Heat conduction and heat dissipation integrated circuit board of mining machine

Abstract

The utility model relates to the field of circuit boards, in particular to a mining machine heat conduction and heat dissipation integrated circuit board which comprises a heat conduction board. The lower end of the heat conduction plate is fixedly connected with uniformly distributed heat dissipation blocks, and the upper end of the heat conduction plate is fixedly connected with a first high heat conduction insulating layer. According to the utility model, an aluminum substrate and a heat-conducting silicone grease layer are removed, and the high-heat-conducting insulating layer is adopted to directly bridge the chip to be connected with the heat-conducting plate, so that the heat transfer level is greatly shortened, the interface thermal resistance is remarkably reduced, the heat is rapidly and directionally conducted, and the working temperature stability of the chip is improved; performance fluctuation caused by heat attenuation of multiple layers of media of a traditional structure is effectively avoided, through collaborative design of the T-shaped heat dissipation grooves and the columnar heat conduction columns, a three-dimensional heat dissipation channel is constructed, the air convection efficiency is enhanced, the heat conduction plates made of high-heat-conduction materials are combined, the overall heat dissipation capacity is remarkably improved, continuous and stable operation of the chip under the high-load working condition is ensured, and the service life of the chip is prolonged. The compact structure design breaks through the space limitation of a traditional heat dissipation system.

Description

Technical Field

[0001] This utility model belongs to the field of circuit boards, specifically relating to an integrated heat dissipation circuit board for mining machines. Background Technology

[0002] In the cryptocurrency mining industry, mining machines are core equipment. As their performance improves, higher requirements are placed on the heat dissipation system. The high heat generated by the chips during mining operation must be dissipated through an efficient heat dissipation path; otherwise, it will lead to a decline in equipment performance, a shortened lifespan, or even failure.

[0003] Traditional mining machine heat dissipation structures rely on multiple layers of media to conduct heat, including chips, solder paste, copper foil, insulating layers, aluminum substrates, thermal grease, and heat sinks. Heat needs to be transferred through multiple interfaces, leading to the accumulation of thermal resistance. The thermal grease layer is susceptible to issues such as thickness, uniformity, and aging, further reducing heat dissipation stability. In addition, the complex structure results in mining machines being bulky and cumbersome to assemble, making it difficult to meet the needs of dense deployment.

[0004] Therefore, an integrated heat dissipation circuit board for mining machines is proposed, which eliminates the aluminum substrate and thermal grease layer, integrates the heat dissipation function into the PCB substrate, and uses high thermal conductivity materials to directly connect the chip and the heat sink, shortening the heat conduction path. Under the premise of ensuring heat dissipation efficiency, the number of components is reduced, the size is reduced, and the weight is reduced. Utility Model Content

[0005] To overcome the problems of poor heat dissipation and large size affecting installation of existing mining machine circuit boards, an integrated heat dissipation circuit board for mining machines is proposed.

[0006] The technical solution of this utility model is as follows: an integrated heat dissipation circuit board for mining machines, including a heat-conducting plate; a uniformly distributed heat dissipation block is fixed to the lower end of the heat-conducting plate, a first high thermal conductivity insulating layer is fixed to the upper end of the heat-conducting plate, a first line copper foil and a second line copper foil are fixed to the upper end of the first high thermal conductivity insulating layer, both the first line copper foil and the second line copper foil are U-shaped blocks, a second high thermal conductivity insulating layer is fixed to the inner wall of the first line copper foil, a third high thermal conductivity insulating layer is fixed to the inner wall of the second line copper foil, a solder paste layer is fixed to the upper end of the second line copper foil, a chip body is fixed to the upper end of the solder paste layer, the opening directions of the first line copper foil and the second line copper foil are opposite, and there is a gap at the end of the first line copper foil and the second line copper foil that are close to each other, and the length of the gap is greater than three millimeters.

[0007] Preferably, a first heat dissipation groove is evenly distributed through one side of the heat-conducting plate, and a third heat dissipation groove is evenly distributed through the upper end of the heat-conducting plate, with the lower end of the third heat dissipation groove communicating with the interior of the first heat dissipation groove.

[0008] Preferably, the third heat dissipation slot is T-shaped, and the heat conduction plate is made of thermally conductive material.

[0009] Preferably, a second heat dissipation groove is evenly distributed through one side of the heat-conducting plate. The second heat dissipation groove is a rectangular groove, and the interior of the second heat dissipation groove is interconnected with that of the first heat dissipation groove.

[0010] Preferably, the top and bottom surfaces of the inner wall of the second heat dissipation groove are provided with cylindrical grooves, and heat-conducting columns are fixed to the inner wall of the cylindrical grooves.

[0011] Preferably, the two sides of the heat-conducting pillar are flush with the two sides of the heat-conducting plate, and the two sides of the heat sink are flush with the two sides of the heat-conducting plate.

[0012] Preferably, the upper ends of the first line copper foil and the upper ends of the second line copper foil are flush, and the thicknesses of the first line copper foil and the second line copper foil are equal.

[0013] The beneficial effects of this utility model are:

[0014] 1. By removing the aluminum substrate and thermal grease layer, a high thermal conductivity insulating layer is used to directly bridge the chip and the heat dissipation plate, which greatly shortens the heat transfer levels, significantly reduces the interface thermal resistance, realizes rapid directional heat conduction, improves the stability of chip operating temperature, effectively avoids the performance fluctuation caused by the thermal decay of multiple layers of media in traditional structures, and solves the problem of poor heat dissipation of existing mining machine circuit boards.

[0015] 2. By using a T-shaped heat sink and columnar heat-conducting pillars in synergy, a three-dimensional heat dissipation channel is constructed to enhance air convection efficiency. Combined with a heat-conducting plate made of high thermal conductivity material, the overall heat dissipation capacity is significantly improved, ensuring the chip continues to operate stably under high load conditions. The compact structure design breaks through the space limitations of traditional heat dissipation systems, and the modular layout facilitates high-density deployment of mining machines, providing greater flexibility for mining rack configuration and solving the problem of the large size of existing mining machine circuit board heat dissipation structures affecting installation. Attached Figure Description

[0016] Figure 1 The diagram shown is a three-dimensional structural schematic of the integrated heat dissipation circuit board for mining machines according to this utility model.

[0017] Figure 2 The image shown is a front view of the integrated heat dissipation circuit board for mining machines according to this utility model.

[0018] Figure 3 The diagram shows a three-dimensional structural schematic of the chip body of the integrated heat dissipation circuit board for mining machines according to this utility model.

[0019] Figure 4 The diagram shown is a three-dimensional structural schematic of the heat-conducting plate of the integrated heat-conducting and heat-dissipating circuit board for mining machines according to this utility model.

[0020] The labels in the attached diagram are as follows: 1. Heat-conducting plate; 2. Heat sink; 3. First high thermal conductivity insulating layer; 4. First circuit copper foil; 5. Second high thermal conductivity insulating layer; 6. Second circuit copper foil; 7. Third high thermal conductivity insulating layer; 8. Solder paste layer; 9. Chip body; 10. First heat sink; 11. Second heat sink; 12. Columnar groove; 13. Heat-conducting pillar; 14. Third heat sink. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] Please see Figures 1-4 This utility model provides an embodiment of an integrated heat dissipation circuit board for mining machines, comprising a heat-conducting plate 1; a uniformly distributed heat dissipation block 2 is fixedly connected to the lower end of the heat-conducting plate 1, a first high thermal conductivity insulating layer 3 is fixedly connected to the upper end of the heat-conducting plate 1, a first circuit copper foil 4 and a second circuit copper foil 6 are fixedly connected to the upper end of the first high thermal conductivity insulating layer 3, both the first circuit copper foil 4 and the second circuit copper foil 6 are U-shaped blocks, a second high thermal conductivity insulating layer 5 is fixedly connected to the inner wall of the first circuit copper foil 4, a third high thermal conductivity insulating layer 7 is fixedly connected to the inner wall of the second circuit copper foil 6, a solder paste layer 8 is fixedly connected to the upper end of the second circuit copper foil 6, a chip body 9 is fixedly connected to the upper end of the solder paste layer 8, the opening directions of the first circuit copper foil 4 and the second circuit copper foil 6 are opposite, and there is a gap at the end of the first circuit copper foil 4 and the second circuit copper foil 6 that are close to each other, and the length of the gap is greater than three millimeters.

[0023] By fixing evenly distributed heat dissipation blocks 2 to the lower end of the heat-conducting plate 1, the heat dissipation area can be expanded and the heat conduction efficiency can be enhanced. A first high thermal conductivity insulation layer 3 is fixed to the upper end of the heat-conducting plate 1. The first high thermal conductivity insulation layer 3 can isolate the circuit from the heat-conducting structure, prevent short circuits, and maintain high thermal conductivity. The first line copper foil 4 and the second line copper foil 6 are both U-shaped blocks, which increases the surface area of ​​the copper foil, improves the current carrying capacity and heat dissipation performance. The opening directions of the first line copper foil 4 and the second line copper foil 6 are opposite and there is a gap of more than three millimeters between their close ends, which can effectively avoid circuit short circuits and ensure the insulation safety distance.

[0024] Please see Figures 1-4 In this embodiment, a first heat dissipation groove 10 is evenly distributed through one side of the heat-conducting plate 1, and a third heat dissipation groove 14 is evenly distributed through the upper end of the heat-conducting plate 1. The lower end of the third heat dissipation groove 14 is interconnected with the interior of the first heat dissipation groove 10. The arrangement of the first heat dissipation groove 10 can optimize the airflow path and improve the convection heat dissipation efficiency. The design of the third heat dissipation groove 14 being interconnected with the first heat dissipation groove 10 can form a three-dimensional heat dissipation channel and enhance the heat diffusion capability.

[0025] Please see Figures 1-4In this embodiment, the third heat dissipation groove 14 is T-shaped, and the heat conduction plate 1 is made of thermally conductive material. The T-shaped design of the third heat dissipation groove 14 increases the groove volume and improves the heat dissipation capacity. The heat conduction plate 1 is made of thermally conductive material to ensure efficient heat conduction and reduce thermal resistance.

[0026] Please see Figures 1-4 In this embodiment, a uniformly distributed second heat dissipation groove 11 is provided through one side of the heat conduction plate 1. The second heat dissipation groove 11 is a rectangular groove. The second heat dissipation groove 11 and the first heat dissipation groove 10 are interconnected. The second heat dissipation groove 11 has a bidirectional heat dissipation design to enhance the heat dissipation balance. The second heat dissipation groove 11 is a rectangular groove and is interconnected with the first heat dissipation groove 10, forming a cross heat dissipation network and improving the overall heat dissipation efficiency of the structure.

[0027] Please see Figures 1-4 In this embodiment, the top and bottom surfaces of the inner wall of the second heat dissipation groove 11 are provided with cylindrical grooves 12, and the inner wall of the cylindrical groove 12 is fixed with a heat-conducting column 13, which can improve the heat conduction and heat dissipation effect.

[0028] Please see Figures 1-4 In this embodiment, the two sides of the heat-conducting pillar 13 are flush with the two sides of the heat-conducting plate 1, and the two sides of the heat sink 2 are flush with the two sides of the heat-conducting plate 1, which ensures the flatness of the overall structure and facilitates modular installation.

[0029] Please see Figures 1-4 In this embodiment, the upper end of the first line copper foil 4 and the upper end of the second line copper foil 6 are flush, and the thickness of the first line copper foil 4 and the second line copper foil 6 are equal, ensuring a flat soldering surface and improving chip installation stability and heat dissipation uniformity.

[0030] Working principle: The heat-conducting plate 1 of the circuit board is made of a high thermal conductivity material and has good thermal conductivity. When the chip body 9 above the circuit board is working, it will generate a lot of heat. The heat is transferred through the chip body 9 and the solder paste layer 8 to the first line copper foil 4 and the second line copper foil 6, and then conducted to the heat-conducting plate 1 through the copper foil.

[0031] The heat-conducting plate 1 has multiple heat dissipation slots on one side, including a first heat dissipation slot 10, a second heat dissipation slot 11 and a third heat dissipation slot 14. The heat dissipation path is reasonably arranged in the design. The first heat dissipation slot 10 and the second heat dissipation slot 11 are interconnected. The convective heat dissipation efficiency is improved by optimizing the air flow path. The third heat dissipation slot 14 has a T-shaped design, which further increases the slot volume and enhances the heat dissipation capacity.

[0032] To improve heat dissipation, the upper part of the heat-conducting plate 1 that contacts the copper foil circuit is provided with a first high thermal conductivity insulation layer 3, a second high thermal conductivity insulation layer 5 and a third high thermal conductivity insulation layer 7. These high thermal conductivity insulation layers effectively isolate the circuit from the heat dissipation structure, prevent short circuits, and ensure that heat can be conducted efficiently.

[0033] The third heat sink 14 is interconnected with the first heat sink 10, forming a three-dimensional heat dissipation channel. Through this design, heat dissipation is not limited to a single plane, which can greatly improve the heat diffusion capability and heat dissipation efficiency, ensuring the stability of the chip under long-term operation. Multiple cylindrical slots 12 are set in the second heat sink 11, and heat-conducting pillars 13 are fixed to its inner wall, which further improves the heat conduction effect. The design of the heat-conducting pillars 13 increases the heat transfer path and enhances the heat dissipation effect. At the same time, the distribution of the cylindrical structure can make the heat more evenly distributed to the entire heat dissipation area.

[0034] During installation, the heat sink 2 and the heat conduction plate 1 are flush on both sides, ensuring the flatness of the entire heat dissipation system and facilitating modular installation later. The uniform distribution of the heat sink 2 further increases the overall heat dissipation area and improves the heat dissipation performance.

[0035] In addition, the opening directions of the first line copper foil 4 and the second line copper foil 6 are opposite, and the gap between them is greater than three millimeters. This design effectively avoids short circuits, ensures the insulation safety of the circuit, and improves the reliability of the electrical system.

Claims

1. A mining machine heat dissipation integrated circuit board, comprising a heat-conducting plate (1); characterized in that: The lower end of the heat-conducting plate (1) is fixed with uniformly distributed heat dissipation blocks (2), the upper end of the heat-conducting plate (1) is fixed with a first high thermal conductivity insulation layer (3), the upper end of the first high thermal conductivity insulation layer (3) is fixed with a first circuit copper foil (4) and a second circuit copper foil (6), the first circuit copper foil (4) and the second circuit copper foil (6) are both U-shaped blocks, the inner wall of the first circuit copper foil (4) is fixed with a second high thermal conductivity insulation layer (5), the inner wall of the second circuit copper foil (6) is fixed with a third high thermal conductivity insulation layer (7), the upper end of the second circuit copper foil (6) is fixed with a solder paste layer (8), the upper end of the solder paste layer (8) is fixed with a solder paste layer (8) A chip body (9) is fixedly attached. The opening directions of the first line copper foil (4) and the second line copper foil (6) are opposite. There is a gap at the end of the first line copper foil (4) and the second line copper foil (6) that are close to each other, and the length of the gap is greater than three millimeters. A first heat dissipation groove (10) is evenly distributed through one side of the heat-conducting plate (1). A third heat dissipation groove (14) is evenly distributed through the upper end of the heat-conducting plate (1). The lower end of the third heat dissipation groove (14) is interconnected with the interior of the first heat dissipation groove (10). The third heat dissipation groove (14) is T-shaped. The heat-conducting plate (1) is made of thermally conductive material.

2. The integrated heat dissipation circuit board for mining machines according to claim 1, characterized in that: A second heat dissipation groove (11) is evenly distributed through one side of the heat conduction plate (1). The second heat dissipation groove (11) is a rectangular groove, and the second heat dissipation groove (11) and the first heat dissipation groove (10) are interconnected.

3. The integrated heat dissipation circuit board for mining machines according to claim 2, characterized in that: The top and bottom surfaces of the inner wall of the second heat dissipation groove (11) are provided with columnar grooves (12), and heat-conducting columns (13) are fixed to the inner wall of the columnar grooves (12).

4. The integrated heat dissipation circuit board for mining machines according to claim 3, characterized in that: The two sides of the heat-conducting column (13) are flush with the two sides of the heat-conducting plate (1), and the two sides of the heat dissipation block (2) are flush with the two sides of the heat-conducting plate (1).

5. The integrated heat dissipation circuit board for mining machines according to claim 1, characterized in that: The upper end of the first line copper foil (4) is flush with the upper end of the second line copper foil (6), and the thicknesses of the first line copper foil (4) and the second line copper foil (6) are equal.

Images