Manual die bonding plate with positioning structure
By designing a combination structure of limiting strips, positioning edges, and arc-shaped notches, the problem of unstable wafer positioning in manual die bonding was solved, achieving high-precision coaxial positioning and stress buffering, improving production efficiency and finished product yield, and meeting the needs of high-cycle SMT production lines.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JILIN HUAYAO SEMICON CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-05-08
AI Technical Summary
The existing manual die bonding board has an inconsistent relative position between the wafer, wafer ring, and label, which affects subsequent packaging operations. Furthermore, the lack of a stable reference and stress buffer leads to micro-vibration, misalignment, and poor solder joints, failing to meet the requirements for high efficiency and consistency.
A manual adhesive plate with a positioning structure was designed. It adopts a combination of limiting strips, positioning edges, positioning pieces and arc-shaped notches to achieve coaxial positioning and angle locking of wafer ring, wafer and label. Through interference fit and stepped thickness change buffering thermal expansion and contraction, it provides a stable reference and rigid clamping, reducing errors and stress concentration.
The relative positional deviation of the wafer ring, wafer, and label was controlled within ±0.05mm, which significantly improved production efficiency and yield, reduced material scrap and human-machine contact contamination risks, and met the needs of high-cycle SMT production lines.
Smart Images
Figure CN224218786U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to, but is not limited to, the field of semiconductor manufacturing technology, and particularly relates to a manual adhesive plate with a positioning structure. Background Technology
[0002] After semiconductor wafers undergo CP testing, a precision dicing machine is used to cut the entire wafer pattern into individual dies according to a pre-designed spacing before packaging. Before dicing, an electronic blue film is used for die bonding. Specifically, the wafer is affixed to an electronic blue film with a wafer ring and labeled with detailed wafer information, such as product name, batch number, skip number, and the number of qualified dies. Currently, some customers use professional die bonding machines for this pre-dicing bonding operation, while others do it manually with a die bonding knife. Using a die bonding machine provides a relatively fixed relative position between the wafer, wafer ring, and label; however, manual bonding results in an inconsistent relative position, which can affect subsequent packaging operations.
[0003] The prior art discloses an adhesive plate, including an adhesive plate body, a limiting strip, positioning edges, positioning pieces, and a notch; the adhesive plate body has an arc-shaped notch at the center of its bottom edge; a raised limiting strip is provided at the upper end of the adhesive plate body, and the upper surface of the limiting strip is higher than the upper surface of the adhesive plate body; two positioning edges are arranged side by side along the length direction on the surface of the adhesive plate body, and the positioning edges form a rectangular receiving area; the positioning piece is detachably assembled in the receiving area and abuts against the two positioning edges; a stepped area is also formed at the upper end of the adhesive plate body.
[0004] Although existing technologies include basic elements such as limiting strips, positioning edges, and positioning pieces at the structural level, three technical problems still exist: First, the limiting strips and the substrate body are usually connected by secondary assembly or screws. After the assembly tolerances accumulate, a height mismatch of 0.1mm is easily generated, which cannot provide a stable double-sided reference in the initial stage of mounting, resulting in micro-drift of the substrate in the Y direction; Second, the positioning pieces and positioning edges mostly adopt clearance fit or flush design, lacking interference clamping and coplanar locking mechanisms. Under the thermo-mechanical coupling load of reflow soldering and drop test, micro-vibration is prone to occur, causing chip misalignment and poor solder joints.
[0005] Secondly, existing technologies process the limiting strip, stepped area, and the upper surface of the adhesive plate on the same plane, lacking a stepped thickness change to buffer thermal expansion and contraction. Although a rounded notch is provided at the bottom edge, stress gradient optimization is not performed on the edge of the notch. After continuous accelerated aging at 85°C or multiple clamping-unclamping cycles, stress concentration cracks will still appear at the bottom edge, reducing fixture life and product reliability. In addition, the positioning piece lacks label grooves and visual-tactile dual positioning guidance, requiring operators to rely on secondary visual inspection, reducing clamping cycle time, and failing to meet the efficiency and consistency requirements of high-cycle SMT production lines. Summary of the Invention
[0006] To address the problems existing in the prior art, this utility model provides a manual adhesive plate with a positioning structure.
[0007] This invention is implemented as follows: a manual die-attachment board with a positioning structure includes a limiting strip, a label, a positioning edge, a die-attachment board, and a notch. The die-attachment board has a fixed limiting edge to constrain the placement direction of the wafer ring; the bottom edge of the die-attachment board has an arc-shaped notch to facilitate the removal of the wafer ring and blue film after die-attachment; the die-attachment area of the die-attachment board has two positioning edges to limit the placement position of the wafer ring on the die-attachment board; the central area of the die-attachment board holds a positioning piece pre-made according to the wafer size and label position; the front end of the die-attachment board has a position for placing the wafer basket; the die-attachment board has a raised limiting strip near the opening of the wafer basket to support one end of the wafer basket for easy pre-checking of the laser marking information on the wafer.
[0008] Furthermore, when gluing the wafer, first select the matching positioning piece according to the wafer size and place it on the gluing board. Then, place the wafer basket on the raised limiting strip at the top of the gluing board, check the laser markings on the wafer, and then pick up the wafer from the basket. Align the wafer back side up with the wafer positioning edge on the positioning piece of the gluing board, and then apply the blue film to the back of the wafer. Then, use a blade to scrape off any air bubbles on the back of the wafer. Next, flip the blue film 180 degrees vertically and align the label with the label position on the positioning piece. Finally, remove the wafer from the arc-shaped notch of the gluing board to complete the entire gluing process.
[0009] The die-attachment plate has three types of datum elements pre-set along the XY coordinate system: limiting strips, positioning edges, and positioning pieces. The wafer ring, wafer, and label sequentially mate with these elements via circle-line, surface-surface, and point-surface connections, thereby achieving coaxial positioning and angle locking within a single datum system. This integrated datum design eliminates the cumulative errors caused by multi-station transitions, ensuring that the relative positional deviation of the ring, wafer, and label is controlled within ±0.05mm, directly meeting the alignment tolerance requirements of the downstream dicing machine and automatic optical inspection system.
[0010] The die-attachment board employs a replaceable positioning tab structure. An H7 / h6 level interference fit is formed between the outer edge of the positioning tab and the positioning edge, ensuring clamping rigidity while allowing for assembly and disassembly within 30 seconds. By configuring positioning tabs of different diameters, it can cover the entire range of wafers from 50mm to 200mm without requiring replacement of the entire board fixture. This modular approach significantly reduces the number of spare parts and is suitable for flexible production modes with multiple varieties and small batches.
[0011] The arc-shaped notch at the bottom edge of the substrate eliminates sharp corners with a 180° radius transition, reducing the stress concentration factor to 1.08. This notch provides finger support for the operator and guides airflow in during substrate demolding, achieving negative pressure release. As a result, the wafer ring-blue film assembly can be smoothly extracted along the normal direction, avoiding micro-scratches and secondary adsorption of particles, thus improving the yield of finished products.
[0012] The two positioning edges utilize integrally machined right-angle shoulders, allowing for one-time clamping and cutting with the substrate body, achieving a parallelism error of less than 0.01mm. A double-line support is formed between the outer diameter of the wafer ring and the inner wall of the positioning edges, effectively constraining the ring's radial runout and pitch angle offset. This design provides a rigid backing for the ring during the film application and scraping stage, effectively suppressing relative slippage between the ring and the wafer.
[0013] The stepped area at the top of the adhesive plate is precisely cut according to the bottom dimensions of the film basket, forming a three-dimensional positioning with the front edge limiting strip. The height of the limiting strip is 2mm higher than the stepped area, which allows the film basket to tilt backward by 3°, so that the laser marking naturally faces the operator's line of sight; this achieves contactless character reading, avoids the introduction of particulate contamination due to arbitrarily moving the film basket, and integrates marking verification into the same station, shortening the changeover cycle.
[0014] Through the aforementioned structural synergy, the adhesive plate achieves single-station operation in all stages of film application, labeling, information verification, and film retrieval; the entire process eliminates the need for rotating fixtures or additional jigs, saving time on handling and realignment. Actual test data shows that compared to traditional segmented processes, equipment changeover time is reduced by 45%, and the overall defect rate for film application and labeling decreases from 0.9% to 0.28%, significantly reducing material waste and the risk of human-machine contact contamination while improving production efficiency. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the adhesive plate provided in an embodiment of the present invention;
[0016] Figure 2 This is a side view of the adhesive plate provided in an embodiment of the present invention;
[0017] Figure 3 This is a schematic diagram of the positioning plate and wafer ring positions provided in an embodiment of the present invention;
[0018] In the diagram: 1. Limiting strip; 2. Label; 3. Positioning edge; 4. Positioning piece; 5. Notch; 6. Wafer; 7. Adhesive plate; 8. Wafer ring. Detailed Implementation
[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this utility model.
[0020] The limiting strip and the adhesive plate body are precision CNC machined / injection molded from a single piece of material, ensuring no assembly gaps or screw pre-tightening errors at the root of the limiting strip, with the tolerance chain locked within ±0.02 mm. When the mounting fixture is pressed together, the upper surface of the limiting strip and the upper surface of the positioning plate form two reference planes, and the substrate is immediately constrained on both sides under force. The drift in the Y direction is suppressed to the sub-hundred-micron level, solving the problem of loosening and micro-vibration of traditional bolted blocks under dynamic loads.
[0021] The limiting strip has a trapezoidal cross-section, and the 6° micro-sloping surface on the side closest to the plate forms a self-locking wedge surface with the bottom surface of the substrate, generating a pre-tightening force along the Z-axis during press-fitting. This structure, together with the 0.8 mm height difference in the step area, forms a thickness abrupt layer, which can complete local thermal stress dissipation within 30 ms under thermal cycling conditions, significantly reducing the shear peak value of the solder joint and fundamentally eliminating the hidden defect of "cold shrinkage warping" after reflow soldering.
[0022] The positioning edge is completed by a single wire cutting, with a straightness better than 0.01 mm / 200 mm. The outer periphery of the positioning piece is designed with an interference fit of −0.03 mm and a 0.7° micro-taper is machined in the insertion force direction. During assembly, the positioning piece is pressed into the rectangular receiving area, resulting in surface-to-surface extrusion. The stable friction coefficient μ≈0.42 gives it anti-shear slippage capability. In the coupled impact of reflow soldering and drop tests, this interface is equivalent to an integrated rigid rib, preventing patch slippage and poor soldering.
[0023] The radius R of the semi-circular notch at the bottom edge was determined using finite element iteration and was set to 2.3 times the plate thickness; a 0.4 mm rounding was added to the inner edge. Simulations confirmed that this dimensional combination reduced the maximum equivalent stress gradient at the bottom edge by 21%, and no crack initiation occurred during accelerated life testing at 85 ℃ / 85 %RH-168 h. The homogenization of stress distribution not only extended the service life of the bonded plate but also eliminated solder joint shear failure caused by plate warping.
[0024] Instead of a traditional right-angle step, a rounded transition is used between the stepped area and the limiting strip. This creates a "hydraulic pad" effect when the substrate is pressed in: the substrate first contacts the stepped area and then transitions to the high surface of the limiting strip. The pressing force is released in segments along the curve, avoiding micro-notches on the substrate and solder paste splashing caused by rigid impact. This flexible transition has both mechanical buffering and process adaptation functions.
[0025] The rectangular label groove in the center of the positioning piece implicitly overlaps the center line of the substrate with the center line of the fixture. The operator can confirm the position by relying on the tactile feedback of the groove boundary. Combined with the "tactile stop" formed by the limit strip, the clamping action is changed from secondary alignment relying on vision to primary tactile alignment, which reduces the manual cycle time by more than 25% and reduces human error, providing a reliable and repeatable loading fixture solution for high-speed SMT production lines.
[0026] like Figure 1 , Figure 2 As shown, the present invention designs a die-attachment plate including a limiting strip 1, a label 2, a positioning edge 3, a die-attachment plate 7, and a notch 5. The fixed limiting edge is used to constrain the placement direction of the wafer ring 8. The bottom edge of the die-attachment plate 7 has an arc-shaped notch 5, facilitating the removal of the wafer ring 8 and the blue film after die-attachment. The die-attachment area of the die-attachment plate 7 has two positioning edges 3 to limit the placement position of the wafer ring 8 on the die-attachment plate 7. The central area of the die-attachment plate 7 holds a positioning piece 4 pre-made according to the wafer 6 size and the label 2 position. The front end of the die-attachment plate 7 has a position for placing the wafer basket. Near the opening of the wafer basket, the die-attachment plate 7 has a raised limiting strip 1, used to support one end of the wafer basket for easy verification of the laser marking information on the wafer 6.
[0027] like Figure 3 As shown, when pasting wafer 6, first select the matching positioning piece 4 according to the size of wafer 6 and place it on the pasting plate 7. Then place the wafer basket on the raised limiting strip 1 at the top of the pasting plate 7, check the laser marking of wafer 6, and then pick up wafer 6 from the basket. Align wafer 6 with the back side facing up and the positioning edge 3 of wafer 6 on the positioning piece 4 of the pasting plate 7. Then stick the blue film on the back of wafer 6. Then use a blade to scrape off the air bubbles on the back of wafer 6. Then flip the blue film 180 degrees vertically and align the label 2 with the label 2 on the positioning piece 4. Finally, take out wafer 6 from the arc-shaped notch 5 of the pasting plate 7 to complete the entire pasting process.
[0028] Before the operation begins, the operator selects a matching positioning piece 4 in the central area of the die bonding plate 7 according to the outer diameter of the wafer 6 to be processed and embeds it into the limiting groove, so that the positioning piece and the die bonding plate form a surface-to-surface fit; the outer contour of the positioning piece forms an interference fit with the two positioning edges 3, thereby establishing an XY constraint frame in the plane with the positioning piece as the reference, providing a geometric reference for the subsequent coaxial positioning of wafer-wafer ring 8.
[0029] When the wafer basket is pushed to the top of the bonding plate, its front end is first supported by the raised limiting strip 1, and the bottom surface of the basket is tilted back about three degrees relative to the bonding plate. This geometric tilt not only ensures that the basket and the bonding plate maintain single-point contact to avoid scratches, but also exposes the laser marking upwards to the center of the operator's field of vision, so as to realize rapid cross-checking of marking and process batch.
[0030] After confirming the markings are correct, the operator uses a vacuum pen to lift the single wafer 6 from the wafer basket and flip it so that the back side faces upwards. Then, a circle-line positioning is established according to the groove of the wafer ring 8 and the inner wall of the positioning edge 3. After alignment, the wafer 6 is gently pressed to make the positioning piece 4 coplanar. The circle-line alignment eliminates the rotational freedom of the wafer, avoiding angular drift during subsequent film application.
[0031] After electrostatic dust removal, the blue film is applied to the back of wafer 6 from above, with the application direction extending outward from the center along the wafer radius. During the lamination process, the operator uses a scraper that slides at a constant speed at a 45° incident angle to scrape and press, and uses an annular vent to remove residual air bubbles, ultimately ensuring that the bonding torque at the adhesive-wafer interface is evenly distributed and suppressing warping stress concentration.
[0032] After the film is applied, the adhesive is rotated 180° along the vertical plane; relying on the label window reserved on the positioning piece 4, the label 2 is directly positioned and pasted at a predetermined angle on the outer edge of the blue film with a Newtonian clamping force. The label and the straight line reference of the positioning edge 3 form a unique orientation mark. This positional relationship provides reliable image features for subsequent AOI recognition and optical alignment of the automatic dicing machine.
[0033] After all the pasting steps are completed, the operator inserts their index finger into the arc-shaped notch 5 at the bottom edge of the adhesive plate, and lifts the wafer ring 8 and the blue film assembly along the normal direction using the gap provided by the notch; the assembly completes a free transition the instant it leaves the positioning edge 3, avoiding scratching the positioning piece 4 or the surface of the adhesive plate 7. At this point, a wafer with controlled orientation, outward markings, fixed labels, and no air bubbles is transferred to the next process.
[0034] SMT assembly experiments were conducted on 20 existing comparative bonding plates (sample A) and 20 bonding plates of this invention (sample B) in the same batch. The results showed that the one-time alignment success rate of this solution increased from 86% to 98%, and the average positioning deviation decreased from 0.45mm to 0.12mm. This result is directly attributed to the stepped transition after the limiting strip is integrally formed with the upper surface, which creates a dual-plane reference in the initial stage of fixture pressing, significantly suppressing drift in the Y direction. Simultaneously, the arc notch releases stress concentration at the center of the bottom edge, enhancing the self-resetting tendency of the positioning plate along the X direction, thereby improving the overall alignment accuracy.
[0035] Assembly time statistics for the same batch show that, without changing process parameters, the average clamping time per piece was reduced from 5.1s to 3.8s, an improvement of 25.5% in cycle time. Analysis revealed that the raised limiting strip provides a "tactile positioning" signal when manually placing the substrate, reducing the need for secondary visual confirmation. In addition, the parallelism of the positioning edge (0.02mm / 200mm) is achieved through a single wire cutting process, and the positioning piece forms a quasi-sliding groove after insertion, giving the component a self-guiding function. All of these factors combined reduce the time of non-value-added actions.
[0036] For repeated clamping tests (100 cycles) during high-frequency sampling inspection, the coplanarity fluctuation of sample B, measured by coordinate measuring machine (CMM), was only ±0.08 mm, while that of sample A was ±0.32 mm. This improvement stems from the 0.03 mm interference fit between the positioning piece and the positioning edge, which provides a stable interfacial friction coefficient (μ≈0.42) at room temperature. Combined with the trapezoidal cross-section limiting strip, it establishes shear support in the Z direction, ensuring that the upper surface of the positioning piece is completely coplanar with the substrate body, ultimately reducing the risk of PCB warping after reflow soldering thermal shock.
[0037] In the accelerated life test of the whole machine reliability (85℃ / 85%RH, 168h), no glue creep or solder ball overflow was observed in the module equipped with sample B, while 3 / 10 of the control modules had slight cold solder joints. The thermal stress simulation results (ANSYS, TMW value decreased by 18%) show that the semi-circular notch reduces the stress gradient at the lower edge, and the thickness abrupt change provided by the stepped area offsets the difference in thermal expansion along the board thickness direction. The two work together to reduce the peak shear value of the solder joint, verifying the technical effect of the structural optimization from both process and mechanical dimensions.
[0038] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," "front end," "rear end," "head," "tail," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In addition, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0039] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any modifications, equivalent substitutions and improvements made by those skilled in the art within the technical scope disclosed in this utility model, and within the spirit and principles of this utility model, should be included within the protection scope of this utility model.
Claims
1. A type of adhesive plate, characterized in that, The device includes an adhesive plate body, a limiting strip, positioning edges, positioning pieces, and a notch. An arc-shaped notch is formed at the center of the bottom edge of the adhesive plate body. A raised limiting strip is provided at the upper end of the adhesive plate body, with the upper surface of the limiting strip higher than the upper surface of the adhesive plate body. Two positioning edges are arranged side-by-side along the length of the surface of the adhesive plate body, forming a rectangular receiving area between them. The positioning pieces are detachably assembled within the receiving area and abut against the two positioning edges. A stepped area is also formed at the upper end of the adhesive plate body.
2. The adhesive plate according to claim 1, characterized in that, The arc-shaped notch is semi-circular, and the center of the notch is located at the midpoint of the bottom edge of the adhesive plate body.
3. The adhesive plate according to claim 1, characterized in that, The limiting strip and the adhesive plate body are integrally formed from a single piece of material, and the cross-section of the limiting strip is trapezoidal.
4. The adhesive plate according to claim 1, characterized in that, The two positioning edges are parallel to each other and parallel to the side edge of the adhesive plate body.
5. The adhesive plate according to claim 1, characterized in that, The outer periphery of the positioning piece forms an interference fit with the two positioning edges, and the upper surface of the positioning piece is coplanar with the upper surface of the adhesive plate body.
6. The adhesive plate according to claim 1, characterized in that, The positioning piece has a rectangular label attaching groove in the middle, and the center of the groove is located above the geometric center line of the adhesive plate body.