LED packaging structure and LED light-emitting device

Abstract

The utility model provides an LED packaging structure and an LED light-emitting device, and the LED packaging structure comprises a substrate, the upper surface of which is provided with a die bonding area; the at least two LED chips are arranged in the die bonding area at intervals, and each LED chip is bonded with the upper surface of the substrate through die bonding glue; and the at least one first groove is formed in the die bonding area, and each first groove is recessed from the upper surface of the substrate to the lower surface of the substrate and is located between two adjacent LED chips. The utilization rate of the die bonding area can be effectively improved.

Description

Technical Field

[0001] This application relates to the field of LED technology, specifically to an LED packaging structure and an LED light-emitting device. Background Technology

[0002] As the demand for high brightness and high integration in LED packaging structures increases, the number of LED chips placed in the die bonding area gradually increases, and the spacing between two adjacent LED chips also becomes smaller. This makes it easy for the die bonding adhesive of two adjacent LED chips to spread to each other during the die bonding process, causing the die bonding position to shift. This is not conducive to the close arrangement of LED chips in the die bonding area, resulting in a low utilization rate of the die bonding area. Utility Model Content

[0003] This application provides an LED packaging structure and an LED light-emitting device to solve the problem of low utilization of the die-bonding area in related technologies.

[0004] This application provides an LED packaging structure, including:

[0005] The substrate has a die-bonding region on its upper surface.

[0006] At least two LED chips are spaced apart in the die bonding area, and each LED chip is bonded to the upper surface of the substrate by die bonding adhesive;

[0007] At least one first groove is disposed in the die bonding region, each first groove being recessed from the upper surface of the substrate to the lower surface of the substrate and located between two adjacent LED chips.

[0008] In one embodiment, the LED packaging structure further includes:

[0009] A bowl-shaped cup is disposed on the upper surface of the substrate, and the area enclosed by the bowl-shaped cup on the upper surface of the substrate constitutes the die-bonding region.

[0010] At least one second groove is disposed in the die bonding region, each second groove being recessed from the upper surface of the substrate to the lower surface of the substrate and located between the cups and adjacent LED chips.

[0011] In one embodiment, the die-bonding region is rectangular, at least two LED chips are arranged at intervals along a first direction, and both the first and second slots extend along a second direction, with the first and second directions being perpendicular to each other; the first direction is either the width direction or the length direction of the die-bonding region, and the second direction is either the width direction or the length direction of the die-bonding region.

[0012] In one embodiment, the substrate includes a positive electrode plate, a negative electrode plate, and an insulating strip located between the positive electrode plate and the negative electrode plate; the LED packaging structure further includes:

[0013] The first metal pillar and the second metal pillar both penetrate the bowl vertically and are located outside the die-bonding area. The top surface of the first metal pillar is connected to the positive electrode of one of the at least two LED chips via a first bonding wire, and the bottom surface of the first metal pillar is connected to the positive electrode plate. The top surface of the second metal pillar is connected to the negative electrode of the other of the at least two LED chips via a second bonding wire, and the bottom surface of the second metal pillar is connected to the negative electrode plate.

[0014] In one embodiment, the top surface of both the first metal pillar and the top surface of the second metal pillar are higher than the top surface of the die bond adhesive.

[0015] In one embodiment, the top surface of the first metal pillar and the top surface of the second metal pillar are both parallel to the upper surface of the substrate, so that the top surface of the first metal pillar forms the second solder joint position of the first bonding wire, and the top surface of the second metal pillar forms the second solder joint position of the second bonding wire.

[0016] In one embodiment, the height of the inner wall of the bowl gradually decreases from the outside to the inside of the bowl, and the top surfaces of the first metal pillar and the second metal pillar both pass through the inner wall of the bowl, and the height of the top surfaces of the first metal pillar and the second metal pillar is lower than the height of the top surface of the bowl.

[0017] And / or, the bottom surface of the first metal post does not protrude from the lower surface of the positive electrode plate, and the bottom surface of the second metal post does not protrude from the lower surface of the negative electrode plate.

[0018] In one embodiment, the LED packaging structure further includes:

[0019] A white adhesive layer is filled at the bottom of the bowl to cover the die bonding area, and the white adhesive layer is located outside each LED chip;

[0020] An encapsulating adhesive layer is filled into the bowl to cover the white adhesive layer and each LED chip.

[0021] In one embodiment, the height of the upper surface of the white adhesive layer gradually decreases from the outside to the inside along the direction of the bowl / cup.

[0022] A second aspect of this application provides an LED light-emitting device, including the LED packaging structure of any of the above embodiments.

[0023] The beneficial effects of this application's technical solution include at least the following: By providing a die-bonding region on the upper surface of the substrate, and spaced at least two LED chips and at least one first groove within the die-bonding region, with each first groove located between two adjacent LED chips and the first groove recessed from the upper surface of the substrate toward the lower surface, this structure allows the first groove to guide and contain the overflowing die-bonding adhesive when it overflows and spreads towards each other during die bonding. This limits the overflow range of the die-bonding adhesive and reduces the area of ​​spread, thus preventing the die-bonding positions of adjacent LED chips from shifting due to the spread, adhesion, and pulling forces of the die-bonding adhesive. This facilitates the close arrangement of LED chips within the die-bonding region, thereby improving the utilization rate of the die-bonding region. Furthermore, after die bonding, the spread of the die-bonding adhesive into the first groove increases the bonding area between the LED chip and the upper surface of the substrate, increasing the bonding force between the LED chip and the substrate and improving the reliability of the bond between the LED chip and the substrate. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Furthermore, these drawings and textual descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this application to those skilled in the art through reference to specific embodiments.

[0025] Figure 1 The figure shown is a schematic diagram of the planar structure of LED packaging in related technologies.

[0026] Figure 2 The figure shown is a planar structural schematic diagram of an LED packaging structure according to an embodiment of this application.

[0027] Figure 3 As shown Figure 2 A schematic diagram of the cross-sectional structure of the LED packaging structure along the cutting line A1-A2.

[0028] Figure 4 As shown Figure 2 A schematic diagram of the planar structure of the support.

[0029] Figure 5 The diagram shown is a planar structural schematic of an LED packaging structure according to another embodiment of this application.

[0030] Figure 6 As shown Figure 5 A schematic diagram of the cross-sectional structure of the LED packaging structure along the cutting line A1-A2. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] like Figure 1 As shown, in related technologies, a die-bonding region 111a is provided on the upper surface of the substrate 11, and the LED chip 12 is bonded by die-bonding adhesive (…). Figure 1 (Not shown) LED chips 12 are bonded within the die-bonding region 111a to achieve die bonding. With the increasing demands for high brightness and high integration in the LED package structure 10, the number of LED chips 12 disposed within the die-bonding region 111a gradually increases, resulting in a smaller spacing between adjacent LED chips 12. Because the spacing between adjacent LED chips 12 within the die-bonding region 111a is small, the die-bonding adhesive of adjacent LED chips 12 easily spreads, adheres, and generates tensile force during the die-bonding process. This leads to a shift in the die-bonding position of adjacent LED chips 12, which is detrimental to the tight arrangement of LED chips 12 within the die-bonding region 111a, resulting in low utilization of the die-bonding region 111a.

[0033] In view of this, embodiments of this application provide an LED packaging structure and an LED light-emitting device to solve the problem of low utilization of the die-bonding area in related technologies. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0034] Figure 2 The figure shown is a planar structural schematic diagram of an LED packaging structure according to an embodiment of this application. Figure 3 As shown Figure 2 A schematic diagram of the cross-sectional structure of the LED packaging structure along the cutting line A1-A2. Figure 4 As shown Figure 2 A schematic diagram of the planar structure of the support.

[0035] Please refer to the following: Figures 2 to 4This application provides an embodiment of an LED packaging structure 10, which includes a substrate 11, at least two LED chips 12, and at least one first groove 111b. A die-bonding region 111a is provided on the upper surface 111 of the substrate 11. At least two LED chips 12 are spaced apart within the die-bonding region 111a, and each LED chip 12 is bonded to the upper surface 111 of the substrate 11 by die-bonding adhesive 13. At least one first groove 111b is disposed within the die-bonding region 111a, and each first groove 111b is recessed from the upper surface 111 of the substrate 11 towards the lower surface 112 of the substrate 11, and each first groove 111b is located between two adjacent LED chips 12.

[0036] For example, "at least two LED chips 12" means that the number of LED chips 12 can be two or more, and "at least one first slot 111b" means that the number of first slots 111b can be one or more. For example, the number of LED chips 12 is two, and the number of first slots 111b is one; or, the number of LED chips 12 is three, and the number of first slots 111b is two. This application embodiment does not limit the number of first slots 111b and LED chips 12, as long as there is one first slot 111b between two adjacent LED chips 12.

[0037] For example, the upper surface 111 and the lower surface 112 of the substrate 11 are disposed opposite each other along the thickness direction T of the substrate 11. The first groove 111b is recessed from the upper surface 111 of the substrate 11 toward the lower surface 112 of the substrate 11, so that the groove opening of the first groove 111b (not shown in the figure) is flush with the upper surface 111 of the substrate 11, so that the die bond adhesive 13 overflowing between the LED chip 12 and the upper surface 111 of the substrate 11 can be guided into the first groove 111b during die bonding.

[0038] The above solution involves providing a die-bonding region 111a on the upper surface 111 of the substrate 11, and at least two LED chips 12 and at least one first groove 111b spaced apart within the die-bonding region 111a. Each first groove 111b is located between two adjacent LED chips 12, and the first groove 111b is recessed from the upper surface 111 of the substrate 11 towards the lower surface 112 of the substrate 11. This structure ensures that during the die-bonding process, when the die-bonding adhesive 13 of two adjacent LED chips 12 overflows towards each other... During the overflow and spread of the die-bonding adhesive 13, the first groove 111b guides the overflowing adhesive 13 into the first groove 111b and contains it, thereby limiting the overflow range of the adhesive 13 and reducing the area of ​​its spread. This avoids the offset of the die-bonding positions of adjacent LED chips 12 caused by the spread, adhesion, and pulling force of the adhesive 13 between adjacent LED chips 12. This facilitates the close arrangement of LED chips 12 within the die-bonding area 111a, thereby improving the utilization rate of the die-bonding area 111a. In addition, after die bonding, the spread of the adhesive 13 into the first groove 111b increases the bonding area between the LED chip 12 and the upper surface 111 of the substrate 11, thereby increasing the bonding force between the LED chip 12 and the substrate 11 and improving the reliability of the bonding between the LED chip 12 and the substrate 11.

[0039] In one implementation, please refer to the following: Figures 2 to 4 The LED package structure 10 also includes a bowl 14 and at least one second groove 111c.

[0040] The bowl 14 is disposed on the upper surface 111 of the substrate 11, and the area surrounded by the upper surface 111 of the substrate 11 by the bowl 14 constitutes a die-bonding region 111a. Specifically, the bottom edge of the inner sidewall 141 of the bowl 14 constitutes the die-bonding region 111a in the area surrounded by the upper surface 111 of the substrate 11. The bowl 14 is made of an insulating material, such as plastic.

[0041] At least one second groove 111c is disposed in the die bonding region 111a. Each second groove 111c is recessed from the upper surface 111 of the substrate 11 to the lower surface 112 of the substrate 11 and is located between the cup 14 and the adjacent LED chip 12.

[0042] The above-described solution involves providing at least one second groove 111c within the die-bonding region 111a, with the second groove 111c recessed from the upper surface 111 of the substrate 11 toward the lower surface 112 of the substrate 11. Each second groove 111c is positioned between the cup 14 and the adjacent LED chip 12. This structure allows the second groove 111c to guide and contain the die-bonding adhesive 13 overflowing and spreading toward the cup 14 during die bonding, thereby limiting the overflow range of the die-bonding adhesive 13 and reducing the area of ​​spread of the die-bonding adhesive 13. This prevents the die-bonding position of the LED chip 12 adjacent to the cup 14 from shifting due to the spread of the die-bonding adhesive 13 to the inner wall of the cup 14. This facilitates the close arrangement of the LED chips 12 adjacent to the cup 14 within the die-bonding region 111a, improving the utilization rate of the die-bonding region 111a. Furthermore, after die bonding, the die bonding adhesive 13 spreads into the second groove 111c, which can increase the bonding area between the LED chip 12 and the upper surface 111 of the substrate 11, thereby increasing the bonding force between the LED chip 12 and the substrate 11 and further improving the reliability of the bonding between the LED chip 12 and the substrate 11.

[0043] In one implementation, please refer to the following: Figure 2 and Figure 3 The die-bonding region 111a is rectangular, with at least two LED chips 12 spaced apart along a first direction D1. The first groove 111b and the second groove 111c both extend along a second direction D2, with the first direction D1 and the second direction D2 perpendicular to each other. The first direction D1 is either the width direction or the length direction of the die-bonding region 111a, and the second direction D2 is the other of the width direction or the length direction of the die-bonding region 111a. Preferably, the die-bonding region 111a is a rounded rectangle.

[0044] In practical applications, since the distance L1 between two adjacent LED chips 12 and the distance L2 between the cup 14 and its adjacent LED chips 12 in the first direction D1 are small, during the die bonding process, when the die bond adhesive 13 between the LED chip 12 and the upper surface of the substrate 11 overflows along the first direction D1, the die bond adhesive 13 is prone to spread between two adjacent LED chips 12 and between the cup 14 and its adjacent LED chips 12. Therefore, the above solution sets at least two LED chips 12 spaced apart along the first direction D1, and sets the first groove 111b and the second groove 111c to extend along the second direction D2, and makes the first direction D1 and the second direction D2 perpendicular to each other. This structure makes it easier for the die bond adhesive 13 to overflow into the first groove 111b and the second groove 111c when the die bond adhesive 13 between the LED chip 12 and the upper surface 111 of the substrate 11 overflows along the first direction D1, and makes it easier for the first groove 111b and the second groove 111c to guide the die bond adhesive 13.

[0045] Furthermore, since the distance L3 between the cup 14 and the adjacent LED chip 12 in the second direction D2 is relatively large, during the die bonding process, when the die bonding adhesive 13 between the LED chip 12 and the upper surface 111 of the substrate 11 overflows towards the cup 14 along the second direction D2, the die bonding adhesive 13 is not easy to spread to the inner wall 141 of the cup 14. Therefore, it is not necessary to set a second groove 111c extending along the first direction D1, which can effectively save process costs.

[0046] It should be noted that, Figure 2 This diagram shows only two LED chips 12 spaced apart along the width of the die-bonding region 111a, with the first trench 111b and the second trench 111c extending along the length of the die-bonding region 111a. Other arrangements of the LED chips 12 and other extension methods of the first trench 111b and the second trench 111c can be found in the following reference. Figure 2 The derivation is described, but will not be elaborated here.

[0047] like Figure 1 As shown, in related technologies, a positive electrode pad is provided on the upper surface of the die-bonding region 111a of the positive electrode plate 11a. Figure 1 (Not shown in the image), the negative electrode plate 11b is provided with a negative electrode pad on the upper surface of the die-bonding region 111a. Figure 1 (Not shown in the image). The positive electrode of one LED chip 121 is connected to the positive electrode pad via a first bonding wire w1, and the negative electrode of the other LED chip 122 is connected to the negative electrode pad via a second bonding wire w2. In this connection method, the need to set the positive and negative electrode pads in the die-bonding region 111a will occupy the area of ​​the die-bonding region 111a, resulting in a low utilization rate of the die-bonding region 111a.

[0048] To resolve the above issues, please refer to the following: Figure 2 and Figure 3This application also provides an embodiment in which the substrate 11 includes a positive electrode plate 11a, a negative electrode plate 11b, and an insulating strip 11c located between the positive electrode plate 11a and the negative electrode plate 11b. By providing the insulating strip 11c between the positive electrode plate 11a and the negative electrode plate 11b, the insulating strip 11c can be used to insulate and isolate the positive electrode plate 11a and the negative electrode plate 11b. The LED packaging structure 10 also includes a first metal pillar 15 and a second metal pillar 16. Both the first metal pillar 15 and the second metal pillar 16 penetrate the cup 14 in a vertical direction (i.e., the thickness direction T of the substrate 11) and are located outside the die bonding region 111a. The top surface 151 of the first metal pillar 15 is connected to the positive electrode of one of the at least two LED chips 121 through a first bonding wire w1, and the bottom surface 152 of the first metal pillar 15 is connected to the positive electrode plate 11a. The top surface 161 of the second metal pillar 16 is connected to the negative electrode of the other LED chip 122 through a second bonding wire w2, and the bottom surface 162 of the second metal pillar 16 is connected to the negative electrode plate 11b.

[0049] Compared to related technologies, the above solution, by setting a first metal pillar 15 and a second metal pillar 16 that penetrate the bowl 14 vertically, ensures that both the first metal pillar 15 and the second metal pillar 16 are located outside the die-bonding region 111a. The top surface 151 of the first metal pillar 15 is connected to the positive electrode of one of at least two LED chips 12 via a first bonding wire w1, and the bottom surface 152 of the first metal pillar 15 is connected to the positive electrode plate 11a. Furthermore, the top surface 161 of the second metal pillar 16 is connected to the positive electrode plate 11a via a second bonding wire w2. The negative electrode of one of the two LED chips 122 is connected to the negative electrode, and the bottom surface 162 of the second metal pillar 16 is connected to the negative electrode plate 11b. This not only enables the connection between the positive electrode of one LED chip 121 and the positive electrode plate 11a, and the connection between the negative electrode of the other LED chip 122 and the negative electrode plate 11b, but also does not occupy the area of ​​the die-bonding region 111a. This allows the area of ​​the die-bonding region 111a to be larger, which is more conducive to the die-bonding of multiple LED chips 12 in the same die-bonding region 111a.

[0050] In this embodiment, one LED chip 121 and another LED chip 122 can be connected in series or in parallel. This application embodiment does not limit the connection method between the two.

[0051] Please refer to the following: Figure 2 and Figure 4 In this embodiment, Figure 2 The LED packaging structure 10 in the middle is formed by omitting the LED chip 12, the first bonding wire w1, and the second bonding wire w2. Figure 4 The bracket for LED chip 12 in the middle.

[0052] Please see Figure 1 In related technologies, the bonding process of the first bonding wire w1 and the second bonding wire w2 is usually performed after the die bonding process. During the die bonding process, the die bonding adhesive can easily spread and cover the positive electrode pad and the negative electrode pad, which makes it difficult for the positive electrode pad to connect with the first bonding wire w1 or the connection strength is weak, and it is also difficult for the negative electrode pad to connect with the second bonding wire w2 or the connection strength is weak, thus causing wire breakage problems.

[0053] Therefore, please refer to the following: Figure 2 and Figure 3 This application also provides an embodiment in which the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 are both higher than the upper surface of the die bond 13 (see attached). Figure 2 and attached Figure 3 (Unmarked in the text). By setting the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 to be higher than the top surface of the die bond adhesive 13, the die bond adhesive 13 can be prevented from spreading and covering the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 during the die bonding process. This ensures that the first bonding wire w1 can be properly connected to the top surface 151 of the first metal pillar 15 and the second bonding wire w2 can be properly connected to the top surface 161 of the second metal pillar 16 during the bonding process, thus avoiding wire breakage problems between the first bonding wire w1 and the top surface 151 of the first metal pillar 15 and the second bonding wire w2 and the top surface 161 of the second metal pillar 16.

[0054] In one implementation, please refer to the following: Figure 2 and Figure 3 The top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 are both parallel to the upper surface 111 of the substrate 11, so that the top surface 151 of the first metal pillar 15 forms the second solder point position of the first solder line w1, and the top surface 161 of the second metal pillar 16 forms the second solder point position of the second solder line w2.

[0055] In practical applications, the first solder joint is spherical, and the second solder joint is wedge-shaped. The bonding process includes: first, using a wedge to hold the bonding wire and lower it vertically at a constant speed to the position of the first solder joint; under the action of heating energy and pressure, one end of the bonding wire is connected to the position of the first solder joint to form the first solder joint; then, the wedge is raised vertically and the other end of the bonding wire held by the wedge is moved to above the position of the second solder joint, and then lowered vertically at a constant speed to the position of the second solder joint; under the action of heating energy and pressure, the other end of the bonding wire is connected to the position of the second solder joint to form the second solder joint.

[0056] In the above scheme, by setting the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 to be parallel to the upper surface 111 of the substrate 11, the top surface 151 of the first metal pillar 15 forms the second solder point position of the first bonding wire w1, and the top surface 161 of the second metal pillar 16 forms the second solder point position of the second bonding wire w2. This structure facilitates controlling the wedge to approach the top surface 151 of the first metal pillar 15 along the thickness direction T of the substrate 11 during the bonding process, so as to bond the first bonding wire w1 to the top surface 151 of the first metal pillar 15 and form the second solder point of the first bonding wire w1. It also facilitates approaching the top surface 161 of the second metal pillar 16 along the thickness direction T of the substrate 11, so as to bond the second bonding wire w2 to the top surface 161 of the second metal pillar 16 and form the second solder point of the second bonding wire w2.

[0057] In one implementation, please refer to Figure 3 The height of the inner wall 141 of the bowl 14 gradually decreases from the outside to the inside. The top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 both pass through the inner wall 141 of the bowl 14, and the height of the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 are both lower than the height of the top surface 142 of the bowl 14. This structure ensures that the top surface 151 of the first metal pillar 15 and the top surface 161 of the second metal pillar 16 do not protrude from the top surface 142 of the bowl 14, thus avoiding the first metal pillar 15 and the second metal pillar 16 from blocking the light emitted by the LED chip 12.

[0058] In one implementation, please refer to Figure 3 The bottom surface 152 of the first metal pillar 15 does not protrude from the lower surface of the positive electrode plate 11a, and the bottom surface 162 of the second metal pillar 16 does not protrude from the lower surface of the negative electrode plate 11b. For example, the bottom surface 152 of the first metal pillar 15 can be embedded in the positive electrode plate 11a; or, the bottom surface 152 of the first metal pillar 15 is flush with the bottom surface of the positive electrode plate 11a. Similarly, the bottom surface 162 of the second metal pillar 16 can be embedded in the negative electrode plate 11b; or, the bottom surface 162 of the second metal pillar 16 is flush with the bottom surface of the negative electrode plate 11b. This ensures that neither the bottom surface 152 of the first metal pillar 15 nor the bottom surface 162 of the second metal pillar 16 protrudes from the lower surface 112 of the substrate 11, thus facilitating the overall flatness of the lower surface 112 of the substrate 11.

[0059] In one implementation, please refer to the following: Figure 5 and Figure 6 The LED encapsulation structure 10 also includes a white adhesive layer 17 and an encapsulating adhesive layer 18.

[0060] The white adhesive layer 17 fills the bottom of the bowl 14 to cover the die-bonding region 111a, and the white adhesive layer 17 is located outside each LED chip 12. The white adhesive layer 17 covering the die-bonding region 111a includes the white adhesive layer 17 filling and covering the first groove 111b and the second groove 111c located within the die-bonding region 111a. The encapsulating adhesive layer 18 fills the bowl 14 to cover the white adhesive layer 17 and each LED chip 12.

[0061] In one example, the encapsulating adhesive layer 18 can be either a fluorescent adhesive layer or a transparent adhesive layer.

[0062] When the encapsulating adhesive layer 18 is a phosphor layer, it can convert the light emitted by the LED chip 12 into light of a specific color or wavelength before it is emitted. For example, when the LED chip 12 is a blue LED chip and the phosphor layer is a yellow phosphor layer, the phosphor layer can convert the blue light emitted by the LED chip 12 into white light before it is emitted. In addition, the phosphor layer can also fix the position of the LED chip 12 and protect it from physical damage and chemical corrosion.

[0063] When the encapsulating adhesive layer 18 is a transparent adhesive layer, the light emitted by the LED chip 12 passes directly through the transparent adhesive layer before exiting. The transparent adhesive layer can also fix the position of the LED chip 12 and protect the LED chip 12 from physical damage and chemical corrosion.

[0064] In another example, the upper surface 181 of the encapsulating adhesive layer 18 is flush with the top surface 142 of the cup 14 to fully seal and fix the LED chip 12, the first bonding wire w1, the second bonding wire w2 and the white adhesive layer 17 inside the cup 14.

[0065] The above-described solution, by filling the bottom of the bowl 14 with a white adhesive layer 17 and covering the die-bonding region 111a with the white adhesive layer 17, can reflect the light emitted by the LED chip 12 towards the rim of the bowl 14, thereby improving the luminous brightness and light extraction efficiency of the LED packaging structure 10. Furthermore, by filling the bowl 14 with an encapsulating adhesive layer 18 to cover the white adhesive layer 17 and each LED chip 12, the encapsulating adhesive layer 18 can be used to fix the position of the LED chip 12 and protect the LED chip 12 from physical damage and chemical corrosion.

[0066] In one implementation, please refer to the following: Figure 5 and Figure 6The height of the upper surface of the white adhesive layer 17 gradually decreases from the outside to the inside along the cup 14. This structure allows the upper surface of the white adhesive layer 17 to form an inwardly concave arc surface inside the cup 14, so that the light emitted by the LED chip 12 toward the white adhesive layer 17 is focused and emitted toward the opening of the cup 14, which is beneficial to the efficient reflection of light by the LED packaging structure 10. In addition, this structure can also protect the die bonding area 111a and the bottom of the cup 14, preventing harmful substances from penetrating the die bonding area 111a and the bottom of the cup 14.

[0067] This application also provides an LED light-emitting device, which includes the LED packaging structure of any of the above embodiments. Since this LED light-emitting device adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be repeated here.

[0068] In one example, the LED light-emitting device can be a display device with display function. For example, a display panel, screen, television, smartphone, smart wearable device, computer, etc. In another example, the LED light-emitting device can be a lighting device, such as indoor lighting, outdoor lighting, vehicle lights, safety indicator lights, mining lamps, etc. The specific type of LED light-emitting device can be selected and adjusted according to actual needs, and this application is not limited thereto.

[0069] Furthermore, in this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0070] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An LED packaging structure, characterized in that, include: A substrate (11) having a die-bonding region (111a) on its upper surface (111); At least two LED chips (12) are spaced apart in the die bonding region (111a), and each LED chip (12) is bonded to the upper surface (111) of the substrate (11) by die bonding adhesive (13). At least one first groove (111b) is disposed in the die-bonding region (111a), each first groove (111b) being recessed from the upper surface (111) of the substrate (11) toward the lower surface (112) of the substrate (11) and located between two adjacent LED chips (12).

2. The LED packaging structure according to claim 1, characterized in that, Also includes: A bowl (14) is disposed on the upper surface (111) of the substrate (11), and the bowl (14) constitutes the die-bonding region (111a) in the area surrounded by the upper surface (111) of the substrate (11). At least one second groove (111c) is disposed within the die-bonding region (111a), each second groove (111c) being recessed from the upper surface (111) of the substrate (11) toward the lower surface (112) of the substrate (11) and located between the cup (14) and the LED chip (12) adjacent to the cup (14).

3. The LED packaging structure according to claim 2, characterized in that, The die-bonding region (111a) is rectangular, and at least two LED chips (12) are arranged at intervals along a first direction (D1). The first groove (111b) and the second groove (111c) both extend along a second direction (D2). The first direction (D1) and the second direction (D2) are perpendicular to each other. The first direction (D1) is either the width direction or the length direction of the die-bonding region (111a), and the second direction (D2) is the other one of the width direction or the length direction of the die-bonding region (111a).

4. The LED packaging structure according to claim 2, characterized in that, The substrate (11) includes a positive electrode plate (11a), a negative electrode plate (11b), and an insulating strip (11c) located between the positive electrode plate (11a) and the negative electrode plate (11b). The LED packaging structure further includes: The first metal pillar (15) and the second metal pillar (16) both penetrate the bowl (14) vertically and are located outside the die-bonding region (111a). The top surface (151) of the first metal pillar (15) is connected to the positive electrode of one of the at least two LED chips (121) via a first bonding wire (w1). The bottom surface (152) of the first metal pillar (15) is connected to the positive electrode plate (11a). The top surface (161) of the second metal pillar (16) is connected to the negative electrode of another of the at least two LED chips (122) via a second bonding wire (w2). The bottom surface (162) of the second metal pillar (16) is connected to the negative electrode plate (11b).

5. The LED packaging structure according to claim 4, characterized in that, The top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) are both higher than the upper surface of the die bond adhesive (13).

6. The LED packaging structure according to claim 4, characterized in that, The top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) are both parallel to the upper surface (111) of the substrate (11), so that the top surface (151) of the first metal pillar (15) forms the second solder point position of the first solder line (w1), and the top surface (161) of the second metal pillar (16) forms the second solder point position of the second solder line (w2).

7. The LED packaging structure according to claim 4, characterized in that, The height of the inner wall (141) of the bowl (14) gradually decreases from the outside to the inside of the bowl (14). The top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) both pass through the inner wall (141) of the bowl (14), and the height of the top surface (151) of the first metal pillar (15) and the top surface (161) of the second metal pillar (16) are both lower than the height of the top surface (142) of the bowl (14). And / or, the bottom surface (152) of the first metal pillar (15) does not protrude from the lower surface of the positive electrode plate (11a), and the bottom surface (162) of the second metal pillar (16) does not protrude from the lower surface of the negative electrode plate (11b).

8. The LED packaging structure according to claim 2, characterized in that, Also includes: A white adhesive layer (17) is filled at the bottom of the bowl (14) to cover the die bonding area (111a), and the white adhesive layer (17) is located outside each of the LED chips (12); An encapsulating adhesive layer (18) is filled into the bowl (14) to cover the white adhesive layer (17) and each of the LED chips (12).

9. The LED packaging structure according to claim 8, characterized in that, The height of the upper surface of the white glue layer (17) gradually decreases from the outside to the inside along the bowl (14).

10. An LED light-emitting device, characterized in that, Includes the LED packaging structure according to any one of claims 1 to 9.

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