Structure-enhanced UV packaging ceramic substrate

Abstract

The utility model discloses a structure-enhanced UV packaging ceramic substrate, which comprises a ceramic base layer, a metal box dam, a front bonding pad, a back bonding pad, a first heat dissipation layer, a second heat dissipation layer and a light-transmitting cover plate, the annular dovetail groove is concavely formed in the periphery of the upper surface of the ceramic base layer, and the annular dovetail block of the metal box dam is arranged in the annular dovetail groove and is matched with the annular dovetail groove, so that the metal box dam and the ceramic base layer are firmly combined together, and the stability of the connecting structure is effectively enhanced; the phenomenon that the ceramic base layer is separated from the metal box dam is avoided, the overall performance of a product is guaranteed, the product quality is improved, and the service life of the product is prolonged; according to the ceramic substrate, the width of the middle layer of the metal box dam is larger than that of the main body layer, the main body layer of the inverted-cone-shaped structure is arranged in a matched mode, the stress of the metal box dam on the ceramic base layer can be effectively reduced through the ceramic substrate of the structure, cracking of the ceramic base layer caused by stress concentration is prevented, the cold and hot impact resistance of a product is effectively improved, and existing requirements are met.

Description

Technical Field

[0001] This utility model relates to the field of ceramic substrates, and in particular to a structurally enhanced UV-encapsulated ceramic substrate. Background Technology

[0002] Ceramic substrates are special boards made by directly bonding copper foil to the surface (single-sided or double-sided) of an alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperatures. The resulting ultra-thin composite substrates possess excellent electrical insulation properties, high thermal conductivity, excellent solderability, and high adhesion strength. Like PCB boards, they can be etched with various patterns and have a large current-carrying capacity. Therefore, ceramic substrates have become a fundamental material for high-power power electronic circuit structure and interconnection technologies.

[0003] Currently, the microelectronics industry is developing rapidly, and electronic devices and equipment are moving towards high integration and miniaturization, which places increasingly higher demands on the performance of substrates. Alumina ceramic substrates and aluminum nitride ceramic substrates are widely used in electronic packaging fields such as thick-film integrated circuits, LED packaging, and UV packaging due to their excellent insulation properties, good thermal conductivity, low coefficient of thermal expansion, and strong mechanical strength.

[0004] Current UV packaging ceramic substrates generally consist of a ceramic base and a metal dam. The metal dam is located on the upper surface of the ceramic base, while the front and back pads are located on the upper and lower surfaces of the ceramic base and connected to conductive pillars penetrating the ceramic base. Although this type of ceramic substrate has a simple structure, the wettability between the ceramic base and the metal dam is poor, and the adhesion between the surface of the metal dam and the ceramic base is relatively weak. After prolonged use, the ceramic base and the metal dam are prone to separation, leading to a significant decrease in overall product performance, product damage, insufficient structural stability, poor product quality, and a short lifespan. Furthermore, due to the significant difference in the coefficients of thermal expansion between metal and ceramic, excessive stress on the ceramic base during the packaging process can cause cracking. The product also exhibits poor resistance to thermal shock and cannot meet current requirements. Therefore, it is necessary to research a new technical solution to improve current UV packaging ceramic substrates. Utility Model Content

[0005] In view of this, the present invention addresses the shortcomings of existing technologies, and its main objective is to provide a structurally enhanced UV encapsulation ceramic substrate. This substrate effectively solves the problems of poor wettability between the ceramic substrate and the metal dam, poor adhesion between the surface of the metal dam and the ceramic substrate, and the tendency for the ceramic substrate and metal dam to separate after prolonged use. These issues lead to a significant decrease in overall product performance, product damage, insufficient structural stability, poor product quality, and a short service life. Furthermore, due to the large difference in thermal expansion coefficients between metal and ceramic, excessive stress on the ceramic substrate during encapsulation can cause cracking, resulting in poor resistance to thermal shock.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A structure-enhanced UV-encapsulated ceramic substrate includes a ceramic base layer, a metal dam, a front pad, a back pad, a first heat dissipation layer, a second heat dissipation layer, and a light-transmitting cover plate.

[0008] The ceramic substrate is provided with through holes and heat-conducting holes. A conductive pillar is provided in the through holes. There are multiple heat-conducting holes, and a heat-conducting pillar is provided in each heat-conducting hole. An annular dovetail groove is recessed around the upper surface of the ceramic substrate. The metal dam and the ceramic substrate form an upward-opening encapsulation cavity. The encapsulation cavity has a conical structure. The metal dam includes an annular dovetail block, an intermediate layer and a main body layer that are integrally formed and connected in sequence. The annular dovetail block is disposed in the annular dovetail groove and is adapted to the annular dovetail groove. The intermediate layer is disposed on the upper surface of the ceramic substrate. The main body layer extends upward from the surface of the intermediate layer. The width of the intermediate layer is greater than the width of the main body layer. The main body layer has an inverted conical structure.

[0009] The front pad is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the front pad is connected to the upper end of the conductive pillar; the back pad is disposed on the lower surface of the ceramic substrate and connected to the lower end of the conductive pillar; the first heat dissipation layer is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the first heat dissipation layer is connected to the upper end of multiple heat-conducting pillars; the second heat dissipation layer is disposed on the lower surface of the ceramic substrate and connected to the lower end of multiple heat-conducting pillars; the light-transmitting cover is disposed on the metal dam and covers the opening of the encapsulation cavity, and the bottom edge of the light-transmitting cover is sealed and fixed to the metal dam with sealant.

[0010] As a preferred embodiment, the metal dam has an annular groove recessed at the opening edge of the encapsulation cavity, and the bottom surface of the light-transmitting cover has an annular protrusion. The annular protrusion is disposed in the annular groove and is adapted to the annular groove. The annular groove and the annular protrusion are sealed and bonded together with sealant, which effectively enhances the sealing performance of the product.

[0011] As a preferred embodiment, the cross-section of the annular groove is a structure with multiple V-shapes, and correspondingly, the cross-section of the annular protrusion is also a structure with multiple V-shapes, further enhancing the product's sealing performance and improving its quality.

[0012] As a preferred embodiment, the light-transmitting cover includes a main body and an extension extending outward from the upper end of the main body. The annular protrusion is disposed on the bottom periphery of the main body. A first annular groove is disposed on the top surface of the metal dam. The extension is disposed on the top surface of the metal dam. A second annular groove is disposed on the bottom surface of the extension. The second annular groove communicates with the first annular groove and is filled with waterproof adhesive, which effectively enhances the waterproof performance of the product and improves the quality of the product.

[0013] As a preferred embodiment, the first annular groove is an arc-shaped structure, and correspondingly, the second annular groove is also an arc-shaped structure.

[0014] As a preferred embodiment, the ceramic substrate is made of aluminum nitride, which has high thermal conductivity, good mechanical properties, good electrical insulation properties, and chemical stability.

[0015] As a preferred embodiment, the first and second heat dissipation layers are made of graphene, which has excellent heat dissipation and thermal conductivity.

[0016] As a preferred embodiment, the heat-conducting pillar is made of graphene, which has excellent heat dissipation and thermal conductivity.

[0017] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution:

[0018] By recessing annular dovetail grooves around the upper surface of the ceramic substrate, and placing the annular dovetail blocks of the metal dam within and fitting into these grooves, the metal dam and ceramic substrate are firmly bonded together. This effectively enhances the stability of the connection structure, preventing separation between the ceramic substrate and the metal dam after prolonged operation. This ensures the overall performance of the product, prevents damage, improves product quality, and extends its lifespan. Furthermore, by setting the width of the intermediate layer of the metal dam to be greater than the width of the main layer, and combining this with the inverted conical structure of the main layer, this UV-encapsulated ceramic substrate effectively reduces the stress exerted by the metal dam on the ceramic substrate, preventing cracking due to stress concentration. This effectively improves the product's resistance to thermal shock and meets current requirements.

[0019] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of a preferred embodiment of the present invention.

[0021] Explanation of reference numerals in the attached diagram:

[0022] 10. Ceramic base layer 11. Through holes

[0023] 12. Heat conduction hole; 13. Annular dovetail groove

[0024] 20. Metal dam 21. Circular dovetail block

[0025] 22. Intermediate layer 23. Main layer

[0026] 24. Annular groove; 25. First annular groove

[0027] 201, Package cavity 30, Front pad

[0028] 40. Back pads; 50. First heat dissipation layer

[0029] 60. Second heat dissipation layer; 70. Light-transmitting cover plate

[0030] 71. Annular protrusion; 72. Main body.

[0031] 73. Extension 731. Second annular groove

[0032] 80, conductive pillar; 90, thermally conductive pillar

[0033] 100, waterproof adhesive, 110, UV chip. Detailed Implementation

[0034] Please refer to Figure 1 As shown, it illustrates the specific structure of a preferred embodiment of the present invention, including a ceramic base layer 10, a metal dam 20, a front pad 30, a back pad 40, a first heat dissipation layer 50, a second heat dissipation layer 60, and a light-transmitting cover plate 70.

[0035] The ceramic base layer 10 is provided with through holes 11 and heat-conducting holes 12. A conductive post 80 is provided in the through hole 11. There are multiple heat-conducting holes 12, and a heat-conducting post 90 is provided in each heat-conducting hole 12. An annular dovetail groove 13 is recessed around the upper surface of the ceramic base layer 10. In this embodiment, the ceramic base layer 10 is made of aluminum nitride, which has high thermal conductivity, good mechanical properties, good electrical insulation properties, and chemical stability. The heat-conducting post 90 is made of graphene, which has good heat dissipation and thermal conductivity.

[0036] The metal dam 20 and the ceramic base layer 10 form an upward-opening encapsulation cavity 201. The encapsulation cavity 201 has a conical structure. The metal dam 20 includes an annular dovetail block 21, an intermediate layer 22, and a main body layer 23, which are integrally formed and connected in sequence. The annular dovetail block 21 is disposed in and adapted to the annular dovetail groove 13. The intermediate layer 22 is disposed on the upper surface of the ceramic base layer 10. The main body layer 23 extends upward from the surface of the intermediate layer 22. The width of the intermediate layer 22 is greater than the width of the main body layer 23. The main body layer 23 has an inverted conical structure. In this embodiment, an annular groove 24 is recessed at the opening edge of the encapsulation cavity 201 on the metal dam 20. Specifically, the cross-section of the annular groove 24 is a structure of multiple V-shapes, which further enhances the sealing performance of the product. A first annular groove 25 is provided on the top surface of the metal dam 20. Specifically, the first annular groove 25 has an arc-shaped structure.

[0037] The front pad 30 is disposed on the upper surface of the ceramic substrate 10 and located in the encapsulation cavity 201. The front pad 30 is connected to the upper end of the conductive post 80. The back pad 40 is disposed on the lower surface of the ceramic substrate 10 and connected to the lower end of the conductive post 80.

[0038] The first heat dissipation layer 50 is disposed on the upper surface of the ceramic base layer 10 and located in the encapsulation cavity 201. The first heat dissipation layer 50 is connected to the upper ends of the plurality of heat-conducting pillars 90. The second heat dissipation layer 60 is disposed on the lower surface of the ceramic base layer 10 and connected to the lower ends of the plurality of heat-conducting pillars 90. In this embodiment, the first heat dissipation layer 50 and the second heat dissipation layer 60 are made of graphene material, which has good heat dissipation and thermal conductivity.

[0039] The light-transmitting cover 70 is disposed on the metal dam 20 and covers the opening of the encapsulation cavity 201. The bottom periphery of the light-transmitting cover 70 is sealed and fixed to the metal dam 20 with sealant. In this embodiment, the bottom surface of the light-transmitting cover 70 is provided with an annular protrusion 71. The annular protrusion 71 is disposed in and adapted to the annular groove 24. The annular groove 24 and the annular protrusion 71 are sealed and bonded together with sealant, effectively enhancing the sealing performance of the product. Specifically, the cross-section of the annular protrusion 71 is a structure with multiple V-shapes, further... To further enhance the product's sealing performance, the light-transmitting cover 70 includes a main body 72 and an extension 73 extending outward from the upper end of the main body 72. The aforementioned annular protrusion 71 is disposed on the bottom periphery of the main body 72, and the extension 73 is disposed on the top surface of the metal dam 20. The bottom surface of the extension 73 is provided with a second annular groove 731, which communicates with the first annular groove 25 and is filled with waterproof adhesive 100, effectively enhancing the product's waterproof performance and improving the product's quality. Specifically, the second annular groove 731 has an arc-shaped structure.

[0040] The packaging process of this embodiment is described in detail below:

[0041] During encapsulation, firstly, the UV chip 110 is placed in the encapsulation cavity 201 and fixed to the first heat dissipation layer 50; then, the UV chip 110 is electrically connected to the front pad 30; next, sealant is injected into the annular groove 24 of the metal dam 20, and waterproof adhesive 100 is injected into the first annular groove 25 of the metal dam 20; finally, the light-transmitting cover 70 is installed from top to bottom onto the metal dam 20 and covers the opening of the encapsulation cavity 201. The annular protrusion 71 is disposed in the annular groove 24 and is adapted to the annular groove 24. The second annular groove 731 is bonded and sealed to the first annular groove 25 with waterproof adhesive 100.

[0042] In use, the second heat dissipation layer 60 is attached to the external heat sink, and the back pad 40 is connected to the external circuitry. After power is applied, the heat generated by the UV chip 110 is transferred sequentially through the first heat dissipation layer 50 and the heat-conducting pillar 90 to the second heat dissipation layer 60, and then to the heat sink for rapid heat dissipation.

[0043] The key design feature of this utility model is:

[0044] By recessing annular dovetail grooves around the upper surface of the ceramic substrate, and placing the annular dovetail blocks of the metal dam within and fitting into these grooves, the metal dam and ceramic substrate are firmly bonded together. This effectively enhances the stability of the connection structure, preventing separation between the ceramic substrate and the metal dam after prolonged operation. This ensures the overall performance of the product, prevents damage, improves product quality, and extends its lifespan. Furthermore, by setting the width of the intermediate layer of the metal dam to be greater than the width of the main layer, and combining this with the inverted conical structure of the main layer, this UV-encapsulated ceramic substrate effectively reduces the stress exerted by the metal dam on the ceramic substrate, preventing cracking due to stress concentration. This effectively improves the product's resistance to thermal shock and meets current requirements.

[0045] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A structurally enhanced UV-encapsulated ceramic substrate, characterized in that: It includes a ceramic base layer, a metal dam, front pads, back pads, a first heat dissipation layer, a second heat dissipation layer, and a light-transmitting cover plate; The ceramic substrate is provided with through holes and heat-conducting holes. A conductive pillar is provided in the through holes. There are multiple heat-conducting holes, and a heat-conducting pillar is provided in each heat-conducting hole. An annular dovetail groove is recessed around the upper surface of the ceramic substrate. The metal dam and the ceramic substrate form an upward-opening encapsulation cavity. The encapsulation cavity has a conical structure. The metal dam includes an annular dovetail block, an intermediate layer and a main body layer that are integrally formed and connected in sequence. The annular dovetail block is disposed in the annular dovetail groove and is adapted to the annular dovetail groove. The intermediate layer is disposed on the upper surface of the ceramic substrate. The main body layer extends upward from the surface of the intermediate layer. The width of the intermediate layer is greater than the width of the main body layer. The main body layer has an inverted conical structure. The front pad is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the front pad is connected to the upper end of the conductive pillar; the back pad is disposed on the lower surface of the ceramic substrate and connected to the lower end of the conductive pillar; the first heat dissipation layer is disposed on the upper surface of the ceramic substrate and located in the encapsulation cavity, and the first heat dissipation layer is connected to the upper end of multiple heat-conducting pillars; the second heat dissipation layer is disposed on the lower surface of the ceramic substrate and connected to the lower end of multiple heat-conducting pillars; the light-transmitting cover is disposed on the metal dam and covers the opening of the encapsulation cavity, and the bottom edge of the light-transmitting cover is sealed and fixed to the metal dam with sealant.

2. The structurally enhanced UV-encapsulated ceramic substrate according to claim 1, characterized in that: The metal dam has an annular groove recessed at the edge of the opening of the encapsulation cavity. The bottom surface of the light-transmitting cover has an annular protrusion, which is located in the annular groove and fits the annular groove. The annular groove and the annular protrusion are sealed and bonded together with sealant.

3. The structurally enhanced UV-encapsulated ceramic substrate according to claim 2, characterized in that: The cross-section of the annular groove is a structure of multiple V-shapes, and correspondingly, the cross-section of the annular protrusion is also a structure of multiple V-shapes.

4. The structurally enhanced UV-encapsulated ceramic substrate according to claim 3, characterized in that: The light-transmitting cover includes a main body and an extension extending outward from the upper end of the main body. The annular protrusion is provided on the bottom periphery of the main body. The top surface of the metal dam is provided with a first annular groove. The extension is provided on the top surface of the metal dam. The bottom surface of the extension is provided with a second annular groove. The second annular groove communicates with the first annular groove and is filled with waterproof adhesive.

5. The structurally enhanced UV-encapsulated ceramic substrate according to claim 4, characterized in that: The first annular groove is an arc-shaped structure, and correspondingly, the second annular groove is also an arc-shaped structure.

6. The structurally enhanced UV-encapsulated ceramic substrate according to claim 1, characterized in that: The ceramic base layer is made of aluminum nitride.

7. The structurally enhanced UV-encapsulated ceramic substrate according to claim 1, characterized in that: The first and second heat dissipation layers are made of graphene.

8. The structurally enhanced UV-encapsulated ceramic substrate according to claim 1, characterized in that: The heat-conducting pillar is made of graphene.

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