Jet flow phase change cold plate

Abstract

The utility model relates to the technical field of cold plates, in particular to a jet flow phase change cold plate which comprises a cold plate body. A first partition plate and a second partition plate are arranged in the cold plate body; a plurality of jet flow holes are formed in the middle of the second partition plate in a penetrating mode. Through the arrangement of the upper cavity, the middle cavity and the lower cavity, a refrigerant entering the middle cavity can exchange heat with a refrigerant in the upper cavity and a refrigerant in the lower cavity respectively, so that the temperature of the refrigerant in the middle cavity is increased, and the refrigerant is changed into a low supercooling degree state or a vapor-liquid two-phase state; the temperature of the refrigerant in a vapor-liquid two-phase state is not changed after the refrigerant absorbs heat until the liquid refrigerant is completely changed into the gaseous refrigerant, so that the temperature uniformity of the cold plate is ensured; in addition, the multiple jet flow holes are formed, so that refrigerants with certain pressure shoot the boiling structure at a certain speed, the thickness of a wall surface temperature boundary layer is reduced, and the effects of increasing the heat exchange capacity and improving the cooling efficiency are achieved.

Description

Technical Field

[0001] This utility model relates to the field of cold plate technology, specifically to a jet phase change cold plate. Background Technology

[0002] With the booming development of artificial intelligence and big data, electronic chips are moving towards smaller size and higher power, resulting in increasingly larger heat flux densities. This causes local temperatures to exceed their threshold in a very short time, leading to thermal stress and strain in the electronic chip. This can cause squeezing and pulling inside the chip, and in extreme cases, it can instantly induce fracture, causing permanent damage to the chip. Therefore, it is particularly important to properly control the temperature and temperature uniformity of the cold plate.

[0003] Microchannel two-phase cooling plates primarily utilize the phase change heat absorption during fluid flow and boiling to remove heat. Leveraging the heat transfer characteristics of flow boiling and the microscale effect of microchannels, flow boiling cooling within microchannels offers advantages such as compact structure, strong heat exchange capacity, high heat transfer coefficient, good temperature uniformity, and low working fluid charge. Therefore, flow boiling phase change cooling technology within microchannels is one of the effective solutions for heat dissipation problems involving high heat flux densities. However, because flow boiling itself is an extremely vigorous and complex multiphase flow process, the growth, expansion, and movement of bubbles are easily affected by numerous factors, leading to poor stability of the flow boiling process for various working fluids within microchannels. Once unstable boiling occurs within a microchannel, it can lead to a series of problems such as uneven flow distribution among parallel multichannels, intermittent hot spots, and oscillations in flow rate and pressure drop. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the prior art by providing a jet phase change cooling plate.

[0005] The objective of this utility model is achieved through the following technical solution: a jet phase change cold plate, comprising a cold plate body; the cold plate body is provided with a first partition and a second partition; the first partition and the second partition divide the cold plate body into an upper cavity, a middle cavity and a lower cavity; the upper cavity is located at the top of the first partition; the middle cavity is located between the first partition and the second partition; the lower cavity is located at the bottom of the second partition; the cold plate body is provided with an inlet pipe and an outlet pipe; the inlet pipe is connected to the middle cavity; the outlet pipe is connected to the upper cavity;

[0006] The second partition has multiple jet holes running through its center; guide tubes are provided on both sides of the second partition; the lower cavity is connected to the middle cavity through the jet holes; and the lower cavity is connected to the upper cavity through the guide tubes.

[0007] The present invention is further configured such that the liquid outlet pipe is located in the middle of the upper cavity; and the guide pipe is located on both sides of the cold plate body along the length direction.

[0008] The present invention is further configured such that a plurality of jet holes are provided through the middle of the second partition plate; the plurality of jet holes are evenly distributed on the second partition plate.

[0009] The present invention is further configured such that the lower cavity is provided with a boiling structure.

[0010] The present invention is further configured such that a gap is provided between the boiling structure and the second partition.

[0011] The present invention is further configured such that the jet hole is located at the top of the boiling structure.

[0012] The present invention is further configured such that the boiling structure includes multiple ribs extending along the length of the cold plate body; microchannels are formed between the multiple ribs.

[0013] The present invention is further provided that the surface of the rib has a rough structure.

[0014] The present invention is further configured such that the boiling structure includes a plurality of granular parts made of porous material.

[0015] The present invention is further configured such that the boiling structure also includes a copper column.

[0016] The beneficial effects of this invention are as follows: By setting up an upper cavity, a middle cavity, and a lower cavity, the refrigerant entering the middle cavity can exchange heat with the refrigerants in the upper and lower cavities respectively. This causes the temperature of the refrigerant in the middle cavity to rise, and the refrigerant becomes either in a low subcooled state or a vapor-liquid two-phase state. The refrigerant in the vapor-liquid two-phase state absorbs heat and its temperature remains constant until all the liquid refrigerant becomes gaseous, ensuring the uniformity of the cold plate temperature. In addition, by setting up multiple jet holes, the refrigerant with a certain pressure is shot at the boiling structure at a certain speed, reducing the thickness of the wall temperature boundary layer, thereby increasing the heat exchange capacity and improving the cooling efficiency. Attached Figure Description

[0017] The utility model will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present utility model. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model;

[0019] Figure 2 This is a cross-sectional view of Embodiment 1 of this utility model;

[0020] Figure 3This is a schematic diagram of the structure behind the concealed cold plate body and the first partition of this utility model;

[0021] Figure 4 yes Figure 3 A magnified view of part A in the middle;

[0022] Figure 5 This is a cross-sectional view of Embodiment 2 of this utility model;

[0023] The components are: 1. Cold plate body; 11. First partition; 12. Second partition; 21. Upper cavity; 22. Middle cavity; 23. Lower cavity; 31. Liquid inlet pipe; 32. Liquid outlet pipe; 4. Jet hole; 5. Guide pipe; 6. Gap; 71. Rib; 72. Microchannel; 81. Parts; 82. Copper column. Detailed Implementation

[0024] The present invention will be further described in conjunction with the following embodiments.

[0025] Example 1, by Figures 1 to 4 As can be seen, the jet phase change cold plate described in this embodiment includes a cold plate body 1; the cold plate body 1 is provided with a first partition 11 and a second partition 12; the first partition 11 and the second partition 12 divide the interior of the cold plate body 1 into an upper cavity 21, a middle cavity 22 and a lower cavity 23; the upper cavity 21 is located at the top of the first partition 11; the middle cavity 22 is located between the first partition 11 and the second partition 12; the lower cavity 23 is located at the bottom of the second partition 12; the cold plate body 1 is provided with an inlet pipe 31 and an outlet pipe 32; the inlet pipe 31 is connected to the middle cavity 22; the outlet pipe 32 is connected to the upper cavity 21;

[0026] The second partition 12 has multiple jet holes 4 through its middle section; the second partition 12 has guide pipes 5 on both sides; the lower cavity 23 is connected to the middle cavity 22 through the jet holes 4; the lower cavity 23 is connected to the upper cavity 21 through the guide pipes 5.

[0027] Specifically, in this embodiment, the jet phase change cold plate is used by placing the heating element at the bottom of the cold plate body 1. The refrigerant enters the middle cavity 22 through the liquid inlet pipe 31 and then enters the lower cavity 23 through the jet hole 4. The heating element exchanges heat with the refrigerant in the lower cavity 23. Then the refrigerant flows into the upper cavity 21 through the guide pipes 5 on both sides and flows out from the liquid outlet pipe 32.

[0028] Through the above-described configuration, the refrigerant entering the middle cavity 22 can exchange heat with the refrigerant in the upper cavity 21 and the refrigerant in the lower cavity 23, respectively. This causes the temperature of the refrigerant in the middle cavity 22 to rise, and the refrigerant to become a low subcooled state or a vapor-liquid two-phase state. The temperature of the refrigerant in the vapor-liquid two-phase state remains unchanged after absorbing heat, until all the liquid refrigerant becomes gaseous refrigerant, thus ensuring the uniformity of the cold plate temperature.

[0029] Furthermore, the refrigerant enters the lower cavity 23 through the jet holes 4 of the second partition 12. Each jet hole 4 is a jet inlet, which allows the refrigerant entering the lower cavity 23 to be evenly sprayed onto the impact surface, improving the cooling effect and uniformity. The jet holes 4 can be inlets of the same shape or different shapes. The spacing of the jet holes 4 can be used to ensure uniform coverage, and the diameter of the jet holes 4 can be controlled to balance the flow rate and pressure loss. The uniform flow distribution and optimized flow rate ensure sufficient contact with the boiling structure, thereby improving the heat transfer efficiency. In addition, the refrigerant with a certain pressure is shot at the boiling structure at a certain speed, reducing the wall temperature boundary layer thickness, thereby increasing the heat exchange capacity and improving the cooling efficiency.

[0030] In this embodiment, a jet phase change cold plate is described, wherein the liquid outlet pipe 32 is located in the middle of the upper cavity 21; and the guide pipes 5 are located on both sides of the cold plate body 1 along its length. This arrangement allows the refrigerant to flow sufficiently through each cavity.

[0031] In this embodiment, a jet phase change cold plate is provided with multiple jet holes 4 penetrating through the middle of the second partition 12; the multiple jet holes 4 are evenly distributed on the second partition 12. This arrangement ensures that the refrigerant entering the lower cavity 23 is evenly sprayed onto the impact surface, thus guaranteeing the temperature uniformity of the cold plate.

[0032] The jet phase change cold plate described in this embodiment has a boiling structure in its lower cavity 23. Specifically, by setting the boiling structure, the refrigerant can be heated and vaporized at the boiling structure, and part of the liquid refrigerant becomes gaseous, thereby causing boiling heat exchange, resulting in a high heat transfer coefficient and reducing the temperature of electronic devices.

[0033] In this embodiment, a jet phase change cold plate is provided with a gap 6 between the boiling structure and the second partition 12. Specifically, the refrigerant is heated and vaporized at the boiling structure, and part of the liquid refrigerant becomes gaseous. The gaseous refrigerant is lifted and collects in the gap 6 at the top of the boiling structure, which can prevent the gaseous refrigerant from becoming blocked at the boiling structure, thus preventing drastic fluctuations in flow rate, pressure, and temperature.

[0034] In this embodiment, a jet phase change cold plate is described, with the jet hole 4 located at the top of the boiling structure. This arrangement ensures that the refrigerant entering the lower cavity 23 is uniformly sprayed onto the boiling structure, thus guaranteeing the temperature uniformity of the cold plate.

[0035] This embodiment describes a jet phase change cold plate, wherein the boiling structure includes multiple ribs 71 extending along the length of the cold plate body 1; microchannels 72 are formed between the multiple ribs 71. Specifically, refrigerant enters the microchannel 72 region, and there is a certain distance between the top of the microchannel 72 region and the second partition 12, forming a certain void region. The microchannel 72 region increases the contact area between the refrigerant and the cold plate body 1. Secondly, the heat transfer coefficient of the microchannel 72 region is high, which is beneficial for heat dissipation of electronic devices with high heat flux density. The refrigerant is heated and vaporized in the microchannel 72 region, and part of the liquid refrigerant becomes gaseous. The gaseous refrigerant is lifted and gathers in the gap 6 at the top of the microchannel 72 region, preventing the gaseous refrigerant from becoming blocked in the microchannel 72 channel, causing violent fluctuations in flow, pressure, and temperature, and creating local hot spots in the cold plate body 1. The ribs 71 can be processed using appropriate methods or combinations of methods, including CNC, extrusion, tooth cutting, micro-electrical discharge wire cutting, photolithography, or 3D printing.

[0036] In this embodiment, a jet phase change cooling plate is described, wherein the surface of the rib 71 has a rough structure. The surface of the rib 71 has a rough structure and is not smooth. For example, random defects, such as machining marks, can be generated on its surface, thereby increasing turbulence or forming vaporization cavities, which can improve the transfer efficiency of latent heat of vaporization.

[0037] Example 2, as Figure 5 As shown, unlike Embodiment 1, the jet phase change cold plate described in this embodiment includes a boiling structure comprising multiple granular parts 81 made of porous material. The boiling structure of the jet phase change cold plate described in this embodiment also includes copper pillars 82.

[0038] Specifically, in this embodiment, the particulate component 81 can be made by directly sintering copper powder on a flat wall surface, installing copper foam, or using a grooved combination with sintered copper powder. All of these methods result in a porous structure. The refrigerant is evenly distributed due to the capillary action of the sintered copper powder and copper foam. Simultaneously, the copper powder and copper foam increase the number of vaporization nuclei, thus increasing boiling heat transfer. The refrigerant is sprayed onto the surface of the sintered copper powder or copper foam through multiple jet holes 4. The liquid refrigerant is evenly distributed on the sintered surface due to capillary action, preventing drying out in areas with high heat flux density. Furthermore, the heat exchange area can be increased by adding copper pillars 82. Copper powder can be sintered on the copper pillars 82, and the refrigerant can rise to a certain height due to capillary force, thereby increasing the heat exchange area. This porous structure increases the heat exchange area and the number of vaporization nuclei, thus increasing the heat transfer coefficient.

[0039] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A jet phase change cooling plate, characterized in that: The device includes a cold plate body (1); the cold plate body (1) is provided with a first partition (11) and a second partition (12); the first partition (11) and the second partition (12) divide the cold plate body (1) into an upper cavity (21), a middle cavity (22) and a lower cavity (23); the upper cavity (21) is located at the top of the first partition (11); the middle cavity (22) is located between the first partition (11) and the second partition (12); the lower cavity (23) is located at the bottom of the second partition (12); the cold plate body (1) is provided with an inlet pipe (31) and an outlet pipe (32); the inlet pipe (31) is connected to the middle cavity (22); the outlet pipe (32) is connected to the upper cavity (21); The second partition (12) has multiple jet holes (4) through its middle section; the second partition (12) has guide pipes (5) on both sides; the lower cavity (23) is connected to the middle cavity (22) through the jet holes (4); the lower cavity (23) is connected to the upper cavity (21) through the guide pipes (5).

2. The jet phase change cold plate according to claim 1, characterized in that: The liquid outlet pipe (32) is located in the middle of the upper cavity (21); the guide pipe (5) is located on both sides of the cold plate body (1) along the length direction.

3. The jet phase change cold plate according to claim 1, characterized in that: The second partition (12) has multiple jet holes (4) through its middle section; the multiple jet holes (4) are evenly distributed on the second partition (12).

4. The jet phase change cold plate according to claim 1, characterized in that: The lower cavity (23) is equipped with a boiling structure.

5. A jet phase change cold plate according to claim 4, characterized in that: A gap (6) is provided between the boiling structure and the second partition (12).

6. A jet phase change cold plate according to claim 4, characterized in that: The jet hole (4) is located at the top of the boiling structure.

7. A jet phase change cold plate according to claim 4, characterized in that: The boiling structure includes multiple ribs (71) extending along the length of the cold plate body (1); microchannels (72) are formed between the multiple ribs (71).

8. A jet phase change cold plate according to claim 7, characterized in that: The surface of the rib (71) has a rough structure.

9. A jet phase change cold plate according to claim 4, characterized in that: The boiling structure comprises multiple granular components (81) made of porous material.

10. A jet phase change cold plate according to claim 9, characterized in that: The boiling structure also includes copper pillars (82).

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