Heat dissipation support capable of adjusting wind direction and angle of fan

Abstract

The heat dissipation support capable of adjusting the wind direction angle of the fan comprises a machine case assembly, a control assembly, an adjusting assembly and a heat dissipation assembly, the control assembly is arranged on the inner side wall of the machine case assembly so that a machine case can be controlled conveniently, and the adjusting assembly is arranged on the inner side wall of the machine case assembly so that the fan can be adjusted conveniently. The heat dissipation assembly is arranged on the inner side wall of the case assembly to facilitate heat dissipation of the interior of the case, the adjusting assembly comprises a fixing frame and an adjusting support, the fixing frame is arranged on the inner side wall of the case assembly, the adjusting support is arranged at one end of the fixing frame to facilitate adjustment of the fixing frame, and the adjusting support and the fixing frame are combined to facilitate adjustment of the interior of the case. And the blowing angle of the fan is flexibly adjusted. A user can dynamically adjust the direction of the fan and accurately cover a high-temperature area according to hardware load distribution in the case, so that the problem of local overheating caused by a fixed fan is avoided, the air circulation efficiency is remarkably improved, and the frequency reduction or downtime risk caused by overheating of hardware is effectively prevented.

Description

Technical Field

[0001] This utility model relates to the field of chassis technology, specifically a heat dissipation bracket with adjustable fan airflow angle. Background Technology

[0002] With the rapid improvement of computer hardware performance, the heat generated by core components such as CPU, GPU and power supply when running complex tasks has increased significantly. The heat dissipation problem inside the chassis has become a key factor restricting the stability and lifespan of the equipment.

[0003] Existing cooling fans are typically fixed to specific locations within the chassis (such as the rear or top) using rigid brackets, making it impossible to dynamically adjust the airflow angle based on heat source distribution. When hardware load increases, causing a sudden surge in localized temperature, fixed fans struggle to accurately cover high-temperature areas, easily creating heat dissipation blind spots and causing heat accumulation. This passive cooling mode not only reduces air circulation efficiency but can also lead to localized overheating, triggering hardware throttling or system crashes. Traditional fan brackets often employ welding or integrated designs, requiring the removal of chassis side panels and even parts of the hardware during disassembly and assembly, which is complex and prone to damaging equipment. Furthermore, the fixed structure limits fan expandability; users cannot flexibly add or remove fans or adjust their layout according to cooling needs, making it difficult to adapt to scenarios with multiple hardware configurations. To address this issue, the inventors have proposed a cooling bracket with adjustable fan airflow angle. Utility Model Content

[0004] In view of the shortcomings of the above-mentioned technologies, this utility model provides a heat dissipation bracket with adjustable fan airflow angle.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a heat dissipation bracket with adjustable fan airflow angle, comprising a chassis assembly, a control assembly, an adjustment assembly, and a heat dissipation assembly. The control assembly is located on the inner wall of the chassis assembly for easy control of the chassis. The adjustment assembly is located on the inner wall of the chassis assembly for easy fan adjustment. The heat dissipation assembly is located on the inner wall of the chassis assembly for easy heat dissipation of the chassis interior. The adjustment assembly includes a fixed frame and an adjustment bracket. The fixed frame is located on the inner wall of the chassis assembly, and the adjustment bracket is located at one end of the fixed frame for easy adjustment of the fixed frame.

[0006] As further explained, the fixing frame extends outward and has a mounting groove for limiting the fan. The mounting groove is located on the inner side wall of the fixing frame. There are multiple mounting grooves and they are spaced apart. The adjusting bracket extends outward and has limiting screws for limiting the fixing frame. The limiting screws are respectively located on the inner side walls of the fixing frame and the adjusting bracket.

[0007] As a further explanation, the adjusting bracket extends inward and is provided with stepped screws, which are respectively provided on the inner sidewalls of the adjusting bracket and the fixing frame.

[0008] As further explained, the heat dissipation component includes a cooling fan and a heat dissipation slot. The cooling fan is respectively disposed on the inner sidewall of the chassis component and the mounting slot, and the heat dissipation slot is formed on the inner sidewall of the chassis component to facilitate heat dissipation inside the chassis.

[0009] As further explained, the control component includes a control panel and a motherboard, the control panel being disposed on the upper surface of the chassis assembly, and the motherboard being disposed on the inner side wall of the chassis assembly.

[0010] As a further explanation, it also includes a baffle strip, which is disposed on the inner sidewall of the chassis assembly.

[0011] As further explained, the chassis assembly includes a chassis body, a base plate, and a base. The chassis body is disposed on the upper surface of the base plate, and the base plate is disposed on the upper surface of the base to facilitate support of the chassis. The base is disposed at the bottom of the base plate, and multiple bases are provided and spaced apart. The mounting bracket is located on the inner side wall of the base plate, the heat dissipation slot is located on the inner side wall of the base plate, and the motherboard is located on the inner side wall of the chassis body.

[0012] As further explained, the chassis body extends outward to provide an upper cover plate, which is located on the upper surface of the chassis body. The upper cover plate extends outward to provide a rear cover plate, which is located on the upper surface of the bottom plate. One end of the upper cover plate is provided with a front cover plate corresponding to the rear cover plate, which is located on the upper surface of the bottom plate. The front cover plate extends outward to provide a front decorative strip, which is located at one end of the front cover plate. The cooling fan is located on the inner sidewall of the rear cover plate and the mounting groove, respectively. The control panel is located on the upper surface of the upper cover plate, and the baffle is located on the inner sidewall of the baffle.

[0013] In summary, this utility model has the following beneficial effects: This utility model provides an adjustable fan airflow angle heat dissipation bracket. The combination design of the adjustable bracket and the fixed bracket allows for flexible adjustment of the fan's airflow angle. Users can dynamically adjust the fan direction according to the hardware load distribution inside the chassis, precisely covering high-temperature areas, avoiding localized overheating problems caused by fixed fans, significantly improving air circulation efficiency, and effectively preventing the risk of hardware throttling or shutdown due to overheating. The use of a fixing structure with limit screws and stepped screws, combined with a multi-spaced mounting slot design, allows users to quickly install, remove, or replace the fan without disassembling the chassis side panel or hardware. The modular design significantly reduces maintenance difficulty, minimizes operational risks, and extends equipment lifespan. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a heat dissipation bracket with an adjustable fan airflow angle according to the present invention.

[0015] Figure 2 This is a schematic diagram of the internal structure of a heat dissipation bracket with adjustable fan airflow angle according to the present invention.

[0016] Figure 3 This is a schematic diagram of the adjustment component structure of a heat dissipation bracket with adjustable fan airflow angle according to the present invention;

[0017] Figure 4 This is an exploded view of the adjustment component of a heat dissipation bracket with adjustable fan airflow angle according to the present invention. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figure 1-4 As shown, this utility model discloses a heat dissipation bracket with adjustable fan airflow angle, including a chassis assembly, a control assembly, an adjustment assembly, and a heat dissipation assembly. The control assembly is located on the inner wall of the chassis assembly for easy control of the chassis. The adjustment assembly is located on the inner wall of the chassis assembly for easy adjustment of the fan. The heat dissipation assembly is located on the inner wall of the chassis assembly for easy heat dissipation of the chassis interior. The adjustment assembly includes a fixed frame 35 and an adjustment bracket 31. The fixed frame 35 is located on the inner wall of the chassis assembly, and the adjustment bracket 31 is located at one end of the fixed frame 35 for easy adjustment of the fixed frame 35.

[0020] Specifically, the mounting bracket 35 fixes the cooling fan 41 through the mounting slot 34 on the inner side wall of the base plate 15. Each mounting slot 34 corresponds to an independent fan unit, forming a modular layout. The mounting slot 34 inside the mounting bracket 35 can have one or more cooling fans 41, which can be used in different occasions, improving practicality. At the same time, multiple mounting brackets 35 can be provided, and they can be set in different positions such as the front cover plate 13, the upper cover plate 12, and the rear cover plate 14, which improves practicality. The limiting screw 32 (located at the connection between the mounting bracket 35 and the adjusting bracket 31) is released by electric or manual means, releasing the rigid fixation on the adjusting bracket 31. The adjusting bracket 31 rotates or translates around the stepped screw 33 as the axis (the stepped screw 33 also serves as a rotation fulcrum and limiting structure). Its movement trajectory is limited by the guide groove of the mounting slot 34 to ensure that the fan adjusts its direction along a preset path.

[0021] The mounting bracket 35 extends outward and has a mounting groove 34 for limiting the fan. The mounting groove 34 is located on the inner side wall of the mounting bracket 35. Multiple mounting grooves 34 are provided and spaced apart. The adjusting bracket 31 extends outward and has a limiting screw 32 for limiting the fan with the mounting bracket 35. The limiting screw 32 is located on the inner side wall of both the mounting bracket 35 and the adjusting bracket 31. The adjusting bracket 31 extends inward and has a stepped screw 33. The stepped screw 33 is located on the inner side wall of both the adjusting bracket 31 and the mounting bracket 35.

[0022] Specifically, mounting slots 34 secure cooling fans 41, with each slot corresponding to an independent fan unit, forming a modular layout. Limiting screws 32, by adjusting their tightness, change the angle between the adjusting bracket 31 and the mounting bracket 35, achieving airflow deflection within a ±30° range. Through the coordinated action of multiple sets of limiting screws 32 and step screws 33, the adjusting bracket 31 can achieve ±30° pitch angle adjustment and horizontal rotation, covering heat source areas at different heights within the chassis.

[0023] The heat dissipation assembly includes a cooling fan 41 and a heat dissipation slot 42. The cooling fan 41 is located on the inner side wall of the chassis assembly and the mounting slot 34, respectively. The heat dissipation slot 42 is opened on the inner side wall of the chassis assembly to facilitate heat dissipation inside the chassis.

[0024] Specifically, the cooling fan 41 starts after adjusting to the target angle according to the command, forming a directional airflow. The heat dissipation slots 42 on the rear cover 14 and front cover 13 of the chassis body 11 form an airflow channel, improving practicality. A honeycomb-shaped perforation design is adopted to balance airflow and dust prevention requirements. The directional airflow exhausts heat from the rear cover 14, while the hollow structure of the base plate 15 and the base 16 forms a vertical airflow channel, preventing hot air from flowing back.

[0025] The control components include a control panel 21 and a motherboard 22. The control panel 21 is located on the upper surface of the chassis assembly, and the motherboard 22 is located on the inner side wall of the chassis assembly. The components also include a baffle 201, which is located on the inner side wall of the chassis assembly.

[0026] Specifically, the motherboard 22 has a built-in temperature sensor array that monitors the temperature distribution of core components such as the CPU, GPU, and power supply in real time, and transmits the data to the control panel 21. The control panel 21 analyzes the location of heat sources and the trend of heat changes through algorithms, and generates priority instructions for heat dissipation requirements. When the hardware load decreases, the control panel 21 can instruct some fans to enter low-power mode, extending their lifespan. The baffle 201 inside the chassis provides lateral support when adjusting the fans, preventing angular displacement caused by vibration.

[0027] The chassis assembly includes a chassis body 11, a base plate 15, and a base 16. The chassis body 11 is located on the upper surface of the base plate 15, and the base plate 15 is located on the upper surface of the base 16 to facilitate support of the chassis. The base 16 is located at the bottom of the base plate 15. Multiple bases 16 are provided and spaced apart. The mounting bracket 35 is located on the inner side wall of the base plate 15, the heat dissipation slot 42 is located on the inner side wall of the base plate 15, and the motherboard 22 is located on the inner side wall of the chassis body 11.

[0028] The chassis body 11 extends outward to provide an upper cover plate 12, which is located on the upper surface of the chassis body 11. The upper cover plate 12 extends outward to provide a rear cover plate 14, which is located on the upper surface of the bottom plate 15. One end of the upper cover plate 12 is provided with a front cover plate 13 corresponding to the rear cover plate 14, which is located on the upper surface of the bottom plate 15. The front cover plate 13 extends outward to provide a front decorative strip 17, which is located at one end of the front cover plate 13. The cooling fan 41 is located on the inner sidewall of the rear cover plate 14 and the mounting groove 34, respectively. The control panel 21 is located on the upper surface of the upper cover plate 12, and the baffle 201 is located on the inner sidewall of the baffle 201.

[0029] Specifically, the heat dissipation slots 42 on the rear cover 14 and front cover 13 of the chassis body 11 form an airflow channel. The front decorative strip 17 and the baffle 201 work together. The baffle 201 reduces airflow turbulence through the airflow guiding protrusion structure and guides cold air to accurately cover the high-temperature area.

[0030] The combination of the adjustable bracket 31 and the fixed bracket 35 allows for flexible adjustment of the fan's airflow angle. Users can dynamically adjust the fan direction according to the internal hardware load distribution, precisely covering high-temperature areas and avoiding localized overheating issues caused by fixed fans. This significantly improves air circulation efficiency and effectively prevents the risk of hardware throttling or system crashes due to overheating. The fixing structure using limit screws 32 and stepped screws 33, combined with a multi-spaced mounting slot design 34, allows users to quickly install, remove, or replace the fan without disassembling the chassis side panel or hardware. The modular design greatly reduces maintenance difficulty, minimizes operational risks, and extends equipment lifespan.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0032] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A heat dissipation bracket with adjustable fan airflow angle, characterized in that: Including chassis components; A control component is located on the inner side wall of the chassis assembly to facilitate control of the chassis. An adjustment component is provided on the inner side wall of the chassis assembly to facilitate fan adjustment; A heat dissipation component is disposed on the inner side wall of the chassis component to facilitate heat dissipation inside the chassis. The adjustment assembly includes a fixed frame and an adjustment bracket. The fixed frame is disposed on the inner side wall of the chassis assembly, and the adjustment bracket is disposed at one end of the fixed frame to facilitate adjustment of the fixed frame.

2. The heat dissipation bracket with adjustable fan airflow angle according to claim 1, characterized in that: The fixed frame extends outward and has a mounting slot for limiting the fan. The mounting slot is located on the inner side wall of the fixed frame. There are multiple mounting slots that are spaced apart. The adjusting bracket extends outward and has limiting screws that limit the fixed frame. The limiting screws are respectively located on the inner side walls of the fixed frame and the adjusting bracket.

3. A heat dissipation bracket with adjustable fan airflow angle according to claim 2, characterized in that: The adjusting bracket extends inward and is provided with stepped screws, which are respectively provided on the inner sidewalls of the adjusting bracket and the fixing bracket.

4. A heat dissipation bracket with adjustable fan airflow angle according to claim 3, characterized in that: The heat dissipation component includes a cooling fan and a heat dissipation slot. The cooling fan is respectively disposed on the inner sidewall of the chassis component and the mounting slot. The heat dissipation slot is formed on the inner sidewall of the chassis component to facilitate heat dissipation inside the chassis.

5. A heat dissipation bracket with adjustable fan airflow angle according to claim 1, characterized in that: The control component includes a control panel and a motherboard. The control panel is located on the upper surface of the chassis assembly, and the motherboard is located on the inner side wall of the chassis assembly.

6. A heat dissipation bracket with adjustable fan airflow angle according to claim 5, characterized in that: It also includes a baffle strip, which is disposed on the inner side wall of the chassis assembly.

7. A heat dissipation bracket with adjustable fan airflow angle according to any one of claims 1, 4, 5, and 6, characterized in that: The chassis assembly includes a chassis body, a base plate, and a base. The chassis body is located on the upper surface of the base plate, and the base plate is located on the upper surface of the base to facilitate support of the chassis. The base is located at the bottom of the base plate, and multiple bases are provided and spaced apart. The mounting bracket is located on the inner side wall of the base plate, the heat dissipation slot is located on the inner side wall of the base plate, and the motherboard is located on the inner side wall of the chassis body.

8. A heat dissipation bracket with adjustable fan airflow angle according to claim 7, characterized in that: The chassis body extends outwards with an upper cover plate, which is located on the upper surface of the chassis body. The upper cover plate extends outwards with a rear cover plate, which is located on the upper surface of the bottom plate. One end of the upper cover plate has a front cover plate corresponding to the rear cover plate, which is located on the upper surface of the bottom plate. The front cover plate extends outwards with a front decorative strip, which is located at one end of the front cover plate. The cooling fans are located on the inner sidewalls of the rear cover plate and the mounting groove, respectively. The control panel is located on the upper surface of the upper cover plate, and the baffle is located on the inner sidewall of the baffle.

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