Device for sampling pollutants in wafer box

Abstract

The utility model discloses a wafer cassette internal pollutant sampling device which comprises a fixed seat, a limiting barrel is fixedly mounted on the surface of the fixed seat, a main driving cylinder is fixedly mounted in the limiting barrel, a lifting table is fixedly mounted at the end of an output shaft of the main driving cylinder, and a mounting seat is fixedly mounted at the top of the lifting table. A sampling assembly A, a sampling assembly B, a sampling assembly C, a sampling assembly D and a sampling assembly E are fixedly arranged on the side wall of the mounting seat, a secondary driving cylinder is arranged on the sampling assembly E, a sampling nozzle is fixedly connected to the end part of an output shaft of the secondary driving cylinder, and a stress seat is arranged on the circumferential outer wall of the sampling nozzle. According to the sampling device for the pollutants in the wafer box, the universality of samples sampled by the sampling nozzle is improved; therefore, impurity samples at different positions of the surface of the wafer can be collected more comprehensively, and the distribution condition and the average content of impurities on the surface of the whole wafer can be reflected more accurately. The wafer quality can be evaluated more accurately.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, specifically to a device for sampling contaminants inside a wafer cassette. Background Technology

[0002] Currently, impurity elements are a significant factor affecting the yield rate of semiconductor chips during the manufacturing process. Even trace amounts of impurity elements can reduce the yield rate. For example, alkali metal and alkaline earth metal impurities can lead to a decrease in chip breakdown voltage; transition metal and heavy metal impurities can shorten chip lifespan or increase dark current during chip operation. The content of impurity elements has a significant impact on the performance and lifespan of semiconductor chips. Therefore, the extraction and measurement of impurity elements are of great importance to the production of semiconductor chips.

[0003] Regarding patents for wafer sampling devices, a search revealed that publication number CN112304703A discloses a wafer surface impurity sampling device. The document proposes that a gas chamber is formed between the external nozzle holder 211 and the internal scanning nozzle 212 to contain the scanning liquid within the sampling nozzle 210, specifically within this gas chamber. The sampling nozzle is configured as an elongated strip extending in one direction, increasing the scanning range of the nozzle along this first direction. This allows the sampling nozzle to scan a larger wafer area when the rotating stage rotates the wafer once, thereby improving the scanning rate and efficiency of the wafer surface impurity sampling device. This significantly enhances the sampling efficiency per wafer.

[0004] While the aforementioned device can sample impurities from wafers, in actual use, the sampling nozzle has a limited sample range, the sample taken is of a single type, and the distribution of impurities on the wafer surface may not be uniform. If the sampling nozzle can only collect samples from a limited area, it is difficult to accurately grasp the distribution and true content of impurities on the entire wafer surface; it may miss some impurity information in key areas, leading to deviations in the assessment of wafer quality. Utility Model Content

[0005] The purpose of this invention is to provide a device for sampling contaminants inside a wafer cassette, in order to address the deficiencies mentioned in the background art.

[0006] To achieve the above objectives, a sampler for contaminants inside a wafer cassette is provided, comprising a fixed base, a limiting cylinder fixedly mounted on the surface of the fixed base, a main drive cylinder fixedly mounted inside the limiting cylinder, a lifting platform fixedly mounted on the output shaft end of the main drive cylinder, a mounting base fixedly mounted on the top of the lifting platform, and sampling components A, B, C, D, and E respectively fixedly mounted on the side wall of the mounting base, a secondary drive cylinder being provided on sampling component E, a sampling nozzle being fixedly connected to the output shaft end of the secondary drive cylinder, and a force-bearing seat being provided on the outer circumference of the sampling nozzle.

[0007] Preferably, the dimensions of the limiting cylinder and the lifting platform are matched, the bottom of the lifting platform is inserted into the inside of the limiting cylinder, and the cross-sections of the limiting cylinder and the lifting platform are both rectangular.

[0008] Preferably, the fixing seat at the bottom of the limiting cylinder is circular, and multiple sets of perforations are evenly opened on the fixing seat. The lifting platform inside the limiting cylinder is vertically lifted and lowered by the main drive cylinder.

[0009] Preferably, the mounting base at the top of the lifting platform is cylindrical, and five sets of connecting seats are evenly fixed on the outer circumference of the mounting base; each of the five sets of connecting seats is equipped with a secondary drive cylinder.

[0010] Preferably, the sampling components A, B, C, D, and E are symmetrical about the central axis of the mounting base, and they rise and fall synchronously.

[0011] Preferably, the sampling component E includes a connecting seat, a secondary drive cylinder, a force-bearing seat, a sampling nozzle, and a negative pressure tube; the sampling nozzle is equipped with a negative pressure tube at its end, and the sampling nozzle has a horizontal and transverse movement structure.

[0012] Compared with the prior art, the beneficial effects of this utility model are: the main drive cylinder can drive sampling components A, B, C, D, and E to move vertically up and down, thereby enabling the sampling nozzle to sample samples at different heights; simultaneously, under the action of the secondary drive cylinder, the sampling nozzle samples samples at lateral positions; improving the sampling range of the sampling nozzle; avoiding being limited to a fixed point or area, thus enabling more comprehensive collection of impurity samples from different positions on the wafer surface, more accurately reflecting the distribution and average content of impurities on the entire wafer surface; and enabling more accurate assessment of wafer quality. Attached Figure Description

[0013] Figure 1 This is a front view schematic diagram of the structure of this utility model;

[0014] Figure 2 for Figure 1 Top view;

[0015] Figure 3 for Figure 1 Side view;

[0016] Figure 4 for Figure 1 A bottom view;

[0017] Figure 5 for Figure 1 Rear view.

[0018] The following are the labels in the diagram: 1. Fixed base; 2. Limiting cylinder; 21. Main drive cylinder; 3. Lifting platform; 4. Mounting base; 5. Sampling component A; 51. Sampling component B; 52. Sampling component C; 53. Sampling component D; 54. Sampling component E; 540. Connecting base; 541. Secondary drive cylinder; 542. Force-bearing base; 543. Sampling nozzle; 544. Negative pressure pipe. Detailed Implementation

[0019] Please see Figure 1-5 This utility model provides a sampling device for contaminants inside a wafer cassette, including a fixed base 1, a limiting cylinder 2 fixedly installed on the surface of the fixed base 1, a main drive cylinder 21 fixedly installed inside the limiting cylinder 2, a lifting platform 3 fixedly installed at the output shaft end of the main drive cylinder 21, a mounting base 4 fixedly installed on the top of the lifting platform 3, and sampling components A5, B51, C52, D53 and E54 respectively fixedly installed on the side wall of the mounting base 4. A secondary drive cylinder 541 is provided on the sampling component E54, and a sampling nozzle 543 is fixedly connected to the output shaft end of the secondary drive cylinder 541. A force-bearing seat 542 is provided on the outer circumference of the sampling nozzle 543.

[0020] Working Principle: In actual use, the device is first installed at the sampling position. Then, the external switch of the main drive cylinder 21 is activated. The main drive cylinder 21 drives sampling components A5, B51, C52, D53, and E54 to move vertically up and down, thereby enabling the sampling nozzle 543 to sample samples at different heights. Simultaneously, under the action of the secondary drive cylinder 541, the sampling nozzle 543 samples samples at lateral positions, improving the breadth of samples collected by the sampling nozzle 543. Through lateral movement, the sampling nozzle 543 can sample at different locations on the wafer surface, avoiding being limited to a fixed point or area. This allows for more comprehensive collection of impurity samples from different locations on the wafer surface, more accurately reflecting the distribution and average content of impurities across the entire wafer surface. Vertical movement allows the sampling nozzle 543 to precisely reach different heights on the wafer surface. For impurities distributed at different depths, it can accurately obtain impurity samples from specific locations, further improving sampling accuracy. The sampling nozzle 543 is located inside the wafer cassette. When sampling gas, the sampling nozzle 543 samples the gas inside the wafer cassette using negative pressure. The gas inside the wafer cassette is then sampled and tested using the sampling nozzle 543 under negative pressure, eliminating the need for direct contact with the wafer. This avoids physical damage to the wafer surface or the introduction of new impurities during sampling, maximizing the preservation of the wafer's original state and quality. This method is particularly suitable for testing high-precision, high-value wafers. Negative pressure sampling allows for the rapid collection of gas samples from the wafer cassette, simplifying the operation and improving testing efficiency. This facilitates timely problem detection and appropriate measures, meeting the high production efficiency requirements of the semiconductor manufacturing industry. The gas environment inside the wafer cassette is closely related to the impurity status of the wafer surface. By detecting the composition and content of impurities in the gas inside the cassette, a comprehensive understanding of the various impurities the wafer may come into contact with during storage and transportation can be obtained, including volatile impurities or gaseous contaminants that are difficult to detect directly on the wafer surface. This provides more comprehensive information for assessing wafer quality and potential risks.

[0021] In a preferred embodiment, the dimensions of the limiting cylinder 2 and the lifting platform 3 are matched, and the bottom of the lifting platform 3 is inserted into the inside of the limiting cylinder 2. Both the limiting cylinder 2 and the lifting platform 3 have rectangular cross-sections.

[0022] As a preferred embodiment, the fixing seat 1 at the bottom of the limiting cylinder 2 is circular, and multiple sets of perforations are evenly opened on the fixing seat 1. The lifting platform 3 inside the limiting cylinder 2 is vertically lifted and lowered by the main drive cylinder 21.

[0023] In a preferred embodiment, the mounting base 4 at the top of the lifting platform 3 is cylindrical, and five sets of connecting seats 540 are evenly fixed on the outer circumference of the mounting base 4; each of the five sets of connecting seats 540 is equipped with a secondary drive cylinder 541.

[0024] In a preferred embodiment, sampling components A5, B51, C52, D53 and E54 are symmetrical about the central axis of the mounting base 4, and the sampling components A5, B51, C52, D53 and E54 rise and fall synchronously.

[0025] In a preferred embodiment, the sampling assembly E54 includes a connecting seat 540, a secondary drive cylinder 541, a force-bearing seat 542, a sampling nozzle 543, and a negative pressure tube 544; the negative pressure tube 544 is installed at the end of the sampling nozzle 543, and the sampling nozzle 543 has a horizontal lateral movement structure.

Claims

1. A device for sampling contaminants inside a wafer cassette, comprising a mounting base (1), characterized in that: The fixed base (1) is fixedly mounted with a limiting cylinder (2), and the limiting cylinder (2) is fixedly mounted with a main drive cylinder (21). The output shaft end of the main drive cylinder (21) is fixedly mounted with a lifting platform (3). The top of the lifting platform (3) is fixedly mounted with a mounting base (4). The side wall of the mounting base (4) is fixedly mounted with sampling components A (5), B (51), C (52), D (53) and E (54). The sampling component E (54) is provided with a secondary drive cylinder (541). The output shaft end of the secondary drive cylinder (541) is fixedly connected with a sampling nozzle (543). The outer circumferential wall of the sampling nozzle (543) is provided with a force-bearing seat (542).

2. The wafer cassette internal contaminant sampling device according to claim 1, characterized in that: The dimensions of the limiting cylinder (2) and the lifting platform (3) are compatible. The bottom of the lifting platform (3) is inserted into the inside of the limiting cylinder (2). The cross-sections of the limiting cylinder (2) and the lifting platform (3) are both rectangular.

3. The wafer cassette internal contaminant sampling device according to claim 1, characterized in that: The fixed seat (1) at the bottom of the limiting cylinder (2) is circular, and multiple sets of perforations are evenly opened on the fixed seat (1). The lifting platform (3) inside the limiting cylinder (2) is vertically lifted by the main drive cylinder (21).

4. A wafer cassette internal contaminant sampling device according to any one of claims 1 or 3, characterized in that: The mounting base (4) at the top of the lifting platform (3) is cylindrical, and five sets of connecting seats (540) are evenly fixed on the outer circumference of the mounting base (4); a secondary drive cylinder (541) is installed on each of the five sets of connecting seats (540).

5. The wafer cassette internal contaminant sampling device according to claim 1, characterized in that: The sampling components A (5), B (51), C (52), D (53) and E (54) are symmetrical about the central axis of the mounting base (4), and the sampling components A (5), B (51), C (52), D (53) and E (54) move up and down synchronously.

6. The wafer cassette internal contaminant sampling device according to claim 5, characterized in that: The sampling component E (54) includes a connecting seat (540), a secondary drive cylinder (541), a force-bearing seat (542), a sampling nozzle (543), and a negative pressure tube (544); the sampling nozzle (543) is equipped with a negative pressure tube (544) at its end, and the sampling nozzle (543) is a horizontally moving structure.

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