Spacing-adjustable semiconductor chip test fixture

By designing an adjustable-pitch semiconductor chip test fixture, the problem that existing fixtures cannot adapt to chips of different sizes and shapes is solved, achieving efficient chip testing and cost reduction.

CN224216753UActive Publication Date: 2026-05-08YANCHENG XINHUI ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YANCHENG XINHUI ELECTRONIC TECH CO LTD
Filing Date
2025-05-22
Publication Date
2026-05-08

AI Technical Summary

Technical Problem

Existing semiconductor chip test fixtures cannot adjust the spacing, making it difficult to adapt to chips of different sizes and irregular shapes, resulting in low testing efficiency and increased equipment procurement costs.

Method used

An adjustable-spacing semiconductor chip test fixture was designed. Through the combination of a sliding sleeve and a connecting rod, multi-level adjustment is achieved. Combined with the design of an eccentric wheel and a threaded rod, the precise positioning and protection of the chip are ensured.

Benefits of technology

It achieves precise adaptation to chips of different sizes and shapes, reduces the frequency of fixture changes, protects the chip surface from damage, improves testing efficiency, and reduces costs.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a spacing-adjustable semiconductor chip test fixture, which belongs to the field of semiconductor chips, and comprises a placing plate, four corners above the placing plate are fixedly connected with stand columns, the interiors of the four stand columns are rotatably connected with mounting rods, the top ends of the four mounting rods are fixedly connected with connecting rods, and the connecting rods are fixedly connected with the connecting rods. According to the scheme, through sliding of the sliding sleeve on the connecting rod and clamping connection of the eight circular holes in an equidistant linear array and the clamping blocks, multi-gear adjustment of the installation position of a test component can be achieved, and the test component can be conveniently and rapidly installed on a chip with the size exceeding a traditional fixing range. According to the utility model, accurate adaptation can be realized by adjusting the position of the sliding sleeve for chips with irregular shapes, irregular shapes and special pin distribution, so that the application range of the clamp is greatly widened, the situation that the clamp is frequently replaced due to the difference of chip specifications is reduced, and the equipment purchasing and using cost of enterprises is reduced.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor chips, and more specifically, to a semiconductor chip test fixture with adjustable spacing. Background Technology

[0002] In the current era of rapid development in the semiconductor industry, semiconductor chips are the core components of modern electronic devices. Their performance testing is a key link in ensuring product quality and reliability. With the booming development of emerging technologies such as artificial intelligence, the Internet of Things, and 5G communication, the demand for high-performance and high-precision chips continues to rise. As the core component that carries and fixes the chips, the performance of the test fixture directly affects the accuracy and efficiency of the test results.

[0003] However, in the prior art, such as Chinese patent "CN221088711U", a fixture for semiconductor chip processing includes a placement plate, with cylinders fixed at the four corners of the placement plate, rods rotatably assembled inside the four cylinders, the tops of the four rods extending to the outside of the corresponding cylinders, and clamping components provided on the four rods. The four cylinders and the four rods are connected by limiting components.

[0004] However, in the aforementioned patent, the length of the outer sleeve is fixed, limiting its applicability to a circular area with a radius equal to the length of the outer sleeve, and making further adjustment of the screw position impossible. When dealing with chips that exceed this circular area, or those with irregular shapes or unique pin distributions, effective clamping and precise positioning become difficult. Furthermore, this fixed structure makes the fixture unsuitable for rapid switching tests of different batches and specifications of chips, resulting in low testing efficiency, increased equipment procurement and time costs for enterprises, and inconvenience, thus presenting certain limitations in its use. Utility Model Content

[0005] 1. Technical problems to be solved

[0006] In view of the problems existing in the prior art, the purpose of this utility model is to provide an adjustable spacing semiconductor chip test fixture, which can realize the function of adjusting the spacing of the pressure blocks.

[0007] 2. Technical Solution

[0008] To solve the above problems, the present invention adopts the following technical solution.

[0009] An adjustable-spacing semiconductor chip test fixture includes a placement plate. Columns are fixedly connected to the four corners of the placement plate. Mounting rods are rotatably connected to the interior of each of the four columns. Connecting rods are fixedly connected to the top of each of the four mounting rods. A groove is formed in the middle of one side of each connecting rod, and eight circular holes are formed in the middle of one side of each connecting rod. These eight circular holes are arranged in an equidistant linear array and communicate with the groove. A sliding sleeve is slidably connected to the outside of each connecting rod, and a mounting block is fixedly connected to the outside of the sliding sleeve.

[0010] Furthermore, a spring is fixedly connected inside the mounting block, and a locking block is fixedly connected to one end of the spring. The locking block and the sliding sleeve are slidably connected.

[0011] Furthermore, one side of the locking block is arc-shaped, and the locking block engages inside the circular hole.

[0012] Furthermore, an eccentric wheel is rotatably connected to the outside of the sliding sleeve, and a through groove is provided on one side of the sliding sleeve. The through groove is located directly in front of the eccentric wheel, and one side of the eccentric wheel is engaged with the inside of the groove.

[0013] Furthermore, a handle is fixedly connected to the outer wall of the eccentric wheel.

[0014] Furthermore, a threaded rod is rotatably connected to the end of the sliding sleeve, and a knob is fixedly connected to the top end of the threaded rod.

[0015] Furthermore, a bearing is installed at the bottom end of the threaded rod, and a pressure block is fixedly connected to the outer wall of the bearing.

[0016] 3. Beneficial effects

[0017] Compared with existing technologies, the advantages of this utility model are:

[0018] (1) In this solution, by sliding the sliding sleeve on the connecting rod, combined with the engagement of the eight equidistant linear array of round holes and the card block, the installation position of the test component can be adjusted in multiple positions. Whether it is a chip whose size exceeds the traditional fixed range, or a chip with irregular shape and special pin distribution, it can be accurately adapted by adjusting the position of the sliding sleeve, which greatly expands the applicability of the fixture, reduces the frequent replacement of the fixture due to chip specification differences, and reduces the cost of equipment procurement and use for enterprises.

[0019] (2) In this solution, the end of the sliding sleeve is rotatably connected to a threaded rod, the top of the threaded rod is fixedly connected to a knob, the bottom of the threaded rod is installed with a bearing, and the outer wall of the bearing is fixedly connected to a pressure block. The pressure block is designed to be rotatable through the bearing. During the process of applying pressure to the chip, even if there is a slight angle adjustment or slight offset, the pressure block will not generate rotational friction on the chip surface. This effectively avoids scratches, wear and other damage to the chip surface due to friction, and can better protect the precision structure and coating of the chip surface. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a schematic diagram showing the connection relationship between the sliding sleeve and the connecting rod in this utility model;

[0022] Figure 3 for Figure 1 Enlarged structural diagram of region A in the middle;

[0023] Figure 4 for Figure 2 A magnified structural diagram of region B in the middle;

[0024] Figure 5 This is a schematic diagram of the internal structure of the mounting block in this utility model.

[0025] Explanation of the labels in the diagram:

[0026] 1. Placement plate; 11. Column; 12. Mounting rod; 13. Connecting rod; 14. Groove; 15. Round hole; 16. Sliding sleeve; 17. Threaded rod; 18. Knob; 2. Eccentric wheel; 21. Handle; 22. Through groove; 23. Mounting block; 24. Spring; 25. Locking block; 26. Bearing; 27. Pressure block. Detailed Implementation

[0027] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Example 1:

[0031] Please see Figure 1-5 An adjustable-spacing semiconductor chip test fixture includes a placement plate 1. Columns 11 are fixedly connected to the four corners of the placement plate 1. Mounting rods 12 are rotatably connected inside each of the four columns 11. Connecting rods 13 are fixedly connected to the top of each of the four mounting rods 12. A groove 14 is formed in the middle of one side of each connecting rod 13, and eight circular holes 15 are formed in the middle of one side of each connecting rod 13. The eight circular holes 15 are arranged in an equidistant linear array and communicate with the groove 14. A sliding sleeve 16 is slidably connected to the outside of the connecting rod 13. By sliding the sliding sleeve 16 on the connecting rod 13 and adjusting the rotation of the threaded rod 17, the installation position of the test component can be flexibly adjusted to meet the testing requirements of semiconductor chips of different sizes. Chips of different sizes can be accurately positioned by adjusting the spacing, greatly improving the versatility of the test fixture, avoiding the cumbersome process of making special fixtures for different chips, and reducing testing costs.

[0032] An mounting block 23 is fixedly connected to the outside of the sliding sleeve 16. A spring 24 is fixedly connected inside the mounting block 23. A locking block 25 is fixedly connected to one end of the spring 24. The locking block 25 and the sliding sleeve 16 are slidably connected. One side of the locking block 25 is arc-shaped. The locking block 25 is engaged inside the round hole 15. The engagement of the locking block 25 with the round hole 15 and the arc-shaped side of the locking block 25 enable the locking block 25 to be stably engaged in the round hole 15, so as to achieve precise positioning of the sliding sleeve 16. The function of the spring 24 ensures that the locking block 25 always maintains close contact with the round hole 15, ensuring the accuracy and stability of the test.

[0033] Example 2:

[0034] Please see Figure 1-5 An adjustable-spacing semiconductor chip testing fixture is disclosed. An eccentric wheel 2 is rotatably connected to the outside of a sliding sleeve 16. A through groove 22 is provided on one side of the sliding sleeve 16, located directly in front of the eccentric wheel 2. One side of the eccentric wheel 2 engages with the inside of a groove 14. A handle 21 is fixedly connected to the outer wall of the eccentric wheel 2. The arrangement of the eccentric wheel 2 and the handle 21 not only facilitates the rapid movement of the sliding sleeve 16 but also effectively secures the sliding sleeve 16 and the connecting rod 13. When the operator rotates the eccentric wheel 2, one side of the eccentric wheel 2 engages with the groove 14 of the connecting rod 13, and through the cooperation with the through groove 22 on the sliding sleeve 16, the sliding sleeve 16 is firmly fixed to the designated position on the connecting rod 13, preventing the sliding sleeve 16 from shifting due to external force during the test.

[0035] The end of the sliding sleeve 16 is rotatably connected to a threaded rod 17, the top of the threaded rod 17 is fixedly connected to a knob 18, the bottom of the threaded rod 17 is mounted with a bearing 26, and the outer wall of the bearing 26 is fixedly connected to a pressure block 27. The pressure block 27 is rotatable through the bearing 26. During the process of applying pressure to the chip, even if there is a slight angle adjustment or slight offset, the pressure block 27 will not generate rotational friction on the chip surface. This effectively avoids scratches, wear and other damage to the chip surface due to friction, and can better protect the precision structure and coating of the chip surface.

[0036] Working principle: According to the size of the semiconductor chip, slide the sliding sleeve 16 along the connecting rod 13. The locking block 25 is locked into the corresponding round hole 15 under the action of the spring 24 for initial positioning. Then, rotate the handle 21 of the eccentric wheel 2 so that one side of the eccentric wheel 2 is locked into the groove 14, which cooperates with the through groove 22 to generate a wedge force, which firmly locks the sliding sleeve 16 on the connecting rod 13 to ensure the accuracy of the test position.

[0037] After placing the chip in the test area of ​​the placement plate 1, rotate the knob 18 to drive the threaded rod 17 to move vertically. The pressure block 27 smoothly contacts the chip surface. The lower surface of the pressure block 27 is provided with a protective rubber pad. The bearing 26 makes the pressure block 27 stop rotating after contacting the chip surface, avoiding rotational friction with the chip surface and applying the required test pressure evenly.

[0038] The eccentric wheel 2 is fastened to prevent displacement during testing, and the rotatable design of the pressure block 27 protects the chip surface from damage. At the same time, the rotatable connection between the column 11 and the mounting rod 12 can be adjusted according to the shape of the chip to adapt to chips of different shapes.

[0039] The eight equidistant circular holes 15 on the connecting rod 13 provide standardized spacing adjustment, and the modular design of the sliding sleeve 16 supports the synchronous adjustment of multiple test probes to meet the testing requirements of different chips. In addition, the four-corner layout of the column 11 ensures uniform pressure distribution.

[0040] The above description is merely a preferred embodiment of this utility model; however, the protection scope of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the technical scope disclosed in this utility model, based on the technical solution and its improved concept, should be included within the protection scope of this utility model.

Claims

1. An adjustable-pitch semiconductor chip test fixture, comprising a placement plate (1), characterized in that: Each of the four corners above the placement plate (1) is fixedly connected with a column (11). Each of the four columns (11) is rotatably connected with an installation rod (12). Each of the four installation rods (12) is fixedly connected with a connecting rod (13) at its top. A groove (14) is provided in the middle of one side of the connecting rod (13). Eight round holes (15) are provided in the middle of one side of the connecting rod (13). The eight round holes (15) are arranged in an equidistant linear array. The eight round holes (15) are connected to the groove (14). A sliding sleeve (16) is slidably connected to the outside of the connecting rod (13). An installation block (23) is fixedly connected to the outside of the sliding sleeve (16).

2. The adjustable-pitch semiconductor chip test fixture according to claim 1, characterized in that: A spring (24) is fixedly connected inside the mounting block (23), and a locking block (25) is fixedly connected to one end of the spring (24). The locking block (25) and the sliding sleeve (16) are slidably connected.

3. The adjustable-pitch semiconductor chip test fixture according to claim 2, characterized in that: One side of the locking block (25) is arc-shaped, and the locking block (25) is engaged inside the circular hole (15).

4. The adjustable-pitch semiconductor chip test fixture according to claim 3, characterized in that: An eccentric wheel (2) is rotatably connected to the outside of the sliding sleeve (16). A through groove (22) is provided on one side of the sliding sleeve (16). The through groove (22) is located in front of the eccentric wheel (2). One side of the eccentric wheel (2) is engaged with the inside of the groove (14).

5. The adjustable-pitch semiconductor chip test fixture according to claim 4, characterized in that: A handle (21) is fixedly connected to the outer wall of the eccentric wheel (2).

6. The adjustable-pitch semiconductor chip test fixture according to claim 1, characterized in that: The end of the sliding sleeve (16) is rotatably connected to a threaded rod (17), and the top end of the threaded rod (17) is fixedly connected to a knob (18).

7. The adjustable-pitch semiconductor chip test fixture according to claim 6, characterized in that: A bearing (26) is installed at the bottom end of the threaded rod (17), and a pressure block (27) is fixedly connected to the outer wall of the bearing (26).

Citation Information

Patent Citations

  • Clamp for processing semiconductor chip

    CN221088711U