approximately equal the threshold. That is, if the number of pixels on the printed circuit board is approximately equal to the area of ​​one printed circuit board, then the initial detection indicates that there is no stacking phenomenon on the printed circuit board PCB on the working board 11.

[0048] Conversely, such as Figure 7 As shown, the processing component 4 compares the number of pixels on the printed circuit board (PCB) to a threshold value. That is, if the number of pixels on the PCB is greater than the area of ​​one PCB, a preliminary detection indicates that the PCB on the work board 11 has a stacking phenomenon.

[0049] In the thickness detection step S110, the processing component 4 calculates the time between the laser rangefinder 3 emitting the emitted light and receiving the reflected light to determine a measured thickness. The processing component 4 compares whether the measured thickness is greater than a preset thickness to determine whether at least one printed circuit board (PCB) on the work board 11 has experienced a stacking phenomenon.

[0050] It should be noted that the processing component 4 calculates a sensing distance d based on the time difference between the emission time of the emitted light and the reception time of the reflected light (e.g., ...). Figure 8 As shown), the processing component 4 calculates the measured thickness based on the distance between the laser rangefinder 3 and the working plate 11 and the sensing distance.

[0051] In detail, such as Figure 8 As shown, the distance between the laser rangefinder 3 and the working board 11 is a working height h, the preset thickness Δh is the thickness of a single printed circuit board (PCB), and the sensing distance d is the distance between the laser rangefinder 3 and the PCB calculated by the processing component 4 using the laser rangefinder 3. When the processing component 4 determines that the working height h minus the sensing distance d is greater than the preset thickness Δh, it determines that at least one PCB on the working board 11 has experienced a stacking phenomenon. The determination formula is as follows:

[0052] ----------------(1)

[0053] It should be noted that the processing component 4 calculates the sensing distance using the laser rangefinder 3 as follows: The laser rangefinder 3 emits the emitted light, and the frequency of the emitted light... It changes linearly with time t. Its frequency modulation law is shown in the following formula (2):

[0054] ---------(2)

[0055] in, is the initial frequency; k is the frequency modulation rate (i.e., the rate of frequency change).

[0056] When the emitted light beam encounters the printed circuit board (PCB), part of it is reflected to generate the reflected light beam, which is received by the laser rangefinder 3. Because laser propagation requires time (i.e., round-trip delay), the frequency of the reflected light beam is different from the frequency of the emitted light beam. Inside the laser rangefinder 3, the reflected light beam mixes (i.e., superimposes) with the reference light. This mixing generates a low-frequency signal with a frequency of ∆F.

[0057] --------------(3)

[0058] in, For the time it takes for light to travel, The formula is shown below:

[0059] ---------------------(4)

[0060] Where d is the distance between the printed circuit board (PCB) and the laser rangefinder 3; and c is the speed of light.

[0061] Based on the above, the distance between the printed circuit board (PCB) and the laser rangefinder 3 can be determined using formulas (3) and (4), as shown in the following formula:

[0062] ------------------(5)

[0063] When the processing component 4 compares the number of pixels on the printed circuit board to be greater than the threshold and compares the measured thickness to be greater than the preset thickness Δh, the processing component 4 issues a stacking information to confirm that a stacking has occurred.

[0064] It should be noted that this utility model is not limited to the printed circuit board inspection method S100 performing the image detection step S109 before performing the thickness detection step S110. For example, the image detection step S109 and the thickness detection step S110 can be performed simultaneously, or the processing component thickness detection step S110 can be performed before performing the image detection step.

[0065] [Technical Effects of the Embodiments of this Utility Model]

[0066] In summary, the printed circuit board inspection device disclosed in this utility model embodiment ensures that the printed circuit board does indeed have a stacking phenomenon by "when the processing component compares the number of pixels of the printed circuit board to be greater than a threshold and compares the measured thickness to be greater than a preset thickness, the processing component sends stacking information to confirm that stacking has occurred", thereby increasing the detection accuracy of the printed circuit board.

[0067] The above-disclosed content is only a preferred and feasible embodiment of the present utility model, and is not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made using the contents of the present utility model specification and drawings are included in the patent scope of the present utility model.

Claims

1. A printed circuit board testing device, characterized in that, The printed circuit board testing equipment includes: One detection entity, including: A working board for carrying at least one printed circuit board; and An adjustment module is spaced apart on the work plate, wherein the adjustment module has a mounting assembly, which is spaced apart above the work plate along a height direction; An image-capturing component is disposed on the mounting component; wherein the image-capturing component is capable of facing at least one of the printed circuit boards to acquire an image of the printed circuit board; A laser rangefinder sensor is disposed on the mounting assembly, and the laser rangefinder sensor and the imaging assembly are spaced apart from each other; wherein the laser rangefinder sensor faces at least one of the printed circuit boards to emit an emitted light and receive a reflected light; and A processing component is disposed within the detection body, and the processing component is electrically coupled to the image acquisition component and the laser rangefinder. The processing component acquires a printed circuit board image through the image acquisition component and calculates the number of pixels in the printed circuit board image based on the outline of the printed circuit board to obtain a number of pixels in the printed circuit board. The processing component calculates the time between the laser rangefinder emitting the emitted light and receiving the reflected light to determine a measured thickness. When the processing component compares the number of pixels in the printed circuit board to be greater than a threshold and the measured thickness to be greater than a preset thickness, the processing component issues a stacking information to confirm that stacking has occurred.

2. The printed circuit board testing equipment according to claim 1, characterized in that, The processing component segments the printed circuit board image based on the outline of the printed circuit board to generate a printed circuit board outline image, and the processing component calculates the pixels of the printed circuit board outline image to obtain the number of pixels of the printed circuit board.

3. The printed circuit board testing equipment according to claim 1, characterized in that, The processing component calculates a sensing distance based on the time difference between the emission time of the emitted light and the reception time of the reflected light, and calculates the measured thickness based on the distance between the laser rangefinder and the working board and the sensing distance.

4. The printed circuit board testing equipment according to claim 1, characterized in that, The adjustment module includes a horizontal adjustment component and a vertical adjustment component. The horizontal adjustment component is vertically disposed on the vertical adjustment component. The horizontal adjustment component has two ends located on opposite sides. One end of the horizontal adjustment component is provided with the mounting component, and the other end of the horizontal adjustment component is connected to the vertical adjustment component. The vertical adjustment component can drive the horizontal adjustment component to move along the height direction to determine the distance between the laser rangefinder and the working plate.

5. The printed circuit board testing equipment according to claim 4, characterized in that, The lateral adjustment component can move the mounting component in a lateral direction perpendicular to the height direction, so that the mounting component can be positioned above the work plate.

6. The printed circuit board testing equipment according to claim 4, characterized in that, The longitudinal adjustment component includes: A fixed block; A guide rod is fixedly connected to the fixing block, and the guide rod has a threaded groove arranged along the height direction; A threaded rod having two ends located on opposite sides, one end of the threaded rod engaging the threaded groove; A sliding sleeve having a through hole; wherein the other end of the threaded rod rotatably passes through the through hole; A sliding rod, which is hollow, has its inner wall fixedly connected to the sliding sleeve, and the sliding rod is slidably sleeved on the guide rod; A rotating rod having an external thread, the rotating rod being rotatably passed through the sliding rod and spaced apart at the other end of the threaded rod; A driving bevel gear meshes with the external thread of the rotating rod; and A driven bevel gear meshes with the driving bevel gear and the threaded rod; When the rotating rod rotates and drives the driving bevel gear to rotate, the driven bevel gear is driven to rotate the threaded rod, so that the sliding sleeve and the sliding rod can move up and down along the height direction.

7. The printed circuit board testing equipment according to claim 1, characterized in that, The printed circuit board inspection equipment further includes a color mark sensor, which is disposed on the mounting assembly and spaced apart from the image acquisition assembly and the laser rangefinder sensor; wherein the color mark sensor senses a trigger point on the working board to drive the image acquisition assembly and the laser rangefinder sensor to operate.

8. The printed circuit board testing equipment according to claim 7, characterized in that, The color mark sensor senses the trigger point on the working board to drive the image acquisition component to operate synchronously with the laser rangefinder.

9. The printed circuit board testing equipment according to claim 1, characterized in that, When there are multiple printed circuit boards, each printed circuit board is the same size.

Images