Static electricity eliminating device in wafer processing and expanding process

Abstract

The utility model relates to the technical field of wafer expansion, and discloses a static electricity elimination device in a wafer processing and expanding process, which comprises a roll of wafer expansion blue film, and a clamping assembly used for clamping and positioning two sides of the wafer expansion blue film is arranged on one side of the wafer expansion blue film. A static electricity eliminating assembly used for eliminating static electricity on the surface of the crystal expanding blue film is arranged on the upper portion of one side of the crystal expanding blue film, a guiding assembly used for assisting the static electricity eliminating assembly in moving is arranged on one side of the clamping assembly, and a displacement mechanism used for driving the static electricity eliminating assembly to move is arranged on the outer side of the guiding assembly. According to the device, through cooperation of the supporting assembly, the guiding assembly, the displacement mechanism, the static electricity elimination assembly and the clamping assembly, all-directional static electricity removal on the surface of the crystal expansion blue film is achieved; and the supporting assembly provides stable support for the whole device, so that other assemblies can efficiently work at accurate positions.

Description

Technical Field

[0001] This utility model relates to the field of wafer expansion technology, specifically to an electrostatic elimination device for the wafer expansion process. Background Technology

[0002] The electrostatic discharge (ESD) elimination device in the wafer expansion process is mainly used to eliminate static electricity on the surface of the expanded blue film. During the handling and processing of the expanded blue film, static electricity easily accumulates on the surface of the blue film, which may lead to particle contamination or damage to the expanded wafer. Therefore, effective ESD elimination measures are required. Such devices generally use technologies such as ion wind and electrostatic discharge to neutralize static electricity by generating positive and negative ion flows, thus avoiding adverse effects of static electricity on the wafer surface. The normal operation of the ESD elimination device helps to ensure the stability of the wafer processing process, improve production efficiency, and at the same time guarantee the quality and yield of the final product.

[0003] However, in existing technologies, the electrostatic discharge (ESD) devices for the extended blue film in traditional wafer fabrication and expansion processes generally employ fixed-installation ion fans. These fixed-installation ion fans are mainly used to remove static electricity and dust accumulated on the surface of the extended blue film. However, fixed-installation ion fans have certain limitations, primarily in that they cannot fully cover the surface of the pulled-out extended blue film. Due to the mobility and positional changes of the extended blue film during processing, fixed ion fans cannot always maintain effective coverage of the entire surface. This results in some areas not being adequately neutralized, leading to static electricity accumulation. Static electricity accumulation not only easily causes particulate contamination, potentially damaging the wafer surface, but may also affect the stability of subsequent processes. Furthermore, failure to eliminate static electricity in a timely manner may lead to equipment malfunctions or abnormalities during processing, severely impacting production efficiency and yield. Therefore, those skilled in the art provide an ESD device for the wafer fabrication and expansion process to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this invention is to provide an electrostatic discharge (ESD) elimination device for the wafer fabrication and expansion process. This addresses the limitations of existing ESD devices that typically use fixed ion fans to remove static electricity and dust accumulated on the surface of the blue film during wafer fabrication and expansion. While these fixed ion fans have limitations, they cannot fully cover the surface of the pulled-out blue film. Due to the movement and positional changes of the blue film during processing, fixed ion fans cannot consistently maintain effective coverage of the entire surface. This results in some areas not being adequately neutralized, leading to static buildup. Static buildup not only easily causes particulate contamination and potential damage to the wafer surface but also affects the stability of subsequent processes. Furthermore, failure to eliminate static electricity in a timely manner can lead to equipment malfunctions or abnormalities during processing, severely impacting production efficiency and yield.

[0005] This utility model provides the following technical solution: an electrostatic elimination device for wafer expansion process, comprising a roll of expansion blue film, a clamping component for clamping and positioning both sides of the expansion blue film on one side, an electrostatic elimination component for eliminating static electricity on the surface of the expansion blue film at an upper position on one side of the expansion blue film, a guide component for assisting the movement of the electrostatic elimination component on one side of the clamping component, a displacement mechanism for driving the movement of the electrostatic elimination component on the outside of the guide component, and a support component for supporting the guide component, the electrostatic elimination component, and the clamping component on one side of the clamping component.

[0006] As a preferred embodiment of the above technical solution, the support component includes a main support block, and a stepper motor and a conductive slip ring are respectively fixedly sleeved at the two ends of the center of the main support block.

[0007] As a preferred embodiment of the above technical solution, the guide assembly includes a first support ring and a second support ring. The first support ring is fixedly sleeved on the outside of the output end of the stepper motor, and the second support ring is fixedly sleeved on the outside of the rotating end of the conductive slip ring. An arc-shaped rack is fixedly connected to the upper end of the first and second support rings. An arc-shaped limiting groove is provided at the center of the two mutually distant sides of the Spassky arc-shaped rack, and an arc-shaped guide groove is provided at both sides of the center of the upper end of the arc-shaped rack.

[0008] As a preferred embodiment of the above technical solution, the displacement mechanism includes two support plates, which are respectively disposed on both sides of the arc-shaped rack. On the side of the two arc-shaped racks that are close to each other, multiple support columns are fixedly connected in a fan-shaped arrangement near the upper part of the center. The outer ends of the multiple support columns on one side and the multiple support columns on the other side that are close to each other are rotatably connected to pulleys through bearings. The multiple pulleys are slidably fitted inside two arc-shaped limiting grooves. A transmission shaft is rotatably connected to the lower part of the center of the two support plates through bearings. A spur gear is fixedly fitted at the outer center of the transmission shaft. The spur gear and the arc-shaped rack are engaged in gear meshing transmission.

[0009] As a preferred embodiment of the above technical solution, multiple threaded holes are equidistantly arranged at the center of the upper ends of the two support plates. A mating plate is provided at the upper ends of the two support plates. Multiple fastening bolts are equidistantly threaded on both sides of the mating plate. The assembly ends of the multiple fastening bolts are respectively threaded into the multiple threaded holes. A protective cover for protecting the spur gear is fixedly fitted on the lower ends of the two support plates. A servo motor is fixedly connected to the lower center of one side of one of the support plates. The output end of the servo motor is fixedly connected to one end of the transmission shaft. Arc-shaped guide rails are fixedly connected to both sides of the lower center of the mating plate. The two arc-shaped guide rails are slidably fitted inside two arc-shaped guide grooves.

[0010] As a preferred embodiment of the above technical solution, the static elimination component includes a support plate, which is fixedly connected to the center of a support plate on the side away from the servo motor. Positioning sleeves are fixedly connected to both the upper and lower ends of the center of the side of the support plate away from the support plate. An electric telescopic rod is fixedly fitted inside each of the two positioning sleeves. A retaining sleeve is fixedly connected to the lower output end of the electric telescopic rod, and an ion fan is engaged inside the retaining sleeve.

[0011] As a preferred embodiment of the above technical solution, the clamping assembly includes two support bars, which are fixedly connected to the upper and lower ends of the center of one side of the main support block. Horizontal guide grooves are provided at the lower center of the upper support bar and the upper center of the lower support bar. Two side support blocks are fixedly connected to both ends of the two support bars. A positive and negative threaded rod is rotatably sleeved inside the two side support blocks through bearings. An adjustment knob is fixedly connected to one end of the positive and negative threaded rod.

[0012] As a preferred embodiment of the above technical solution, the two outer ends of the positive and negative threaded rods are threaded with sliders, and the upper and lower ends of the two sliders are fixedly connected with horizontal guide rails. The four horizontal guide rails are slidably sleeved inside the two horizontal guide grooves. The center of the side of the two sliders away from the main support block is fixedly connected with a clamping plate. The center of the inside of the two clamping plates is fixedly sleeved with a damping bearing. The inner ring of the two damping bearings is clamped with a plug rod, and the plug rod is detachably connected to the two damping bearings. The expanded blue film is wrapped around the outside of the damping bearings.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This electrostatic discharge (ESD) elimination device for wafer fabrication and expansion achieves comprehensive ESD removal from the surface of the expanded blue film through the collaboration of the support assembly, guide assembly, displacement mechanism, ESD elimination assembly, and clamping assembly. The support assembly provides stable support for the entire device, enabling other components to work efficiently in precise positions.

[0015] The guiding component, through the cooperation of a stepper motor and a conductive slip ring, ensures that the electrostatic elimination component can move precisely and cover the surface of the expanded blue film. The displacement mechanism, driven by a servo motor and a transmission shaft, smoothly operates the arc-shaped rack and pulley, achieving precise positioning of the electrostatic elimination component. The electrostatic elimination component eliminates static electricity on the surface of the expanded blue film through an ion fan, avoiding particle contamination and equipment damage. The clamping component, by adjusting the clamping force of the film, ensures the stability of the film and reduces offset during processing, further improving the electrostatic removal effect. This device significantly improves the electrostatic elimination efficiency in the wafer processing process, reduces potential problems caused by static electricity, and ensures product quality and production stability. Attached Figure Description

[0016] Figure 1 A three-dimensional structural schematic diagram of an electrostatic elimination device for wafer fabrication and expansion processes;

[0017] Figure 2 This is a three-dimensional structural schematic diagram of an electrostatic elimination device for wafer fabrication and expansion processes from another perspective.

[0018] Figure 3 A three-dimensional disassembled structural diagram of an electrostatic elimination device for wafer fabrication and expansion processes;

[0019] Figure 4 This is a three-dimensional split-structure diagram of an electrostatic elimination device for wafer fabrication and expansion processes from another perspective.

[0020] Figure 5 A schematic diagram of the three-dimensional disassembled structure supporting the components;

[0021] Figure 6A three-dimensional structural diagram of the guide component;

[0022] Figure 7 A three-dimensional structural diagram of the guide component from another perspective;

[0023] Figure 8 This is a schematic diagram of the three-dimensional disassembled structure of the displacement mechanism;

[0024] Figure 9 A three-dimensional disassembled structural diagram of the static elimination component;

[0025] Figure 10 This is a schematic diagram of the three-dimensional disassembled structure of the clamping component.

[0026] Legend:

[0027] 1. Support assembly; 101. Main support block; 102. Stepper motor; 103. Conductive slip ring; 2. Guide assembly; 201. First support ring; 202. Second support ring; 203. Arc-shaped rack; 204. Arc-shaped limiting groove; 205. Arc-shaped guide groove; 3. Displacement mechanism; 301. Support plate; 302. Support column; 303. Pulley; 304. Drive shaft; 305. Spur gear; 306. Threaded hole; 307. Connecting plate; 308. Fastening bolt; 309. Protective cover; 301 0. Servo motor; 3011. Arc-shaped guide rail; 4. Static elimination assembly; 401. Support plate; 402. Positioning sleeve; 403. Electric telescopic rod; 404. Sleeve; 405. Ion fan; 5. Clamping assembly; 501. Support bar; 502. Horizontal guide groove; 503. Side support block; 504. Positive and negative threaded rod; 505. Adjustment knob; 506. Slider; 507. Horizontal guide rail; 508. Clamping plate; 509. Damping bearing; 5010. Insert rod; 6. Expanding blue film. Detailed Implementation

[0028] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0029] Please see Figures 1-4 As shown, this utility model provides a technical solution: an electrostatic elimination device for wafer expansion process, including a roll of expansion blue film 6, a clamping component 5 for clamping and positioning both sides of the expansion blue film 6 on one side, an electrostatic elimination component 4 for eliminating static electricity on the surface of the expansion blue film 6 near the upper part of one side of the expansion blue film 6, a guide component 2 for assisting the movement of the electrostatic elimination component 4 on one side of the clamping component 5, a displacement mechanism 3 for driving the movement of the electrostatic elimination component 4 on the outside of the guide component 2, and a support component 1 for supporting the guide component 2, the electrostatic elimination component 4 and the clamping component 5 on one side of the clamping component 5.

[0030] This electrostatic discharge (ESD) elimination device for wafer fabrication expansion achieves comprehensive ESD removal from the surface of the blue film 6 through the collaboration of support component 1, guide component 2, displacement mechanism 3, ESD elimination component 4, and clamping component 5. Support component 1 provides stable support for the entire device, enabling other components to work efficiently in precise positions. Guide component 2, through the cooperation of stepper motor 102 and conductive slip ring 103, ensures that the ESD elimination component 4 can move precisely and cover the surface of the blue film 6. Displacement mechanism 3, through servo motor 3010 and drive shaft 304, drives arc rack 203 and pulley 303 to run smoothly, achieving precise positioning of ESD elimination component 4. ESD elimination component 4 eliminates static electricity on the surface of the blue film 6 through ion fan 405, avoiding particle contamination and equipment damage. Clamping component 5, by adjusting the clamping force of the film, ensures film stability and reduces offset during processing, further improving the ESD removal effect. This device significantly improves the ESD elimination efficiency in wafer fabrication, reduces potential problems caused by static electricity, and ensures product quality and production stability.

[0031] As one implementation method in this embodiment, please refer to Figure 5 As shown, the support component 1 includes a main support block 101, and a stepper motor 102 and a conductive slip ring 103 are respectively fixedly sleeved at the center of the main support block 101 near both ends.

[0032] The support component 1 consists of a main support block 101, which houses a stepper motor 102 and a conductive slip ring 103. The stepper motor 102 controls the rotation of the guide component 2 to remove static electricity from the surface of the expanded blue film 6. The conductive slip ring 103 provides power transmission to the displacement mechanism 3 and the static elimination component 4 on the guide component 2, thereby ensuring that the static elimination component 4 can operate efficiently. Through the support of the support component 1, the system maintains a stable working state, effectively reducing equipment vibration and instability problems that may occur during processing, and providing a foundation for the precise operation of subsequent components.

[0033] As one implementation method in this embodiment, please refer to Figures 6-7 As shown, the guide assembly 2 includes a first support ring 201 and a second support ring 202. The first support ring 201 is fixedly sleeved on the outside of the output end of the stepper motor 102, and the second support ring 202 is fixedly sleeved on the outside of the rotating end of the conductive slip ring 103. An arc-shaped rack 203 is fixedly connected to the upper end of the first support ring 201 and the second support ring 202. An arc-shaped limiting groove 204 is provided at the center of the two sides of the Spassky arc-shaped rack 203 that are far apart from each other. An arc-shaped guide groove 205 is provided at the center of the upper end of the arc-shaped rack 203 near both sides.

[0034] The guide assembly 2 consists of a first support ring 201 and a second support ring 202. Through the cooperation of the arc-shaped rack 203 and the arc-shaped guide groove 205, the displacement mechanism 3 can move smoothly along the arc-shaped limiting groove 204 and the arc-shaped guide groove 205. The stepper motor 102 controls the rotation of the arc-shaped rack 203, so that the electrostatic elimination assembly 4 can accurately cover the surface of the expanded blue film 6 and remove static electricity. The design of the arc-shaped limiting groove 204 and the arc-shaped guide groove 205 ensures the accurate positioning and stability of the displacement mechanism 3 and reduces the problem of uneven electrostatic elimination caused by component offset.

[0035] As one implementation method in this embodiment, please refer to Figure 8 As shown, the displacement mechanism 3 includes two support plates 301, which are respectively disposed on both sides of the arc-shaped rack 203. Multiple support columns 302 are fixedly connected in a fan-shaped arrangement near the upper center of each side of the two arc-shaped racks 203. Each of the multiple support columns 302 on one side and the multiple support columns 302 on the other side has a pulley 303 rotatably sleeved on its outer side via a bearing. The pulleys 303 are slidably sleeved inside two arc-shaped limiting grooves 204. A transmission shaft 304 is rotatably sleeved on the lower center of each of the two support plates 301 via a bearing. A spur gear 305 is fixedly sleeved at the center of the outer side of the transmission shaft 304. The spur gear 305 and the arc-shaped rack 203 are engaged in gear transmission. The upper centers of the two support plates 301 are equidistant from each other. Multiple threaded holes 306 are arranged in a row. A docking plate 307 is provided on the upper end of the two support plates 301. Multiple fastening bolts 308 are threaded and sleeved at equal intervals on both sides of the docking plate 307. The assembly ends of the multiple fastening bolts 308 are threaded and sleeved in the multiple threaded holes 306. A protective cover 309 for protecting the spur gear 305 is fixedly sleeved on the lower end of the two support plates 301. A servo motor 3010 is fixedly connected to the lower center of one of the support plates 301 away from the spur gear 305. The output end of the servo motor 3010 is fixedly connected to one end of the transmission shaft 304. Arc-shaped guide rails 3011 are fixedly connected to both sides of the lower center of the docking plate 307. The two arc-shaped guide rails 3011 are slidably sleeved in the two arc-shaped guide grooves 205.

[0036] The displacement mechanism 3, through the combined action of two support plates 301 and multiple support columns 302, and in conjunction with the arc-shaped rack 203, allows the position of the displacement mechanism 3 to be freely adjusted. The support plates 301 are connected to the spur gear 305 through the transmission shaft 304, enabling the spur gear 305 to move stably and drive the static elimination component 4 to complete precise movement. The pulley 303 slides in the arc-shaped limiting groove 204, ensuring the smooth movement of the displacement mechanism 3. The servo motor 3010 provides precise power, ensuring that the displacement mechanism 3 can quickly and stably adjust the movement trajectory of the static elimination component 4, thus guaranteeing the efficiency and accuracy of the entire static elimination process.

[0037] As one implementation method in this embodiment, please refer to Figure 9 As shown, the static elimination component 4 includes a support plate 401. The support plate 401 is fixedly connected to the center of the support plate 301 on the side away from the servo motor 3010. Positioning sleeves 402 are fixedly connected to both the upper and lower ends of the center of the side of the support plate 401 away from the support plate 301. An electric telescopic rod 403 is fixedly fitted inside each of the two positioning sleeves 402. A retaining sleeve 404 is fixedly connected to the lower output end of the electric telescopic rod 403. An ion fan 405 is snapped into the retaining sleeve 404.

[0038] The static eliminator assembly 4 includes a support plate 401 and an electric telescopic rod 403. An ion fan 405 is installed via a clamp 404. The electric telescopic rod 403 can adjust the position of the ion fan 405 as needed, so that the ion fan 405 can evenly cover the surface of the expanded blue film 6 to remove static electricity. The support plate 401 connects the static eliminator assembly 4 to other parts to ensure the stability of the static eliminator device. This design makes the static eliminator process more precise, effectively reduces the accumulation of static electricity on the surface of the expanded blue film 6, and avoids particulate contamination and equipment failure caused by static electricity.

[0039] As one implementation method in this embodiment, please refer to Figure 10 As shown, the clamping assembly 5 includes two support bars 501, which are fixedly connected to the upper and lower ends of the center of one side of the main support block 101. Horizontal guide grooves 502 are provided at the lower center of the upper support bar 501 and the upper center of the lower support bar 501. Two side support blocks 503 are fixedly connected to both ends of the two support bars 501. A positive and negative threaded rod 504 is rotatably sleeved inside the two side support blocks 503 via bearings. An adjustment knob 505 is fixedly connected to one end of the positive and negative threaded rod 504, and threads are present at both ends of the outer side of the positive and negative threaded rod 504. Slider 506 is sleeved, and horizontal guide rails 507 are fixedly connected to the upper and lower ends of the two sliders 506. The four horizontal guide rails 507 are slidably sleeved inside the two horizontal guide grooves 502. Clamping plates 508 are fixedly connected to the center of the side of the two sliders 506 away from the main support block 101. Damping bearings 509 are fixedly sleeved at the center of the inside of the two clamping plates 508. Insert rods 5010 are snapped into the inner rings of the two damping bearings 509, and the insert rods 5010 and the two damping bearings 509 are detachably connected. The expanded blue film 6 is wrapped around the outside of the damping bearings 509.

[0040] The clamping assembly 5 consists of two support bars 501, a positive and negative threaded rod 504, and an adjustment knob 505. The clamping assembly 5 adjusts the clamping force of the expanded blue film 6 through the positive and negative threaded rod 504 to ensure the stability of the film during processing. The horizontal guide groove 502 and the slider 506 ensure that the clamping assembly 5 can accurately adjust the overall position of the film while reducing the offset of the film during the electrostatic elimination process. The damping bearing 509 can prevent the film from vibrating excessively and protect the surface of the expanded blue film 6 from damage. This structure ensures the stability of the film throughout the entire processing process by precisely adjusting the clamping force of the film, further improving the effect of electrostatic removal.

[0041] Working principle: The support assembly 1 consists of a main support block 101, which houses a stepper motor 102 and a conductive slip ring 103. The stepper motor 102 controls the rotation of the guide assembly 2, achieving electrostatic removal coating on the surface of the expanded blue film 6. The conductive slip ring 103 provides power transmission to the displacement mechanism 3 and the electrostatic elimination assembly 4 on the guide assembly 2, thereby ensuring the efficient operation of the electrostatic elimination assembly 4. Through the supporting effect of the support assembly 1, the system maintains a stable working state, effectively reducing equipment vibration and instability problems that may occur during processing, and providing a basis for the precise operation of subsequent components. The guide assembly 2, consisting of a first support ring 201 and a second support ring 202, provides a foundation. Through the cooperation of the arc-shaped rack 203 and the arc-shaped guide groove 205, the displacement mechanism 3 can move smoothly along the arc-shaped limiting groove 204 and the arc-shaped guide groove 205. The stepper motor 102 controls the rotation of the arc-shaped rack 203, so that the electrostatic elimination assembly 4 can accurately cover the surface of the expanded blue film 6 and remove static electricity. The design of the arc-shaped limiting groove 204 and the arc-shaped guide groove 205 ensures the accurate positioning and stability of the displacement mechanism 3 and reduces the problem of uneven electrostatic elimination caused by component offset.

[0042] The displacement mechanism 3, through the combined action of two support plates 301 and multiple support columns 302, and in conjunction with the arc-shaped rack 203, allows for free adjustment of its position. The support plates 301 are internally connected to a spur gear 305 via a transmission shaft 304, enabling the spur gear 305 to move stably and drive the static elimination component 4 to complete precise movement. The pulley 303 slides within the arc-shaped limiting groove 204, ensuring smooth movement of the displacement mechanism 3. The servo motor 3010 provides precise power, ensuring that the displacement mechanism 3 can quickly and stably adjust the movement trajectory of the static elimination component 4, guaranteeing the efficiency and accuracy of the entire static elimination process. The static elimination component 4 includes a support plate 401 and an electric telescopic rod 403. An ion fan 405 is mounted via a clamp 404. The electric telescopic rod 403 can adjust the position of the ion fan 405 as needed, allowing the ion fan 405 to evenly cover the surface of the expanded blue film 6. To remove static electricity, the support plate 401 connects the static elimination component 4 to other parts, ensuring the stability of the static elimination device. This design makes the static elimination process more precise, effectively reducing static electricity accumulation on the surface of the expanded blue film 6, and avoiding particulate contamination and equipment failure caused by static electricity. The clamping component 5 consists of two support bars 501, positive and negative threaded rods 504, and an adjustment knob 505. The clamping component 5 adjusts the clamping force of the expanded blue film 6 through the positive and negative threaded rods 504 to ensure the stability of the film during processing. The horizontal guide groove 502 and the slider 506 ensure that the clamping component 5 can accurately adjust the overall position of the film, while reducing the offset of the film during the static elimination process. The damping bearing 509 can prevent excessive vibration of the film and protect the surface of the expanded blue film 6 from damage. This structure ensures the stability of the film throughout the entire processing process by precisely adjusting the clamping force of the film, further improving the static removal effect.

[0043] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A static electricity elimination device for wafer fabrication and expansion processes, characterized in that: The device includes a roll of blue film (6), a clamping assembly (5) for clamping and positioning the two sides of the blue film (6) is provided on one side of the blue film (6), an electrostatic elimination assembly (4) for eliminating static electricity on the surface of the blue film (6) is provided at the upper part of one side of the blue film (6), a guide assembly (2) for assisting the movement of the electrostatic elimination assembly (4) is provided on one side of the clamping assembly (5), a displacement mechanism (3) for driving the electrostatic elimination assembly (4) to move is provided on the outside of the guide assembly (2), and a support assembly (1) for supporting the guide assembly (2), the electrostatic elimination assembly (4) and the clamping assembly (5) is provided on one side of the clamping assembly (5).

2. The electrostatic elimination device for wafer fabrication and expansion process according to claim 1, characterized in that: The support assembly (1) includes a main support block (101), and a stepper motor (102) and a conductive slip ring (103) are respectively fixedly sleeved at the center of the main support block (101) near both ends.

3. The electrostatic elimination device for wafer fabrication and expansion process according to claim 2, characterized in that: The guide assembly (2) includes a first support ring (201) and a second support ring (202). The first support ring (201) is fixedly sleeved on the outside of the output end of the stepper motor (102), and the second support ring (202) is fixedly sleeved on the outside of the rotating end of the conductive slip ring (103). The upper ends of the first support ring (201) and the second support ring (202) are fixedly connected with arc-shaped racks (203). Arc-shaped limiting grooves (204) are opened at the center of the two sides of the Spassky arc-shaped rack (203) that are far apart from each other. Arc-shaped guide grooves (205) are opened at the center of the upper end of the arc-shaped rack (203) on both sides.

4. The electrostatic elimination device for wafer fabrication and expansion process according to claim 3, characterized in that: The displacement mechanism (3) includes two support plates (301), which are respectively disposed on both sides of the arc rack (203). On the side of the arc rack (203) that is close to each other, multiple support columns (302) are fixedly connected in a fan-shaped arrangement near the upper part of the center. On the side of the arc rack (203) that is close to each other, multiple support columns (302) on one side and multiple support columns (302) on the other side are connected to pulleys (303) through bearings. Multiple pulleys (303) are slidably sleeved in the two arc-shaped limiting grooves (204). A transmission shaft (304) is connected to the lower part of the center of the two support plates (301) through bearings. A spur gear (305) is fixedly sleeved at the center of the outer side of the transmission shaft (304). The spur gear (305) and the arc rack (203) are engaged by gear meshing.

5. The electrostatic elimination device for wafer fabrication and expansion process according to claim 4, characterized in that: Multiple threaded holes (306) are evenly spaced at the center of the upper ends of the two support plates (301). A mating plate (307) is provided at the upper end of the two support plates (301). Multiple fastening bolts (308) are evenly spaced on both sides of the mating plate (307) and threaded into it. The mounting ends of the multiple fastening bolts (308) are threaded into the multiple threaded holes (306). A protective spur gear (3) is fixedly fitted at the lower end of the two support plates (301). The protective cover (309) of 05) has a servo motor (3010) fixedly connected to the center of one of the support plates (301) away from the spur gear (305) at a lower position. The output end of the servo motor (3010) is fixedly connected to one end of the transmission shaft (304). The lower center of the docking plate (307) is fixedly connected to both sides of the arc-shaped guide rail (3011). The two arc-shaped guide rails (3011) are slidably sleeved inside the two arc-shaped guide grooves (205).

6. The electrostatic discharge device for wafer fabrication and expansion process according to claim 5, characterized in that: The static elimination component (4) includes a support plate (401), which is fixedly connected to the center of the support plate (301) on the side away from the servo motor (3010). Positioning sleeves (402) are fixedly connected to both the upper and lower ends of the center of the side of the support plate (401) away from the support plate (301). An electric telescopic rod (403) is fixedly fitted inside each of the two positioning sleeves (402). A retaining sleeve (404) is fixedly connected to the lower output end of the electric telescopic rod (403). An ion fan (405) is snapped into the retaining sleeve (404).

7. The electrostatic elimination device for wafer fabrication and expansion process according to claim 2, characterized in that: The clamping assembly (5) includes two support bars (501). The two support bars (501) are fixedly connected to the upper and lower ends of the center of one side of the main support block (101). Horizontal guide grooves (502) are provided at the lower center of the upper support bar (501) and the upper center of the lower support bar (501). Two side support blocks (503) are fixedly connected to both ends of the two support bars (501). The two side support blocks (503) are rotatably sleeved with positive and negative threaded rods (504) through bearings. An adjustment knob (505) is fixedly connected to one end of the positive and negative threaded rods (504).

8. The electrostatic elimination device for wafer fabrication and expansion process according to claim 7, characterized in that: The positive and negative threaded rods (504) are threaded with sliders (506) at both ends on the outer side. The upper and lower ends of the two sliders (506) are fixedly connected with horizontal guide rails (507). The four horizontal guide rails (507) are slidably sleeved inside the two horizontal guide grooves (502). The center of the side of the two sliders (506) away from the main support block (101) is fixedly connected with clamping plates (508). The center of the inside of the two clamping plates (508) is fixedly sleeved with damping bearings (509). The inner ring of the two damping bearings (509) is clamped with insert rods (5010), and the insert rods (5010) and the two damping bearings (509) are detachably connected. The expanded blue film (6) is wrapped around the outside of the damping bearings (509).

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